US20020186537A1 - Heat sink and thermal interface having shielding to attenuate electromagnetic interference - Google Patents
Heat sink and thermal interface having shielding to attenuate electromagnetic interference Download PDFInfo
- Publication number
- US20020186537A1 US20020186537A1 US09/876,573 US87657301A US2002186537A1 US 20020186537 A1 US20020186537 A1 US 20020186537A1 US 87657301 A US87657301 A US 87657301A US 2002186537 A1 US2002186537 A1 US 2002186537A1
- Authority
- US
- United States
- Prior art keywords
- heat
- heat sink
- folded
- baseplate
- thermal interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Definitions
- Interface systems for use in transferring heat produced from a heat-dissipating electronic component to a heat dissipator or heat sink are well-known in the art.
- electronic components the most common being computer chip microprocessors, generate sufficient heat to adversely affect their operation unless adequate heat dissipation is provided.
- interface systems are specifically designed to aid in the transfer of heat by forming a heat-conductive pathway from the component to its mounting surface, across the interface, and to the heat sink.
- Exemplary of such contemporary thermal interfaces are THERMSTRATE and ISOSTRATE (both trademarks of Power Devices, Inc. of Laguna Hills, Calif.
- the THERMSTRATE interface comprises thermally conductive, die-cut pads which are placed intermediate the electronic component and the heat sink so as to enhance heat conduction therebetween.
- the THERMSTRATE heat pads comprise a durable-type 1100 or 1145 aluminum alloy substrate having a thickness of approximately 0.002 inch (although other aluminum and/or copper foil thickness may be utilized) that is coated on both sides thereof with a proprietary thermal compound, the latter comprising a paraffin base containing additives which enhance thermal conductivity, as well as control its responsiveness to heat and pressure.
- Such compound advantageously undergoes a selective phase-change insofar the compound is dry at room temperature, yet liquifies below the operating temperature of the great majority of electronic components, which is typically around 51E ° C. or higher, so as to assure desired heat conduction.
- the electronic component is no longer in use (i.e., is no longer dissipating heat)
- such thermal conductive compound resolidifies once the same cools to below 51E ° C.
- the ISOSTRATE thermal interface is likewise a die-cut mounting pad that utilizes a heat conducting polyimide substrate, namely, KAPTON (a registered trademark of DuPont) type MT, that further incorporates the use of a proprietary paraffin based thermal compound utilizing additives to enhance thermal conductivity and to control its response to heat and pressure.
- a heat conducting polyimide substrate namely, KAPTON (a registered trademark of DuPont) type MT
- KAPTON a registered trademark of DuPont type MT
- thermal interfaces include those disclosed in U.S. Pat. No. 5,912,805, issued on Jun. 15, 1999 to Freuler et al. and entitled THERMAL INTERFACE WITH ADHESIVE.
- Such patent discloses a thermal interface positionable between an electronic component and heat sink comprised of first and second generally planar substrates that are compressively bonded to one another and have a thermally-conductive material formed on the outwardly-facing opposed sides thereof.
- Such interface has the advantage of being adhesively bonded into position between an electronic component and heat sink such that the adhesive formed upon the thermal interface extends beyond the juncture where the interfaces interpose between the heat sink and the electronic component.
- thermal interfaces there have further been advancements in the art with respect to the thermal compositions utilized for facilitating the transfer of heat across an interface.
- Exemplary of such compounds include those disclosed in U.S. Pat. No. 6,054,198, issued on Apr. 25, 2000 to Bunyan et al. and entitled CONFORMAL THERMAL INTERFACE MATERIAL FOR ELECTRONIC COMPONENTS, and U.S. Pat. No. 5,930,893, issued on Aug. 3, 1999 to Eaton and entitled THERMALLY CONDUCTIVE MATERIAL AND METHOD OF USING THE SAME, the teachings of which are expressly incorporated by reference.
- a grounded substrate formed from a conductive material, such as copper, to suppress radiated emissions, namely electromagnetic interference (EMI), generated in high frequency transistor applications.
- EMI electromagnetic interference
- such grounded substrate is utilized to minimize capacitance to the heat sink to which it is attached, as well as to provide shielding effectiveness and attenuation of radiated EMI.
- electrically grounded copper substrates can provide shielding effectiveness to 60 dB at 1000 KHz, which is an attenuation percentage of 99.9%.
- thermal interface incorporating a grounded conductive substrate
- EMI-STRATE a registered trademark of Power Devices, Inc. of Laguna Hills, Calif.
- Such interface comprises a grounded copper substrate sandwiched between two polyimide film substrates, the latter being comprised of KAPTON-type MT.
- the exterior sides of such interface are further coated with a proprietary thermal compound to thus facilitate the transfer of heat away from the electronic component to a heat sink.
- heat sinks In addition to the need for improved interface systems is the need for improved heat sinks to be used therewith that are capable of more effectively and efficiently dissipating the heat transfer thereto.
- most heat sinks in use which are typically fabricated from extruded aluminum, are formed to have a base with a plurality of fins extending therefrom. The fins are equidistantly spaced from one another and are formed to have sufficient surface area to dissipate the heat into the surrounding air.
- a fan is frequently used to assure adequate circulation of air over the fins, so as to maintain desirable heat dissipation therefrom.
- folded-fin heat sinks Such assemblies comprise a relatively thin base section and a set of fins folded into corrugated sections mounted thereon.
- the base section is typically formed to be either very thin to reduce mass or, alternatively, thicker to act as a heat spreader.
- the folded fins coupled to the base act as a heat-transfer area, allowing a stream of forced air to remove heat from the base.
- folded-fin heat sinks offer the maximum potential in surface area and reduced weight. In this respect, thermal resistance as low as 0.40E ° C. C/W can be reached with folded-fin assemblies in forced-air cooling at 500 ft/min of air velocity.
- thermal resistance as low as 0.40E ° C. C/W can be reached with folded-fin assemblies in forced-air cooling at 500 ft/min of air velocity.
- in utilizing a corrugated piece of aluminum or copper there is thus eliminated the restrictions otherwise faced in the extrusion process.
- thermal interface that provides greater thermal conductivity and greater electrical insulation than prior art interfaces.
- thermal interface that is of low cost, easy to manufacture, and may be readily utilized with existing componentry requiring the integration of a thermal interface system.
- an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component.
- such an improved heat sink that is particularly more effective in transferring heat from a given heat source to the fins or other apparatus by which the same is dissipated.
- the present invention specifically addresses and alleviates the aforementioned deficiencies in the art.
- the interface system of the present invention comprises the combination of a generally planar substrate, preferably being comprised of a non-conductive material having a high dielectric strength.
- the planar substrate defines two outwardly facing flatwise surfaces that are configured to mate with the interface surfaces formed on the electronic component and the interface surface formed on the heat dissipator or heat sink, on the other surface
- Each respective outwardly facing surface has formed thereon a layer of a thermally conductive compound having a high degree of thermal conductivity to thus further facilitate the transfer of heat.
- such compound is preferably formed to have selective phase-change properties whereby the composition exists in a solid phase at normal room temperature, but melts, and therefore assumes a liquid phase, when subjected to the elevated temperatures at which the electronic component usually operates.
- the present invention further includes an improved heat sink that is more efficient and effective in dissipating heat transferred thereto via an electronic component.
- such improved heat sink comprises the combination of a base plate attachable to a heat-dissipating component and a folded-fin assembly compressively attached thereto.
- the heat sink is provided with one or more pressure clips (or other fastener arrangement) detachably fastenable to the baseplate that apply a compressive force, via a pressure spreader engagable therewith, against the folded-fin assembly that causes the assembly to remain compressively bonded with the baseplate from which the heat to be dissipated is received.
- a layer of a thermally-conductive compound having selective phase-change properties i.e., liquefies during the operational temperature of the electronic component coupled to the heat sink
- a thermal interface having a high dielectric capability may be interposed between the baseplate and folded-fin assembly.
- the present invention thus provides a thermal interface system that provides both electrical insulation and sufficient thermal conductivity to effectively facilitate the removal of heat therefrom more so than prior art interface systems.
- the present invention further provides a thermal interface having electrical isolation capability that utilizes a minimal number of layers in the construction thereof.
- Another object of the present invention is to provide a thermal interface that is relatively simple and inexpensive to manufacture compared to prior art interface systems, and may be readily and easily utilized in a wide variety of commercial applications.
- Another object of the present invention is to provide an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component, and especially more so than conventional heat sinks formed from extruded aluminum.
- Another object of the present invention is to provide an improved heat sink that is capable of more effectively transferring heat received thereby to the heat-dissipating component thereof than prior art heat sinks.
- a still further object of the present invention is to provide an improved heat sink that is of simple construction, may be readily and easily fabricated from existing materials well-known to those skilled in the art, is relatively inexpensive, and may be readily and easily utilized in numerous commercial applications.
- FIG. 1 is an exploded perspective view of an extruded heat sink positioned for attachment to an electronic component showing a preformed thermal interface pad of the present invention being disposed therebetween;
- FIG. 2 is a cross-sectional view taken along line 2 ? 2 of FIG. 1;
- FIG. 3 is a perspective view of the respective layers comprising the thermal interface of the present invention.
- FIG. 4 is a perspective view of the respective layers comprising a prior art thermal interface
- FIG. 5 is a perspective view of an improved heat sink constructed in accordance to a preferred embodiment of the present invention.
- FIG. 6 is an exploded perspective view of the heat sink depicted in FIG. 5.
- thermal interface 10 constructed in accordance with one embodiment of the present invention.
- the thermal interface 10 is specifically designed and configured to facilitate the transfer of heat away from an electronic component 12 to a heat sink 14 .
- the thermal interface 10 of the present invention is further provided with electrical insulating capability to thus substantially electrically isolate the electronic component 12 during the operation thereof.
- the thermal interface 10 is specifically designed and adapted to be interposed between the electronic component 12 and heat sink 14 .
- heat sink 14 is provided with structures such as fins or other protuberances 14 a having sufficient surface area to dissipate the heat into the surrounding air.
- a fan is frequently utilized to provide adequate air circulation over the fins or protuberances 14 a.
- the thermal interface 10 is die-cut or pre-formed to have a shape or footprint compatible with the particular electronic component and/or heat sink to thus enable the thermal interface 10 to maximize surface area contact at the juncture between the electronic component 12 and heat sink 14 .
- the thermal interface 10 of the present invention may also be manually cut from a sheet of interface material, similar to other interface pads currently in use, so as to provide a custom fit between a given electronic component and heat sink.
- the thermal interface 10 is comprised of three layers 16 - 20 .
- the first layer 16 comprises a thermally conductive compound formulated to facilitate and enhance the ability of the interface 10 to transfer heat away from the electronic component to the heat sink. Similar to other prior art compositions, such layer 16 is preferably formulated to have certain desired phase-change properties. Specifically, at room temperature, i.e., when the electronic device is not operating, the layer of thermal compound 16 remains substantially solid.
- the thermally conductive composition may take any of those disclosed in Applicant's co-pending patent application entitled PHASE CHANGE THERMAL INTERFACE COMPOSITION HAVING INDUCED BONDING PROPERTY, filed on Apr. 12, 2001, Ser. No. not yet assigned, and Applicant's co-pending patent application entitled GRAPHITIC ALLOTROPE INTERFACE COMPOSITION AND METHOD OF FABRICATING THE SAME, filed on May 18, 2000, and assigned application Ser. No. 09/573,508, the teachings of which are expressly incorporated herein by reference.
- Such thermal compounds have the desirable phase-change properties of assuming a solid phase at normal room temperature, but liquify at elevated temperatures of approximately 51° C.
- thermally conductive materials and compounds are available and readily known to those skilled in the art which could be deployed for use in the practice of the present invention.
- the second layer 18 is a generally planar substrate layer provided with an outwardly facing side and an inwardly facing side, the latter being bonded to the thermal component layer 16 .
- the substrate 18 is formed from a material that is both thermally conductive and has high dielectric strength.
- a substrate is fabricated from a polymer and preferably a polyimide.
- one such highly preferred polyimide substrate includes KAPTON-type MT.
- other similar materials well-known to those skilled in the art may also be utilized, including ULTEM, a registered trademark of General Electric Corporation.
- a substrate formed of a material having a high dielectric strength there is thus provided a high degree of electrical insulation.
- the interface of the present invention is specifically designed and adapted to be utilized with electronic componentry that already is electrically isolated, such added electrical insulation, as provided by the substrate 18 , additionally ensures such electrical isolation, which as those skilled in the art will recognize is frequently required in such applications.
- second layer 20 of a thermally conductive compound formed upon the outwardly facing surface of substrate 18 is preferably provided.
- second layer 20 is preferably formulated to have certain desired phase-change properties, namely, assumes a solid phase when the electronic component is not operating, but liquifies when subjected to the operating temperature of the electronic component, so as to ensure that any voids or gaps formed by surface irregularities present upon the surface of the heat sink become filled, thereby maintaining a generally continuous mechanical contact to thus facilitate the transfer of heat to the heat sink coupled therewith.
- the interface 10 of the present invention because of its novel construction, will only be fabricated from three layers of material, namely, the first layer of thermal compound 16 , intermediate substrate 18 and second layer of thermal compound 20 , perspectively illustrated in FIG. 3.
- Such construction due to the minimal amount of layers utilized, is specifically configured for optimal heat transmission therethrough, and thus is ideally suited for application as a thermal interface for facilitating heat transfer from an electronic component to a heat sink.
- additional layers of material which are typically present in prior art interfaces, there is thus facilitated the performance of heat transfer from the electronic component to a heat sink. More specifically, it is well-known that the rate of heat transfer through such interface is reduced by each layer added thereto.
- FIG. 4 there is shown a prior art interface 26 having a seven-layer construction.
- the layers comprising the prior art interface 26 comprise, from bottom to top, a first or external thermal compound layer 28 , a first non-conductive substrate 30 , a first or internal adhesive layer 32 , a layer of conductive material 34 , a second internal adhesive layer 36 , a second non-conductive substrate 38 , and a second external thermal compound layer 40 .
- such multi-layer construction substantially reduces the rate of heat transfer therethrough, with the addition of each additional layer providing that much more of an impediment in achieving the desired thermal conductivity.
- the thermal interface 10 of the present invention is provided with a reduced thickness than such prior art interfaces, which, as a result, even further enhances the flow of heat therethrough.
- the heat sink 50 comprises the combination of a baseplate 52 and a folded-fin assembly 60 , the latter being compressively mounted upon an electrically insulated platform surface 52 a formed on the baseplate 52 (shown in FIG. 6), via a pair of pressure clips 68 a, 68 b and electrically insulated pressure spreaders 64 a, 64 b.
- the platform surface 52 a may have formed thereon a sheet of electrically insulated material, such as KAPTON-type MT.
- the pressure clips 68 a, 68 b will preferably be formed from electrically non-conductive materials such as fiberglass, or other like materials.
- the baseplate 52 is provided with a plurality of apertures 54 to enable the same to be fastened, via bolts and the like, to a given heat-dissipating component (not shown).
- the baseplate 52 further has formed thereon opposed pairs of slots 56 a, a′ and 56 b, b′ that are designed and configured to receive respective ones of pairs of feet 70 a, a′ and 70 b, b′ formed upon pressure clips 68 a, 68 b, more clearly seen in FIG. 6.
- slots 56 a, a′ and 56 b, b′ provide points of leverage by which pressure clips 68 can impart a downwardly compressive force, via pressure spreader 64 a, 64 b, upon the folded-fin assembly 60 , and more particularly the upper folds 60 b thereof.
- the baseplate 52 is preferably formed from a material having excellent thermally conductive properties, such as aluminum and other like metals.
- the folded-fin assembly 60 preferably comprises a unitary piece of corrugated metal, such as aluminum or other like materials well-known to those skilled in the art, that have ideal heat-dissipating properties. As illustrated, the folded-fin assembly 60 is formed to have a generally serpentine configuration such that the same is provided with a plurality of downwardly facing bends 60 a that are oriented to mate with the electrically insulated upper platform surface 52 a of baseplate 52 , more clearly seen in FIG. 6, and a plurality of upwardly oriented folds 60 b, the latter being forced compressively downward via pressure clips 68 a, 68 b, and pressure spreader 64 a, 64 b.
- corrugated metal such as aluminum or other like materials well-known to those skilled in the art
- the heat sink 50 is thus provided with a heat-dissipating component that is not limited by prior art extrusion processes.
- prior heat sinks formed from extruded aluminum possess substantial limitations insofar as most extrusion processes limit the height of such fins formed thereon to dissipate heat, as well as the spacing therebetween.
- Such limitations do not apply to the folded-fin assembly 60 , in contrast, by virtue of having fins folded into such corrugated sections 60 a, 60 b.
- each pressure clip 68 a, 68 b is provided with downwardly extending legs 72 a, a′ and 72 b, b′ having outwardly extending feet 70 a, a′ and 70 b, b′ formed at the distalmost ends thereof.
- the legs 72 are connected to one another via an elongate segment defined by downwardly-biased sections 74 and mid-portion 76 .
- downwardly-biased sections 74 and mid-portion 76 are caused to impart the aforementioned downwardly compressive force.
- Pressure spreaders 64 a, 64 b which are preferably electrically insulated, are provided to impart a more even distribution of force about the upwardly extending bend 60 b of folded-fin assembly 60 .
- the pressure spreaders 64 a, 64 b preferably comprise elongate beams that are designed and configured to align with downwardly-biased sections 74 and mid-portion 76 of each respective pressure clip and become sandwiched between the clip 68 and the top fold 60 b of folded-fin assembly 60 .
- thermal conductivity and, ultimately, heat dissipation is maximized and allows for greater heat transfer than prior art heat sinks.
- a layer of thermally conductive compound formulated to have the aforementioned desired phase-change properties to thus ensure maximum mechanical contact between the folded-fin assembly 60 and baseplate 52 .
- an interface pad or other like system may be positioned upon the platform surface 52 a to provide further desired properties (e.g., electrical insulation) in addition to facilitating the transfer of heat.
- base plate 52 maybe provided with a ground contact connection 78 , shown in phantom in FIGS. 5 and 6, to thus enable an electronic utilized therewith to become electrically grounded.
- ground contact connection 58 will thus facilitate that end.
- base plate 52 will be for the heat sink 50 will further include an electrically insulated pad or layer, such as 80 depicted in phantom in FIGS. 5 and 6, to ensure electrical isolation of the base plate 52 .
- such optional pad or layer 80 may take the form of an interface pad or other like system that, in addition to providing electrical insulation, can further facilitate the transfer of heat.
Abstract
Description
- Interface systems for use in transferring heat produced from a heat-dissipating electronic component to a heat dissipator or heat sink are well-known in the art. In this regard, such electronic components, the most common being computer chip microprocessors, generate sufficient heat to adversely affect their operation unless adequate heat dissipation is provided. To achieve this end, such interface systems are specifically designed to aid in the transfer of heat by forming a heat-conductive pathway from the component to its mounting surface, across the interface, and to the heat sink.
- In addition to facilitating the transfer of heat, certain applications further require electrical insulation. Accordingly, such interface systems are frequently further provided with materials that are not only effective in conducting heat, but additionally offer high electrical insulating capability. Among the materials frequently utilized to provide such electrical insulation are polyimide substrates, and in particular KAPTON (a registered trademark of DuPont) type MT.
- Exemplary of such contemporary thermal interfaces are THERMSTRATE and ISOSTRATE (both trademarks of Power Devices, Inc. of Laguna Hills, Calif. The THERMSTRATE interface comprises thermally conductive, die-cut pads which are placed intermediate the electronic component and the heat sink so as to enhance heat conduction therebetween. The THERMSTRATE heat pads comprise a durable-type 1100 or 1145 aluminum alloy substrate having a thickness of approximately 0.002 inch (although other aluminum and/or copper foil thickness may be utilized) that is coated on both sides thereof with a proprietary thermal compound, the latter comprising a paraffin base containing additives which enhance thermal conductivity, as well as control its responsiveness to heat and pressure. Such compound advantageously undergoes a selective phase-change insofar the compound is dry at room temperature, yet liquifies below the operating temperature of the great majority of electronic components, which is typically around 51E ° C. or higher, so as to assure desired heat conduction. When the electronic component is no longer in use (i.e., is no longer dissipating heat), such thermal conductive compound resolidifies once the same cools to below 51E ° C.
- The ISOSTRATE thermal interface is likewise a die-cut mounting pad that utilizes a heat conducting polyimide substrate, namely, KAPTON (a registered trademark of DuPont) type MT, that further incorporates the use of a proprietary paraffin based thermal compound utilizing additives to enhance thermal conductivity and to control its response to heat and pressure. Advantageously, by utilizing a polyimide substrate, such interface is further provided with high dielectric capability.
- Additionally exemplary of prior-art thermal interfaces include those disclosed in U.S. Pat. No. 5,912,805, issued on Jun. 15, 1999 to Freuler et al. and entitled THERMAL INTERFACE WITH ADHESIVE. Such patent discloses a thermal interface positionable between an electronic component and heat sink comprised of first and second generally planar substrates that are compressively bonded to one another and have a thermally-conductive material formed on the outwardly-facing opposed sides thereof. Such interface has the advantage of being adhesively bonded into position between an electronic component and heat sink such that the adhesive formed upon the thermal interface extends beyond the juncture where the interfaces interpose between the heat sink and the electronic component.
- The process for forming thermal interfaces according to contemporary methodology is described in more detail in U.S. Pat. No. 4,299,715, issued on Nov. 10, 1981 to Whitfield et al. and entitled METHODS AND MATERIALS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE; U.S. Pat. No. 4,466,483, issued on Aug. 21, 1984 to Whitfield et al. and entitled METHODS AND MEANS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE; and United States Pat. No. 4,473,113, issued on Sep. 25, 1984 to Whitfield et al. and entitled METHODS AND MATERIALS FOR CONDUCTING HEAT FROM ELECTRONIC COMPONENTS AND THE LIKE, the contents of all three of which are expressly incorporated herein by reference.
- In addition to the construction of thermal interfaces, there have further been advancements in the art with respect to the thermal compositions utilized for facilitating the transfer of heat across an interface. Exemplary of such compounds include those disclosed in U.S. Pat. No. 6,054,198, issued on Apr. 25, 2000 to Bunyan et al. and entitled CONFORMAL THERMAL INTERFACE MATERIAL FOR ELECTRONIC COMPONENTS, and U.S. Pat. No. 5,930,893, issued on Aug. 3, 1999 to Eaton and entitled THERMALLY CONDUCTIVE MATERIAL AND METHOD OF USING THE SAME, the teachings of which are expressly incorporated by reference.
- In addition to being able to facilitate the transfer of heat and provide electrical insulation, many interface systems additionally employ a grounded substrate formed from a conductive material, such as copper, to suppress radiated emissions, namely electromagnetic interference (EMI), generated in high frequency transistor applications. In this regard, such grounded substrate is utilized to minimize capacitance to the heat sink to which it is attached, as well as to provide shielding effectiveness and attenuation of radiated EMI. With respect to the latter, it has been shown that electrically grounded copper substrates can provide shielding effectiveness to 60 dB at 1000 KHz, which is an attenuation percentage of 99.9%.
- One such commercially-available thermal interface incorporating a grounded conductive substrate is EMI-STRATE (a registered trademark of Power Devices, Inc. of Laguna Hills, Calif. Such interface comprises a grounded copper substrate sandwiched between two polyimide film substrates, the latter being comprised of KAPTON-type MT. The exterior sides of such interface are further coated with a proprietary thermal compound to thus facilitate the transfer of heat away from the electronic component to a heat sink.
- Notwithstanding the effectiveness of thermal interfaces currently in use, a substantial need exists in the art for an interface that provides greater EMI attenuation, shielding effectiveness, and thermal conductivity. In this regard, newer electronic componentry continues to have ever increasing power dissipation and EMI emission. While such electronic componentry typically is constructed and/or packaged to be electrically isolated, the aforementioned increases in power dissipation and EMI emission currently present drawbacks that must be addressed if such componentry is to perform optimally. Additionally, as such advances are made in such componentry, it is certain that the aforementioned concerns regarding radiated emission and power dissipation will continue to create a demand for an interface system that can adequately address the same.
- Prior art interface systems, however, are ill-suited to meet such needs insofar as such interface systems, because of their multiple-layer construction, substantially reduces the flow of heat thereacross. In this regard, it has been found that the use of thermal interface systems having six layer construction does not provide desirable heat transfer from a given electronic component to a heat sink. Moreover, not only does each individual layer impede heat flow, but, as those skilled in the art will appreciate, each interface of adjacent layers additionally inhibits heat flow. In this respect, each layer contributes three distinct impediments to heat flow, namely, each layer introduces the material of which the layer itself is comprised, as well as the two interfaces at either surface of the layer. Thus, it will be appreciated that it is highly desirable to minimize the number of layers, and consequently the number of interfaces, comprising such interface system. In addition to the foregoing, it should be noted from a practical standpoint that manufacturing such interface systems having multiple layers is expensive.
- In addition to the need for improved interface systems is the need for improved heat sinks to be used therewith that are capable of more effectively and efficiently dissipating the heat transfer thereto. In this regard, most heat sinks in use, which are typically fabricated from extruded aluminum, are formed to have a base with a plurality of fins extending therefrom. The fins are equidistantly spaced from one another and are formed to have sufficient surface area to dissipate the heat into the surrounding air. In this respect, a fan is frequently used to assure adequate circulation of air over the fins, so as to maintain desirable heat dissipation therefrom.
- Unfortunately, however, the number of fins and the spacing therebetween is limited by the aluminum extrusion process. As is well-known, fins spaced closer together than 0.2 inches tends to block natural convection air flow and cannot be optimized for use in forced convection. Additionally, conventional extrusion technology limits the amount of surface area, namely, the height of the fins of the heat sink, which further constrains heat removal. In this respect, it is well-known that the amount of surface area is proportional to the amount of heat that can be removed. Hence, a decrease in surface area thus translates into limited heat removal.
- To partially address the aforementioned inadequacies with extruded aluminum heat sinks has been the introduction of folded-fin heat sinks. Such assemblies comprise a relatively thin base section and a set of fins folded into corrugated sections mounted thereon. The base section is typically formed to be either very thin to reduce mass or, alternatively, thicker to act as a heat spreader. The folded fins coupled to the base act as a heat-transfer area, allowing a stream of forced air to remove heat from the base. Currently, such folded-fin heat sinks offer the maximum potential in surface area and reduced weight. In this respect, thermal resistance as low as 0.40E ° C. C/W can be reached with folded-fin assemblies in forced-air cooling at 500 ft/min of air velocity. Moreover, in utilizing a corrugated piece of aluminum or copper, there is thus eliminated the restrictions otherwise faced in the extrusion process.
- Notwithstanding the desirability of such folded-fin heat sinks, the same still suffer from the drawback of failing to achieve optimal heat transfer and dissipation insofar as current folded-fin heat sinks fail to achieve optimal heat transfer from the base to the folded-fin assembly coupled thereto. As such, the maximum amount of heat that could otherwise be dissipated by the assembly is not attained.
- Accordingly, there is a need in the art for a thermal interface that provides greater thermal conductivity and greater electrical insulation than prior art interfaces. There is additionally a need in the art for such a thermal interface that is of low cost, easy to manufacture, and may be readily utilized with existing componentry requiring the integration of a thermal interface system. Moreover, there is a need in the art for an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component. There is further a need for such an improved heat sink that is particularly more effective in transferring heat from a given heat source to the fins or other apparatus by which the same is dissipated.
- The present invention specifically addresses and alleviates the aforementioned deficiencies in the art. Specifically, the present invention is directed to an interface system for use with electronic componentry that has superior electrical insulation and thermal conductivity properties than prior art systems. In the preferred embodiment, the interface system of the present invention comprises the combination of a generally planar substrate, preferably being comprised of a non-conductive material having a high dielectric strength. The planar substrate defines two outwardly facing flatwise surfaces that are configured to mate with the interface surfaces formed on the electronic component and the interface surface formed on the heat dissipator or heat sink, on the other surface Each respective outwardly facing surface has formed thereon a layer of a thermally conductive compound having a high degree of thermal conductivity to thus further facilitate the transfer of heat. In a preferred embodiment, such compound is preferably formed to have selective phase-change properties whereby the composition exists in a solid phase at normal room temperature, but melts, and therefore assumes a liquid phase, when subjected to the elevated temperatures at which the electronic component usually operates.
- The present invention further includes an improved heat sink that is more efficient and effective in dissipating heat transferred thereto via an electronic component. Specifically, such improved heat sink comprises the combination of a base plate attachable to a heat-dissipating component and a folded-fin assembly compressively attached thereto. In a preferred embodiment, the heat sink is provided with one or more pressure clips (or other fastener arrangement) detachably fastenable to the baseplate that apply a compressive force, via a pressure spreader engagable therewith, against the folded-fin assembly that causes the assembly to remain compressively bonded with the baseplate from which the heat to be dissipated is received. To further facilitate the transfer of heat from the baseplate to the folded-fin assembly, there is preferably provided upon the baseplate a layer of a thermally-conductive compound having selective phase-change properties (i.e., liquefies during the operational temperature of the electronic component coupled to the heat sink), to eliminate any air gaps or voids between the baseplate and folded-fin assembly that would otherwise impede the transfer of heat. Alternatively, to the extent a greater degree of electrical isolation is desired, a thermal interface having a high dielectric capability may be interposed between the baseplate and folded-fin assembly.
- The present invention thus provides a thermal interface system that provides both electrical insulation and sufficient thermal conductivity to effectively facilitate the removal of heat therefrom more so than prior art interface systems.
- The present invention further provides a thermal interface having electrical isolation capability that utilizes a minimal number of layers in the construction thereof.
- Another object of the present invention is to provide a thermal interface that is relatively simple and inexpensive to manufacture compared to prior art interface systems, and may be readily and easily utilized in a wide variety of commercial applications.
- Another object of the present invention is to provide an improved heat sink that is more effective and efficient at dissipating heat transferred thereto from an electronic component, and especially more so than conventional heat sinks formed from extruded aluminum.
- Another object of the present invention is to provide an improved heat sink that is capable of more effectively transferring heat received thereby to the heat-dissipating component thereof than prior art heat sinks.
- A still further object of the present invention is to provide an improved heat sink that is of simple construction, may be readily and easily fabricated from existing materials well-known to those skilled in the art, is relatively inexpensive, and may be readily and easily utilized in numerous commercial applications.
- These as well as other features of the present invention will become more apparent upon reference to the drawings wherein:
- FIG. 1 is an exploded perspective view of an extruded heat sink positioned for attachment to an electronic component showing a preformed thermal interface pad of the present invention being disposed therebetween;
- FIG. 2 is a cross-sectional view taken along
line 2?2 of FIG. 1; - FIG. 3 is a perspective view of the respective layers comprising the thermal interface of the present invention;
- FIG. 4 is a perspective view of the respective layers comprising a prior art thermal interface;
- FIG. 5 is a perspective view of an improved heat sink constructed in accordance to a preferred embodiment of the present invention; and
- FIG. 6 is an exploded perspective view of the heat sink depicted in FIG. 5.
- The detailed description set forth below in connection with the appended drawings is intended merely as a description of the presently preferred embodiment of the invention, and is not intended to represent the only form in which the present invention may be constructed or utilized. The description sets forth the functions and sequence of steps for construction and implementation of the invention in connection with the illustrated embodiments. It is to be understood, however, that the same or equivalent functions and sequences may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention.
- Referring now to the drawings, and initially to FIG. 1, there is shown a
thermal interface 10 constructed in accordance with one embodiment of the present invention. Thethermal interface 10 is specifically designed and configured to facilitate the transfer of heat away from anelectronic component 12 to aheat sink 14. In addition to facilitating the transfer of heat, thethermal interface 10 of the present invention is further provided with electrical insulating capability to thus substantially electrically isolate theelectronic component 12 during the operation thereof. - As illustrated, the
thermal interface 10 is specifically designed and adapted to be interposed between theelectronic component 12 andheat sink 14. As is well-known,such heat sink 14 is provided with structures such as fins orother protuberances 14a having sufficient surface area to dissipate the heat into the surrounding air. Although not shown, to facilitate such heat dissipation, a fan is frequently utilized to provide adequate air circulation over the fins orprotuberances 14 a. - Preferably, the
thermal interface 10 is die-cut or pre-formed to have a shape or footprint compatible with the particular electronic component and/or heat sink to thus enable thethermal interface 10 to maximize surface area contact at the juncture between theelectronic component 12 andheat sink 14. Alternatively, thethermal interface 10 of the present invention may also be manually cut from a sheet of interface material, similar to other interface pads currently in use, so as to provide a custom fit between a given electronic component and heat sink. - Referring now to FIG. 2, there is shown a cross-sectional view of the
thermal interface 10 of the present invention. As illustrated, thethermal interface 10 is comprised of three layers 16-20. Thefirst layer 16 comprises a thermally conductive compound formulated to facilitate and enhance the ability of theinterface 10 to transfer heat away from the electronic component to the heat sink. Similar to other prior art compositions,such layer 16 is preferably formulated to have certain desired phase-change properties. Specifically, at room temperature, i.e., when the electronic device is not operating, the layer ofthermal compound 16 remains substantially solid. - The thermally conductive composition may take any of those disclosed in Applicant's co-pending patent application entitled PHASE CHANGE THERMAL INTERFACE COMPOSITION HAVING INDUCED BONDING PROPERTY, filed on Apr. 12, 2001, Ser. No. not yet assigned, and Applicant's co-pending patent application entitled GRAPHITIC ALLOTROPE INTERFACE COMPOSITION AND METHOD OF FABRICATING THE SAME, filed on May 18, 2000, and assigned application Ser. No. 09/573,508, the teachings of which are expressly incorporated herein by reference. Such thermal compounds have the desirable phase-change properties of assuming a solid phase at normal room temperature, but liquify at elevated temperatures of approximately 51° C. or higher, which is typically just below the operating temperatures at which most electronic components are intended to operate. It should be understood, however, that a wide variety of alternative thermally conductive materials and compounds are available and readily known to those skilled in the art which could be deployed for use in the practice of the present invention.
- The
second layer 18 is a generally planar substrate layer provided with an outwardly facing side and an inwardly facing side, the latter being bonded to thethermal component layer 16. Preferably, thesubstrate 18 is formed from a material that is both thermally conductive and has high dielectric strength. In a preferred embodiment, a substrate is fabricated from a polymer and preferably a polyimide. Not by way of limitation, one such highly preferred polyimide substrate includes KAPTON-type MT. However, other similar materials well-known to those skilled in the art may also be utilized, including ULTEM, a registered trademark of General Electric Corporation. - Advantageously, by using a substrate formed of a material having a high dielectric strength, there is thus provided a high degree of electrical insulation. Along these lines, while the interface of the present invention is specifically designed and adapted to be utilized with electronic componentry that already is electrically isolated, such added electrical insulation, as provided by the
substrate 18, additionally ensures such electrical isolation, which as those skilled in the art will recognize is frequently required in such applications. - To further facilitate and enhance the thermal performance of the
thermal interface 10 of the present invention, there is preferably provided asecond layer 20 of a thermally conductive compound formed upon the outwardly facing surface ofsubstrate 18. As withfirst layer 16,second layer 20 is preferably formulated to have certain desired phase-change properties, namely, assumes a solid phase when the electronic component is not operating, but liquifies when subjected to the operating temperature of the electronic component, so as to ensure that any voids or gaps formed by surface irregularities present upon the surface of the heat sink become filled, thereby maintaining a generally continuous mechanical contact to thus facilitate the transfer of heat to the heat sink coupled therewith. - As will be recognized by those skilled in the art, the
interface 10 of the present invention, because of its novel construction, will only be fabricated from three layers of material, namely, the first layer ofthermal compound 16,intermediate substrate 18 and second layer ofthermal compound 20, perspectively illustrated in FIG. 3. Such construction, due to the minimal amount of layers utilized, is specifically configured for optimal heat transmission therethrough, and thus is ideally suited for application as a thermal interface for facilitating heat transfer from an electronic component to a heat sink. As those skilled in the art will appreciate, by eliminating additional layers of material, which are typically present in prior art interfaces, there is thus facilitated the performance of heat transfer from the electronic component to a heat sink. More specifically, it is well-known that the rate of heat transfer through such interface is reduced by each layer added thereto. - In contrast, as depicted in FIG. 4, there is shown a
prior art interface 26 having a seven-layer construction. The layers comprising theprior art interface 26 comprise, from bottom to top, a first or externalthermal compound layer 28, a firstnon-conductive substrate 30, a first or internaladhesive layer 32, a layer ofconductive material 34, a second internaladhesive layer 36, a secondnon-conductive substrate 38, and a second externalthermal compound layer 40. As discussed above, such multi-layer construction substantially reduces the rate of heat transfer therethrough, with the addition of each additional layer providing that much more of an impediment in achieving the desired thermal conductivity. Additionally, by using fewer layers, thethermal interface 10 of the present invention is provided with a reduced thickness than such prior art interfaces, which, as a result, even further enhances the flow of heat therethrough. - Referring now to FIGS. 5 and 6, and initially to FIG. 5, there is shown an
improved heat sink 50 constructed in accordance to a preferred embodiment of the present invention. As shown, theheat sink 50 comprises the combination of abaseplate 52 and a folded-fin assembly 60, the latter being compressively mounted upon an electrically insulatedplatform surface 52 a formed on the baseplate 52 (shown in FIG. 6), via a pair of pressure clips 68 a, 68 b and electrically insulatedpressure spreaders platform surface 52 a may have formed thereon a sheet of electrically insulated material, such as KAPTON-type MT. Similarly, the pressure clips 68 a, 68 b will preferably be formed from electrically non-conductive materials such as fiberglass, or other like materials. - The
baseplate 52 is provided with a plurality ofapertures 54 to enable the same to be fastened, via bolts and the like, to a given heat-dissipating component (not shown). Thebaseplate 52 further has formed thereon opposed pairs ofslots 56 a, a′ and 56 b, b′ that are designed and configured to receive respective ones of pairs offeet 70 a, a′ and 70 b, b′ formed upon pressure clips 68 a, 68 b, more clearly seen in FIG. 6. As will be appreciated by those skilled in the art,slots 56 a, a′ and 56 b, b′ provide points of leverage by which pressure clips 68 can impart a downwardly compressive force, viapressure spreader fin assembly 60, and more particularly the upper folds 60 b thereof. Thebaseplate 52 is preferably formed from a material having excellent thermally conductive properties, such as aluminum and other like metals. - The folded-
fin assembly 60 preferably comprises a unitary piece of corrugated metal, such as aluminum or other like materials well-known to those skilled in the art, that have ideal heat-dissipating properties. As illustrated, the folded-fin assembly 60 is formed to have a generally serpentine configuration such that the same is provided with a plurality of downwardly facingbends 60 a that are oriented to mate with the electrically insulatedupper platform surface 52 a ofbaseplate 52, more clearly seen in FIG. 6, and a plurality of upwardly oriented folds 60 b, the latter being forced compressively downward via pressure clips 68 a, 68 b, andpressure spreader - As will be recognized by those skilled in the art, by using a folded-
fin assembly 60, theheat sink 50 is thus provided with a heat-dissipating component that is not limited by prior art extrusion processes. As is well-known, prior heat sinks formed from extruded aluminum possess substantial limitations insofar as most extrusion processes limit the height of such fins formed thereon to dissipate heat, as well as the spacing therebetween. Such limitations do not apply to the folded-fin assembly 60, in contrast, by virtue of having fins folded into suchcorrugated sections - To maximize and facilitate physical contact, and thus enhance thermal conductivity between the folded-
fin assembly 60 andbaseplate 52, there are provided pressure clips 68 a, 68 b andpressure spreaders bends 60 b of the folded-fin assembly 60 thus forcing the folded-fin assembly to remain firmly seated and compressed against thebaseplate 52. In the preferred embodiment shown, eachpressure clip legs 72 a, a′ and 72 b, b′ having outwardly extendingfeet 70 a, a′ and 70 b, b′ formed at the distalmost ends thereof. The legs 72 are connected to one another via an elongate segment defined by downwardly-biasedsections 74 and mid-portion 76. As will be readily appreciated by those skilled in the art, when the feet 70 of eachrespective pressure clip baseplate 52, such downwardly biasedsections 74 and mid-portion 76 are caused to impart the aforementioned downwardly compressive force. -
Pressure spreaders bend 60 b of folded-fin assembly 60. As shown, thepressure spreaders sections 74 and mid-portion 76 of each respective pressure clip and become sandwiched between the clip 68 and thetop fold 60 b of folded-fin assembly 60. Advantageously, by compressively bonding the folded-fin assembly 60 againstbaseplate 52, thermal conductivity and, ultimately, heat dissipation is maximized and allows for greater heat transfer than prior art heat sinks. - To further facilitate the transfer of heat, there is optionally provided upon the
upper platform surface 52 a ofbaseplate 52 a layer of thermally conductive compound formulated to have the aforementioned desired phase-change properties to thus ensure maximum mechanical contact between the folded-fin assembly 60 andbaseplate 52. Alternatively, to the extent desired, an interface pad or other like system may be positioned upon theplatform surface 52 a to provide further desired properties (e.g., electrical insulation) in addition to facilitating the transfer of heat. - In yet another optional embodiment of the present invention,
base plate 52 maybe provided with aground contact connection 78, shown in phantom in FIGS. 5 and 6, to thus enable an electronic utilized therewith to become electrically grounded. Along these lines, while most electronic componentry typically in use is constructed and/or packaged to be electrically isolated, to the extent such componentry is not grounded, ground contact connection 58 will thus facilitate that end. It will be readily recognized by those skilled in the art, however, that in such applications,base plate 52 will be for theheat sink 50 will further include an electrically insulated pad or layer, such as 80 depicted in phantom in FIGS. 5 and 6, to ensure electrical isolation of thebase plate 52. In this respect, it is contemplated that such optional pad orlayer 80 may take the form of an interface pad or other like system that, in addition to providing electrical insulation, can further facilitate the transfer of heat. - Although the invention has been described herein with specific reference to a presently preferred embodiment thereof, it will be appreciated by those skilled in the art that various additions, modifications, deletions and alterations may be made to such preferred embodiment without departing from the spirit and scope of the invention. For example, with respect to the improved heat sink of the present invention, any of a variety of mechanisms may be utilized to impart the compressive force against the folded-fin assembly whereby the latter is caused to be compressively bonded to the baseplate coupled therewith. Additionally,
upper platform surface 52 a need not necessarily be formed to be electrically insulated, but may simply comprise an outwardly facing surface of thebaseplate 52. Accordingly, it is intended that all reasonably foreseeable additions, modifications, deletions and alterations be included within the scope of the invention as defined in the following claims.
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/876,573 US6483707B1 (en) | 2001-06-07 | 2001-06-07 | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
PCT/US2002/007608 WO2002102125A1 (en) | 2001-06-07 | 2002-03-13 | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/876,573 US6483707B1 (en) | 2001-06-07 | 2001-06-07 | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
Publications (2)
Publication Number | Publication Date |
---|---|
US6483707B1 US6483707B1 (en) | 2002-11-19 |
US20020186537A1 true US20020186537A1 (en) | 2002-12-12 |
Family
ID=25368047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/876,573 Expired - Lifetime US6483707B1 (en) | 2001-06-07 | 2001-06-07 | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
Country Status (2)
Country | Link |
---|---|
US (1) | US6483707B1 (en) |
WO (1) | WO2002102125A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040010912A1 (en) * | 2002-05-31 | 2004-01-22 | Amigo Jean | Method for making a heat sink device and product made thereby |
US20040132331A1 (en) * | 2003-01-07 | 2004-07-08 | Osborn Jay Kevin | Support and grounding structure |
US20100091462A1 (en) * | 2007-02-15 | 2010-04-15 | Nec Corporation | Electronic device-mounted apparatus and noise suppression method for same |
US20110061847A1 (en) * | 2009-09-11 | 2011-03-17 | Meng-Hsiu Hsieh | Heat dissipation device |
CN102623418A (en) * | 2011-01-31 | 2012-08-01 | 台通科技股份有限公司 | Radiator |
TWI408537B (en) * | 2009-08-21 | 2013-09-11 | Meng Hsiu Hsieh | Heat sink |
CN109679198A (en) * | 2018-12-28 | 2019-04-26 | 苏州赛伍应用技术股份有限公司 | A kind of heat conductive phase change material and preparation method thereof |
Families Citing this family (150)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6672378B2 (en) * | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
JP3938681B2 (en) * | 2001-11-21 | 2007-06-27 | 信越化学工業株式会社 | Heat dissipation structure |
US7473995B2 (en) * | 2002-03-25 | 2009-01-06 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US7846778B2 (en) * | 2002-02-08 | 2010-12-07 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
TW520133U (en) * | 2002-05-17 | 2003-02-01 | Hon Hai Prec Ind Co Ltd | A clip assembly |
KR20070006682A (en) * | 2004-03-30 | 2007-01-11 | 허니웰 인터내셔널 인코포레이티드 | Heat spreader constructions, integrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry |
WO2006017193A1 (en) * | 2004-07-13 | 2006-02-16 | Henkel Corporation | Novel packaging solution for highly filled phase-change thermal interface material |
US7529095B2 (en) * | 2007-09-28 | 2009-05-05 | Visteon Global Technologies, Inc. | Integrated electrical shield in a heat sink |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
US11374118B2 (en) | 2009-10-12 | 2022-06-28 | Monolithic 3D Inc. | Method to form a 3D integrated circuit |
US10043781B2 (en) | 2009-10-12 | 2018-08-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10354995B2 (en) | 2009-10-12 | 2019-07-16 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11018133B2 (en) | 2009-10-12 | 2021-05-25 | Monolithic 3D Inc. | 3D integrated circuit |
US10388863B2 (en) | 2009-10-12 | 2019-08-20 | Monolithic 3D Inc. | 3D memory device and structure |
US10366970B2 (en) | 2009-10-12 | 2019-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10910364B2 (en) | 2009-10-12 | 2021-02-02 | Monolitaic 3D Inc. | 3D semiconductor device |
US10157909B2 (en) | 2009-10-12 | 2018-12-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10217667B2 (en) | 2011-06-28 | 2019-02-26 | Monolithic 3D Inc. | 3D semiconductor device, fabrication method and system |
US20120037348A1 (en) * | 2010-08-13 | 2012-02-16 | Chu Su Hua | Heat sink structure |
US10497713B2 (en) | 2010-11-18 | 2019-12-03 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11482440B2 (en) | 2010-12-16 | 2022-10-25 | Monolithic 3D Inc. | 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits |
US11600667B1 (en) | 2010-10-11 | 2023-03-07 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US10290682B2 (en) | 2010-10-11 | 2019-05-14 | Monolithic 3D Inc. | 3D IC semiconductor device and structure with stacked memory |
US11315980B1 (en) | 2010-10-11 | 2022-04-26 | Monolithic 3D Inc. | 3D semiconductor device and structure with transistors |
US11024673B1 (en) | 2010-10-11 | 2021-06-01 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11018191B1 (en) | 2010-10-11 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11227897B2 (en) | 2010-10-11 | 2022-01-18 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US10896931B1 (en) | 2010-10-11 | 2021-01-19 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11158674B2 (en) | 2010-10-11 | 2021-10-26 | Monolithic 3D Inc. | Method to produce a 3D semiconductor device and structure |
US11469271B2 (en) | 2010-10-11 | 2022-10-11 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US11257867B1 (en) | 2010-10-11 | 2022-02-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with oxide bonds |
US10998374B1 (en) | 2010-10-13 | 2021-05-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11404466B2 (en) | 2010-10-13 | 2022-08-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11063071B1 (en) | 2010-10-13 | 2021-07-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US11164898B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11694922B2 (en) | 2010-10-13 | 2023-07-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US10943934B2 (en) | 2010-10-13 | 2021-03-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US10679977B2 (en) | 2010-10-13 | 2020-06-09 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11133344B2 (en) | 2010-10-13 | 2021-09-28 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11163112B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US11855114B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US10833108B2 (en) | 2010-10-13 | 2020-11-10 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11605663B2 (en) | 2010-10-13 | 2023-03-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11929372B2 (en) | 2010-10-13 | 2024-03-12 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11043523B1 (en) | 2010-10-13 | 2021-06-22 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11437368B2 (en) | 2010-10-13 | 2022-09-06 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11855100B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11327227B2 (en) | 2010-10-13 | 2022-05-10 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US10978501B1 (en) | 2010-10-13 | 2021-04-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US11869915B2 (en) | 2010-10-13 | 2024-01-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11121021B2 (en) | 2010-11-18 | 2021-09-14 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11508605B2 (en) | 2010-11-18 | 2022-11-22 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11569117B2 (en) | 2010-11-18 | 2023-01-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11854857B1 (en) | 2010-11-18 | 2023-12-26 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11355380B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | Methods for producing 3D semiconductor memory device and structure utilizing alignment marks |
US11784082B2 (en) | 2010-11-18 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11482439B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors |
US11804396B2 (en) | 2010-11-18 | 2023-10-31 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11901210B2 (en) | 2010-11-18 | 2024-02-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11031275B2 (en) | 2010-11-18 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11107721B2 (en) | 2010-11-18 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with NAND logic |
US11004719B1 (en) | 2010-11-18 | 2021-05-11 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11482438B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11495484B2 (en) | 2010-11-18 | 2022-11-08 | Monolithic 3D Inc. | 3D semiconductor devices and structures with at least two single-crystal layers |
US11443971B2 (en) | 2010-11-18 | 2022-09-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11018042B1 (en) | 2010-11-18 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11211279B2 (en) | 2010-11-18 | 2021-12-28 | Monolithic 3D Inc. | Method for processing a 3D integrated circuit and structure |
US11615977B2 (en) | 2010-11-18 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11164770B1 (en) | 2010-11-18 | 2021-11-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US11094576B1 (en) | 2010-11-18 | 2021-08-17 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11521888B2 (en) | 2010-11-18 | 2022-12-06 | Monolithic 3D Inc. | 3D semiconductor device and structure with high-k metal gate transistors |
US11355381B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11923230B1 (en) | 2010-11-18 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11610802B2 (en) | 2010-11-18 | 2023-03-21 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes |
US11862503B2 (en) | 2010-11-18 | 2024-01-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11735462B2 (en) | 2010-11-18 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US10388568B2 (en) | 2011-06-28 | 2019-08-20 | Monolithic 3D Inc. | 3D semiconductor device and system |
US11694944B1 (en) | 2012-04-09 | 2023-07-04 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11735501B1 (en) | 2012-04-09 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11476181B1 (en) | 2012-04-09 | 2022-10-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10600888B2 (en) | 2012-04-09 | 2020-03-24 | Monolithic 3D Inc. | 3D semiconductor device |
US11088050B2 (en) | 2012-04-09 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers |
US11410912B2 (en) | 2012-04-09 | 2022-08-09 | Monolithic 3D Inc. | 3D semiconductor device with vias and isolation layers |
US11164811B2 (en) | 2012-04-09 | 2021-11-02 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers and oxide-to-oxide bonding |
US11594473B2 (en) | 2012-04-09 | 2023-02-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11616004B1 (en) | 2012-04-09 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11881443B2 (en) | 2012-04-09 | 2024-01-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11309292B2 (en) | 2012-12-22 | 2022-04-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11063024B1 (en) | 2012-12-22 | 2021-07-13 | Monlithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11217565B2 (en) | 2012-12-22 | 2022-01-04 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11784169B2 (en) | 2012-12-22 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11018116B2 (en) | 2012-12-22 | 2021-05-25 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11916045B2 (en) | 2012-12-22 | 2024-02-27 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10115663B2 (en) | 2012-12-29 | 2018-10-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430668B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US10903089B1 (en) | 2012-12-29 | 2021-01-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10651054B2 (en) | 2012-12-29 | 2020-05-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11087995B1 (en) | 2012-12-29 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11004694B1 (en) | 2012-12-29 | 2021-05-11 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US9385058B1 (en) * | 2012-12-29 | 2016-07-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US10892169B2 (en) | 2012-12-29 | 2021-01-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430667B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US10600657B2 (en) | 2012-12-29 | 2020-03-24 | Monolithic 3D Inc | 3D semiconductor device and structure |
US11177140B2 (en) | 2012-12-29 | 2021-11-16 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10325651B2 (en) | 2013-03-11 | 2019-06-18 | Monolithic 3D Inc. | 3D semiconductor device with stacked memory |
US8902663B1 (en) | 2013-03-11 | 2014-12-02 | Monolithic 3D Inc. | Method of maintaining a memory state |
US11869965B2 (en) | 2013-03-11 | 2024-01-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US11935949B1 (en) | 2013-03-11 | 2024-03-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US11923374B2 (en) | 2013-03-12 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10840239B2 (en) | 2014-08-26 | 2020-11-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11398569B2 (en) | 2013-03-12 | 2022-07-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11088130B2 (en) | 2014-01-28 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10224279B2 (en) | 2013-03-15 | 2019-03-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US11487928B2 (en) | 2013-04-15 | 2022-11-01 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11030371B2 (en) | 2013-04-15 | 2021-06-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11270055B1 (en) | 2013-04-15 | 2022-03-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11720736B2 (en) | 2013-04-15 | 2023-08-08 | Monolithic 3D Inc. | Automation methods for 3D integrated circuits and devices |
US11574109B1 (en) | 2013-04-15 | 2023-02-07 | Monolithic 3D Inc | Automation methods for 3D integrated circuits and devices |
US9021414B1 (en) | 2013-04-15 | 2015-04-28 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11341309B1 (en) | 2013-04-15 | 2022-05-24 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11031394B1 (en) | 2014-01-28 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11107808B1 (en) | 2014-01-28 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10297586B2 (en) | 2015-03-09 | 2019-05-21 | Monolithic 3D Inc. | Methods for processing a 3D semiconductor device |
US11011507B1 (en) | 2015-04-19 | 2021-05-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11056468B1 (en) | 2015-04-19 | 2021-07-06 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10381328B2 (en) | 2015-04-19 | 2019-08-13 | Monolithic 3D Inc. | Semiconductor device and structure |
US10825779B2 (en) | 2015-04-19 | 2020-11-03 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11956952B2 (en) | 2015-08-23 | 2024-04-09 | Monolithic 3D Inc. | Semiconductor memory device and structure |
CN115942752A (en) | 2015-09-21 | 2023-04-07 | 莫诺利特斯3D有限公司 | 3D semiconductor device and structure |
US10522225B1 (en) | 2015-10-02 | 2019-12-31 | Monolithic 3D Inc. | Semiconductor device with non-volatile memory |
US10418369B2 (en) | 2015-10-24 | 2019-09-17 | Monolithic 3D Inc. | Multi-level semiconductor memory device and structure |
US11114464B2 (en) | 2015-10-24 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10847540B2 (en) | 2015-10-24 | 2020-11-24 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11296115B1 (en) | 2015-10-24 | 2022-04-05 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11937422B2 (en) | 2015-11-07 | 2024-03-19 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11114427B2 (en) | 2015-11-07 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor processor and memory device and structure |
US11711928B2 (en) | 2016-10-10 | 2023-07-25 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11251149B2 (en) | 2016-10-10 | 2022-02-15 | Monolithic 3D Inc. | 3D memory device and structure |
US11930648B1 (en) | 2016-10-10 | 2024-03-12 | Monolithic 3D Inc. | 3D memory devices and structures with metal layers |
US11812620B2 (en) | 2016-10-10 | 2023-11-07 | Monolithic 3D Inc. | 3D DRAM memory devices and structures with control circuits |
US11869591B2 (en) | 2016-10-10 | 2024-01-09 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11329059B1 (en) | 2016-10-10 | 2022-05-10 | Monolithic 3D Inc. | 3D memory devices and structures with thinned single crystal substrates |
US11009924B2 (en) * | 2018-08-03 | 2021-05-18 | Dell Products L.P. | Systems and methods for combined active and passive cooling of an information handling resource |
US11158652B1 (en) | 2019-04-08 | 2021-10-26 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11296106B2 (en) | 2019-04-08 | 2022-04-05 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11763864B2 (en) | 2019-04-08 | 2023-09-19 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures with bit-line pillars |
US11018156B2 (en) | 2019-04-08 | 2021-05-25 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US10892016B1 (en) | 2019-04-08 | 2021-01-12 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
CN115437480A (en) * | 2021-06-03 | 2022-12-06 | 英业达科技有限公司 | Servo device |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA600823A (en) | 1960-06-28 | Canadian General Electric Company | Mounting device for semiconductor devices and the like | |
US2799793A (en) | 1952-10-31 | 1957-07-16 | Gen Precision Lab Inc | Electronic tube shield |
NL101297C (en) | 1956-06-12 | |||
US3013104A (en) | 1957-07-18 | 1961-12-12 | Video Instr Company Inc | Heat bank for transistorized circuits |
GB1086003A (en) | 1964-03-13 | 1967-10-04 | Ass Elect Ind | Mounting arrangements for electronic devices |
US3249680A (en) | 1964-04-14 | 1966-05-03 | Nat Beryllia Corp | Insulating, heat-sink holder for transistors |
GB1063743A (en) | 1964-04-30 | 1967-03-30 | Raymond Francis Furness | Improvements in or relating to methods of and/or means for the storage of heat and/orheaters incorporating such storage means |
US3463161A (en) | 1965-04-13 | 1969-08-26 | Stella Andrassy | Temperature maintaining device |
US3391242A (en) | 1966-12-27 | 1968-07-02 | Admiral Corp | Transistor insulator with self-contained silicone grease supply |
DE1283404B (en) | 1967-02-16 | 1968-11-21 | Philips Patentverwertung Gmbh | Radiator assembly for contact cooling for electrical discharge tubes |
US3467547A (en) | 1967-07-06 | 1969-09-16 | Sun Oil Co | Corrugated paperboard having improved wet strength properties |
US3463140A (en) | 1967-10-11 | 1969-08-26 | Edward A Rollor Jr | Container for heated liquids |
US3819530A (en) | 1968-07-15 | 1974-06-25 | Sun Oil Co | Stabilized wax emulsions |
US3586102A (en) | 1969-02-17 | 1971-06-22 | Teledyne Inc | Heat sink pillow |
US3823089A (en) | 1969-03-27 | 1974-07-09 | J Ryan | Heat storage composition |
US3603106A (en) | 1969-03-27 | 1971-09-07 | John W Ryan | Thermodynamic container |
US3887628A (en) | 1973-02-23 | 1975-06-03 | Diamond Shamrock Corp | Methylene chloride stabilized with organic epoxides |
US3972821A (en) | 1973-04-30 | 1976-08-03 | Amchem Products, Inc. | Heat transfer composition and method of making |
US4065908A (en) | 1976-04-26 | 1978-01-03 | Owens-Illinois, Inc. | Method and apparatus for sealing tamper-indicating tabs to a container sidewall |
US4139051A (en) | 1976-09-07 | 1979-02-13 | Rockwell International Corporation | Method and apparatus for thermally stabilizing workpieces |
FR2368529A1 (en) | 1976-10-20 | 1978-05-19 | Blanie Paul | Paraffin complexes with added solids - have improved calorific reserve and thermal conductivity |
US4151547A (en) | 1977-09-07 | 1979-04-24 | General Electric Company | Arrangement for heat transfer between a heat source and a heat sink |
US4473113A (en) | 1978-04-14 | 1984-09-25 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4466483A (en) | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4299715A (en) | 1978-04-14 | 1981-11-10 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4237086A (en) | 1979-02-22 | 1980-12-02 | Rockwell International Corporation | Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction |
US4266267A (en) | 1979-11-19 | 1981-05-05 | General Electric Company | Mounting arrangement for transistors and the like |
DE3104623A1 (en) | 1981-02-10 | 1982-08-26 | Robert Bosch Gmbh, 7000 Stuttgart | METHOD FOR FASTENING COMPONENTS WITH FLAT CONNECTORS AND COMPONENT HERE |
US5237086A (en) | 1989-09-02 | 1993-08-17 | Bayer Aktiengesellschaft | Fungicidal derivatives of carbocyclic anilides |
US5060114A (en) | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
EP0956590A1 (en) * | 1996-04-29 | 1999-11-17 | Parker-Hannifin Corporation | Conformal thermal interface material for electronic components |
US5930893A (en) * | 1996-05-29 | 1999-08-03 | Eaton; Manford L. | Thermally conductive material and method of using the same |
US5931831A (en) | 1996-07-09 | 1999-08-03 | Linder; Gerald S. | Dual-lumen suction catheter with smaller diameter vent lumen having multiple apertures therein |
US6260610B1 (en) * | 1998-03-06 | 2001-07-17 | Thermal Form & Function | Convoluted fin heat sinks with base topography for thermal enhancement |
US5986884A (en) | 1998-07-13 | 1999-11-16 | Ford Motor Company | Method for cooling electronic components |
US5912805A (en) | 1998-11-04 | 1999-06-15 | Freuler; Raymond G. | Thermal interface with adhesive |
US6165612A (en) * | 1999-05-14 | 2000-12-26 | The Bergquist Company | Thermally conductive interface layers |
JP3273505B2 (en) * | 1999-08-18 | 2002-04-08 | 古河電気工業株式会社 | Heat sink provided with heat radiation fins and method of fixing heat radiation fins |
US6343013B1 (en) * | 2001-04-12 | 2002-01-29 | Foxconn Precision Components Co., Ltd. | Heat sink assembly |
-
2001
- 2001-06-07 US US09/876,573 patent/US6483707B1/en not_active Expired - Lifetime
-
2002
- 2002-03-13 WO PCT/US2002/007608 patent/WO2002102125A1/en not_active Application Discontinuation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040010912A1 (en) * | 2002-05-31 | 2004-01-22 | Amigo Jean | Method for making a heat sink device and product made thereby |
US20040132331A1 (en) * | 2003-01-07 | 2004-07-08 | Osborn Jay Kevin | Support and grounding structure |
US7232332B2 (en) * | 2003-01-07 | 2007-06-19 | Sun Microsystems, Inc. | Support and grounding structure |
US20100091462A1 (en) * | 2007-02-15 | 2010-04-15 | Nec Corporation | Electronic device-mounted apparatus and noise suppression method for same |
TWI408537B (en) * | 2009-08-21 | 2013-09-11 | Meng Hsiu Hsieh | Heat sink |
US20110061847A1 (en) * | 2009-09-11 | 2011-03-17 | Meng-Hsiu Hsieh | Heat dissipation device |
CN102623418A (en) * | 2011-01-31 | 2012-08-01 | 台通科技股份有限公司 | Radiator |
CN109679198A (en) * | 2018-12-28 | 2019-04-26 | 苏州赛伍应用技术股份有限公司 | A kind of heat conductive phase change material and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2002102125A1 (en) | 2002-12-19 |
US6483707B1 (en) | 2002-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6483707B1 (en) | Heat sink and thermal interface having shielding to attenuate electromagnetic interference | |
US6097598A (en) | Thermal conductive member and electronic device using same | |
US7056566B2 (en) | Preappliable phase change thermal interface pad | |
US6315038B1 (en) | Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device | |
US7004244B2 (en) | Thermal interface wafer and method of making and using the same | |
JP3326540B2 (en) | Equipment for mounting electronic circuit elements on circuit boards | |
US20020080584A1 (en) | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | |
JP2003168882A (en) | Heat conductive sheet | |
US6590771B2 (en) | Heat sink assembly and method | |
US11495519B2 (en) | Apparatus for thermal management of electronic components | |
CA2349833A1 (en) | Heat sink including heat receiving surface with protruding portion | |
JP2009099753A (en) | Heat sink | |
US7203065B1 (en) | Heatsink assembly | |
US20030024698A1 (en) | Flexible coupling for heat sink | |
JP2866632B2 (en) | Heat dissipation material | |
US6988533B2 (en) | Method and apparatus for mounting a heat transfer apparatus upon an electronic component | |
JPH0864731A (en) | Heat conducting member and cooler and electronic apparatus employing the same | |
CN110098153B (en) | Power electronic module and method of manufacturing a power electronic module | |
JP2003198171A (en) | Heat sink and radiator | |
JPH1092990A (en) | Cooling structure | |
WO1991019415A1 (en) | Heat sink for heat generating components | |
US20220151108A1 (en) | Thermal management of high heat flux multicomponent assembly | |
JPH1092986A (en) | Heat sink | |
WO2022249841A1 (en) | Mounting structure | |
JP2001523047A (en) | Non-conductive heat dissipator components |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LOCTITE CORPORATION, CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FREULER, RAYMOND G.;FLYNN, GARY E.;REEL/FRAME:011886/0279 Effective date: 20010607 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: HENKEL CORPORATION, CONNECTICUT Free format text: MERGER;ASSIGNOR:HENKEL LOCTITE CORPORATION;REEL/FRAME:031684/0261 Effective date: 20040101 Owner name: HENKEL LOCTITE CORPORATION, CONNECTICUT Free format text: CHANGE OF NAME;ASSIGNOR:LOCTITE CORPORATION;REEL/FRAME:031731/0900 Effective date: 20020514 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
SULP | Surcharge for late payment |
Year of fee payment: 11 |
|
AS | Assignment |
Owner name: HENKEL US IP LLC, CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HENKEL CORPORATION;REEL/FRAME:034184/0396 Effective date: 20141106 |
|
AS | Assignment |
Owner name: HENKEL IP & HOLDING GMBH, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HENKEL US IP LLC;REEL/FRAME:035100/0776 Effective date: 20150225 |