US20030038314A1 - Semiconductor device and method of manufacturing the same - Google Patents
Semiconductor device and method of manufacturing the same Download PDFInfo
- Publication number
- US20030038314A1 US20030038314A1 US10/277,891 US27789102A US2003038314A1 US 20030038314 A1 US20030038314 A1 US 20030038314A1 US 27789102 A US27789102 A US 27789102A US 2003038314 A1 US2003038314 A1 US 2003038314A1
- Authority
- US
- United States
- Prior art keywords
- electrode
- insulating film
- film
- capacitor
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
Definitions
- the present invention relates to a semiconductor device with a capacitor using tungsten nitride as a material to form an electrode, and a method of manufacturing the same.
- DRAM dynamic random access memory
- a technique which increases the substantial area by forming a capacitor with a cylindrical or multilayered electrode structure, so that the memory capacity is increased without increasing the memory cell size.
- a plate electrode which forms a capacitor is formed on a capacitor film having a large step.
- a conductor layer serving as the plate electrode to be formed on the capacitor film must be formed continuously including a step portion produced by the thickness portion of the capacitor film.
- Tungsten nitride, titanium nitride, ruthenium, or the like that can be formed with a good step coverage is used as the material of the conductor film, because these conductive materials can form a film by chemical vapor deposition (CVD) having a good step coverage.
- CVD chemical vapor deposition
- tungsten nitride is superior in terms of adhesion properties and easiness to be processed to the electrode, and low leakage.
- Tungsten nitride is less expensive and easier to be processed to the electrode than ruthenium.
- tungsten nitride can form a film with less damaging to an underlying capacitor film than titanium nitride.
- a gate electrode 704 is formed on that region on a semiconductor substrate 701 , which is defined by an isolation region 702 through a gate insulating film 703 . Impurity regions are formed in the semiconductor substrate 701 on the two sides of the gate electrode 704 by ion implantation or the like using the gate electrode 704 as a mask, thereby forming source/drain regions 705 .
- An interlevel insulating film 706 is formed on the gate electrode 704 over the entire surface of the semiconductor substrate 701 .
- a contact plug 707 to be connected to the corresponding source/drain region 705 formed in the semiconductor substrate 701 is formed at a predetermined position of the interlevel insulating film 706 .
- a bit line 708 is formed to be connected to the contact plug 707 .
- An interlevel insulating film 709 is formed on the interlevel insulating film 706 including the bit line 708 .
- a contact plug 710 to be connected to the corresponding source/drain region 705 formed in the semiconductor substrate 701 is formed to extend through the interlevel insulating films 709 and 706 .
- a storage electrode 711 is formed on the contact plug 710 through a barrier film 710 a.
- a capacitor insulating film 712 is formed to cover the storage electrode 711 , and a plate electrode 713 made of tungsten nitride is formed to cover the storage electrode 711 and capacitor insulating film 712 .
- a transistor comprised of the gate electrode 704 , and a capacitor to be connected to this transistor and comprised of the storage electrode 711 , capacitor insulating film 712 , and plate electrode 713 make up the basic unit of the memory cell.
- An interlevel insulating film 714 made of an insulator is formed also on the interlevel insulating film 709 including the plate electrode 713 .
- an interconnection layer to be connected to the bit line 708 and plate electrode 713 is formed on the interlevel insulating film 714 .
- the interlevel insulating film is formed on the plate electrode, for example, when a contact between the interconnection formed on the interlevel insulating film on the plate electrode and the silicon substrate is to be formed, high-temperature annealing at approximately 600° C. is sometimes performed. If such a high temperature is applied, cracking may occur in the plate electrode or in the worst case, the plate electrode may be peeled.
- the principal object of the present invention to provide a method of manufacturing a semiconductor device, by which even if a high temperature is applied in the post-process to a tungsten nitride electrode which forms a capacitor, cracking or peeling will not occur in the electrode.
- a semiconductor device comprising at least one interlevel insulating film arranged on a semiconductor substrate, a first electrode made of a metal material and arranged on the interlevel insulating film, a capacitor insulating film made of an insulating metal oxide and arranged on the first electrode, a second electrode made of tungsten nitride and arranged on the capacitor insulating film, and a protective film arranged on the second electrode to suppress outward diffusion of nitrogen from the second electrode.
- FIG. 1 is a sectional view schematically showing the arrangement of a semiconductor device according to the present invention
- FIGS. 2A to 6 L are sectional views showing the steps in a method of manufacturing the semiconductor device shown in FIG. 1;
- FIG. 7 is a schematical sectional view showing the arrangement of a conventional semiconductor device.
- FIG. 1 shows a semiconductor device according to an embodiment of the present invention.
- a gate electrode 104 is formed on that region on a semiconductor substrate 101 , which is defined by an isolation region 102 through a gate insulating film 103 .
- impurity regions are formed in the semiconductor substrate 101 on the two sides of the gate electrode 104 by diffusion with ion implantation or the like using the gate electrode 104 as a mask, thereby forming source/drain regions 105 .
- An interlevel insulating film 106 is formed over the entire surface of the semiconductor substrate 101 including the gate electrode 104 .
- a contact plug 107 to be connected to the corresponding source/drain region 105 formed in the semiconductor substrate 101 is formed at a predetermined position of the interlevel insulating film 106 .
- the contact plug 107 is connected to a bit line 108 arranged on the interlevel insulating film 106 .
- An interlevel insulating film 109 is formed on the interlevel insulating film 106 including the bit line 108 .
- a contact plug 110 to be connected to the corresponding drain/source region 105 formed in the semiconductor substrate 101 is formed to extend through the interlevel insulating films 109 and 106 .
- a storage electrode 111 is formed on the contact plug 110 through a barrier film 110 a.
- a capacitor insulating film 112 is formed to cover the storage electrode 111 , and a plate electrode 113 made of tungsten nitride is formed to cover the storage electrode 111 and capacitor insulating film 112 .
- a protective film 113 a made of a metal silicide such as tungsten silicide is formed to cover the upper surface of the plate electrode 113 .
- An interlevel insulating film 114 made of an insulator is formed also on the interlevel insulating film 109 including the plate electrode 113 .
- an interconnection layer to be connected to the bit line 108 and plate electrode 113 is formed on the interlevel insulating film 114 .
- the protective film 113 a made of the metal silicide is formed on the upper surface of the plate electrode 113 , even if high-temperature annealing at, e.g., 600° C. or more is performed in the post-process, cracking in the plate electrode 113 can be suppressed.
- the above problem of cracking in the plate electrode is supposed to occur because, during the high-temperature annealing in the post-process, nitrogen is diffused outward from tungsten nitride that forms the plate to cause shrinkage of the plate electrode.
- This outward diffusion of nitrogen can be suppressed by the above protective film made of the metal silicide, so cracking or the like in the plate electrode can be suppressed.
- outward diffusion described above is suppressed in the following manner.
- a gate electrode 104 is formed by a known method on that region on a silicon substrate 101 , which is defined by an isolation region 102 through a gate oxide film 103 .
- source/drain regions 105 are formed by ion implantation or the like using the gate electrode 104 as a mask.
- an interlevel insulating film 106 made of an insulator such as silicon oxide is formed on the entire region of the silicon substrate 101 .
- a contact plug 107 to be connected to either one of the source/drain regions 105 formed in the semiconductor substrate 101 is formed at a predetermined position.
- a bit line 108 is formed to be connected to the contact plug 107 .
- an interlevel insulating film 109 made of an insulator such as silicon oxide is formed on the interlevel insulating film 106 including the bit line 108 .
- a contact hole 301 is formed in the interlevel insulating films 109 and 106 by the known photolithography or etching technique to reach the corresponding source/drain region 105 .
- polysilicon is deposited on the interlevel insulating film 109 so as to fill the contact hole 301 , thereby forming a polysilicon film 302 as shown in FIG. 3E.
- Polysilicon may be deposited by, e.g., CVD.
- the polysilicon film 302 is selectively etched back so a contact plug 110 made of polysilicon is formed in the contact hole 301 while keeping a certain space in the upper portion of the contact hole 301 , as shown in FIG. 3F.
- Selective etch-back of the polysilicon film 302 may be performed by reactive dry etching using an etching gas that has a selectivity with respect to silicon and does not substantially etch the interlevel insulating film 109 .
- processes such as film formation and CMP or etch-back are performed to form a barrier film 110 a to cover the upper surface of the contact plug 110 .
- the metal film 401 is patterned by the known photolithography and etching techniques to form a storage electrode (first electrode) 111 on the interlevel insulating film 109 so as to be connected to the contact plug 110 through the barrier film 110 a , as shown in FIG. 4I.
- the material of the storage electrode is not limited to ruthenium, but gold or platinum may also be used instead.
- a tantalum oxide film is formed on the interlevel insulating film 109 to a thickness of about 5 nm to 20 nm to cover the storage electrode 111 , and is subjected to the post-process by, e.g., annealing in an oxygen atmosphere at a temperature of approximately 500° C. to 700° C., to form a capacitor insulating film 112 , as shown in FIG. 5J.
- the material of the capacitor insulating film is not limited to tantalum oxide, but other metal oxides may also be used instead.
- These two films are patterned by the known photolithography and etching techniques, thereby forming a plate electrode (second electrode) 113 with an upper surface being covered by a protective film 113 a , as shown in FIG. 5K.
- Formation of the tungsten nitride film and formation of the tungsten silicide film described above are preferably performed continuously in a single apparatus by thermal chemical vapor deposition (thermal CVD).
- thermal CVD thermal chemical vapor deposition
- a tungsten silicide is formed on the formed tungsten nitride film.
- a native insulating layer or the like will not be formed at the interface between the tungsten nitride film and tungsten silicide.
- an interlevel insulating film 114 made of an insulating material such as silicon oxide is formed to cover the plate electrode 113 , thereby forming a 1-transistor, 1-capacitor DRAM, as shown in FIG. 6L.
- tungsten silicide is used as the material of the protective film.
- the present invention is not limited to this, and other metal suicides may be used. If a silicon nitride film is used as the protective film, the same effect can be obtained.
- the capacitor electrode forms a flat plate. If the capacitor has a cylindrical or multilayered electrode structure, the present invention can be applied in the same manner as in the above embodiment.
- a plate electrode—capacitor insulating film—storage electrode—capacitor insulating film—plate electrode are arranged in it in this order on the side surface from the outer side.
- the capacitor can have a multilayered electrode structure. In this case, a storage electrode is sometimes arranged at the uppermost layer.
- an interlevel insulating film is formed on a semiconductor substrate, a first electrode made of a metal material is formed on the interlevel insulating film, a capacitor insulating film made of an insulating metal oxide is formed on the first electrode, a second electrode made of tungsten nitride is formed by chemical vapor deposition on the surface of the first electrode while being insulated and isolated by the capacitor insulating film, and a protective film is formed on the second electrode to suppress outward diffusion of nitrogen from the second electrode.
- the protective film is formed on the second electrode. After the protective film is formed, nitrogen is suppressed from being outwardly diffused from tungsten nitride that forms the second electrode, and a change in volume of the second electrode by outward diffusion of nitrogen is suppressed. As a result, according to the present invention, even if high-temperature heat is applied in the post-process to the tungsten nitride electrode that forms the capacitor, cracking or peeling of the electrode can be suppressed, which is an excellent effect.
Abstract
A semiconductor device includes at least one interlevel insulating film, a storage electrode, a capacitor insulating film, a plate electrode, and a protective film. The interlevel insulating film is arranged on a semiconductor substrate. The storage electrode is made of a metal material and arranged on the interlevel insulating film. The capacitor insulating film is made of an insulating metal oxide and arranged on the storage electrode. The plate electrode is made of tungsten nitride and arranged on the capacitor insulating film. The protective film is arranged on the plate electrode to suppress outward diffusion of nitrogen from the plate electrode. A method of manufacturing the semiconductor device is also disclosed.
Description
- The present invention relates to a semiconductor device with a capacitor using tungsten nitride as a material to form an electrode, and a method of manufacturing the same.
- In a dynamic random access memory (DRAM) comprised of one transistor and one capacitor, along with an increase in integration degree of the integrated circuit, it is required to increase the memory capacity by reducing the memory cell area. In this requirement, a technique has been proposed which increases the substantial area by forming a capacitor with a cylindrical or multilayered electrode structure, so that the memory capacity is increased without increasing the memory cell size.
- For example, when a cylindrical capacitor structure is to be employed, a plate electrode which forms a capacitor is formed on a capacitor film having a large step. A conductor layer serving as the plate electrode to be formed on the capacitor film must be formed continuously including a step portion produced by the thickness portion of the capacitor film. Tungsten nitride, titanium nitride, ruthenium, or the like that can be formed with a good step coverage is used as the material of the conductor film, because these conductive materials can form a film by chemical vapor deposition (CVD) having a good step coverage. Among these conductive materials, tungsten nitride is superior in terms of adhesion properties and easiness to be processed to the electrode, and low leakage. Tungsten nitride is less expensive and easier to be processed to the electrode than ruthenium. Also, tungsten nitride can form a film with less damaging to an underlying capacitor film than titanium nitride.
- A DRAM using above tungsten nitride will be described.
- As shown in FIG. 7, a
gate electrode 704 is formed on that region on asemiconductor substrate 701, which is defined by anisolation region 702 through a gateinsulating film 703. Impurity regions are formed in thesemiconductor substrate 701 on the two sides of thegate electrode 704 by ion implantation or the like using thegate electrode 704 as a mask, thereby forming source/drain regions 705. - An interlevel
insulating film 706 is formed on thegate electrode 704 over the entire surface of thesemiconductor substrate 701. Acontact plug 707 to be connected to the corresponding source/drain region 705 formed in thesemiconductor substrate 701 is formed at a predetermined position of the interlevelinsulating film 706. Abit line 708 is formed to be connected to thecontact plug 707. - An interlevel
insulating film 709 is formed on the interlevelinsulating film 706 including thebit line 708. Acontact plug 710 to be connected to the corresponding source/drain region 705 formed in thesemiconductor substrate 701 is formed to extend through the interlevelinsulating films storage electrode 711 is formed on thecontact plug 710 through abarrier film 710 a. - A
capacitor insulating film 712 is formed to cover thestorage electrode 711, and aplate electrode 713 made of tungsten nitride is formed to cover thestorage electrode 711 and capacitorinsulating film 712. - In this manner, a transistor comprised of the
gate electrode 704, and a capacitor to be connected to this transistor and comprised of thestorage electrode 711,capacitor insulating film 712, andplate electrode 713 make up the basic unit of the memory cell. - An interlevel
insulating film 714 made of an insulator is formed also on the interlevel insulatingfilm 709 including theplate electrode 713. Although not shown, an interconnection layer to be connected to thebit line 708 and plate electrode 713 (described above) is formed on the interlevelinsulating film 714. - In the above semiconductor device, after the interlevel insulating film is formed on the plate electrode, for example, when a contact between the interconnection formed on the interlevel insulating film on the plate electrode and the silicon substrate is to be formed, high-temperature annealing at approximately 600° C. is sometimes performed. If such a high temperature is applied, cracking may occur in the plate electrode or in the worst case, the plate electrode may be peeled.
- It is, therefore, the principal object of the present invention to provide a method of manufacturing a semiconductor device, by which even if a high temperature is applied in the post-process to a tungsten nitride electrode which forms a capacitor, cracking or peeling will not occur in the electrode.
- In order to achieve the above object, according to the present invention, there is provided a semiconductor device comprising at least one interlevel insulating film arranged on a semiconductor substrate, a first electrode made of a metal material and arranged on the interlevel insulating film, a capacitor insulating film made of an insulating metal oxide and arranged on the first electrode, a second electrode made of tungsten nitride and arranged on the capacitor insulating film, and a protective film arranged on the second electrode to suppress outward diffusion of nitrogen from the second electrode.
- FIG. 1 is a sectional view schematically showing the arrangement of a semiconductor device according to the present invention;
- FIGS. 2A to6L are sectional views showing the steps in a method of manufacturing the semiconductor device shown in FIG. 1; and
- FIG. 7 is a schematical sectional view showing the arrangement of a conventional semiconductor device.
- An embodiment of the present invention will be described with reference to the accompanying drawings.
- FIG. 1 shows a semiconductor device according to an embodiment of the present invention. Referring to FIG. 1, a
gate electrode 104 is formed on that region on asemiconductor substrate 101, which is defined by anisolation region 102 through a gateinsulating film 103. In FIG. 1, impurity regions are formed in thesemiconductor substrate 101 on the two sides of thegate electrode 104 by diffusion with ion implantation or the like using thegate electrode 104 as a mask, thereby forming source/drain regions 105. - An interlevel
insulating film 106 is formed over the entire surface of thesemiconductor substrate 101 including thegate electrode 104. Acontact plug 107 to be connected to the corresponding source/drain region 105 formed in thesemiconductor substrate 101 is formed at a predetermined position of the interlevelinsulating film 106. Thecontact plug 107 is connected to abit line 108 arranged on the interlevelinsulating film 106. - An interlevel
insulating film 109 is formed on the interlevelinsulating film 106 including thebit line 108. Acontact plug 110 to be connected to the corresponding drain/source region 105 formed in thesemiconductor substrate 101 is formed to extend through the interlevelinsulating films storage electrode 111 is formed on thecontact plug 110 through abarrier film 110 a. - A capacitor
insulating film 112 is formed to cover thestorage electrode 111, and aplate electrode 113 made of tungsten nitride is formed to cover thestorage electrode 111 and capacitorinsulating film 112. A transistor comprised of thegate electrode 104, and a capacitor to be connected to this transistor and comprised of thestorage electrode 111, capacitorinsulating film 112, andplate electrode 113, each of which is described above, make up the basic unit of the memory cell. - In this embodiment, a protective film113 a made of a metal silicide such as tungsten silicide is formed to cover the upper surface of the
plate electrode 113. An interlevelinsulating film 114 made of an insulator is formed also on the interlevelinsulating film 109 including theplate electrode 113. Although not shown, an interconnection layer to be connected to thebit line 108 and plate electrode 113 (described above) is formed on the interlevelinsulating film 114. - As described above, since the protective film113 a made of the metal silicide is formed on the upper surface of the
plate electrode 113, even if high-temperature annealing at, e.g., 600° C. or more is performed in the post-process, cracking in theplate electrode 113 can be suppressed. - The above problem of cracking in the plate electrode is supposed to occur because, during the high-temperature annealing in the post-process, nitrogen is diffused outward from tungsten nitride that forms the plate to cause shrinkage of the plate electrode. This outward diffusion of nitrogen can be suppressed by the above protective film made of the metal silicide, so cracking or the like in the plate electrode can be suppressed. It is supposed that outward diffusion described above is suppressed in the following manner. When a metal silicide film is formed on tungsten nitride, when annealing exceeding at least 600° C. is performed, a dense thin film made of a nitride of the metal silicide is formed at the interface between tungsten nitride and the metal silicide film, thereby suppressing outward diffusion of nitrogen from the plate electrode.
- A manufacturing method will be described.
- A method of manufacturing a semiconductor device with the structure shown in FIG. 1 will be described with reference to FIGS. 2A to6L. First, as shown in FIG. 2A, a
gate electrode 104 is formed by a known method on that region on asilicon substrate 101, which is defined by anisolation region 102 through agate oxide film 103. After thegate electrode 104 is formed, source/drain regions 105 are formed by ion implantation or the like using thegate electrode 104 as a mask. - As shown in FIG. 2B, an interlevel
insulating film 106 made of an insulator such as silicon oxide is formed on the entire region of thesilicon substrate 101. Acontact plug 107 to be connected to either one of the source/drain regions 105 formed in thesemiconductor substrate 101 is formed at a predetermined position. Abit line 108 is formed to be connected to thecontact plug 107. - As shown in FIG. 3C, an interlevel
insulating film 109 made of an insulator such as silicon oxide is formed on the interlevelinsulating film 106 including thebit line 108. As shown in FIG. 3D, acontact hole 301 is formed in the interlevel insulatingfilms drain region 105. - Subsequently, polysilicon is deposited on the interlevel
insulating film 109 so as to fill thecontact hole 301, thereby forming apolysilicon film 302 as shown in FIG. 3E. Polysilicon may be deposited by, e.g., CVD. - The
polysilicon film 302 is selectively etched back so acontact plug 110 made of polysilicon is formed in thecontact hole 301 while keeping a certain space in the upper portion of thecontact hole 301, as shown in FIG. 3F. Selective etch-back of thepolysilicon film 302 may be performed by reactive dry etching using an etching gas that has a selectivity with respect to silicon and does not substantially etch the interlevelinsulating film 109. - As shown in FIG. 4G processes such as film formation and CMP or etch-back are performed to form a
barrier film 110 a to cover the upper surface of thecontact plug 110. - As shown in FIG. 4H, a
metal film 401 made of, e.g., ruthenium, is formed on the interlevelinsulating film 109 including thebarrier film 110 a by, e.g., sputtering or CVD, to a thickness of about 20 nm to 100 nm. - The
metal film 401 is patterned by the known photolithography and etching techniques to form a storage electrode (first electrode) 111 on the interlevelinsulating film 109 so as to be connected to thecontact plug 110 through thebarrier film 110 a, as shown in FIG. 4I. The material of the storage electrode is not limited to ruthenium, but gold or platinum may also be used instead. - A tantalum oxide film is formed on the interlevel
insulating film 109 to a thickness of about 5 nm to 20 nm to cover thestorage electrode 111, and is subjected to the post-process by, e.g., annealing in an oxygen atmosphere at a temperature of approximately 500° C. to 700° C., to form acapacitor insulating film 112, as shown in FIG. 5J. The material of the capacitor insulating film is not limited to tantalum oxide, but other metal oxides may also be used instead. - A conductive film made of, e.g., tungsten nitride, is formed on the
capacitor insulating film 112 to a thickness of about 10 nm to 30 nm and, for example, a tungsten silicide film is successively formed to a thickness of about 5 nm to 20 nm. These two films are patterned by the known photolithography and etching techniques, thereby forming a plate electrode (second electrode) 113 with an upper surface being covered by a protective film 113 a, as shown in FIG. 5K. - Formation of the tungsten nitride film and formation of the tungsten silicide film described above are preferably performed continuously in a single apparatus by thermal chemical vapor deposition (thermal CVD). First, using WF6 as the tungsten source gas and NH3 as the nitrogen source gas, and setting the substrate temperature to approximately 500° C., a tungsten nitride film is formed. Successively, using SiH4, in place of NH3, as the silicon source gas, tungsten silicide is formed on the formed tungsten nitride film. When film formation is continuously performed in this manner, a native insulating layer or the like will not be formed at the interface between the tungsten nitride film and tungsten silicide.
- After that, an interlevel
insulating film 114 made of an insulating material such as silicon oxide is formed to cover theplate electrode 113, thereby forming a 1-transistor, 1-capacitor DRAM, as shown in FIG. 6L. - In the above description, tungsten silicide is used as the material of the protective film. However, the present invention is not limited to this, and other metal suicides may be used. If a silicon nitride film is used as the protective film, the same effect can be obtained.
- In the above embodiment, the capacitor electrode forms a flat plate. If the capacitor has a cylindrical or multilayered electrode structure, the present invention can be applied in the same manner as in the above embodiment. When the capacitor electrode is cylindrical, a plate electrode—capacitor insulating film—storage electrode—capacitor insulating film—plate electrode are arranged in it in this order on the side surface from the outer side. Alternatively, the capacitor can have a multilayered electrode structure. In this case, a storage electrode is sometimes arranged at the uppermost layer.
- As has been described above, according to the present invention, an interlevel insulating film is formed on a semiconductor substrate, a first electrode made of a metal material is formed on the interlevel insulating film, a capacitor insulating film made of an insulating metal oxide is formed on the first electrode, a second electrode made of tungsten nitride is formed by chemical vapor deposition on the surface of the first electrode while being insulated and isolated by the capacitor insulating film, and a protective film is formed on the second electrode to suppress outward diffusion of nitrogen from the second electrode.
- According to the present invention, the protective film is formed on the second electrode. After the protective film is formed, nitrogen is suppressed from being outwardly diffused from tungsten nitride that forms the second electrode, and a change in volume of the second electrode by outward diffusion of nitrogen is suppressed. As a result, according to the present invention, even if high-temperature heat is applied in the post-process to the tungsten nitride electrode that forms the capacitor, cracking or peeling of the electrode can be suppressed, which is an excellent effect.
Claims (11)
1. A semiconductor device comprising:
at least one interlevel insulating film arranged on a semiconductor substrate;
a first electrode made of a metal material and arranged on said interlevel insulating film;
a capacitor insulating film made of an insulating metal oxide and arranged on said first electrode;
a second electrode made of tungsten nitride and arranged on said capacitor insulating film; and
a protective film arranged on said second electrode to suppress outward diffusion of nitrogen from said second electrode.
2. A device according to claim 1 , wherein said protective film is made of a metal silicide.
3. A device according to claim 2 , wherein said protective film is made of tungsten silicide.
4. A device according to claim 1 , wherein said protective film is made of silicon nitride.
5. A device according to claim 1 , wherein a transistor is arranged on said semiconductor substrate under said interlevel insulating film.
6. A method of manufacturing a semiconductor device, comprising the steps of:
forming at least one interlevel insulating film on a semiconductor substrate;
forming a first electrode made of a metal material on the interlevel insulating film;
forming a capacitor insulating film made of an insulating metal oxide on the first electrode;
forming a second electrode made of tungsten nitride, formed by thermal chemical vapor deposition, on the capacitor insulating film; and
forming a protective film on the second electrode to suppress outward diffusion of nitrogen from the second electrode.
7. A method according to claim 6 , wherein the protective film is made of a metal silicide.
8. A method according to claim 7 , wherein the protective film is made of tungsten silicide.
9. A method according to claim 6 , wherein the protective film is made of silicon nitride.
10. A method according to claim 6 , wherein the protective film is formed by thermal chemical vapor deposition using at least silicon source gas.
11. A method according to claim 6 , wherein a tungsten nitride film and a silicon-containing thin film are continuously formed on the semiconductor substrate on which the capacitor insulating film has been formed, and the tungsten nitride film and the silicon-containing thin film are processed to form the second electrode and the protective film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/277,891 US20030038314A1 (en) | 2000-03-22 | 2002-10-23 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000079642A JP2001267529A (en) | 2000-03-22 | 2000-03-22 | Semiconductor device and method of manufacturing the same |
JP079642/2000 | 2000-03-22 | ||
US09/812,691 US6489198B2 (en) | 2000-03-22 | 2001-03-21 | Semiconductor device and method of manufacturing the same |
US10/277,891 US20030038314A1 (en) | 2000-03-22 | 2002-10-23 | Semiconductor device and method of manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/812,691 Division US6489198B2 (en) | 2000-03-22 | 2001-03-21 | Semiconductor device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20030038314A1 true US20030038314A1 (en) | 2003-02-27 |
Family
ID=18596865
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/812,691 Expired - Fee Related US6489198B2 (en) | 2000-03-22 | 2001-03-21 | Semiconductor device and method of manufacturing the same |
US10/277,891 Abandoned US20030038314A1 (en) | 2000-03-22 | 2002-10-23 | Semiconductor device and method of manufacturing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/812,691 Expired - Fee Related US6489198B2 (en) | 2000-03-22 | 2001-03-21 | Semiconductor device and method of manufacturing the same |
Country Status (4)
Country | Link |
---|---|
US (2) | US6489198B2 (en) |
JP (1) | JP2001267529A (en) |
KR (1) | KR100737255B1 (en) |
TW (1) | TW492055B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004363396A (en) * | 2003-06-05 | 2004-12-24 | Renesas Technology Corp | Semiconductor device and manufacturing method thereof |
US11049820B2 (en) * | 2018-07-30 | 2021-06-29 | Texas Instruments Incorporated | Crack suppression structure for HV isolation component |
CN112792735B (en) * | 2021-01-20 | 2022-04-05 | 北京科技大学 | Clamp for inhibiting generation and expansion of grinding and polishing cracks of diamond film and using method |
CN112909169B (en) * | 2021-01-28 | 2022-04-29 | 长鑫存储技术有限公司 | Semiconductor structure and method for manufacturing semiconductor structure |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5504041A (en) * | 1994-08-01 | 1996-04-02 | Texas Instruments Incorporated | Conductive exotic-nitride barrier layer for high-dielectric-constant materials |
US5641985A (en) * | 1994-09-29 | 1997-06-24 | Kawasaki Steel Corporation | Antifuse element and semiconductor device having antifuse elements |
KR0183732B1 (en) * | 1995-09-01 | 1999-03-20 | 김광호 | Method of manufacturing semiconductor device capacitor |
JP3063606B2 (en) * | 1996-02-13 | 2000-07-12 | 日本電気株式会社 | Method for manufacturing semiconductor device |
JP2917916B2 (en) * | 1996-06-12 | 1999-07-12 | 日本電気株式会社 | Semiconductor integrated circuit using ferroelectric and method of manufacturing the same |
WO1998050951A1 (en) * | 1997-05-01 | 1998-11-12 | Hitachi, Ltd. | Semiconductor integrated circuit device and method for manufacturing the same |
JPH118355A (en) * | 1997-06-16 | 1999-01-12 | Nec Corp | Ferroelectric memory |
TW402809B (en) * | 1997-10-18 | 2000-08-21 | United Microelectronics Corp | The manufacture method of electrical charge storage structure |
JP3250504B2 (en) * | 1997-10-24 | 2002-01-28 | 日本電気株式会社 | Method for manufacturing semiconductor device |
JP3542704B2 (en) * | 1997-10-24 | 2004-07-14 | シャープ株式会社 | Semiconductor memory device |
US6320244B1 (en) * | 1999-01-12 | 2001-11-20 | Agere Systems Guardian Corp. | Integrated circuit device having dual damascene capacitor |
JP2001257327A (en) * | 2000-03-10 | 2001-09-21 | Nec Corp | Semiconductor device and its manufacturing method |
-
2000
- 2000-03-22 JP JP2000079642A patent/JP2001267529A/en active Pending
-
2001
- 2001-03-20 TW TW090106504A patent/TW492055B/en not_active IP Right Cessation
- 2001-03-21 US US09/812,691 patent/US6489198B2/en not_active Expired - Fee Related
- 2001-03-21 KR KR1020010014487A patent/KR100737255B1/en not_active IP Right Cessation
-
2002
- 2002-10-23 US US10/277,891 patent/US20030038314A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR100737255B1 (en) | 2007-07-10 |
US6489198B2 (en) | 2002-12-03 |
US20020027240A1 (en) | 2002-03-07 |
TW492055B (en) | 2002-06-21 |
JP2001267529A (en) | 2001-09-28 |
KR20010092703A (en) | 2001-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6165833A (en) | Semiconductor processing method of forming a capacitor | |
US6475855B1 (en) | Method of forming integrated circuitry, method of forming a capacitor and method of forming DRAM integrated circuitry | |
US5918118A (en) | Dual deposition methods for forming contact metallizations, capacitors, and memory devices | |
US20020132467A1 (en) | Method of forming plugs and local interconnect for embedded memory/system-on-chip (SOC) applications | |
US7112839B2 (en) | Semiconductor device with transistor and capacitor and its manufacture method | |
US6762110B1 (en) | Method of manufacturing semiconductor device having capacitor | |
US7790613B2 (en) | Semiconductor device and method of manufacturing the same | |
US6285038B1 (en) | Integrated circuitry and DRAM integrated circuitry | |
JP2002124649A (en) | Semiconductor integrated circuit device and the manufacturing method therefor | |
US6489198B2 (en) | Semiconductor device and method of manufacturing the same | |
JP4812949B2 (en) | Capacitor manufacturing method | |
US6468922B2 (en) | Method for manufacturing a semiconductor device with a dual interlayer insulator film of borophosphosilicate glass to prevent diffusion of phosphorus | |
US6239014B1 (en) | Tungsten bit line structure featuring a sandwich capping layer | |
US6306666B1 (en) | Method for fabricating ferroelectric memory device | |
KR100464938B1 (en) | A method for forming capacitor using polysilicon plug structure in semiconductor device | |
KR20220153483A (en) | Semiconductor Device for DRAM and Method of Manufacturing the Same | |
KR100322839B1 (en) | Method of fabricating capacitor of semiconductor device | |
JP2002033461A (en) | Semiconductor device and its fabricating method | |
JP2001320032A (en) | Semiconductor device and its manufacturing method | |
JP2002543592A (en) | Method for structuring a metal layer or metal silicide layer and a capacitor manufactured using the method | |
JPH1117136A (en) | Semiconductor device and manufacture thereof | |
JPH06151755A (en) | Semiconductor memory device | |
KR20010096352A (en) | Semiconductor Memory Device And Manufacturing Thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |