SG111229A1 - Pb-free solder alloy, and solder material and solder joint using same - Google Patents

Pb-free solder alloy, and solder material and solder joint using same

Info

Publication number
SG111229A1
SG111229A1 SG200405932A SG200405932A SG111229A1 SG 111229 A1 SG111229 A1 SG 111229A1 SG 200405932 A SG200405932 A SG 200405932A SG 200405932 A SG200405932 A SG 200405932A SG 111229 A1 SG111229 A1 SG 111229A1
Authority
SG
Singapore
Prior art keywords
solder
same
alloy
free
joint
Prior art date
Application number
SG200405932A
Other languages
English (en)
Inventor
Ochi Shinya
Tawara Fumitoshi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG111229A1 publication Critical patent/SG111229A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
SG200405932A 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same SG111229A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003352015 2003-10-10
JP2004223189A JP4453473B2 (ja) 2003-10-10 2004-07-30 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部

Publications (1)

Publication Number Publication Date
SG111229A1 true SG111229A1 (en) 2005-05-30

Family

ID=34425378

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405932A SG111229A1 (en) 2003-10-10 2004-10-08 Pb-free solder alloy, and solder material and solder joint using same

Country Status (6)

Country Link
US (1) US20050079092A1 (ko)
JP (1) JP4453473B2 (ko)
KR (1) KR100678803B1 (ko)
CN (1) CN1311950C (ko)
SG (1) SG111229A1 (ko)
TW (1) TWI301854B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
US20080225490A1 (en) * 2007-03-15 2008-09-18 Daewoong Suh Thermal interface materials
CN101804527A (zh) * 2010-04-06 2010-08-18 山东大学 一种低锌Sn-Zn基无铅钎焊材料
CA2866466C (en) 2012-03-28 2016-10-25 Nippon Steel & Sumitomo Metal Corporation Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same
EP2839920B1 (en) * 2012-04-18 2017-11-01 Senju Metal Industry Co., Ltd. Solder alloy
CN104755221B (zh) * 2012-08-31 2018-06-15 千住金属工业株式会社 导电性密合材料
CN103212919A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种改进的无铅焊锡丝及其助焊剂
CN106238951A (zh) * 2016-08-26 2016-12-21 王泽陆 一种环保高强度无铅钎料及其制备工艺
CN109926750B (zh) * 2019-05-17 2021-03-30 云南锡业集团（控股）有限责任公司研发中心 一种低温无铅焊料合金及其真空铸造方法
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0168964B1 (ko) * 1995-06-30 1999-01-15 이형도 납땜성이 우수한 무연땜납
CN1087994C (zh) * 1995-09-29 2002-07-24 松下电器产业株式会社 无铅钎料合金
JPH10193171A (ja) * 1996-12-27 1998-07-28 Murata Mfg Co Ltd 半田付け物品
JPH10249578A (ja) * 1997-03-11 1998-09-22 Hitachi Cable Ltd 銅および銅合金ブレージングシート
JPH10328880A (ja) * 1997-06-04 1998-12-15 Mitsui Mining & Smelting Co Ltd 錫−銀系無鉛半田合金
JP2001321983A (ja) * 2000-05-16 2001-11-20 Canon Inc はんだペースト及びそれを用いた電子部品のはんだ付け方法
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy

Also Published As

Publication number Publication date
KR100678803B1 (ko) 2007-02-06
CN1605427A (zh) 2005-04-13
JP2005131705A (ja) 2005-05-26
CN1311950C (zh) 2007-04-25
JP4453473B2 (ja) 2010-04-21
KR20050035083A (ko) 2005-04-15
TWI301854B (en) 2008-10-11
US20050079092A1 (en) 2005-04-14
TW200519216A (en) 2005-06-16

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