TWI408537B - Heat sink - Google Patents

Abstract

A heat sink includes a heat conductive plate, a set of fins laid on the heat conductive plate, and a fastener. The fastener has a curve section and two legs joined to the opposite ends of the curve section. The two legs are fastened on the heat conductive plate. The curve section spans the set of fins and presses the set of fins against a top surface of the heat conductive plate.

Description

heat sink

The present invention relates to the structure of a heat sink for dissipating heat from a wafer, and more particularly to the assembly problem between the heat sink group and the heat conductive plate in the heat sink.

A conventional heat sink is a wafer that fixes the entire heat sink to the wafer carrier by means of a fastener that is fastened to a wafer carrier, such as Taiwan Patent Publication Nos. 286791, 311706, 571609, 437993, M326763, and the like. Although these patents all use wavy fasteners, these fasteners are not used to join the heat sink's bottom plate and heat sink because the heat sink's bottom plate and heat sink are integrally formed.

The Taiwan Patent No. 501,765 patent discloses a press part, a heat sink set, and a socket. The lower pressing member is used to restrict its heat sink group from coming off its seat. The lower pressing member is substantially a strip-shaped wave piece and is placed in a through hole traversing the middle of the heat sink group. The problem is that the wave shape of the lower pressing member itself makes it difficult to fit into the through hole, and both ends of the lower pressing member are hard to be inserted into the button holes on both sides of the socket. In short, the patent case has the problem of assembly difficulties and is not economical.

The present invention provides a new heat sink comprising a heat conducting plate, a heat sink set stacked on the heat conducting plate, and a fastener. The fastener has a curved section and two legs respectively connected to the two ends of the curved section. The curved section has an elastic deformation capability and has at least one low bend. The two pins are fastened to the heat conducting plate. The curved section spans the heat sink group, and the low bend of the curved section is to press the heat sink set tightly on the top surface of the heat conducting plate. In this way, the heat sink group can be bonded to the heat conductive plate without soldering.

Preferably, the low bend of the curved section is pressed against the top surface of the heat sink group.

Preferably, the low bend of the curved section is pressed against a backing plate, and the backing plate is pressed against the top surface of the heat sink group.

Preferably, the heat sink group has at least one long groove on its top surface, and the low bend portion of the curved portion is pressed against the bottom surface of the groove of the heat sink group.

Preferably, the low bend of the curved section is pressed against a backing plate, and the backing plate is pressed against the bottom surface of the groove of the heat sink group.

Wherein, the above-mentioned pad has the function of distributing the pressure from the curved section of the fastener evenly to the heat sink group, so that the heat dissipation The sheet set maintains good and intimate contact with the thermally conductive plate.

The first to fourth figures show a first preferred embodiment of the present invention in which a heat sink that can be used to dissipate heat from a CPU is disclosed.

The first figure discloses a heat sink including a heat conducting plate 1 on which a heat sink group 2 is stacked, and two pad portions 3 are stacked on the heat sink group 2, and the two fasteners 4 are fastened to the heat conducting plate. The plate 1 is pressed against the fin group 2, and four sets of fixing bolts 5 are provided at four corners of the heat conducting plate 1.

The second figure shows the case where the heat sink is applied to a circuit board 6. The circuit board 6, such as a computer motherboard, has a wafer carrier 60 thereon, and a wafer 61, such as a CPU, is mounted on the wafer carrier 60. The heat sink is quickly assembled to the circuit board 6 by the set of fixing bolts 5. Each of the sets of fixing bolts 5 includes a plug 50 and a compression spring 51. The compression spring 51 is sleeved on the plug 50 and is disposed between the head 501 of the plug 50 and the top surface of the heat conducting plate 1. The end portion of the peg 50 forms a threaded portion 502 for screwing onto a retaining frame 9 after passing through the reserved hole 62 in the circuit board 6. As shown in the figure, the bottom surface of the heat conducting plate 1 abuts against the wafer 61, and the bottom surface of the heat sink group 2 abuts against the top surface of the heat conducting plate 1. Therefore, the heat generated by the wafer 61 due to operation will pass through the guide. The hot plate 1 is quickly conducted to the heat sink group 2 for heat dissipation.

The heat conducting plate 1 is made of a heat conductive material such as copper, aluminum, ceramic, or the like, and may be made of a composite material or a multilayer material having a preferable heat conducting effect. In order to speed up the conduction of heat on the heat conducting plate 1 to the heat sink group 2, one or more heat pipes 7 may be used as shown in the first and third figures, and the heat pipes 7 may be sandwiched between the heat conducting plates. The top surface of 1 is between the top surface of the heat sink group 2. At this time, the top surface of the heat conducting plate 1 is not a full plane, but a recess is formed to accommodate the heat pipes 7. If it is desired that the top surface of the heat conducting plate 1 is a full plane, the bottom surface of the heat sink group 2 needs to form a recess to accommodate the heat pipes 7.

The heat sink group 2 can be manufactured by using an aluminum extrusion method, or by stamping copper or aluminum sheets, preferably by using a plurality of copper heat sinks or aluminum heat sinks to form the heat sink group 2 . More specifically, as shown in the second and third figures, the heat sink group 2 includes a plurality of fins 21 arranged in a certain direction, and a bottom portion of each fin 21 extends vertically with a folded bottom portion 21a. 21a is placed flat on the top surface of the heat conducting plate 1. As shown in the third figure, the top edge of each of the fins 21 further has two recesses 210. Each of the fins 21 further has a connecting piece 210a. The connecting piece 210a is located at the bottom edge of the recess 210 and from the bottom of the recess 210. Extending vertically with respect to the direction of the surface of the heat sink 21, each of the heat sinks 21 is connected by the plurality of heat sinks 21 The tab 210a is abutted against the connecting piece 210a of the adjacent fins 21 and is connected to form a connecting bottom surface. The concave portions 210 of the fins 21 are arranged to form two long and straight grooves 22, and the two grooves 22 are parallel to accommodate the two pad portions 3, respectively. The number of recesses 210 on the top edge of each fin 21 may be only one or more to form one or more grooves 22 for receiving one or more pads 3. The number of the pad portions 3 depends on the number of the fasteners 4, and the fastener members 4 may have only one or more. As shown in the third and fourth figures, the recess 22 has a bottom surface 22a and two side walls 22b. In other words, the bottom surface 22a of the recess 22 is a connecting bottom surface formed by the connecting pieces 210a.

As shown in the second, third, and fourth figures, each of the pads 3 is preferably made of a thermally conductive metal that includes a backing plate 30. Each fastener 4 includes a curved section 40 and two legs 41 connected to the two ends of the curved section 40, respectively. The curved section 40 has an elastic deformation capability and has one or more low bends 401 and one or more high bends 402. The backing plate 30 is sandwiched between the bottom surface 22a of the recess 22 of the heat sink group 2 and the low curved portion 401 of the fastener 4. The bottom surface of the backing plate 30 is flat and pressed against the heat sink group 2. The bottom surface 22a of the recess 22 has a flat surface and is pressed against the low curvature portion 401 of the fastener 4.

As shown in the second and third figures, the two pins 41 of each fastener 4 Each of the fastening portions 1 is buckled to the heat conducting plate 1 , and each of the fastening portions 410 is substantially a kind of hook. In this example, since the two fasteners 4 have a total of four fastening portions 410 (ie, hooks), the heat conducting plate 1 needs to be correspondingly provided with four longitudinal straight holes 10 and four horizontal straight holes 11 . The four straight through holes 10 are all connected to the top surface of the heat conducting plate 1 and distributed at four corners. Two of the four lateral straight holes 11 open to one side of the heat conducting plate 1, respectively, and the other two are respectively connected to the other side of the heat conducting plate 1, that is, opposite to the aforementioned side faces. As shown in the second figure, each of the horizontal straight holes 11 is perpendicular to one longitudinal straight hole 10 and communicated with each other, and the two fastening portions 410 (ie, hooks) can respectively enter the two vertical straight holes 10, and Straight straight holes 11 communicating with the two longitudinal straight holes 10 are respectively hooked (hooked). In this way, not only can each fastener 4 be quickly fastened to the heat conducting plate 1, but there is no worry about tripping or unhooking at all, because the button portion 410 of each fastener 4 is hidden in a corresponding correspondence. The longitudinal straight hole 10 and the horizontal straight hole 11 are not detached by random touch. When the fasteners 4 need to be removed, the fasteners 410 that are fastened or hooked therein can be easily pushed away from the lateral straight holes 11 by simply inserting the inserts into the lateral straight holes 11 at this time. The buckle portion 410 can be withdrawn from the heat conducting plate 1 along the corresponding longitudinal straight hole 10.

It can be seen from the second figure that the two pins 41 of each fastener 4 are fastened to the heat conducting plate 1 and the curved section 40 of each fastener 4 is made. The low-bend portion 401 is pressed against the backing plate 30. Therefore, the heat sink group 2 can be reliably pressed by the fastener 4, which not only enables the heat sink group 2 not to pass from the heat-conductive plate 1. The detachment is performed, and the bottom surface of the heat sink group 2 is brought into close contact with the top surface of the heat conductive plate 1 to achieve an optimum heat transfer effect. In this way, the heat sink group 2 and the heat conducting plate 1 can be connected without being connected by solder, thereby reducing the process and reducing the cost. Of course, it is preferable to apply a thermal conductive paste on the joint between the fin group 2 and the heat conducting plate 1 to increase the heat transfer efficiency between the two.

Furthermore, each fastener 4 is preferably made of a relatively high elasticity metal and is less susceptible to thermal deformation than the heat sink group 2, such as steel, iron or copper. Thus, the higher the heat conducting plate 1 and the heat sink group 2 expand due to heat absorption, the lower curved portion 401 of the curved portion 40 of each fastener 4 presses the heat sink group 2 tighter, which indicates the heat conduction. The heat transfer efficiency between the plate 1 and the fin group 2 will become higher.

In addition, the pad 30 of the pad portion 3 can effectively distribute the pressure from the curved section 40 of each fastener 4 laterally to the heat sink group 2 instead of being concentrated at a certain point, so that the heat sink group 2, it can be pressed more evenly, so that all the contact points between the bottom surface of the heat conducting plate 1 and the top surface of the heat conducting plate 1 are as tight as possible to avoid contact failure.

As shown in the third and fourth figures, in order to avoid lateral displacement of each fastener 4, each pad portion 3 includes two side plates 31 which are respectively erected on two opposite long sides of the top surface of the pad 30, and the two side plates 31 are respectively The outer faces of the two opposite side walls 22b of the corresponding recesses 22 of the heat sink group 2 respectively abut against the opposite sides of the curved section 40 of the fastener 4 located therein. side.

A second preferred embodiment of the present invention is similar to the first preferred example described above. The second preferred example uses a heat sink group without the recess 22 instead of the heat sink group 2 of the first preferred example. . The top surface of the heat sink group is flat. At this time, the curved portion 40 of the fastener 4 is directly pressed against the flat top surface of the heat sink group. When it is considered that the top surface of the heat sink group may not be very flat, the backing plate 30 as described above may be further disposed between the fastener 4 and the aforementioned heat sink group, and at this time, the backing plate 30 is sandwiched Between the top surface of the heat sink group and the low curved portion 401 of the fastener 4, wherein the bottom surface of the backing plate 30 is flat and pressed against the top surface of the heat sink group, the top surface of the backing plate 30 It is flat and pressed against the low curvature 401 of the fastener 4.

A third preferred embodiment of the present invention is the same as the first preferred example described above. The third preferred example is to completely remove the pad portion 3 of the first preferred example and to provide the fastener in the first preferred example. The curved section 40 of 4 is directly pressed against the bottom surface of the recess 22 of the heat sink group 2 22a. At this time, the opposite side walls 22b of the recess 22 of the fin group 2 abut against the opposite sides of the curved section 40 of the fastener 4, and the bottom surface 22a of the recess 22 is of course flatter. The curved section 40 is applied to the heat sink group 2 as evenly as possible.

In any event, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed different from the prior art, and is industrially usable and progressive. It is the invention that has indeed met the patent requirements and has filed an application in accordance with the law.

1‧‧‧heat conducting plate

10‧‧‧ vertical straight hole

11‧‧‧Straight straight hole

2‧‧‧Heat plate group

21‧‧‧ Heat sink

210‧‧‧ recess

21a‧‧‧Fold bottom

210a‧‧‧Connecting piece

22‧‧‧ Groove

3‧‧‧Mats

22a‧‧‧ bottom

22b‧‧‧ Sidewall

30‧‧‧ pads

31‧‧‧ side panels

4‧‧‧fasteners

40‧‧‧Bend section

401‧‧‧low bend

402‧‧‧High bending

41‧‧‧ pins

410‧‧‧ buckle

5‧‧‧Fixed plug group

50‧‧‧ bolt

501‧‧‧ head

502‧‧‧Threading Department

51‧‧‧Compression spring

6‧‧‧Circuit board

60‧‧‧ wafer carrier

61‧‧‧ wafer

62‧‧‧Reserved holes

7‧‧‧heat pipe

9‧‧‧ Fixing frame

The first figure is a perspective view of a preferred embodiment of the present invention.

The cross-sectional view of the second drawing shows the case where the preferred embodiment of the present invention is used on a circuit board.

The third figure is an exploded perspective view of the preferred embodiment of the present invention.

Figure 4 is a cross-sectional view of the preferred embodiment of the present invention.

1. . . Thermal plate

2. . . Heat sink set

3. . . Pad

4. . . Fastener

5. . . Fixed plug group

7. . . Heat pipe

Claims (8)

A heat sink comprises: a heat conducting plate; a heat sink group comprising a plurality of heat sinks, wherein a bottom edge of each heat sink extends vertically with a folded bottom portion, the bottom portion of which is flatly attached to the top surface of the heat conducting plate, each The heat sink has a recess, the recess is located at a top edge of the heat sink, wherein the recesses of the heat sink are arranged to form a long groove, the groove has two side walls and a bottom surface; The groove of the heat sink, the pad portion has a pad, the bottom surface of the pad is flat and in contact with the bottom surface of the groove, and the opposite long sides of the pad respectively abut the groove a second side wall; and a fastening member pressed against the backing plate and fastened to the heat conducting plate. The heat sink of claim 1, wherein each of the heat sinks further has a connecting piece, the connecting piece is located at a bottom edge of the concave portion and perpendicular to the heat sink, and the connecting piece of each heat sink is opposite thereto The connecting fins of the adjacent fins are brought together. The heat sink of claim 1, wherein the fastener comprises a curved section and two legs respectively connected to the two ends of the curved section. The heat sink of claim 3, wherein the opposite sides of the curved section of the fastener abut against the heat sink group The two side walls of the groove. The heat sink of claim 4, wherein the pad portion further has two side plates that are respectively erected on opposite longitudinal sides of the pad, and the outer wall faces of the two side plates respectively abut The two side walls of the groove, the inner wall surfaces of the two side plates respectively abut against opposite side edges of the curved section of the fastener. The heat sink of claim 1, wherein the two legs have a buckle portion, the buckle portion is a hook, and the top surface of the heat conduction plate has two longitudinal directions. a hole, the opposite sides of the heat conducting plate respectively have a transverse straight hole, wherein a horizontal straight hole is perpendicular to one of the longitudinal straight holes and communicates, and the other horizontal straight hole is perpendicular to the other longitudinal straight hole and communicates with the two hooks The two longitudinal straight holes can be respectively entered, and the horizontal straight holes communicating with the two longitudinal straight holes are respectively hooked. The heat sink according to claim 1, 2, 3, 4 or 5, further comprising at least one heat pipe, the heat pipe is laid flat on the heat conducting plate and sandwiched between the heat conducting plate and the heat sink group between. The heat sink according to claim 1, 2, 3, 4 or 5, further comprising at least one heat pipe, the top surface of the heat conducting plate has a recessed portion, the recess portion surrounding an accommodating space for the heat pipe to be placed flat The heat pipe is sandwiched between the recess and the folded bottom of the heat sink group.