CA600823A - Mounting device for semiconductor devices and the like - Google Patents
Mounting device for semiconductor devices and the likeInfo
- Publication number
- CA600823A CA600823A CA600823A CA600823DA CA600823A CA 600823 A CA600823 A CA 600823A CA 600823 A CA600823 A CA 600823A CA 600823D A CA600823D A CA 600823DA CA 600823 A CA600823 A CA 600823A
- Authority
- CA
- Canada
- Prior art keywords
- semiconductor devices
- mounting device
- mounting
- semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA600823T |
Publications (1)
Publication Number | Publication Date |
---|---|
CA600823A true CA600823A (en) | 1960-06-28 |
Family
ID=35816612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA600823A Expired CA600823A (en) | Mounting device for semiconductor devices and the like |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA600823A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3430686A (en) * | 1967-10-31 | 1969-03-04 | American Standard Inc | Heat shield for soldering plumbing lines |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
US4446916A (en) * | 1981-08-13 | 1984-05-08 | Hayes Claude Q C | Heat-absorbing heat sink |
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4471837A (en) * | 1981-12-28 | 1984-09-18 | Aavid Engineering, Inc. | Graphite heat-sink mountings |
US4473113A (en) * | 1978-04-14 | 1984-09-25 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4685987A (en) * | 1983-09-02 | 1987-08-11 | The Bergquist Company | Method of preparing interfacings of heat sinks with electrical devices |
US5904796A (en) * | 1996-12-05 | 1999-05-18 | Power Devices, Inc. | Adhesive thermal interface and method of making the same |
US6483707B1 (en) | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US6616999B1 (en) | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
US6652705B1 (en) | 2000-05-18 | 2003-11-25 | Power Devices, Inc. | Graphitic allotrope interface composition and method of fabricating the same |
US6672378B2 (en) | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
-
0
- CA CA600823A patent/CA600823A/en not_active Expired
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3430686A (en) * | 1967-10-31 | 1969-03-04 | American Standard Inc | Heat shield for soldering plumbing lines |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4473113A (en) * | 1978-04-14 | 1984-09-25 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4446916A (en) * | 1981-08-13 | 1984-05-08 | Hayes Claude Q C | Heat-absorbing heat sink |
US4471837A (en) * | 1981-12-28 | 1984-09-18 | Aavid Engineering, Inc. | Graphite heat-sink mountings |
US4685987A (en) * | 1983-09-02 | 1987-08-11 | The Bergquist Company | Method of preparing interfacings of heat sinks with electrical devices |
US5904796A (en) * | 1996-12-05 | 1999-05-18 | Power Devices, Inc. | Adhesive thermal interface and method of making the same |
US6616999B1 (en) | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
US7056566B2 (en) | 2000-05-17 | 2006-06-06 | Henkel Corporation | Preappliable phase change thermal interface pad |
US6652705B1 (en) | 2000-05-18 | 2003-11-25 | Power Devices, Inc. | Graphitic allotrope interface composition and method of fabricating the same |
US6483707B1 (en) | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US6672378B2 (en) | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
US6901997B2 (en) | 2001-06-07 | 2005-06-07 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
US7004244B2 (en) | 2001-06-07 | 2006-02-28 | Henkel Corporation | Thermal interface wafer and method of making and using the same |
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