US2799793A - Electronic tube shield - Google Patents

Electronic tube shield Download PDF

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US2799793A
US2799793A US317888A US31788852A US2799793A US 2799793 A US2799793 A US 2799793A US 317888 A US317888 A US 317888A US 31788852 A US31788852 A US 31788852A US 2799793 A US2799793 A US 2799793A
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Prior art keywords
tube
shield
envelope
layer
silicone rubber
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US317888A
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Cain Donald J De
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General Precision Laboratory Inc
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General Precision Laboratory Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/02—Vessels; Containers; Shields associated therewith; Vacuum locks
    • H01J5/12—Double-wall vessels or containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Definitions

  • This invention relates to shields for electronic tubes and especially to tube shields facilitating heat dissipation.
  • the problem is particularly acute with subminiature tubes when they are mounted by clipping the envelopes to a base card, as they frequently are. It is desirable to make the tube shield integral with and inseparable from the tube, to facilitate stocking and replacement, yet to incorporate in the shield the function of protecting the tube from mechanical shock.
  • the present invention solves this problem by covering the glass tube envelope with a form fitting metal sheet separated from the envelope by a layer of heat-conductive rubber-like material. This material is securely and permanently bonded both to the glass envelope and to the metal shield.
  • the metal shield thus constitutes a solid external surface which can be gripped positively by the metal spring clip which mechanically secures the tube to the base card.
  • the principal purpose of this invention then is to provide a shield for electronic tubes which not only shields the tube electrostatically, but also protects the tube against mechanical shock while facilitating heat dissipation.
  • a further purpose of this invention is to provide a shield for subminiature tubes, the shield being integrally associated with the tube so as to facilitate stocking, mounting and replacement.
  • Figure 1 is a plan view of a subminiature tube partly enclosed in a cover in accordance with the invention.
  • Figure 2 is an enlarged cross section of the tube and cover of Fig. 1 along the line 22.
  • a subminiature tube 11 is provided with a cover 12 that is both shock absorbent and heat dissipative as well as constituting an electrostatic shield.
  • the cover 12 is securely bonded and attached to the tube envelope, and is clipped by means of metal clips 13 and 13' to a card 14 of insulating material. Connections may be made between the tube terminal wires such as 16 and other components either directly or through terminals such as 17 by means of connecting wires or so-called printed conductive strips on the front or rear face of the card 14.
  • the glass tube envelope is indicated at 18. Surrounding the envelope 18 there is a two-layer cover.
  • the first layer 19 is made of a
  • This material consists of a silicone rubber loaded or impregnated with a quantity of metal particles to increase its heat conductivity. Any metal particles may be employed such as copper, aluminum, silver or zinc, and the particles may be of any convenient small size.
  • the silicone rubber is resilient and the thickness of the layer is sufficient to provide mechanical shock protection for the tube. For example, in the case of a subminiature cylindrical tube envelope having a diameter of inch, a thickness of silicone rubber of A inch has been found to be satisfactory.
  • the silicone rubber layer is surrounded by a metallic shield 21, the two being firmly and permanently bonded together.
  • the shield 21 serves as a mechanical protection for the silicone rubber layer and as a base for the mechanical support by clips of the entire tube and jacket assembly.
  • the shield 21 serves as an electrostatic tube shield and as an external heat radiating and conducting surface for dissipating the tube heat.
  • the tube and cover assembly is firmly gripped and held by the spring clips 13 and 13, these clips being riveted at 22 and 22 to the base 14.
  • a ground wire 23 is desirable because of the electrostatic shielding function of the shield 21.
  • a subminiature tube type 5902 having an outer envelope diameter of 0.375 inch is provided with a shield made to a similar shape but inch larger at all points and therefore having an inner diameter of 0.5 inch.
  • the shield is made of & inch copper sheet formed into a round bottomed cup by punching and die forming.
  • the silicone rubber layer is compounded starting with uncured silicone rubber having the consistency of soft putty. Into this is thoroughly mixed 5% to 50% of electrolytic copper dust.
  • a primer coating of silicone resin varnish is applied to the interior of the copper cup, the mixture placed into the copper cup, and then the subminiature tube is pressed into the cup and positioned centrally thereof.
  • the waste extruded compound is removed and the assembly is baked at C. for one hour to cure the silicone rubber.
  • No primer coating is necessary for the glass tube envelope.
  • the silicone rubber expands slightly to fill all voids, sets and becomes resilient, and bonds firmly to both the glass tube envelope and the interior of the copper cup. After trimming any excess silicone rubber from the edge of the cup the assembly is ready for clipping to the card 14 and for making terminal connec tions.
  • This method of securing and shielding the tube thus provides good heat dissipation while protecting the tube from injury by mechanical shock and permitting the use of conventional clip mounting.
  • the silicone rubber with stands the highest temperatures to which it can here be subjected.
  • the assembly takes but little space, and stocking and replacement of the covered tube as a unit are no more diflicult than stocking and replacing the bare tube.
  • An electronic tube cover assembly comprising, an electronic tube having an envelope, a layer of resilient, heat-conductive silicone material bonded to the outer surface of said envelope, and an exterior metallic layer bonded to the outer surface of said resilient heat-conductive material.
  • a shield for an electronic tube comprising, a thickness of rubber-like material containing silicone bonded to the outside envelope of said electronic tube, and metallic electrostatic shielding means bonded to the outer surface of said rubber-like material thickness.
  • a shield for an electronic tube having a glass enhaving relatively high heat conductivity bonded to the outer surface of said envelope, and a metallic shell securely bonded to the outer surface of said layer of silicone rubber.
  • a shock-resistant, heat-transmitting shield for the envelope of an electronic tube comprising, a sheath of resilient silicone rubber containing an admixture of finely divided metallic particles and having relatively high heat conductivity, said sheath being bonded to the outer sur face of the envelope of said electronic tube, and a metallic cup bonded to the outer surface of said sheath to form a surrounding shell.
  • a shock-resistant, heat-transmitting shield for the envelope of an electronic tube in accordance with claim 5 in which said finely divided metallic particles consist of electrolytic copper dust.
  • An electronic tube cover and clip assembly comprising, an electronic tube having an envelope, a layer of resilient heat-conductive silicone material bonded to the outer surface of said envelope, an exterior metallic layer bonded to the outer surface of said resilient heat-conductive material, and spring clip means partly surrounding said metallic layer for securing it to a base.
  • An electronic tube cover and clip assembly comprising, a layer of resilient silicone rubber containing metallic particles and having relatively high heat conductivity bonded to the outer surface of said electronic tube, a metallic shell securely bonded to the outer surface of said layer of silicone rubber, and spring clip means partly surrounding said metallic layer for securing it to a base.

Description

Jul 16, 1957 D. J, DE CAIN ELECTRONIC TUBE SHIELD Filed Oct. 31. 1952 I N V EN TOR. DON/9L0 4/. 05 C/Q/N HTTOR/VEY.
United States Patent '0 ELECTRONIC TUBE SHIELD Donald J. De Cain, Mount Vernon, N. Y., assignor to General Precision Laboratory Incorporated, a corporation of New York Application October 31, 1952, Serial No. 317,888
9 Claims. (Cl. 313-312) This invention relates to shields for electronic tubes and especially to tube shields facilitating heat dissipation.
Electronic tubes require electrostaticshielding'in many applications. Frequently tubes also have to be shock mounted, and when the tube envelope is fastened to a base by means of a spring clip the conventional type of tube socket shock mounting cannot be used. .A problem is presented when clip fastening, shock mounting and electrostatic shielding are all required and the problem is complicated by the necessity for dissipating the heat generated inside the tube.
The problem is particularly acute with subminiature tubes when they are mounted by clipping the envelopes to a base card, as they frequently are. It is desirable to make the tube shield integral with and inseparable from the tube, to facilitate stocking and replacement, yet to incorporate in the shield the function of protecting the tube from mechanical shock.
The present invention solves this problem by covering the glass tube envelope with a form fitting metal sheet separated from the envelope by a layer of heat-conductive rubber-like material. This material is securely and permanently bonded both to the glass envelope and to the metal shield. The metal shield thus constitutes a solid external surface which can be gripped positively by the metal spring clip which mechanically secures the tube to the base card.
The principal purpose of this invention then is to provide a shield for electronic tubes which not only shields the tube electrostatically, but also protects the tube against mechanical shock while facilitating heat dissipation.
A further purpose of this invention is to provide a shield for subminiature tubes, the shield being integrally associated with the tube so as to facilitate stocking, mounting and replacement.
A complete understanding of this invention may be secured from the detailed description and drawings, in which:
Figure 1 is a plan view of a subminiature tube partly enclosed in a cover in accordance with the invention.
Figure 2 is an enlarged cross section of the tube and cover of Fig. 1 along the line 22. I
Referring now to Fig. 1, a subminiature tube 11 is provided with a cover 12 that is both shock absorbent and heat dissipative as well as constituting an electrostatic shield. The cover 12 is securely bonded and attached to the tube envelope, and is clipped by means of metal clips 13 and 13' to a card 14 of insulating material. Connections may be made between the tube terminal wires such as 16 and other components either directly or through terminals such as 17 by means of connecting wires or so-called printed conductive strips on the front or rear face of the card 14.
In the cross section of Fig. 2 the glass tube envelope is indicated at 18. Surrounding the envelope 18 there is a two-layer cover. The first layer 19 is made of a,
ice
rubber-like material which is firmly and continuously bonded to the glass envelope at all points. This material consists of a silicone rubber loaded or impregnated with a quantity of metal particles to increase its heat conductivity. Any metal particles may be employed such as copper, aluminum, silver or zinc, and the particles may be of any convenient small size. The silicone rubber is resilient and the thickness of the layer is sufficient to provide mechanical shock protection for the tube. For example, in the case of a subminiature cylindrical tube envelope having a diameter of inch, a thickness of silicone rubber of A inch has been found to be satisfactory.
The silicone rubber layer is surrounded by a metallic shield 21, the two being firmly and permanently bonded together. The shield 21 serves as a mechanical protection for the silicone rubber layer and as a base for the mechanical support by clips of the entire tube and jacket assembly. In addition the shield 21 serves as an electrostatic tube shield and as an external heat radiating and conducting surface for dissipating the tube heat.
The tube and cover assembly is firmly gripped and held by the spring clips 13 and 13, these clips being riveted at 22 and 22 to the base 14. A ground wire 23 is desirable because of the electrostatic shielding function of the shield 21. As a specific example of one tube cover assembly, a subminiature tube type 5902 having an outer envelope diameter of 0.375 inch is provided with a shield made to a similar shape but inch larger at all points and therefore having an inner diameter of 0.5 inch. The shield is made of & inch copper sheet formed into a round bottomed cup by punching and die forming. The silicone rubber layer is compounded starting with uncured silicone rubber having the consistency of soft putty. Into this is thoroughly mixed 5% to 50% of electrolytic copper dust. A primer coating of silicone resin varnish is applied to the interior of the copper cup, the mixture placed into the copper cup, and then the subminiature tube is pressed into the cup and positioned centrally thereof. The waste extruded compound is removed and the assembly is baked at C. for one hour to cure the silicone rubber. No primer coating is necessary for the glass tube envelope. In curing, the silicone rubber expands slightly to fill all voids, sets and becomes resilient, and bonds firmly to both the glass tube envelope and the interior of the copper cup. After trimming any excess silicone rubber from the edge of the cup the assembly is ready for clipping to the card 14 and for making terminal connec tions.
This method of securing and shielding the tube thus provides good heat dissipation while protecting the tube from injury by mechanical shock and permitting the use of conventional clip mounting. The silicone rubber with stands the highest temperatures to which it can here be subjected. The assembly takes but little space, and stocking and replacement of the covered tube as a unit are no more diflicult than stocking and replacing the bare tube.
What is claimed is:
1. An electronic tube cover assembly comprising, an electronic tube having an envelope, a layer of resilient, heat-conductive silicone material bonded to the outer surface of said envelope, and an exterior metallic layer bonded to the outer surface of said resilient heat-conductive material.
2. A shield for an electronic tube comprising, a thickness of rubber-like material containing silicone bonded to the outside envelope of said electronic tube, and metallic electrostatic shielding means bonded to the outer surface of said rubber-like material thickness.
3. A shield for an electronic tube having a glass enhaving relatively high heat conductivity bonded to the outer surface of said envelope, and a metallic shell securely bonded to the outer surface of said layer of silicone rubber.
5. A shock-resistant, heat-transmitting shield for the envelope of an electronic tube comprising, a sheath of resilient silicone rubber containing an admixture of finely divided metallic particles and having relatively high heat conductivity, said sheath being bonded to the outer sur face of the envelope of said electronic tube, and a metallic cup bonded to the outer surface of said sheath to form a surrounding shell.
6. A shock-resistant, heat-transmitting shield for the envelope of an electronic tube in accordance with claim 5 in which said finely divided metallic particles consist of electrolytic copper dust.
7. A shock-resistant, heat-transmitting shield for the envelope of an electronic tube in accordance with claim 6 in which the electrolytic copper dust in said admixture is of from 5% to 50% of the quantity of said silicone rubber.
8. An electronic tube cover and clip assembly comprising, an electronic tube having an envelope, a layer of resilient heat-conductive silicone material bonded to the outer surface of said envelope, an exterior metallic layer bonded to the outer surface of said resilient heat-conductive material, and spring clip means partly surrounding said metallic layer for securing it to a base.
9. An electronic tube cover and clip assembly comprising, a layer of resilient silicone rubber containing metallic particles and having relatively high heat conductivity bonded to the outer surface of said electronic tube, a metallic shell securely bonded to the outer surface of said layer of silicone rubber, and spring clip means partly surrounding said metallic layer for securing it to a base.
References Cited in the file of this patent I UNITED STATES PATENTS

Claims (1)

  1. 9. AN ELCTRONIC TUBE COVER AND CLIP ASSEMBLY COMPRISING, A LAYER OF RESILIENT SILICONE RUBBER CONTAINING METALLIC PARTICLES AND HAVING RELATIVELY HIGH HEAT CONDUCTIVITY BONDED TO THE OUTER SURFACE OF SAID ELECTRONIC TUBE, A METALIC SHELL SECURELY BONDED TO THE OUTER SURFACE OF SAID LAYER OF SILICONE RUBBER, AND SPRING CLIP MEANS PARTLY SURROUNDING SAID METALLIC LAYER FOR SECURING IT TO A BASE
US317888A 1952-10-31 1952-10-31 Electronic tube shield Expired - Lifetime US2799793A (en)

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Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897252A (en) * 1955-03-11 1959-07-28 Sylvania Electric Prod Shield and package for electron discharge device
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US3066499A (en) * 1959-01-02 1962-12-04 Stewart Warner Corp Electronic cooling by wick boiling and evaporation
US3087982A (en) * 1959-12-01 1963-04-30 Northrop Corp Vacuum tube mounts
US3153561A (en) * 1960-06-09 1964-10-20 Pyion Company Inc Resilient electrical connector
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3315200A (en) * 1963-11-20 1967-04-18 British Aircraft Corp Ltd Strain gauges
US3327779A (en) * 1965-12-16 1967-06-27 Jacoby John Hull Heat dissipating device and method
US3401439A (en) * 1965-05-19 1968-09-17 Gen Binding Corp Laminating apparatus
US3498371A (en) * 1967-06-12 1970-03-03 Alfred E Zygiel Heat transfer device
US3545097A (en) * 1968-12-09 1970-12-08 Pennwalt Corp High thermal conductivity plastic tray for freeze drying of products
US4191240A (en) * 1977-04-04 1980-03-04 Rubel Peter A Heat conducting filler material for motor-containing devices
US4222434A (en) * 1978-04-27 1980-09-16 Clyde Robert A Ceramic sponge heat-exchanger member
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4433271A (en) * 1980-07-15 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha High pressure discharge lamp
US4682566A (en) * 1979-04-06 1987-07-28 Applied Materials, Inc. Evacuated equipment
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US5938810A (en) * 1996-10-23 1999-08-17 Donnelly Corporation Apparatus for tempering and bending glass
US6481493B1 (en) * 1998-08-04 2002-11-19 Dr. Heilscher Gmbh Arrangement for heat discharge, particularly for ultrasonic transducers with high performance
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6616999B1 (en) 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6672378B2 (en) 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US20040265495A1 (en) * 2000-05-18 2004-12-30 Freuler Raymond G. Phase change thermal interface composition having induced bonding property

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1559381A (en) * 1925-10-27 Vacuum-bulb device
US1610208A (en) * 1925-10-31 1926-12-07 Leslie R Mcdonald Antimicrophonic shield for electron tubes
US1616176A (en) * 1925-11-07 1927-02-01 Harry A Bremer Vibration absorber for radiotubes
US1637864A (en) * 1926-05-25 1927-08-02 Fed Telegraph Co Electron-tube apparatus
US1685766A (en) * 1926-06-02 1928-09-25 Gen Electric Support for vacuum tubes
US1982319A (en) * 1931-12-04 1934-11-27 Sperry Prod Inc Replaceable tube holder
US2258221A (en) * 1940-04-27 1941-10-07 Gen Electric Aroxy silicones and insulated conductors and other products utilizing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1559381A (en) * 1925-10-27 Vacuum-bulb device
US1610208A (en) * 1925-10-31 1926-12-07 Leslie R Mcdonald Antimicrophonic shield for electron tubes
US1616176A (en) * 1925-11-07 1927-02-01 Harry A Bremer Vibration absorber for radiotubes
US1637864A (en) * 1926-05-25 1927-08-02 Fed Telegraph Co Electron-tube apparatus
US1685766A (en) * 1926-06-02 1928-09-25 Gen Electric Support for vacuum tubes
US1982319A (en) * 1931-12-04 1934-11-27 Sperry Prod Inc Replaceable tube holder
US2258221A (en) * 1940-04-27 1941-10-07 Gen Electric Aroxy silicones and insulated conductors and other products utilizing the same

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2897252A (en) * 1955-03-11 1959-07-28 Sylvania Electric Prod Shield and package for electron discharge device
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US3066499A (en) * 1959-01-02 1962-12-04 Stewart Warner Corp Electronic cooling by wick boiling and evaporation
US3087982A (en) * 1959-12-01 1963-04-30 Northrop Corp Vacuum tube mounts
US3185756A (en) * 1960-05-02 1965-05-25 Cool Fin Electronics Corp Heat-dissipating tube shield
US3153561A (en) * 1960-06-09 1964-10-20 Pyion Company Inc Resilient electrical connector
US3315200A (en) * 1963-11-20 1967-04-18 British Aircraft Corp Ltd Strain gauges
US3401439A (en) * 1965-05-19 1968-09-17 Gen Binding Corp Laminating apparatus
US3327779A (en) * 1965-12-16 1967-06-27 Jacoby John Hull Heat dissipating device and method
US3498371A (en) * 1967-06-12 1970-03-03 Alfred E Zygiel Heat transfer device
US3545097A (en) * 1968-12-09 1970-12-08 Pennwalt Corp High thermal conductivity plastic tray for freeze drying of products
US4191240A (en) * 1977-04-04 1980-03-04 Rubel Peter A Heat conducting filler material for motor-containing devices
US4299715A (en) * 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4222434A (en) * 1978-04-27 1980-09-16 Clyde Robert A Ceramic sponge heat-exchanger member
US4682566A (en) * 1979-04-06 1987-07-28 Applied Materials, Inc. Evacuated equipment
US4433271A (en) * 1980-07-15 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha High pressure discharge lamp
US6321570B1 (en) 1996-10-23 2001-11-27 Donnelly Corporation Method and apparatus for tempering and bending glass
US5938810A (en) * 1996-10-23 1999-08-17 Donnelly Corporation Apparatus for tempering and bending glass
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6481493B1 (en) * 1998-08-04 2002-11-19 Dr. Heilscher Gmbh Arrangement for heat discharge, particularly for ultrasonic transducers with high performance
US20040052998A1 (en) * 2000-05-17 2004-03-18 Freuler Raymond G. Preappliable phase change thermal interface pad
US7056566B2 (en) 2000-05-17 2006-06-06 Henkel Corporation Preappliable phase change thermal interface pad
US6616999B1 (en) 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6869642B2 (en) 2000-05-18 2005-03-22 Raymond G. Freuler Phase change thermal interface composition having induced bonding property
US20040265495A1 (en) * 2000-05-18 2004-12-30 Freuler Raymond G. Phase change thermal interface composition having induced bonding property
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US20050161632A1 (en) * 2000-05-18 2005-07-28 Henkel Corporation Phase change thermal interface composition having induced bonding property
US6672378B2 (en) 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US20040069452A1 (en) * 2001-06-07 2004-04-15 Rauch Robert A. Thermal interface wafer and method of making and using the same
US20040081803A1 (en) * 2001-06-07 2004-04-29 Rauch Robert A. Thermal interface wafer and method of making and using the same
US6901997B2 (en) 2001-06-07 2005-06-07 Loctite Corporation Thermal interface wafer and method of making and using the same
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference

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