US20050079092A1 - Pb-free solder alloy, and solder material and solder joint using same - Google Patents
Pb-free solder alloy, and solder material and solder joint using same Download PDFInfo
- Publication number
- US20050079092A1 US20050079092A1 US10/960,116 US96011604A US2005079092A1 US 20050079092 A1 US20050079092 A1 US 20050079092A1 US 96011604 A US96011604 A US 96011604A US 2005079092 A1 US2005079092 A1 US 2005079092A1
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- United States
- Prior art keywords
- solder
- weight
- alloy
- temperature
- concentration
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Definitions
- the present invention relates to a Pb-free solder alloy, and a solder material and a solder joint using same.
- characteristic properties of an alloy necessary as a solder material there are melting temperature, tensile strength, ductility (or elongation property), wettability, bonding strengths of parts joints, and the like.
- a melting temperature of a solder is preferably to be set at approximately 200° C. If a melting point of the solder is too high, it will exceed heat resistance temperatures of the parts in a reflow soldering, whereby a current soldering method may possibly incur damages on the parts. On the other hand, if a melting point of the solder is too low, the solder becomes most likely melted such that the parts may fall down or be peeled off in case when the environmental temperature surrounding the parts becomes high.
- solder for a reflow soldering in which a lead is employed, there is an Sn-37Pb solder alloy, typically.
- Sn-37Pb solder alloy typically.
- Pb-free solder alloys following Pb-free solder alloys have been studied. For example, enumerated are Sn—Ag(—Cu) based, Sn—Cu(—Ni) based, Sn—Ag—Bi—Cu based, Sn—Zn(—Bi,—Al) based, Sn—In—Ag—Bi based solder alloys, and the like.
- Sn—Ag(—Cu) based, Sn—Cu(—Ni) based, and Sn—Bi—Cu based solder alloys have alloy compositions whose melting points are measured in a range from 210° C. to 230° C. and are used for a flow soldering, a reflow soldering method, or the like.
- the melting points of these alloys are higher than that of a conventional Sn—Pb solder by 30° C. to 40° C.
- the melting points thereof may exceed heat resistance temperatures of the parts.
- Sn—Zn(—Bi,—Al) based and Sn—In—Ag—Bi based solder alloys, and the like are employed in a field of PCB (printed circuit board) packaging in which a reflow soldering method is generally adopted.
- group II alloys are highly oxidized in a melting state in the air, and technically difficult to be applied in the flow soldering method at this point.
- a group II alloy has many disadvantages as a solder in comparison with group I, it is advantageous in that its melting point can be adjusted to a temperature region close to that of the conventional Sn—Pb solder. Further, a group II alloy is used by adjusting composition thereof such that melting point thereof falls in the range from approximately 180° C. to 210° C.
- the Sn—Zn(—Bi,—Al) based solder alloy can be used under the current reflow soldering condition since a melting point is in the range from approximately 190° C. to 200° C. that is close to that of the conventional Sn-37Pb solder alloy, and is advantageous in being of low cost among Pb-free solders.
- a melting point is in the range from approximately 190° C. to 200° C. that is close to that of the conventional Sn-37Pb solder alloy, and is advantageous in being of low cost among Pb-free solders.
- wettability to a joint base material of a solder is not good.
- bonding strengths of the parts are significantly deteriorated if the joint to be soldered with a Cu base material is exposed to a high temperature and a high humidity condition, even after the reflow soldering.
- Zn is eluted from a solder into a flux, possibly incurring problems such as a lowered insulation resistance and a generation of migration, since Zn is employed in solder.
- a melting point of the Sn—In—Ag—Bi based solder alloy is close to that of an Sn—Pb solder, similarly to the case for the Sn—Zn based solder.
- a Cu—Zn compound is not formed since Zn is not employed. Accordingly, such a phenomenon does not occur that a bonding strength in a bonding surface with Cu is significantly lowered under the high temperature and high humidity atmosphere.
- Solder alloys having melting points in the range from 180° C. to 210° C. are widely used in a soldering method in which soldering is performed several times (flow soldering after reflow soldering, reflow soldering after reflow soldering, or the like), due to temperature characteristics thereof.
- the problematic point is that a place soldered once is peeled off in subsequent soldering processes.
- parts leads float from a PCB, together with solder.
- the reason for such a phenomenon is that on the second soldering or thereafter, a joint solder formed by a former soldering is partially melted and a bonding strength thereof decreases, and, in such a state, the joint is peeled off by a bending of a PCB or deformations of the parts.
- a solder alloy's property the bigger a difference between a temperature where a solder alloy begins to melt (hereinafter, referred to as a solidus line) and a temperature where the solder alloy completely melts (hereinafter, referred to as a liquidus line), the higher the possibility that the joint is peeled off.
- the Ag concentration described in reference 1 is too high by as much as 1% in weight or more.
- an alloy of a high Ag concentration (1 weight %) such as Sn-6Zn-6In-1Ag
- endothermic peak area whose summit is in the vicinity of a melting point of 200° C.
- DSC differential scanning calorimetry
- the conventional Pb-free solder may incur various problems such as poor wettability due to Zn, which is a problem in the Sn—Zn(—Bi,—Al) based solder, and a lowered bonding strength with Cu electrode under the condition of the high temperature and high humidity. Further, using rare metals such as In and Ag becomes a problem in the Sn—In—Ag—Bi based solder alloy.
- an object of the present invention to meet such a condition that a melting temperature characteristic is same as that of an Sn—Pb based solder and to solve the problems of the conventional Sn—Zn(—Bi,—Al) based solder and the Sn—in—Ag—Bi based solder.
- a solder alloy in accordance with the present invention is based on an Sn—Zn—In—Ag system having, in weight, 0.3% ⁇ Zn ⁇ 5.0%, 0.1% ⁇ In ⁇ 4.0%, 0.1% ⁇ Ag ⁇ 0.4%, and the balance Sn.
- FIG. 1 is a graph for showing peel strengths of solder joints of solders in accordance with Example 1 of the present invention, as a function of exposure time;
- FIGS. 2A to 2 E show DSC measurement results of solder alloys as a function of temperature, in case when Zn is added to Sn-3In-0.3Ag of Example 1 of the present invention while varying the Zn concentration in the range from 2 to 6 weight %;
- FIGS. 3A to 3 C describe typical views of structures, in case when a small amount of Ag is added to Sn-4Zn-3In of Example 2 of the present invention
- FIG. 4 illustrates a graph for showing electrochemical corrosion potentials as a function of time, in case when a small amount of Ag is added to Sn-4Zn-3In of Example 3 of the present invention
- FIGS. 5A to 5 E explain variations of melting temperatures as a function of Ag concentration, when a small amount of Ag is added to Sn-4Zn-3In of Example 1 of the present invention
- FIG. 6 offers a graph for showing variations of mechanical properties of solder alloys as a function of In concentration, in case when In is added to Sn-4Zn-0.3Ag of Example 6 of the present invention in a range from 0 to 10 weight %;
- FIG. 7 sets forth to a graph for showing variations of mechanical properties of solder alloys in accordance with Example 8 of the present invention, as a function of exposure time;
- FIG. 8 presents a graph for showing variations of mechanical properties of another solder alloys in Example 8 of the present invention, as a function of exposure time.
- FIG. 9 depicts a DSC measurement result of a conventional Sn-6Zn-6In-1Ag alloy.
- a solder alloy is an Sn—Zn—In—Ag solder containing a small amount of Ag for preventing a bonding interface strength from being lowered when a joint of a Cu base material with a solder is exposed to the high temperature and high humidity atmosphere, based on an Sn—Zn—In based solder having a melting point of 210° C. or less.
- the concentration of each element in such a solder alloy is as follows, in weight:
- the Zn concentration is from about 3.0% to 5.0% in weight.
- a melting point of the solder cannot be lowered to about 200° C.
- a difference between a solidus temperature and a liquidus temperature becomes large even though the In concentration is increased. As a result, in multiple soldering processes, it is likely that the parts joints are peeled off.
- the In concentration is from 0.1 to about 20.0% in weight. When the concentration is less than about 0.1% in weight, a melting point cannot be expected to be lowered. If the In concentration is more than 20.0% in weight, a solidus temperature in the solder melting point becomes too low. In case of the Sn-20In, a solidus temperature is 153° C. If the solidus temperature decreases, the solder is melted and peeled off when being exposed to a high temperature environment.
- the same failure may possibly be caused due to heat generation by using equipment. Still further, since the solidus temperature (153° C.) and the liquidus temperature (199° C.) of the Sn-20In are separated from each other too far, such a phenomenon may occur that the solder is peeled off in the second soldering process or thereafter.
- the Ag concentration is between 0.1% and 0.4% in weight. If the concentration is less than about 0.1% in weight, an effect that prevents a bonding strength from being lowered cannot be obtained when exposing to an environment of high temperature and high humidity after soldering.
- the solder tends to melt at a higher temperature in a melting point temperature area of the solder, so that fluidity of a molten solder becomes poor in the reflow soldering process.
- composition range is as follows below, in weight:
- the In concentration in the solder alloy increases, ductility of the solder alloy becomes deteriorated. Further, if the In concentration is 4% in weight and less, elongation of 30% or greater can be assured. Therefore, a stress can be relieved since the solder is deformed when a stress due to heat-shock or the like is on. In contrast, if the solder does not have ductility, crack may possibly be developed in the solder joint in case where a PCB or parts are expanded or shrunk.
- high temperature and high humidity means a circumstance of 85° C. and 85% RH (relative humidity).
- Example 1 a peel strength of a joint having, in weight, 3% In and 0-6% Zn (the remaining portion was Sn) was measured, with respect to a variation of a bonding strength when exposed to an environment of the high temperature and high humidity.
- a solder alloy which was mixed to have a predetermined composition, of about 1 kg was held at 230° C.
- QFP Quad Flat Package
- parts of 0.65 mm in pitch and 100 pins are fixed to a Cu-attached glass epoxy PCB by using an adhesive.
- This specimen was applied to a flux, and then, subjected to soldering by dipping into the solder.
- a soldered article was washed with acetone by using a microwave washing machine, so that residuals of the flux were removed.
- a soldered PCB specimen after being washed was put into a hygro-thermostat (constant temperature and humidity oven) kept at 85° C. and 85% RH, and then, a peeling strength of a lead bonding strength was measured for every 250 hours.
- FIG. 1 shows a variation of a lead bonding strength, in case when soldering QFP parts with a solder having, in weight, 3% In, 0-6% Zn, and the balance Sn.
- 0-6% Zn means that the Zn concentration is in the range from 0 to 6% in weight.
- a bonding strength at exposure time of 500 hours becomes 1 kgf or less.
- the Zn concentration in the solder increases, bonding strengths of the parts tend to decrease under an environment of the high temperature and high humidity.
- Zn phases in the solder diffuse into a bonding surface and react with a Cu base material under the high temperature and high humidity atmosphere, to thereby form and grow a Cu—Zn compound layer.
- Zn oxidizes due to an effect of high humidity, whereby a bonding strength in an interface of the Cu—Zn compound layer of the bonding surface with the solder is significantly lowered.
- the Zn concentration is less than about 5% in weight.
- FIGS. 2A to 2 E describe DSC measurement results of solders, each having, in weight, 3% In, 2-6% Zn, 0.3% Ag, and the balance Sn. If the Zn concentration is less than 3% in weight, a melting point of a metal exceeds 210° C. Therefore, it is preferable that the Zn concentration is greater than about 3% in weight.
- the Zn concentration is greater than 5% in weight, a bonding strength under the high temperature and high humidity is gradually lowered.
- the Zn concentration is less than about 5% in weight.
- Example 2 was carried out for observing a structure, in case when a small amount of Ag is added to an Sn-4Zn-3In.
- Each solder having, in weight, 4% Zn, 3% In, 0.1-0.5% Ag, and the balance Sn of about 0.6 g was melted on a ceramic plate to form a sphere shape, and in that state, cooled in the air.
- a section of each solder particle was polished and observed by using scanning electron microscope (SEM). The results were described in FIGS. 3A to 3 C.
- Example 3 a variation of an electrochemical corrosion potential would be explained, in case when a small amount of Ag is added to the Sn-4Zn-3In.
- Each solder having, in weight, 4% Zn, 3% In, 0-0.5% Ag, and the balance Sn was prepared with a bar shape having a cross section of 5 mm ⁇ 5 mm.
- a surface of the bar-shaped specimen was polished with water resistance polishing paper of 1200 mesh, and then, subjected to buffing by using Al 2 O 3 suspension. Subsequently, the specimen was immersed into a 3.5 wt. % NaCl water solution at 25° C. Further, by using a standard electrode employing a silver electrode, a silver chloride electrode, and a saturated KCl water solution, an electromotive force difference, which is generated between Ag of the standard electrode and the solder specimen, was measured. The result was shown in FIG. 4 . Still further, as a reference sample, an electrochemical corrosion potential of the Sn-3In solder not containing Zn was described.
- Example 4 an observation result of a bonding surface would be explained when soldering the Sn-4Zn-3In—0.3Ag with a Cu plate.
- the Sn-4Zn-3In-0.3Ag solder of 0.3 g was placed on the Cu plate and applied to a flux. Then, it was heated on a 230° C. heat plate and soldered. After this specimen was filled into a resin, polished, and evaporated, a section of the bonding surface was observed by using SEM and X-ray micro analyzer (XMA). As a result of the observation using SEM and XMA, a Zn layer and an Ag layer could be observed to be generated in a bonding surface between the solder and the Cu plate.
- SEM and XMA X-ray micro analyzer
- a Zn—Ag phase is formed in the bonding surface between the Cu plate and the bonding surface. If a Zn—Cu compound phase is formed in a bonding surface, oxidation in an interface of the solder with the Zn—Cu compound progresses, so that a bonding strength is lowered. Namely, by preventing the formation of the Zn—Cu compound layer, a bonding strength can be prevented from being lowered.
- Example 5 a variation of a melting point would be explained, in case when a small amount of Ag is added to the Sn-4Zn-3In.
- FIGS. 5A to 5 E show measurement results of melting points of solders, each having, in weight, 4% Zn, 3% In, 0-0.5% Ag, and the balance Sn, by using DSC.
- FIGS. 5A to 5 E it could be noted that as the Ag concentration increases, a peak representing a heat absorbing amount in the vicinity of 205° C. to 210° C. becomes large, and a melting amount of the solder increases in this temperature area. If the Ag concentration becomes 0.5% in weight, an endothermic peak in the vicinity of 205° C. to 210° C.
- solder grows as much as substantially same as that in the vicinity of 190° C.
- the solder is melted at a lower temperature (about 193° C.) first, and melted again at a higher temperature. Further, wettability or fluidity of the solder becomes deteriorated.
- the Zn—Ag compound phase is formed in a bonding surface when soldering on a Cu, to thereby serve as a barrier layer for suppressing a reaction between Cu and Zn.
- formation of the Zn—Cu compound layer which tends to be easily oxidized, can be suspended, so that oxidation in the bonding surface is suppressed to thereby prevent the bonding strength from being lowered.
- Each solder having, in weight, 4% Zn, 0-10% In, 0.3% Ag, and the balance Sn was molded to a plate shape at a temperature higher than a solder liquidus temperature by 50° C., and a tensile specimen was prepared.
- the specimen was JIS4 specimen.
- the tensile test was performed at a tensile rate of 5.0 mm/min.
- a Pb-free solder material formed of a solder alloy and a flux is utilized in a wire solder and a cream solder.
- the solder alloy is based on the Sn—Zn—In—Ag system having, in weight:
- the flux a known flux may be used.
- Example 8 a solder bonding strength would be explained by using a solder alloy, which has at least one element selected from a group consisting of Ni, Ti, Mg, Al, and Co, based on the Sn—Zn—In—Ag system having, in weight:
- a total concentration of at least one element is in the range from 0.001% to 0.05% in weight and the remainder is Sn.
- FIG. 7 exhibits variations of bonding strengths thereof. Bonding strength was measured by the same method as in Example 1.
- the samples were prepared by using solder alloys, each having one of the aforementioned elements and performing a reflow soldering on a Cu film.
- F represents a standard Pb-free solder alloy of the present invention.
- A, B, C, D, and E have the same composition with F other than Sn, and contain 0.004% Ti, 0.01% Ni, 0.01% Mg, 0.05% Al, and 0.05% Co, in weight, respectively. And, the remaining portion thereof is Sn. Comparing bonding strengths after being exposed for 1000 hours under the condition of the high temperature and high humidity, the samples A, B, C, and E are found to be superior to the standard F. Further, it can be noted that the sample D maintains a bonding strength at least equal to or greater than F.
- FIG. 8 shows variations of bonding strengths under the high temperature and high humidity on three solder joint compositions: Sn-8Znn-3Bi, Sn-4Zn-3In-0.3Ag, and Sn-4Zn-3In—0.3Ag-0.003Ti. Further, the solder joints are formed by the same manner as in Example 1. As can be seen from FIG. 8 , the addition of Ti is clearly demonstrated to be effective after 1500 hours.
- a bonding strength becomes less than 1 kgf after 250 hours.
- Other elements such as Ni, Mg, Al, and Co provide the same effects as Ti.
- a Pb-free solder material formed of a solder alloy and a flux of Example 9 is utilized in a wire solder and a cream solder.
- the solder alloy has at least one element selected from the group consisting of Ni, Ti, Mg, Al and Co, based on the Sn—Zn—In—Ag having, in weight:
- a total concentration of at least one element is in the range from about 0.001% to about 0.05% in weight and the remainder is Sn.
- the flux a known flux may be used.
- the Zn concentration is in the range from about 3 to 5% in weight, so that solder joint reliability can be improved under the high temperature and high humidity atmosphere.
- a solder alloy of the present invention may be a bar solder (molten solder), and a Pb-free solder alloy suitable for a diffusion bonding.
- the present invention may include a solder joint of electrical and electronic equipment using the solder alloy of the present invention.
- a Pb-free solder using a solder alloy in accordance with the present invention has a melting temperature substantially equal to that of a conventional Sn—Pb solder. Therefore, the current Sn—Pb soldering method and the current parts or production equipment can be employed as it is. Further, a Pb-free solder material having a solder characteristic with excellent bonding strengths of the parts can be provided.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2003-352015 | 2003-10-10 | ||
JP2003352015 | 2003-10-10 | ||
JP2004223189A JP4453473B2 (ja) | 2003-10-10 | 2004-07-30 | 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部 |
JP2004-223189 | 2004-07-30 |
Publications (1)
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US20050079092A1 true US20050079092A1 (en) | 2005-04-14 |
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ID=34425378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/960,116 Abandoned US20050079092A1 (en) | 2003-10-10 | 2004-10-08 | Pb-free solder alloy, and solder material and solder joint using same |
Country Status (6)
Country | Link |
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US (1) | US20050079092A1 (ko) |
JP (1) | JP4453473B2 (ko) |
KR (1) | KR100678803B1 (ko) |
CN (1) | CN1311950C (ko) |
SG (1) | SG111229A1 (ko) |
TW (1) | TWI301854B (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080225490A1 (en) * | 2007-03-15 | 2008-09-18 | Daewoong Suh | Thermal interface materials |
US20090001141A1 (en) * | 2005-08-05 | 2009-01-01 | Grillo-Werke Aktiengesellschaft | Method for Arc or Beam Brazing/Welding of Workspieces of Identical or Different Metals or Metal Alloys with Additional Materials of Sn Base Alloys; Sn Base Alloy Wire |
CN103212919A (zh) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | 一种改进的无铅焊锡丝及其助焊剂 |
EP2839920A4 (en) * | 2012-04-18 | 2015-12-09 | Senju Metal Industry Co | solder alloy |
EP2891538A4 (en) * | 2012-08-31 | 2016-05-04 | Senju Metal Industry Co | ELECTRICALLY CONDUCTIVE BINDING MATERIAL |
US9901969B2 (en) | 2012-03-28 | 2018-02-27 | Nippon Steel & Sumitomo Metal Corporation | Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same |
CN109926750A (zh) * | 2019-05-17 | 2019-06-25 | 云南锡业集团(控股)有限责任公司研发中心 | 一种低温无铅焊料合金及其真空铸造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101804527A (zh) * | 2010-04-06 | 2010-08-18 | 山东大学 | 一种低锌Sn-Zn基无铅钎焊材料 |
CN106238951A (zh) * | 2016-08-26 | 2016-12-21 | 王泽陆 | 一种环保高强度无铅钎料及其制备工艺 |
US11383330B2 (en) | 2020-09-21 | 2022-07-12 | Aptiv Technologies Limited | Lead-free solder composition |
Citations (1)
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US5843371A (en) * | 1995-06-30 | 1998-12-01 | Samsung Electro-Mechanics Co., Ltd. | Lead-free soldering material having superior solderability |
Family Cites Families (6)
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CN1087994C (zh) * | 1995-09-29 | 2002-07-24 | 松下电器产业株式会社 | 无铅钎料合金 |
JPH10193171A (ja) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | 半田付け物品 |
JPH10249578A (ja) * | 1997-03-11 | 1998-09-22 | Hitachi Cable Ltd | 銅および銅合金ブレージングシート |
JPH10328880A (ja) * | 1997-06-04 | 1998-12-15 | Mitsui Mining & Smelting Co Ltd | 錫−銀系無鉛半田合金 |
JP2001321983A (ja) * | 2000-05-16 | 2001-11-20 | Canon Inc | はんだペースト及びそれを用いた電子部品のはんだ付け方法 |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
-
2004
- 2004-07-30 JP JP2004223189A patent/JP4453473B2/ja not_active Expired - Fee Related
- 2004-10-07 KR KR1020040079790A patent/KR100678803B1/ko not_active IP Right Cessation
- 2004-10-08 SG SG200405932A patent/SG111229A1/en unknown
- 2004-10-08 US US10/960,116 patent/US20050079092A1/en not_active Abandoned
- 2004-10-08 TW TW093130582A patent/TWI301854B/zh not_active IP Right Cessation
- 2004-10-10 CN CNB2004100921370A patent/CN1311950C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US5843371A (en) * | 1995-06-30 | 1998-12-01 | Samsung Electro-Mechanics Co., Ltd. | Lead-free soldering material having superior solderability |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090001141A1 (en) * | 2005-08-05 | 2009-01-01 | Grillo-Werke Aktiengesellschaft | Method for Arc or Beam Brazing/Welding of Workspieces of Identical or Different Metals or Metal Alloys with Additional Materials of Sn Base Alloys; Sn Base Alloy Wire |
US20080225490A1 (en) * | 2007-03-15 | 2008-09-18 | Daewoong Suh | Thermal interface materials |
US9901969B2 (en) | 2012-03-28 | 2018-02-27 | Nippon Steel & Sumitomo Metal Corporation | Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same |
US10807138B2 (en) | 2012-03-28 | 2020-10-20 | Nippon Steel Corporation | Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same |
EP2839920A4 (en) * | 2012-04-18 | 2015-12-09 | Senju Metal Industry Co | solder alloy |
US9808890B2 (en) | 2012-04-18 | 2017-11-07 | Senju Metal Industry Co., Ltd. | Solder alloy |
EP2891538A4 (en) * | 2012-08-31 | 2016-05-04 | Senju Metal Industry Co | ELECTRICALLY CONDUCTIVE BINDING MATERIAL |
US9487846B2 (en) | 2012-08-31 | 2016-11-08 | Senju Metal Industry Co., Ltd. | Electroconductive bonding material |
CN103212919A (zh) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | 一种改进的无铅焊锡丝及其助焊剂 |
CN109926750A (zh) * | 2019-05-17 | 2019-06-25 | 云南锡业集团(控股)有限责任公司研发中心 | 一种低温无铅焊料合金及其真空铸造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100678803B1 (ko) | 2007-02-06 |
CN1605427A (zh) | 2005-04-13 |
JP2005131705A (ja) | 2005-05-26 |
CN1311950C (zh) | 2007-04-25 |
JP4453473B2 (ja) | 2010-04-21 |
KR20050035083A (ko) | 2005-04-15 |
TWI301854B (en) | 2008-10-11 |
TW200519216A (en) | 2005-06-16 |
SG111229A1 (en) | 2005-05-30 |
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