US20040012049A1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- US20040012049A1 US20040012049A1 US10/458,668 US45866803A US2004012049A1 US 20040012049 A1 US20040012049 A1 US 20040012049A1 US 45866803 A US45866803 A US 45866803A US 2004012049 A1 US2004012049 A1 US 2004012049A1
- Authority
- US
- United States
- Prior art keywords
- gate
- region
- semiconductor device
- source
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 239000000758 substrate Substances 0.000 claims description 81
- 238000007689 inspection Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 15
- 229920005591 polysilicon Polymers 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 48
- 238000004519 manufacturing process Methods 0.000 description 38
- 239000000523 sample Substances 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 230000002829 reductive effect Effects 0.000 description 14
- 229910052814 silicon oxide Inorganic materials 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910015900 BF3 Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
A semiconductor device includes a gate electrode GE electrically connected to a gate portion which is made of a polysilicon film provided in the inside of a plurality of grooves formed in a striped form along the direction of T of a chip region CA wherein the gate electrode GE is formed as a film at the same layer level as a source electrode SE electrically connected to a source region formed between adjacent stripe-shaped grooves and the gate electrode GE is constituted of a gate electrode portion G1 formed along a periphery of the chip region CA and a gate finger portion G2 arranged so that the chip region CA is divided into halves along the direction of X. The source electrode SE is constituted of an upper portion and a lower portion, both relative to the gate finger portion G2, and the gate electrode GE and the source electrode SE are connected to a lead frame via a bump electrode.
Description
- This invention relates to a technique for semiconductor devices and more particularly, to a technique effective for application to semiconductor devices having power MISFET (metal insulator semiconductor field effect transistor).
- Transistors for high-power purposes dealing with electric power of several watts (W) or over are called power transistor, and various types of structures have been studied.
- Among them, power MISFET includes ones called a longitudinal type and a transverse type and are classified into a trench-type structure and a planar structure depending on the structure of a gate portion.
- Such power MISFET has a multitude of (e.g. several tens of thousands of) MISFET's in fine pattern connected in parallel in order to obtain high power.
- For instance, Japanese Unexamined Patent Publication No. Hei 7(1995)-249770 discloses power MISFET of the trench gate type.
- We have engaged in studies and developments of power MISFET used as a high-efficiency power supply and the like.
- With such power MISFET as mentioned above, it is required to reduce an ON resistance (Ron), a gate capacitance (Qg) and, particularly, a gate-drain capacitance (Qgd). A great current can be obtained by reducing the ON resistance. The reduction of the capacitance between the gate and drain leads to an improved switching characteristic.
- Under these circumstances, studies have been made on the scale down of power MISFET and, particularly, on the reduction in width of a groove where a gate portion is formed.
- More particularly, in order to reduce the ON resistance, it is necessary to increase a channel area per unit area. If the width of the groove at which a gate portion is to be formed is made small, a channel area per unit area can be increased. If the width of the groove at which a gate portion is to be formed is made small, then a counter area for a drain portion at the side of a substrate opposite to the gate portion can be made small, thereby ensuring reduction of the capacitance (Qgd).
- However, when the width of the groove where the gate portion is to be formed, the resistance of the gate portion becomes large, thereby causing the switching characteristic to be degraded instead.
- Especially, in high frequency operations, an-efficiency η is greatly influenced depending on the resistance of the gate portion as will be hereinafter described in detail. This efficiency means a value of output power/input power.
- Accordingly, a measure for reducing the resistance of the gate portion becomes important.
- An object of the invention is to provide a semiconductor device of the type wherein the resistance of a gate portion of power MISFET is reduced.
- Another object of the invention is to provide a semiconductor device of the type wherein a semiconductor device having power MISFET can be improved in characteristics.
- The above and other objects and novel features of the invention will become apparent from the following description with reference to the accompanying drawings.
- Typical embodiments of the invention among those embodiments set forth in this application are briefly described below.
- A semiconductor device according to the invention comprises:
- (a) a MISFET formed in a chip region of a semiconductor substrate and having a gate portion, a source portion and a drain portion, each made of a first conductor;
- (b) a gate electrode which is electrically connected with the gate portion and is made of a second conductor having a resistivity lower than the first conductor and which includes (b1) a first portion formed along a periphery of the chip region and (b2) a second portion connected with the first portion and formed on the inside of said first portion in said chip region;
- (c) a source electrode which is electrically connected with the source portion and is made of the second conductor and which is formed plurally within the chip region;
- (d) a bump electrode formed on the upper portions of the gate electrode and the plurality of source electrodes, respectively;
- (e) the gate electrode and the plurality of source electrodes being arranged at the same layer level; and
- (f) the second portion of the gate electrode being arranged between adjacent source electrodes of the plurality of source electrodes.
- FIG. 1 is a sectional view of an essential part of a substrate showing a fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 2 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 3 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 4 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 5 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 6 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 7 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 8 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 9 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 10 a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 11 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 12 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 13 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 14 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 15 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 16 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 1 of the invention; - FIG. 17 is a graph showing the relation between the gate resistance and the efficiency for illustrating the effect of
Embodiment 1 of the invention; - FIG. 18 is a plan view of an essential part of a substrate showing a fabrication method of a semiconductor device according to
Embodiment 2 of the invention; - FIG. 19 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 2 of the invention; - FIG. 20 is a plan view of an essential part of a substrate showing a fabrication method of a semiconductor device according to
Embodiment 3 of the invention; - FIG. 21 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 3 of the invention; - FIG. 22 is a plan view of an essential part of a substrate showing a fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 23 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 24 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 25 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 26 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 27 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 28 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 29 is a sectional view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 30 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to Embodiment 4 of the invention;
- FIG. 31 is a plan view of an essential part of a substrate showing a fabrication method of a semiconductor device according to
Embodiment 5 of the invention; - FIG. 32 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 5 of the invention; - FIG. 33 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 5 of the invention; - FIG. 34 is a plan view of the essential part of the substrate showing the fabrication method of a semiconductor device according to
Embodiment 5 of the invention; - FIG. 35 is a sectional view of the essential part of the substrate for illustrating the effect of
Embodiment 1 of the invention; - FIG. 36 is a sectional view of the essential part of the substrate for illustrating the effect of
Embodiment 5 of the invention; - FIG. 37 is a plan view showing an essential part of a substrate showing a further groove pattern according to an embodiment of the invention; and
- FIG. 38 is a plan view showing an essential part of a substrate showing a still further groove pattern according to an embodiment of the invention.
- The embodiments of the invention are described with reference to the accompanying drawings, in which like members or parts having a similar function are indicated by like reference numerals throughout the drawings illustrating the embodiments and are not repeatedly explained.
- (Embodiment 1)
- A semiconductor device according to this embodiment is described by way of a fabrication method thereof.
- FIGS.1 to 16 are, respectively, a sectional or plan view of an essential part of a substrate showing a fabrication method of a semiconductor device according to the embodiment. The sectional view corresponds, for example, to a section taken along line A-A of a plan view.
- Initially, as shown in FIG. 1, a semiconductor substrate1 (hereinafter referred to simply as “substrate”), in which a single
crystal silicon layer 1 b doped with an n-type impurity (e.g. arsenic) is epitaxially grown on the surface la of an n-type single crystal, is provided. - Next, as shown in FIG. 2, the surface of the
substrate 1 is, for example, thermally oxidized to form asilicon oxide film 3. Thereafter, a p-type impurity (e.g. boron) is injected over thesilicon oxide film 3 through a mask of a silicon nitride film (not shown) which has been patterned by use of a lithographic technique, followed by thermal diffusion to form a p-type well 5. Next, the silicon nitride film is removed. - Subsequently, as shown in FIGS. 3 and 4, the
silicon oxide film 3 and thesubstrate 1 are, respectively, etched through a mask of a film patterned by the use of a photolithographic technique to form grooves (trenches) 7. As shown in FIG. 4, the pattern of eachgroove 7 is in the form of a stripe extending along the direction of Y. CA indicates a chip region. This chip region is in the form of a rectangle (oblong) elongated along the direction of X. It will be noted that although not shown in the figure, a great number of chips of the type as mentioned above are provided on the wafer-shapedsemiconductor substrate 1. - Next, as shown in FIGS. 5 and 6, the
substrate 1 is thermally treated to form a thermally-oxidizedfilm 9 on the bottom and side walls of eachgroove 7. This thermally oxidizedfilm 9 serves as a gate insulating film of power MISFET. Next, an impurity-doped, lowresistance polysilicon film 11 is deposited to such an extent that eachgroove 7 is buried. During the deposition, thepolysilicon film 11 is formed as a layer on thesilicon oxide film 3 over the p-type well 5. Thereafter, thepolysilicon film 11 is etched through a mask of a photoresist film (hereinafter referred to simply as “resist film”) not shown, thepolysilicon film 11 is left inside thegroove 7. Theinside polysilicon 11 acts as a gate portion G of power MISFET. Subsequently, a polysilicon film pattern P1 is formed over an outer periphery of a chip region CA, and a polysilicon film pattern P2 which is arranged to divide the chip region CA into halves along the direction of X is also formed (FIG. 6). The patterns P1 and P2 are connected to each other. The region where thesilicon oxide film 3 is formed below the polysilicon film pattern P1 serves as an element isolation region, and regions which are marked off with this region are provided as an element forming region (active). - Next, the
silicon oxide film 3 in the element forming region is removed and a thinsilicon oxide film 13 is formed over the gate portion G and also over each portion between thegrooves 7 as is particularly shown in FIG. 7. Thereafter, a p-type impurity is injected into thesubstrate 1 at the portion thereof between thegrooves 7 and is diffused, thereby forming a p-type semiconductive region (channel region) 15. This p−-type semiconductive region 15 extends to the inside of the p-type well 5. - Next, an n-type impurity (e.g. arsenic) is injected into the
substrate 1 at a portion between thegrooves 7 through a mask of a resist film (not shown) and diffused to form an n+-type semiconductive region (source region) 17. It will be noted that this n+-type semiconductive region (source region) 17 extends between the gate portions G, shown in FIG. 6, in the form of a stripe. Next, as shown in FIGS. 8 and 9, asilicon oxide film 19 is formed over thesubstrate 1, after which thesilicon oxide films type semiconductive region 15 and the n+-type semiconductive region 17) are, respectively, etched to form a contact groove (source contact) 21 s. - This
contact grove 21 s is so arranged as to permit the n+-type semiconductive region 17 to be exposed from the side walls thereof and the p−-type semiconductive region 15 to be exposed from the bottom thereof. In other words, the depth of thecontact groove 21 s exceeds the n+-type semiconductive region 17 and arrives at the p−-type semiconductive region 15. - At this stage, the
silicon oxide film 19 on the polysilicon film patterns P1 and P2 is removed to form contact grooves (gate contacts - The
contact groove 21 b is contacted at one end thereof (i.e. at a left end as viewed in FIG. 9) with thecontact groove 21 a, and the other end (i.e. a right end as viewed in FIG. 9) is not contacted with thecontact groove 21 a. More particularly, a space S1 is established between thecontact grooves - Next, as shown in FIGS. 10 and 11, a p-type impurity such as, for example, boron fluoride (BF2), is injected into the bottom of the
contact groove 21 s and diffused to form a p+-type semiconductive region (back gate contact region) 23. More particularly, the source electrode formed on thecontact groove 21 s is connected to thesource region 17 and further to the back gate via the p+-type semiconductive region 23. - In this way, the
contact groove 21 s is formed and the p+-type semiconductive region 23 is formed at the bottom thereof, so that an allowance for mask alignment can be reduced and spaces between the gate portions can be made finer over the case where a device having such a structure as shown in FIG. 35 is formed. - Next, according to a sputtering method, a TiW (titanium tungsten)
film 25 is thinly deposited, for example, as a barrier film over thesilicon oxide film 19 including the insides of the contact holes (21 s, 21 a, 21 b), followed by thermal treatment. Subsequently, an aluminium (Al)film 27 is deposited, for example, as a conductive film according to a puttering method. This barrier film serves to prevent an undesirable reaction layer from being formed owing to the contact between Al and the substrate (Si). It will be noted that the Al film means a film mainly made of Al, and other types of metals may be contained therein. - Next, the
TiW film 25 and theAl film 27 are, respectively, etched through a mask of a resist film not shown to form a gate electrode (gate leading electrode) GE and a source electrode (source leading electrode) SE. These electrodes (GE, DE) serve as a first-layer wiring. - As shown in FIG. 11, the gate electrode GE includes a gate electrode portion (first portion) G1 formed along the periphery of the chip region CA and a gate finger portion (second portion) G2 which is so arranged as to divide the chip region CA into halves along the direction of X. The pattern of the gate electrode GE is shown in FIG. 12, and the pattern of the source electrode SE is shown in FIG. 13.
- As shown in FIGS. 11 and 12, the gate electrode portion G1 is positioned on the polysilicon film pattern P1 and also on the
contact groove 21 a. The gate finger portion G2 is positioned on the polysilicon film pattern P2 and also on thecontact groove 21 b. - It should be noted that any gate finger portion G2 is not formed on the space between the
contact grooves - On the other hand, the source electrode SE is constituted, as shown in FIGS. 11 and 13, of a portion which is located at one of the halves of the chip region CA divided with the polysilicon film pattern P2 (i.e. an upper side portion relative to the gate finger portion G2) and a portion located at the other half of the chip region (i.e. a lower side portion relative to the gate finger portion G2). These portions are connected to each other and combined together at the space S1. In other words, the halves of the source electrode SE are connected in the vicinity of at the end portion of the gate finger portion G2.
- It will be noted that the gate electrode GE and the source electrode SE are at the same layer level, and a guard ring (not shown) may be formed at the outside of the gate electrode GE for protection of the element.
- Next, as shown in FIGS. 14 and 15, a
polyimide resin film 29 is applied to over thesubstrate 1, for example, as a protective film, followed by exposure to light and development thereby removing thepolyimide resin film 29 formed on the gate electrode GE and the source electrode SE to form openings (pad portions) 31 g, 31 s. The Al film 27 (the gate electrode GE and the source electrode SE) is exposed at these openings. It is to be noted that although theopening 31 s does not appear at the section taken along the line A-A of FIG. 15, theopening 31 s is illustrated in FIG. 14 in order to clarify the relation between the source electrode SE and theopening 31 s. - Thereafter, the
substrate 1 is protected such as with a tape on the surface thereof, after which thesubstrate 1 is polished at the back side thereof so that the protecting face is turned downside as shown in FIG. 16. Subsequently, a Ni (nickel) film, a Ti (titanium) film and a Au (gold) film are successively formed, for example, as a conductive film, on the back side of thesubstrate 1 according to a sputtering method, thereby forming a built-upfilm 35 thereof. This built-upfilm 35 serves as a leading electrode (drain electrode DE) for drains (1 a, 1 b). - Next, the tape is peeled off and a bump electrode made, for example, of gold or the like is formed at the
openings substrate 1 along the chip region, packaging the resulting individual chips on a lead frame (packaging plate) and sealing (packaging) with a resin or the like. Eventually, a semiconductor device is completed. With respect to bump-forming and packaging procedures, these are described in detail in Embodiment 4 or the like and are not illustrated herein. - Thus, according to this embodiment, the gate finger portion G2 is disposed in the gate electrode GE, so that the gate resistance Rg can be reduced. As a result, switching characteristics can be improved.
- Especially, because the gate-drain capacitance (Qgd) is reduced, the gate resistance can be reduced if the width of a groove where the gate portion is formed is made small (particularly, in the case where the groove is formed as a stripe). Thus, it becomes possible to reduce the gate-drain capacitance (Qgd), ensure high-speed switching operation due to the reduction of the gate resistance and reduce a switching loss.
- Especially, where the groove pattern is formed as a stripe, it is possible to reduce the gate resistance according to this embodiment with the tendency that the gate resistance Rg increases in proportion to the pattern length of the groove over the case using a pattern of FIG. 37 described hereinafter because the cells arranged in parallel become small in number.
- Upon driving LSI, there is a tendency toward low voltage and great electric current. For instance, with CPU of a notebook computer, studies have been made to design a drive voltage at about 1.6V and an applied current at about20A. In addition, miniaturization of a notebook computer and the like has been greatly required for which a working frequency (f) is in a high frequency range of from 300 kHz to 500 kHz. Studies on the breakdown of a loss of a synchronous rectifying circuit used as a power supply for notebook computers and constituted of power MISFET reveal that the sum of “on” loss and switching loss is at 50% or over. Accordingly, it will be seen that the reduction of these losses contributes greatly to high efficiency.
- FIG. 17 is a graph showing the relation between the gate resistance Rg(Ω) and the efficiency η (%) . As shown in the figure, the efficiency at a frequency of 1 MHz becomes lower than that at 300 kHz. In either case, the efficiency increases with a decreasing gate resistance. However, it will be seen that with the case where the frequency f is at 1 MHz, the gradient in the graph is sharper than that at 300 kHz, and an increasing rate of the efficiency based on the lowering of the gate resistance is great. It will be noted that the input potential Vin is at 12V, the out potential Vout is at 1.6 V and the output current Iout is at 10A.
- Accordingly, in power MISFET corresponding to a high frequency potential, it is convenient to use such a structure as stated in this embodiment.
- It will be noted that extensive studies on the structure have been made wherein a gate finger portion G2 and the like are disposed, revealing that the gate resistance can be suppressed to 1 Ω or below.
- Upon comparison with an existing structure checked by the inventors (i.e. a structure having such a pattern of a
groove 7 as shown in FIG. 38 and not formed with the gate finger portion G2), the device having the structure according to this embodiment exhibits an improved efficiency of about 2% at 300 kHz and from 2 to 4% at 1 MHz. - In this manner, the gate resistance Rg can be reduced and thus, the efficiency can be improved.
- It will be noted that the shape in pattern of the contact groove may be any one which allows the connection between the gate electrode GE and the gate portion G, and also between the source electrode SE and the n+-
type semiconductive region 17 and should not be construed as limiting to the shape which has been illustrated with reference to FIG. 9. However, in order to reduce the gate resistance Rg and the like, it is as a matter of course that the contact area of these portions should preferably be greater. - Although the polysilicon film is used as a gate portion in this embodiment, other types of films including a silicide film and a composite film of polysilicon and silicide may be likewise used.
- (Embodiment 2)
- Although the space S1 is provided between the
contact groove Embodiment 1, thecontact grooves - FIG. 18 shows a pattern of contact grooves (21 a, 21 b, 21 s). FIG. 19 shows a pattern of a gate electrode GE and a source electrode SE. As shown in FIG. 19, the source electrode SE is divided into halves.
- It will be noted that because those other than the patterns of the contact grooves and the gate electrode GE and the source electrode SE are similar to in
Embodiment 1, the structures of the respective members and procedures for forming same are not described herein. - (Embodiment 3)
- The case where only one gate finger portion G2 is formed along the direction of X (see FIGS. 11, 12) has been illustrated in
Embodiment 1. Alternatively, an increasing number of gate fingers may be provided as described below. - FIG. 20 shows a pattern of a gate electrode GE and a source electrode SE wherein two gate finger portions G2 are provided.
- FIG. 21 is a pattern of a gate electrode GE and a source electrode SE wherein three gate finger portions G2 are provided.
- It will be noted that contact grooves (21 a, 21 b) may be formed in the same pattern as the gate electrode GE.
- In this way, an increase in number of the gate finger portions allows the gate resistance Rg to be efficiently reduced. Especially, it is preferred that where the gate portion G is elongated along the direction of Y correspondingly to the size of the chip region, the number of gate fingers is increased to reduce the gate resistance.
- In FIGS. 20 and 21, any gate finger G2 is not provided over the space S1. Alternatively, as illustrated with respect to
Embodiment 2, the gate finger portion G2 may be connected to the gate electrode portion G1 over the space S1. - (Embodiment 4)
- In this embodiment, the procedure of forming bump electrodes on the
openings Embodiment 1 and mounting a chip is described. - FIGS.22 to 28 are, respectively, a sectional or plan view of an essential part such as of a substrate showing a method of fabricating a semiconductor device according to this embodiment.
- Initially, a
substrate 1 of the type, which has been described inEmbodiment 1 with reference to FIGS. 14 and 15, is provided. As shown in FIGS. 22 to 24,bump electrodes openings opening 31 s, and FIG. 24 is a plan view of an essential part of the substrate. FIG. 23 corresponds to the section taken along line B-B of FIG. 24. - Reference numeral37 g indicates a bump electrode for connection with a gate electrode DE, and
reference numeral 37 s indicates a bump electrode for connection with a source electrode SE. Thesebump electrodes openings - Next, the wafer-shaped
substrate 1 is diced, for example, in a rectangular form along the chip region. - Thereafter, as shown in FIGS. 25 and 26, a chip CH is bonded to and fixed on a lead frame R1 at the back side thereof by use of a silver (Ag)
paste 39 or the like. The lead frame R1 has a chip mounting portion R1 a and an external terminal R1 b. In doing so, the lead frame R1 and the back side (drain electrode DE) of the chip CH are electrically connected to each other. More particularly, the external terminal R1 b becomes a drain terminal DT. - On the other hand, the chip CH has a lead frame R2 mounted on the surface side thereof, followed by thermocompression to permit the
bump electrodes bump 37 s, respectively, and the external terminal R2 a is electrically connected to thebump electrode 37 g. More particularly, the external terminal Ra serves as a gate terminal GT and the external terminals R2 b to R2 d serve as a source terminal ST. - Subsequently, as shown in FIGS. 27 and 28, a
resin melt 41 is charged and cured, for sealing, between the chip CH and lead frame R2 and over the lead frame R2. - According to this embodiment, because the connection with the external terminals R2 a to R2 d is established by use of the bump electrodes, the connection resistance between the source electrode SE or gate electrode GE and each of the external terminals R2 a to R2 d can be reduced.
- For instance, although these connections are possible by use of a wire such as of a gold wire, the resistance of the gold wire and the inductance of a source or a gate undesirably increase.
- If this inductance is great, (1) a transient induced voltage occurs. This voltage acts as a negative feedback relative to gate drive voltage and increases an ON resistance in the course of the period of transition. Moreover, 2) an impedance between source and drain increases, adversely influencing the transient characteristics under working conditions at a large electric current and at a high value of di/dt. Such problems as mentioned above are more frequently experienced as the frequency becomes higher.
- In contrast, according to this embodiment, the inductance can be reduced, with an improved efficiency and improved device characteristics. It will be noted that as a result of the inventors' study, the device of this embodiment has an efficiency higher by about 1 to 2% than a package using a gold wire.
- Especially, as described in detail in
Embodiment 1, if the resistance Rg of the gate portion is reduced by trying various measures for the arrangement of the gate electrode and the source electrode, the reduction effect of the gate resistance Rg cannot be satisfactorily shown under high frequency working conditions in case where the resistance or inductance becomes large in association with external terminals. - Accordingly, the package form (or package structure) set forth in this embodiment may be one which is suitable for use in power MISFET set out in
Embodiment 1 and the like. Of course, this package structure may be applicable to structures different from the power MISFET described inEmbodiment 1. - (Embodiment 5)
- In Embodiment 4, although the bump electrodes have been formed on the gate electrode GE and the like, a bump electrode may be formed after formation of a conductive film made, for example, of Al on the gate electrode GE as described below.
- FIGS. 29 and 30 is, respectively, a sectional view of an essential part of a substrate and the like showing a semiconductor device according to this embodiment.
- First, a
substrate 1 of the type, which has been illustrated with reference to FIGS. 14 and 15 inEmbodiment 1, is provided. As shown in FIGS. 29 and 30, a conductive film such as, for example, an Al film (33) is deposited over apolyimide resin film 29 including the insides of theopenings - Next, the Al film (33) is so patterned as to be larger in size than the
openings reference numeral 33 s indicates an Al film over theopening 31 s. - Thereafter, bump
electrodes Al films - The wafer-shaped
substrate 1 is diced and individual chips are packaged. These steps may be performed in the same manner as in Embodiment 4 and are not described again. - As will be apparent from the above, the
Al films bump electrodes Al film 27 constituting the gate electrode and the source electrode in accordance with this embodiment, so that stress exerted upon the formation of thebump electrodes - With packaging using a so-called wire bonding technique, stress is exerted on chips only when wire bonding is performed. Accordingly, the need for applying the embodiment of the invention to the technique is not great. Nevertheless, the technique set out in this embodiment is important for the package using bump electrodes because stress is applied to not only at the time of formation of bump electrodes, but also at the time of connection (thermocompression) between the lead frame and the bump electrode, under which bonding damage is liable to occur.
- This stress may be mitigated by forming a thick Al film (27) constituting the gate electrode and the source electrode. However, if the Al film is formed as being thick, a subsequent processing step (i.e. for the formation of gate and source electrodes) becomes difficult.
- Especially, as illustrated in
Embodiment 1 or the like, where the gate finger portion G2 is provided at the gate electrode GE, the pattern becomes complicated in shape, so that the procedure of this embodiment wherein the Al films are built up is appropriate. - The
Al films openings Al films - In the power MISFET illustrated in
Embodiment 1 or the like, a bump electrode is formed over the gate portion G and the gate portion G has a trench structure. In this case, stress is liable to be exerted on the upper end portion of thegroove 7 shown in FIG. 22, thereby causing gate breakage. In the case, it is favorable to use conductive films (i.e. theAl films Embodiment 1. - (Embodiment 6)
- Many tests (inspections) are usually conducted in the course of fabrication of semiconductor devices or after completion of the devices.
- For instance, whether or not power MISFET works properly is inspected by applying a given potential to the gate electrode GE or source electrode SE that has been illustrated with reference to FIG. 11 in
Embodiment 1. This inspection is called a probe inspection, which is carried out by applying a potential via a probe to electrodes of individual chip regions of a wafer-shaped substrate. - This probe inspection may be carried out, for example, by bringing a probe into contact with the gate electrode GE and the source electrode SE exposed from the
openings - If bump electrodes (37 g, 37 s) are formed on the probe traces, connection failure or the lowering of connection strength may be caused.
- To avoid this, according to this embodiment, an
opening 31 p for probe inspection (or for measurement) is provided aside from the openings for bump electrodes (FIG. 31). A plurality ofopenings 31 p may be provided depending on the number of inspections. For example, a sense inspection terminal, a focus inspection terminal and the like may be provided. - In the MISFET of this embodiment, a pad for probe inspection is formed on a so-called active region in order to make effective use of the chip area. The term “on active region” means, for example, a region that is marked out with the
silicon oxide film 3 formed beneath the gate electrode GE shown in FIG. 16. The active region is partitioned with thissilicon oxide film 3 substantially in a rectangular form. In other words, the active region is surrounded with thesilicon oxide film 3. - In contrast, a pad for probe inspection may be provided, for example, at a region other than the active region (e.g. a stripe region extending to around the active region or between the chip regions). However, such a region is very narrow, making it difficult to provide the pad for probe inspection. If a pad for probe inspection is provided in a peripheral region, the chip size becomes great, so that the number of chips obtained form one wafer is reduced. This eventually leads to higher manufacture costs.
- FIG. 31 is a plan view of an essential part of the substrate after the formation of openings. An
opening 31 p is formed over the source electrode SE simultaneously with the formation of theopenings polyimide film 29, inclusive, are carried out in the same manner as inEmbodiment 1 and are not described again. After the formation of theopening 31 p, such an opening is used for probe inspection, after which bump electrodes are formed in the same manner as in Embodiment 4, followed by dicing and packaging. Of course, an opening for probe inspection may be formed over the gate electrode. - The pattern of the
opening 31 p is in a rectangular (or oblong) form. The rectangle-shaped pattern permits easy contact of a probe and a reduced opening area. It should be noted that anybump electrode 31 p is not formed over theopening 31 p, which is covered, for example, with aresin 41. - As shown in FIG. 36, for example, in case where any gate finger portion G2 is not formed, a large-
sized opening 50 s can be formed within a chip region CA. In this case, it is unlikely that a bonding portion is formed on a probe trace. - Accordingly, as illustrated in the above embodiment, where the gate finger portion G2 is provided or where connection with an external terminal through a bump electrode is intended, it is preferred to form an
opening 31 p for probe inspection. - As having illustrated in
Embodiment 2, where the gate finger portion G2 and the gate electrode portion G1 formed along the periphery of the chip region CA are connected with each other over the space S1, it is favorable to form anopening 31 p for probe inspection on individual halves obtained by division of the source electrode SE. - In this way, when the
opening 31 p for probe inspection is formed on each of the divided source electrode SE, element characteristics of the respective region can be accurately obtained. - On the contrary, where the patterns of the source electrode SE are integrally connected with each other, it is convenient to form an
opening 31 p for probe inspection in any of the regions and the probe inspection time (number of inspections) can be reduced. - In this embodiment, although the case where the electrode is divided into halves (FIG. 31) has been illustrated, this embodiment is applicable to the case where the electrode is divided into plural pieces as illustrated in
Embodiment 3. FIG. 33 shows an instance of a layout ofopenings 31 p for probe inspection in case where two gate fingers G2 are provided. Likewise, FIG. 34 shows an instance of a layout ofopenings 31 p for probe inspection in case where three gate fingers G2 are provided. - According to this embodiment, unlike the case shown in FIG. 36, the source electrode SE and the like are widely covered with a polyimide resin, so that a satisfactory contact area with a sealing resin is ensured, thereby preventing moisture or the like from entering into the openings.
- It will be noted that this embodiment is applicable to a structure other than that of power MISFET set forth in
Embodiment 1. - Although the invention made by us has been particularly described based on the embodiments, the invention should not be construed as limiting top these embodiments and many changes are possible without departing from the spirit of the invention.
- Especially, in the foregoing embodiments, the case where the
groove 7 is in a striped pattern has been set out. Besides, the groove may be formed in such patterns as shown in FIGS. 37 and 38, respectively. FIG. 37 shows a case where the external shape of thegroove 7 is in octagon-shaped mesh, and FIG. 38 shows a case where the external shape of thegroove 7 is in square-shaped mesh. - The effects of typical embodiments disclosed in the present invention are briefly described below.
- Agate finger (second portion) is provided at a gate electrode of power MISFET, so that the gate resistance can be reduced, thus leading to improved characteristics of semiconductor device.
- The gate electrode and source electrode of power MISFET are connected to external terminals by use of bump electrodes, so that the characteristics of semiconductor device can be improved.
Claims (23)
1. A semiconductor device comprising:
(a) a MISFET formed in a chip region of a semiconductor substrate and having a gate portion, a source portion and a drain portion, each comprised of a first conductor;
(b) a gate electrode which is electrically connected with said gate portion and is comprised of a second conductor having a resistivity lower than said first conductor, said gate electrode including
(b1) a first portion formed along a periphery of said chip region and
(b2) a second portion connected with said first portion and formed on the inside of said first portion in said chip region;
(c) a source electrode which is electrically connected with said source portion and is comprised of said second conductor and which is formed plurally within said chip region; and
(d) a bump electrode formed on the upper portions of said gate electrode and said plural source electrodes, respectively,
(e) wherein said gate electrode and said plural source electrodes are arranged at the same layer level and
(f) wherein said second portion of said gate electrode is arranged between adjacent source electrodes of said plural source electrodes.
2. The semiconductor device according to claim 1 ,
wherein said gate portion and said source portion are, respectively, formed at a first surface of said semiconductor substrate, and
wherein said drain portion is formed at a second surface opposite to said first surface.
3. The semiconductor device according to claim 1 ,
wherein said first conductor is made mainly of silicon and said second conductor is made mainly of aluminium.
4. The semiconductor device according to claim 1 ,
wherein said gate portion is comprised of said first conductor formed within a groove of said semiconductor substrate.
5. The semiconductor device according to claim 1 , wherein said gate portion is formed plurally in number in a striped form within said chip region.
6. The semiconductor device according to claim 1 ,
wherein said chip region is substantially in a rectangular form, and
wherein said second portion of said gate electrode extends along the long side of said chip region.
7. The semiconductor device according to claim 1 ,
wherein said gate portion is formed plurally in number within said chip region and
wherein said second portion of said gate electrode extends in a direction intersecting perpendicularly to the extending direction of said gate portion.
8. The semiconductor device according to claim 1 , wherein said plural source electrodes contains two source electrodes.
9. The semiconductor device according to claim 1 , further comprising:
(g) a protective film having openings over said gate electrode and said plural source electrodes, respectively, and
(h) said bump electrodes being, respectively, formed at said openings over said gate electrode and said plural source electrodes and are electrically connected with said gate electrode and said plural source electrodes.
10. The semiconductor device according to claim 9 ,
wherein said semiconductor substrate has a first region and a second region surrounding said first region therewith, and
wherein said MISFET is formed at said first region,
said semiconductor device further comprising:
(i) other openings in said protective film
wherein said other openings are formed over said first region and also over said plural source electrodes, respectively.
11. The semiconductor device according to claim 9 ,
wherein said semiconductor substrate has a first region and a second region surrounding said first region therewith and
wherein said MISFET is formed within said first region, and
(i) wherein said plural source electrodes are, respectively, connected with a connection unit formed at the same layer level as the source electrodes,
said semiconductor device further comprising:
(j) another opening in said protective layer, the opening being formed over said first region and also over a single source electrode among said plural source electrodes.
12. The semiconductor device according to claim 1 , further comprising:
(g) a packaging plate having a plurality of external terminals; and
(h) said plural external terminals being connected with said gate electrode and said plural source electrodes via said bump electrodes, respectively.
13. A semiconductor device comprising:
(a) a MISFET formed in a substantially rectangle-shaped chip region of a semiconductor substrate and having
(a1) a gate portion which is formed inside a plurality of grooves arranged in said semiconductor substrate and in a striped form along a short side of said substantially rectangle-shaped chip region and is comprised of a silicon film,
(a2) a source portion formed between adjacent grooves of said plural striped grooves and comprised of a first semiconductor region, and
(a3) a drain portion formed on a back side of said semiconductor substrate and comprised of a second semiconductor region;
(b) a gate electrode which is electrically connected with said gate portion and is comprised of an aluminium film, said gate electrode including:
(b1) a first portion formed along a periphery of said chip region;
(b2) a second portion connected with said first portion and extending along a long side of said first portion so that said first portion is divided approximately into halves along the long side thereof;
(c) two source electrodes which are electrically connected with said source portions, are comprised of said aluminium film, are arranged at the same layer level as said gate electrode and are formed on said chip region divided approximately into halves, respectively; and
(d) a bump electrode formed over said gate electrode and said two source electrodes, respectively.
14. The semiconductor device according to claim 13 , further comprising:
(e) a protective film having openings over said gate electrode and said two source electrodes; and
(f) said bump electrode being formed in said openings over said gate electrode and said two source electrodes and electrically connected with said gate and said two source electrodes, respectively.
15. The semiconductor device according to claim 14 ,
wherein said semiconductor substrate has a first region and a second region surrounding said first region therewith, and
wherein said MISFET is formed within said first region, said semiconductor device further comprising:
(g) other openings in said protective film
wherein said other openings are over said first region and also over said two source electrodes, respectively.
16. The semiconductor device according to claim 14 ,
wherein said semiconductor substrate has a first region and a second region surrounding said first region therewith, and
wherein said MISFET is formed within said first region,
(g) wherein said two source electrodes are connected with each other through said aluminium film in the vicinity of an end portion of the second portion of said gate electrode,
said semiconductor device further comprising:
(h) other openings in said protective film
wherein said other openings are over said first region and also over only either of said two source electrodes.
17. The semiconductor device according to claim 13 , further comprising:
(e) a packaging plate having a plurality of external terminals; and
(f) said plural external terminals being connected with said gate electrode and said two source electrodes through said bump electrodes, respectively.
18. A semiconductor device comprising:
(a) A MISFET having a gate portion which is comprised of a first conductor inside a groove formed in a first surface of a semiconductor substrate, a source portion formed at said first surface, and a drain portion formed at a second surface opposite to said first surface;
(b) a gate electrode and a source electrode which are electrically connected to said gate portion and said source portion, respectively, and both of which serve as a first wiring layer;
(c) bump electrodes formed over said gate portion and said source portion for electric connection with said gate portion and said source portion, respectively.
(d) a second conductor film formed between said gate electrode and one of said bump electrodes for connection therewith and serving as a second wiring layer, and
a third conductor film formed between said source electrode and the other bump electrode for electric connection therewith and serving as said second wiring layer.
19. The semiconductor device according to claim 18 , further comprising:
(e) a protective film having openings over aid gate electrode and said source electrode, respectively; and
(f) said bump electrodes being formed at said openings over said gate electrode and said source electrode for electric connection with said gate electrode and said source electrode.
20. A semiconductor device comprising:
(a) a MISFET having a gate portion comprised of a first conductor at the inside of a groove formed in a first surface of a semiconductor substrate, a source portion formed at said first surface and a drain portion formed at a second surface opposite to said first surface;
(b) a gate electrode and a source electrode electrically connected to said gate portion and said source portion, respectively, and being positioned at the same layer level;
(c) a protective film having first openings formed over said gate electrode and said source electrode;
(d) a bump electrode formed at the first openings over said gate electrode and said source electrode and electrically connected to said gate electrode and said source electrode; and
(e) a second opening formed in said protective film over said source electrode and serving for inspection.
21. The semiconductor device according to claim 20 ,
wherein said first openings have substantially a circular form in plane.
22. The semiconductor device according to claim 20 , wherein said second opening has substantially a rectangular form in plane.
23. The semiconductor device according to claim 20 ,
wherein said MISFET is formed in the chip region of said semiconductor substrate,
wherein said groove is formed as a stripe extending along the first direction,
wherein said gate electrode has a first portion formed along a periphery of said chip region and a second portion extending in such a way that said chip region is divided into a plurality of regions in a second direction intersecting perpendicularly to said first direction, and
wherein the bump electrode electrically connected with said source electrode is formed in said plural divided regions, respectively.
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-
2005
- 2005-07-14 US US11/180,612 patent/US7317224B2/en not_active Expired - Lifetime
-
2007
- 2007-11-21 US US11/944,343 patent/US7768065B2/en not_active Expired - Lifetime
-
2010
- 2010-02-19 US US12/709,260 patent/US8536643B2/en active Active
- 2010-12-09 US US12/964,651 patent/US8120102B2/en not_active Expired - Lifetime
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US9461163B2 (en) | 2004-07-30 | 2016-10-04 | Renesas Electronics Corporation | Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same |
US9793265B2 (en) | 2004-07-30 | 2017-10-17 | Renesas Electronics Corporation | Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same |
US8853846B2 (en) | 2004-07-30 | 2014-10-07 | Renesas Electronics Corporation | Semiconductor device and a manufacturing method of the same |
US20140332878A1 (en) * | 2004-07-30 | 2014-11-13 | Renesas Electronics Corporation | Semiconductor device and a manufacturing method of the same |
US9153686B2 (en) * | 2004-07-30 | 2015-10-06 | Renesas Electronics Corporation | Semiconductor device including DC-DC converter |
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US20060163650A1 (en) * | 2005-01-27 | 2006-07-27 | Ling Ma | Power semiconductor device with endless gate trenches |
US20080206944A1 (en) * | 2007-02-23 | 2008-08-28 | Pan-Jit International Inc. | Method for fabricating trench DMOS transistors and schottky elements |
US10074744B2 (en) | 2014-01-31 | 2018-09-11 | Renesas Electronics Corporation | Semiconductor device |
CN104969356A (en) * | 2014-01-31 | 2015-10-07 | 瑞萨电子株式会社 | Semiconductor device |
US20170207180A1 (en) * | 2016-01-19 | 2017-07-20 | Ubiq Semiconductor Corp. | Semiconductor device |
US20210287971A1 (en) * | 2020-03-16 | 2021-09-16 | Kabushiki Kaisha Toshiba | Semiconductor device |
EP4254511A1 (en) * | 2022-04-01 | 2023-10-04 | STMicroelectronics S.r.l. | Electronic device with reduced switching oscillations |
Also Published As
Publication number | Publication date |
---|---|
US7768065B2 (en) | 2010-08-03 |
JP2004055812A (en) | 2004-02-19 |
US20080073714A1 (en) | 2008-03-27 |
US20050012144A1 (en) | 2005-01-20 |
US8120102B2 (en) | 2012-02-21 |
US6930354B2 (en) | 2005-08-16 |
US20100148247A1 (en) | 2010-06-17 |
US8536643B2 (en) | 2013-09-17 |
US20110079842A1 (en) | 2011-04-07 |
US7317224B2 (en) | 2008-01-08 |
US20050242393A1 (en) | 2005-11-03 |
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