US20030017788A1 - Method and apparatus for shaping edges - Google Patents

Method and apparatus for shaping edges Download PDF

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Publication number
US20030017788A1
US20030017788A1 US10/204,997 US20499702A US2003017788A1 US 20030017788 A1 US20030017788 A1 US 20030017788A1 US 20499702 A US20499702 A US 20499702A US 2003017788 A1 US2003017788 A1 US 2003017788A1
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United States
Prior art keywords
range
edge
resin
abrasive wheel
bonded abrasive
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Pending
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US10/204,997
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English (en)
Inventor
Hironori Hagiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Assigned to 3M INNOVATIVE PROPERTIES COMPANY reassignment 3M INNOVATIVE PROPERTIES COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAGIWARA, HIRONORI
Publication of US20030017788A1 publication Critical patent/US20030017788A1/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Definitions

  • the present invention relates to a method and an apparatus for shaping the edges of rigid, materials such as ceramic plates and rigid composite plates.
  • glass fragments on the cut surfaces and/or the fine splitting, cracks, etc. present of the cut surface can lead to glass fragments separating from the glass plate into the assembly equipment and/or precision devices.
  • resin-bonded, diamond wheels have been used, for example, in place of metal-bonded diamond wheels, to shape the edge of glass plates (see, e.g., U.S. Pat. Nos. 5,975,992 (Raeder et al.) and 5,816,897 (Raeder et al.)).
  • Advantages of resin-bonded, diamond wheels include increased wheel flexibility and elasticity.
  • the amount of abrading that occurs with conventional chamfering processes that utilize metal-bonded or resin, diamond wheels, can be controlled by adjusting the position of the metal-bonded, diamond wheel relative to the surface of material to be abraded. Further with regard to the conventional chamfering process, the amount abraded is determined by the position of the diamond wheel relative to the material to be abraded. This process requires frequent and precise adjustment of the relative positions of the diamond wheel surface and the surface of the material to be abraded. Such frequent adjustments become cumbersome.
  • the position adjustments are typically facilitated using computer control (sometimes called, NC (numerical control) machining system) (see, e.g., Japanese Patent Laid-Open Publication No. 11-221763, published Aug. 17, 1999).
  • NC numbererical control
  • the input of position data typically requires a relatively long period of time (e.g., 60 to 120 minutes).
  • the present invention relates to a method and an apparatus for shaping an edge (i.e., providing a surface of edge being free of pits) of a rigid, brittle material such as ceramic (i.e., glass, crystalline ceramic, and combinations thereof plates and rigid composite plates (including rigid printed circuit boards).
  • a rigid, brittle material such as ceramic (i.e., glass, crystalline ceramic, and combinations thereof plates and rigid composite plates (including rigid printed circuit boards).
  • the present invention provides a method for shaping an edge of a material such as ceramic plates and rigid composite plates (including rigid printed circuit boards), the method comprising; abrading an edge of a material such as ceramic plates and rigid composite plates (including rigid printed circuit boards) in a predetermined abrasion amount, using a resin-bonded abrasive wheel under a load, and in contact with, the edge being abrading, wherein the abrasion amount is determined by controlling the load for pressing the material being abraded with the resin-bonded abrasive wheel.
  • the method according to the present invention is conducted such that the edge of the resulting abraded material is free of corners, pits, and cracks.
  • the wheel has a width surface contacting the edge of the material being abraded, and during the abrading, at least one of (i) the width surface traverses along the edge of the material being abraded or (ii) the edge of the material being abraded traverses along said width surface.
  • the present invention provides an apparatus for abrading an edge of a rigid, brittle materials such as ceramic plates and rigid composite plates in a predetermined abrasion amount using a resin-bonded abrasive wheel under a load and in contact with the edge being abraded, the apparatus comprising a resin-bonded abrasive wheel, a mechanism for rotating the abrasive wheel, and a system for contacting and controlling, during the abrading, the load of the abrasive wheel on the material being abraded.
  • a resin-bonded abrasive wheel comprising a resin-bonded abrasive wheel, a mechanism for rotating the abrasive wheel, and a system for contacting and controlling, during the abrading, the load of the abrasive wheel on the material being abraded.
  • Apparatus according to the present invention 200 comprises abrasive wheel 201 , driving shaft 202 , motor 203 , and pressure cylinder 204 .
  • Apparatus 200 and material to be abraded e.g., glass plate 206 are arranged so that they can movable independently with respect to each other. Material to be abraded 206 may, for example, move in parallel to driving shaft 202 (the direction indicated by arrow) of the device during abrading).
  • Advantages of the present invention include being able to provide materials such as ceramic plates and rigid composite plates free of comers, pits, and cracks in a relative short period of time, as compared, for example, to conventional techniques.
  • FIG. 1 is a perspective view illustrating the edge of a material to be abraded by the method according to the present invention.
  • FIGS. 2 A, B, and C are a front, side, and plane view, respectively, of an apparatus according to the method of the present invention for abrading the edge of a material to be abraded (e.g., a glass plate.
  • a material to be abraded e.g., a glass plate.
  • FIG. 3 is a photograph at 100 ⁇ of the edge surface of a glass plate shaped according to the method of the present invention.
  • FIG. 4 is a photograph at 100 ⁇ of the edge surface of a glass plate shaped by a conventional method.
  • the present invention may be suitable for shaping the edge of a variety of rigid, brittle materials such as ceramic plates and rigid composite plates.
  • glass plates include those used for precision device (e.g., portable phone or pager) display windows, LCD panels, or face plate.
  • the thickness of the glass plate for such devices is typically from 0.2 to 1.4 mm, more typically for example, about 0.3 to 0.7 mm, or even about 0.3 to 0.5 mm.
  • Rigid composite plates include those comprised of binder material such as polymer reinforced with fillers such as ceramic particles and fibers.
  • Rigid composite plates include the substrate for rigid printed boards.
  • Rigid printed circuit boards may have a mono-layered, or multi-layered, circuits (e.g., copper circuits).
  • the rigid print-circuit board typically has a thickness of about 0.5 to 5 mm, more typically about 1 to 3 mm.
  • Resin-bonded abrasive wheels utilized in the present invention are abrasive wheels in which abrasive grains are fixed with a resin binder. Resin-bonded abrasive wheels typically exhibit flexibility and elasticity characteristics such that than can substantially elastically conform to the shape of the surface being abraded. Further, the cut mode is for abrading brittle glass plates according to the method and device of the present invention is typically a “shear-type”. Although not wanting to be bound by theory, it is believed that the lack of cracking, pitting, etc. in the glass plate surfaces abraded according to the method and device of the present invention is facilitated by a “shear-type” cutting mode.
  • shear plane is a smooth cut surface (mirror surface), and looks glossy.
  • Suitable resin-bonded abrasive wheels preferably have an elastic modulus in the range from 50 to 10,000 kg/cm 2 , more preferably, in the range from 500 to 7,000 kg/cm 2 .
  • resin-bonded abrasive wheels having an elastic modulus less than 50 kg/cm 2 may also be useful, such wheels tend to wear out quickly.
  • use of resin-bonded wheels with an elastic modulus above about 10,000 kg/cm 2 tend to lead to the formulation of cracks or pits on the newly formed surfaces.
  • the resin-bonded abrasive wheel preferably has a Shore D hardness in the range from 10 to 95, more preferably, in the range from 40 to 80. If the Shore D hardness is below about 10, the abrasive wheel tends to wear out quickly. If the Shore D hardness is above about 95, there is a tendency for cracks or pits to be present on the newly formed surfaces.
  • the density of the resin-bonded abrasive wheel is preferably in the range from about 0.4 to 2.5 g/cm 3 . If the density is below about 0.4 g/cm 3 , the abrasive wheel tends to wear out quickly. For densities above about 2.5 g/cm 3 , there is a tendency for cracks or pits to be present on newly formed surfaces.
  • Examples of abrasive grains present in the resin-bonded abrasive wheels include conventional abrasive grains such as SiC, Al 2 O 3 , and CeO 2 .
  • the abrasive grains are screened and graded using the well known techniques and standards for JIS (Japanese Industrial Standard) grade (e.g., JIS (R6001, 1987 ver.) JIS 100 to JIS 10,000, preferably, in the range from JIS 220 to JIS 2,000, or the like).
  • the abrasive grains generally have particle sizes (in conformity with JIS) in the range from about 1 to 125 micrometers preferably in the range from about 6 to 50 micrometers. It is also within the scope of the present invention to use abrasive grain graded to other industry recognized standards, such as ANSI (American National Standard Institute) and FEPA (Federation Europeane de Products Abrasifs).
  • the resin binder for the resin-bonded abrasive wheel is preferably polyurethane.
  • a preferred polyurethane is a cross-linked polyurethane matrix such as disclosed in Japanese Patent Laid-Open Publication No. 294336/1990, published on Dec. 5, 1990, the disclosure of which is incorporated herein by reference.
  • the cross-linked polyurethane preferably has a glass transition temperature greater than about 10° C., more preferably, in the range from greater than about 10° C. to 70° C.
  • Suitable resin-bonded abrasive wheel are commercially available, and/or can be made by techniques known in the art (see e.g., Japanese Patent Laid-Open Publication No. 294336/1990, published on Dec. 5, 1990, and U.S. Pat No. 4,933,373 (Moren), the disclosures of which are incorporated herein by reference.
  • Abrasive wheels utilized in practicing the present invention typically have an outer diameter in the range from 50 to 500 mm, more typically, from 100 to 305 mm.
  • the inner diameter of the wheels is typically in the range from 5 to 300 mm, more typically in the range from 10 to 127 mm.
  • the width of the wheels is typically in the range from 10 to 500 mm, more typically in the range from 10 to 300 mm.
  • FIG. 1 is a perspective view showing the edge of a material (e.g., a glass plate) being abraded by a method according to the present invention.
  • Material 101 is fixed such that the width of the edge to be abraded is parallel to with the axial direction of resin-bonded abrasive wheel 102 .
  • the outer peripheral surface of abrasive wheel 102 is under a load, and is in contact with, edge 103 for a predetermined period of time.
  • the load the abrasive wheel is under when in contact with the edge of the material being abraded is changed in accordance with the desired area and amount to be abraded. Since the resin-bonded abrasive wheel has flexibility and elasticity, the load for contacting the abrasive wheel with the surface to be abraded can be varied as desired over a range of loads. The load is correlated to the amount to be abraded per unit period of time. In other words, the amount to be abraded can be varied and controlled by adjusting the load. The amount to be abraded is also affected by, for example, by the abrading time and rotational speed of the abrasive wheel.
  • a metal-bonded, diamond wheel which is not flexible and elastic, does not allow for a range of loading, but rather is maintained at a substantially single, optimal value. Since the diamond wheel is rigid and non-elastic, if the load is even a little above the (substantially single) optimal value, the material (e.g., glass plate) being abraded typically breaks, Similarly, the load is even a little below the (substantially single) optimal value, there is no or insufficient abrading of the material. Hence, in conventional methods of shaping a material using a diamond wheel, the amount to be abraded cannot effectively be controlled by adjusting the load, but rather the amount being abraded is determined by the position of the wheel with respect to the surface being abraded.
  • the load for practicing the present invention is about 0.1 to 4 kg/50 mm (i.e., 0.1 to 4 kilograms based on a 50 mm wide wheel) (0.002 kg/mm to 0.08 kg/mm), preferably from 0.5 to 2 kg/50 mm (0.01 kg/mm to 0.04 kg/mm).
  • the abrading time is typically 0.5 to 5 seconds, preferably from 1 to 3 seconds.
  • the rotation peripheral speed of the abrasive wheel is typically about 100 to 2000 m/min. preferably from 200 to 1000 m/min.
  • the contact angle, ⁇ , of the abrasive wheel to the edge of the glass plate is typically from 0 to 60°, preferably from 30 to 60°.
  • Device or apparatus 200 has resin-bonded abrasive wheel 201 , driving shaft 202 , motor 203 , and pressure cylinder 204 placed on movable frame 205 .
  • Glass plate 206 which is to be abraded, is fixed to working table 207 .
  • Apparatus 200 and material to be abraded (e.g., glass plate) 206 are arranged so that they can movable independently with respect to each other. Material to be abraded 206 may, for example, move in parallel to driving shaft 202 (the direction indicated by arrow) of the device during abrading).
  • the load can be applied, for example, using a pneumatic pressure cylinder, and controlled, for example, using a system moderated by control system such as that available from Mechanotron Co., Ltd., USA under the trade designation “ACTIVE FORCE CONTROL SYSTEM”.
  • the Mechanotron Co. device uses closed loop feedback to provide an adjustable constant force. It uses load cell or drive motor feedback to monitor force, and a microprocessor to continuously adjust the force to the desired setting.
  • the device behaves similarly to passive devices, but is more effective at low forces, and exhibits faster response rates. It can be utilize linear or rotary bearings, with or without counterbalance weights. It can also be used for wrist mounted, or floor mounted devices. Further, the device can utilize any of a variety of actuators to control forces directly.
  • a resin-bonded abrasive wheel (marketed under the trade designation “DLO WHEEL SERIES” by Sumitomo/3M Co., Ltd., Japan) was mounted on an abrasive apparatus as shown in FIG. 2.
  • the elastic constant of the abrasive wheel was 1,000 kg/cm 2 , and the density 1.5 g/cm 3 .
  • the abrasive grains were JIS 600 graded SiC.
  • the outer diameter of the wheel was 200 mm, the inner diameter 31.8 mm, and the width 50 mm.
  • the glass plate (0.7 mm thick) was fixed to a working table. The edge of the edge of the glass plate was abraded under the following conditions.
  • the rotational speed of the wheel was 1,500 rpm, the contact angle 45°, and the load 2 kg/50 mm.
  • the abrading time was 2 seconds. Water was used as a lubricant.
  • FIG. 3 is a photograph at 100 ⁇ of the edge surface of the abraded glass plate.
  • the black area in the lower half of FIG. 3 was the edge surface of the glass plate.
  • the appearance of the abraded edge was smooth.
  • FIG. 4 is a photograph at 100 ⁇ of the edge surface of the abraded glass plate.
  • the black area in the lower half of FIG. 4 was the edge surface of the glass plate. There were pits such as conchoidal defects or pits present on the abraded surface of the glass plate edge.
  • a type FR4 printed circuit board i.e., a glass-epoxy resin printed circuit according to ASTM standard D1867-62T, the disclosure of which is incorporated herein by reference
  • the edge of the print-circuit board was abraded with a resin-bonded abrasive wheel as described in Example 1 under the following conditions.
  • the rotational speed of the wheel was 1,500 rpm, the contact angle 0 degree, and the load 2 kg/50 mm
  • the abrading time was 4 seconds. Water was used as a lubricant.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Processing Of Meat And Fish (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
US10/204,997 2000-03-07 2001-03-06 Method and apparatus for shaping edges Pending US20030017788A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-61915` 2000-03-07
JP2000061915A JP2001259978A (ja) 2000-03-07 2000-03-07 ガラス板の端部を面取りする方法

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US20030017788A1 true US20030017788A1 (en) 2003-01-23

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US10/204,997 Pending US20030017788A1 (en) 2000-03-07 2001-03-06 Method and apparatus for shaping edges

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US (1) US20030017788A1 (de)
EP (1) EP1268127B1 (de)
JP (2) JP2001259978A (de)
AT (1) ATE296713T1 (de)
AU (1) AU2001247271A1 (de)
DE (1) DE60111203D1 (de)
WO (1) WO2001066307A2 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164819A1 (en) * 2004-03-26 2007-07-19 Junetsu Urata Amplifier
US7303464B1 (en) * 2006-10-13 2007-12-04 3M Innovative Properties Company Contact wheel
US20070298240A1 (en) * 2006-06-22 2007-12-27 Gobena Feben T Compressible abrasive article
US20100330885A1 (en) * 2009-06-24 2010-12-30 Siltronic Ag Method For Polishing The Edge Of A Semiconductor Wafer
GB2482345A (en) * 2010-07-30 2012-02-01 Vestas Wind Sys As Tapering an edge of a fibrous reinforcement sheet using a rotary tool
TWI490479B (zh) * 2010-07-08 2015-07-01 Asahi Glass Co Ltd A method of evaluating the end face of a glass substrate, a method of processing a glass substrate end face, and a glass substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8721392B2 (en) * 2011-06-28 2014-05-13 Corning Incorporated Glass edge finishing method
SG192302A1 (en) * 2012-01-18 2013-08-30 Avanstrate Inc Method of making glass sheet
WO2015113026A2 (en) * 2014-01-27 2015-07-30 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
JP2019171520A (ja) * 2018-03-28 2019-10-10 株式会社ノリタケカンパニーリミテド レジノイド研削砥石

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US4667443A (en) * 1984-09-06 1987-05-26 Kaoru Sakurai End face grinding apparatus
US4756124A (en) * 1986-02-04 1988-07-12 Societa' Italiana Vetro Siv S.P.A. Machine for grinding the edges of a sheet of glass, particularly for automobile windows
US5514025A (en) * 1991-05-24 1996-05-07 Shin-Etsu Handotai Co. Ltd. Apparatus and method for chamfering the peripheral edge of a wafer to specular finish
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US5727990A (en) * 1994-06-17 1998-03-17 Shin-Etsu Handotai Co., Ltd. Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6217434B1 (en) * 1997-04-04 2001-04-17 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6267649B1 (en) * 1999-08-23 2001-07-31 Industrial Technology Research Institute Edge and bevel CMP of copper wafer
US6332834B1 (en) * 1999-03-31 2001-12-25 Nippei Toyama Corporation Method and apparatus for grinding a workpiece
US6402606B1 (en) * 1999-10-25 2002-06-11 Noritake Co., Limited Grinding wheel having urethane resin bushing in its center mounting hole
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method

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JPS6062464A (ja) * 1983-09-10 1985-04-10 Kawasaki Steel Corp 回転砥石による金属帯の側端研削装置
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US3889430A (en) * 1972-05-17 1975-06-17 S P A M Abrasive tools
US4667443A (en) * 1984-09-06 1987-05-26 Kaoru Sakurai End face grinding apparatus
US4756124A (en) * 1986-02-04 1988-07-12 Societa' Italiana Vetro Siv S.P.A. Machine for grinding the edges of a sheet of glass, particularly for automobile windows
US5514025A (en) * 1991-05-24 1996-05-07 Shin-Etsu Handotai Co. Ltd. Apparatus and method for chamfering the peripheral edge of a wafer to specular finish
US5727990A (en) * 1994-06-17 1998-03-17 Shin-Etsu Handotai Co., Ltd. Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US6217434B1 (en) * 1997-04-04 2001-04-17 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6332834B1 (en) * 1999-03-31 2001-12-25 Nippei Toyama Corporation Method and apparatus for grinding a workpiece
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6267649B1 (en) * 1999-08-23 2001-07-31 Industrial Technology Research Institute Edge and bevel CMP of copper wafer
US6402606B1 (en) * 1999-10-25 2002-06-11 Noritake Co., Limited Grinding wheel having urethane resin bushing in its center mounting hole
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164819A1 (en) * 2004-03-26 2007-07-19 Junetsu Urata Amplifier
US20070298240A1 (en) * 2006-06-22 2007-12-27 Gobena Feben T Compressible abrasive article
US7303464B1 (en) * 2006-10-13 2007-12-04 3M Innovative Properties Company Contact wheel
US20100330885A1 (en) * 2009-06-24 2010-12-30 Siltronic Ag Method For Polishing The Edge Of A Semiconductor Wafer
US8388411B2 (en) * 2009-06-24 2013-03-05 Siltronic Ag Method for polishing the edge of a semiconductor wafer
TWI490479B (zh) * 2010-07-08 2015-07-01 Asahi Glass Co Ltd A method of evaluating the end face of a glass substrate, a method of processing a glass substrate end face, and a glass substrate
GB2482345A (en) * 2010-07-30 2012-02-01 Vestas Wind Sys As Tapering an edge of a fibrous reinforcement sheet using a rotary tool

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Publication number Publication date
JP2003525759A (ja) 2003-09-02
JP2001259978A (ja) 2001-09-25
WO2001066307A3 (en) 2002-03-28
ATE296713T1 (de) 2005-06-15
WO2001066307A2 (en) 2001-09-13
EP1268127A2 (de) 2003-01-02
DE60111203D1 (de) 2005-07-07
EP1268127B1 (de) 2005-06-01
AU2001247271A1 (en) 2001-09-17

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