US20020090759A1 - Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment - Google Patents

Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment Download PDF

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Publication number
US20020090759A1
US20020090759A1 US09/555,141 US55514100A US2002090759A1 US 20020090759 A1 US20020090759 A1 US 20020090759A1 US 55514100 A US55514100 A US 55514100A US 2002090759 A1 US2002090759 A1 US 2002090759A1
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land
resin
semiconductor chip
substrate
circuit board
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US6410364B1 (en
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Nobuaki Hashimoto
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to US10/141,954 priority Critical patent/US6656771B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Definitions

  • the present invention relates to a semiconductor device, a method of connecting a semiconductor chip, a circuit board, and electronic equipment.
  • Known methods of connecting a semiconductor chip utilize the hardening contraction of a resin.
  • a semiconductor chip is disposed on a substrate, resin is injected therebetween, and an electrical connection between an electrode of the semiconductor chip and a circuit pattern on the substrate is created by the hardening contraction of the resin. This enables electrical connections by a simple process.
  • the present invention solves the above described problem and has as an objective thereof the provision of a semiconductor device, a method of connecting a semiconductor chip, a circuit board, and electronic equipment that make it possible to preserve electrical connections and ensure the stablility thereof.
  • a semiconductor device in accordance with one aspect of the present invention comprises:
  • a semiconductor chip to be bonded face-down to the support member and having a bump for an electrode that is disposed on the land;
  • the semiconductor chip and the support member are pulled together by stress generated by the hardening contraction of the resin, so that the land and bump are pressure-bond to form an electrical connection. Since the support member deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land.
  • the support member may comprise a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E A of the adhesive may be such that:
  • the adhesive is easier to deform elastically than the resin, so that the stress may be absorbed partially by the adhesive.
  • the support member may be a substrate on which the interconnecting pattern is formed directly and which has deformed elastically.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E S of the substrate may be such that:
  • the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate.
  • a semiconductor device in accordance with another aspect of the present invention comprises:
  • a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land;
  • the stress is partially absorbed by elastic deformation of at least the adhesive.
  • the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive.
  • a semiconductor device in accordance with still another aspect of the present invention comprises:
  • a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land;
  • the stress is partially absorbed by elastic deformation of at least the substrate.
  • the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the substrate deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate.
  • the present invention also applies to a circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween,
  • a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land; resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the adhesive, without changing the shape of the land.
  • the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E A of the adhesive may be such that:
  • the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive.
  • the present invention further applies to a circuit board on which is directly formed an interconnecting pattern including a land,
  • a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the circuit board, without changing the shape of the land.
  • the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the circuit board deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E S of the circuit board may be such that:
  • the circuit board is easier to deform elastically than the resin, encouraging stress absorption by the circuit board.
  • a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction;
  • the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive.
  • a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction;
  • the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the circuit board deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • circuit board is easier to deform elastically than the resin, encouraging stress absorption by the circuit board.
  • a method of connecting a semiconductor chip in accordance with still further aspect of the present invention comprises:
  • the semiconductor chip and the support member are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the support member deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin can be reduced, thus preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land.
  • the support member may comprise a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically;
  • the adhesive may be deformed elastically.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E A of the adhesive may be such that:
  • the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive.
  • the support member may be a substrate on which the interconnecting pattern is formed directly;
  • the substrate may be deformed elastically.
  • the relationship between the elastic modulus E M of the resin and the elastic modulus E S of the substrate may be such that:
  • the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate.
  • a method of connecting a semiconductor chip in accordance with still further aspect of the present invention comprises:
  • the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin can also be reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive.
  • a method of connecting a semiconductor chip in accordance with yet further aspect of the present invention comprises:
  • the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the substrate deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin can be reduced, thus preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner.
  • the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate.
  • FIGS. 1A to 1 D illustrate a method of connecting a semiconductor chip and a connection configuration in accordance with an embodiment to which the present invention is applied;
  • FIG. 2 illustrates a modification on this embodiment of the invention
  • FIG. 3 illustrates another modification on this embodiment of the invention
  • FIG. 4 shows a semiconductor device fabricated in accordance with the present invention
  • FIG. 5 shows electronic equipment having a circuit board or semiconductor device in accordance with the present invention.
  • a semiconductor chip 10 is connected to a support member 20 .
  • the semiconductor chip 10 has one or more bumps 12 , where each of these bumps 12 acts as an electrode for electrical connection with the circuitry within the semiconductor chip 10 .
  • these bumps 12 may be formed of a conductive material such as gold, copper, nickel, or solder, and may be formed to be spherical-shape or rectangular parallelepiped, provided they protrude from the base surface (active surface) of the semiconductor chip 10 .
  • Bumps 12 of a height on the order of 5 ⁇ m to 500 ⁇ m are often used; when they are of gold, they are often of a height on the order of 5 ⁇ m to 30 ⁇ m.
  • these bumps may be formed on a land 24 side of an interconnecting pattern 22 , and may be a structure called a bump TAB (BTAB) in which the lands 24 are etched.
  • BTAB bump TAB
  • the interconnecting pattern 22 is formed on the support member 20 .
  • the interconnecting pattern 22 comprises the lands 24 on which the bumps 12 of the semiconductor chip 10 will be mounted.
  • the lands 24 are formed to correspond in number and position with the bumps 12 .
  • the support member 20 refers to a member on which the interconnecting pattern 22 is formed.
  • the support member 20 in this embodiment of the invention is an adhesive 26 and a substrate 28 , by way of example.
  • the adhesive 26 is interposed between the substrate 28 and the interconnecting pattern 22 to form a three-layer substrate.
  • the configuration may be such that a multi-layer structure formed of a stack of layers of insulating resin and interconnecting patterns is formed on a substrate, or a plurality of substrates may be superimposed to form a multi-layer substrate.
  • another interconnecting pattern may be formed on the other surface. Note that an example in which the substrate alone acts as a support member, with no adhesive, will be described later with reference to FIG. 3.
  • the substrate 28 that forms part of the support member 20 is a circuit board in accordance with this embodiment.
  • the substrate 28 may be formed of either an organic or inorganic material, or it may be formed of a compound structure thereof.
  • An example of the substrate 28 formed of an organic material is a flexible substrate made of a polyimide resin.
  • Examples of the substrate 28 formed of an inorganic material include a ceramic substrate and a glass substrate.
  • An example of a structure that is a compound of organic and inorganic materials is a glass epoxy substrate.
  • the elastic modulus of the substrate 28 is not specifically limited in this embodiment, but it is preferably small. Note that the following examples are known as the elastic modulus of the substrate 28 : Flexible substrate: 60 kg/mm 2 Glass epoxy substrate: 1,100 kg/mm 2 Ceramic substrate: 350,000 kg/mm 2
  • resin 30 is used to ensure that face-down bonding structure of the semiconductor chip 10 on the support member 20 is maintained.
  • the resin 30 provides adhesion between the semiconductor chip 10 and the support member 20 , and the bumps 12 and the lands 24 are pressure-bonded together by the stress induced by the contraction of the resin 30 on hardening, or the thermal contraction thereof (which will be described later), or both the hardening contraction and the thermal contraction. It is therefore general to use a light-hardening resin or thermal-hardening resin which contracts on hardening, as the resin 30 .
  • the resin 30 preferably has a high adhesive strength with respect to the semiconductor chip 10 and the support member 20 .
  • the relationship between the elastic modulus E A of at least a part (the adhesive 26 ) of the support member 20 after hardening and the elastic modulus E M of the resin after hardening is:
  • E M 150 kg/mm 2 ;
  • the adhesive 26 is made to be easier than the resin 30 to deform elastically in the direction of thickness of the semiconductor chip 10 and the substrate 28 , in response to internal stress due to the contraction on hardening of the resin 30 , or internal stress due to the volumetric contraction generated by the cooling from a hot state of the resin 30 if it is a thermal-hardening resin, or internal stress due to both hardening contraction and volumetric contraction.
  • the semiconductor chip 10 is connected by using a member of the above described configuration, as described below.
  • the support member 20 on which is formed the interconnecting pattern 22 is prepared, as shown in FIG. 1A.
  • the support member 20 comprises the adhesive 26 and the substrate 28 .
  • the bumps 12 of the semiconductor chip 10 are then positioned above the lands 24 of the interconnecting pattern 22 so that the bumps 12 are disposed on the lands 24 , as shown in FIG. 1B.
  • the resin 30 is then injected into the space between the semiconductor chip 10 and the support member 20 (the adhesive 26 ), as shown in FIG. 1C.
  • the resin 30 is then subjected to hardening appropriate to the composition thereof, to cause the resin 30 to exhibit hardening contraction. Stress generated by the hardening contraction, thermal contraction, or both the hardening contraction and thermal contraction act to decrease the space between the semiconductor chip 10 and the support member 20 .
  • the bumps 12 and the lands 24 are pressure bonded to form electrical connections therebetween.
  • the resin 30 may be painted or applied in a liquid form or sheet form on the surface of the semiconductor chip 10 on which the active elements are formed, or on the support member 20 facing that surface.
  • the resin 30 used may also be an anisotropic conductive adhesive into which is mixed some conductive particles.
  • the relationship between the elastic modulus E A of the adhesive 26 after hardening and the elastic modulus E M of the resin 30 after hardening is:
  • the adhesive 26 is deformed elastically by the stress generated by the hardening contraction of the resin 30 , or the thermal contraction thereof, or both the hardening contraction and the thermal contraction thereof.
  • the lands 24 sink into the layer formed of the adhesive 26 , as shown by way of example in FIG. 1D.
  • at least one of the bumps 12 , the lands 24 , and the substrate 28 may be made to deform elastically.
  • connection configuration makes it possible to partially absorb the stress generated by the hardening contraction of the resin 30 and also weaken the force that is generated in opposite directions in the boundary surfaces between the semiconductor chip, the support member 20 , and the resin 30 , thus making it difficult for releasing to occur. This also improves the reliability of the electrical connections between the bumps 12 and the lands 24 .
  • FIG. 2 A modification of the above described embodiment of the invention is shown in FIG. 2. This modification differs from the above described embodiment in that lands 34 shown in this figure are larger in plan, or are thinner, or are made of a softer material than the lands 24 of FIG. 1A, or the adhesive 26 is made to be softer than the lands 24 of FIG. 1A. All other components and methods are similar to those of the above described embodiment, and thus are denoted by the same reference numerals.
  • the lands 24 sink into the layer formed of the adhesive, without deforming substantially, as shown in FIG. 1D.
  • the lands 34 of the example shown in FIG. 2 also deform due to the stress generated by the hardening contraction of the resin 30 , as the adhesive 26 deforms elastically for the previously described reasons. Note that it is preferable that the deformation of the lands 34 is elastic deformation. This configuration makes it possible to achieve the same effects as those of the above described embodiment of the invention.
  • FIG. 3 Another modification on the above described embodiment is shown in FIG. 3.
  • a support member 48 which does not include an adhesive is used.
  • a conductive film of a material such as copper is deposited on the support member 48 by a method such as sputtering, then this is etched to form an interconnecting pattern 42 comprising lands 44 .
  • the interconnecting pattern 42 is formed directly on the support member 48 to configure a two-layer substrate with no adhesive therebetween.
  • the relationship between the elastic modulus E S of the support member 48 and the elastic modulus E M of the resin 30 is:
  • E M 150 kg/mm 2 ;
  • the support member 48 is easier to deform elastically than the resin 30 .
  • This relationship can be achieved if the support member 48 is a flexible substrate made of a polyimide resin, by way of example. All other components and methods are similar to those of the above described embodiment, and thus are denoted by the same reference numerals.
  • the support member 48 acting as a substrate, deforms elastically due to the stress generated by the hardening contraction of the resin 30 .
  • This elastic deformation makes it possible to partially absorb the stress generated by the hardening contraction and/or thermal contraction of the resin 30 .
  • the bumps 12 may also deform elastically.
  • This configuration also makes it possible to achieve the same effects as those of the above described embodiments.
  • the support member 48 is shown in a greatly deformed state in FIG. 3, to make this state clear, but in actual practice it is considered that this deformation will not be discernible to the naked eye.
  • the adhesive surface of the resin 30 with respect to the support member 48 may be deformed by being warped in a bimetal manner. Note that the support member 20 in the three-layer substrate of FIG. 1D is also thought to deform in accordance with the elastic modulus thereof, when viewed on a microscopic level.
  • FIG. 4 A further modification of the above described embodiment is shown in FIG. 4.
  • This example relates to the fabrication of a semiconductor device to which is applied the connection configuration of the semiconductor chip of the present invention.
  • the semiconductor device is shown in FIG. 4 as a completed product.
  • the semiconductor chip 10 is bonded face-down to a support member 50 .
  • the support member 50 comprises an adhesive 56 and a substrate 58 , and an interconnecting pattern 52 is formed thereon.
  • the interconnecting pattern 52 comprises lands 52 that are connected electrically to external electrodes 60 by conductive members that pass through the substrate 58 .
  • Each of the external electrodes 60 is formed of a solder ball or the like.
  • the previously described substrate 28 may also be selected for use as the support member 50 .
  • the configuration may be such that a multi-layer structure formed of a stack of layers of insulating resin and interconnecting patterns is formed on the support member 50 , or a plurality of substrates may be superimposed to form a multi-layer substrate. All other components and methods are similar to those of the above described embodiment of the invention, and thus are denoted by the same reference numerals.
  • the layer formed of the adhesive 56 deforms elastically in such a manner that at least part of each of the lands 52 sinks thereinto, so that the stress is partially absorbed.
  • This example also makes it possible to achieve the same effects as those of the above described embodiment. Note that at least one of the bumps 12 , the lands 52 , and the substrate 58 may be made to deform elastically in this example too.
  • the present invention can be applied to a chip scale/size package (CSP) type of semiconductor device, or a face-down type of semiconductor device in which at least one semiconductor chip is mounted, or a module configuration thereof.
  • a semiconductor device of face-down type may be a chip-on-flex/film (COF) or a chip-on-board (COB) structure, by way of example.
  • COF chip-on-flex/film
  • COB chip-on-board
  • the present invention can also be applied to a CSP semiconductor device in which a plurality of semiconductor chips are mounted.
  • the semiconductor device shown in FIG. 4 may have the external electrodes 60 , or part of the substrate 58 may be extended to provide external connections therefrom. Part of the substrate 58 may form a connector lead, connectors may be installed on the substrate 58 , or the interconnecting pattern 52 of the substrate 58 itself may be connected to other electronic equipment.
  • the configuration may be such that the external electrodes 60 are not formed in actuality, but a solder cream is provided to the motherboard side when the device is mounted on a motherboard is used effectively so that the surface tension of the solder cream when melted forms external electrodes.
  • a semiconductor device is called a land grid array type of semiconductor device.
  • this embodiment of the invention ensure that local elastic deformation occurs within a structure formed of the semiconductor chip, bumps, lands, and support member, due to the hardening or thermal contraction force of resin in accordance with the elastic modulus of these components, to ensure that electrical connections between the bumps and the lands are maintained more stably.
  • a notebook-sized personal computer 100 which is an example of electronic equipment having a circuit board or semiconductor device to which the present invention is applied, is shown in FIG. 5.
  • a semiconductor chip is used by way of example in this description of the invention, but the present invention may also be applied to an electronic component for surface mounting that requires a large number of bumps, similar to that of a semiconductor chip, regardless of whether this is an active component or a passive component.
  • electronic components include resistors, capacitors, coils, oscillators, filters, temperature sensors, thermistors, varistors, variable resistors, or fuses, by way of example.
  • a plurality of the semiconductor chips may be mounted in all of the previously described embodiments of the invention.
  • electronic components other than those semiconductor chips can be mixed with such semiconductor chips, to form a module type of semiconductor device.

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Abstract

A semiconductor device comprises: a support member (20) on which a land (24) is formed; a semiconductor chip (10) having a bump for an electrode (12) that is disposed on the land (24), and to be bonded face-down to a support member (20); and resin (30) which is provided as an adhesive between the semiconductor chip (10) and the support member (20), which is allowed to contract on hardening, and which causes pressure-bonding between the land (24) and the bump (12) by the stress due to this hardening contraction. The stress therein is partially absorbed by elastic deformation of at least the support member (20).

Description

    TECHNICAL FIELD
  • The present invention relates to a semiconductor device, a method of connecting a semiconductor chip, a circuit board, and electronic equipment. [0001]
    • BACKGROUND OF ART
  • Known methods of connecting a semiconductor chip utilize the hardening contraction of a resin. In a method disclosed in Japanese Patent Application Laid-Open No. 1-226161, for example, a semiconductor chip is disposed on a substrate, resin is injected therebetween, and an electrical connection between an electrode of the semiconductor chip and a circuit pattern on the substrate is created by the hardening contraction of the resin. This enables electrical connections by a simple process. [0002]
  • However, stress in the resin that has hardened on contraction and reaction force of the same order of magnitude are applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin, so that releasing can easily occur. If releasing occurs, the maintaining force thereof becomes insufficient and it is no longer possible to ensure an electrical connection. [0003]
    • DISCLOSURE OF INVENTION
  • The present invention solves the above described problem and has as an objective thereof the provision of a semiconductor device, a method of connecting a semiconductor chip, a circuit board, and electronic equipment that make it possible to preserve electrical connections and ensure the stablility thereof. [0004]
  • 1) A semiconductor device in accordance with one aspect of the present invention comprises: [0005]
  • a support member on which is formed an interconnecting pattern including a land; [0006]
  • a semiconductor chip to be bonded face-down to the support member and having a bump for an electrode that is disposed on the land; and [0007]
  • resin which provides adhesion between the semiconductor chip and the support member and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, [0008]
  • wherein the stress is partially absorbed by elastic deformation of the support member, without changing the shape of the land. [0009]
  • With this aspect of the invention, the semiconductor chip and the support member are pulled together by stress generated by the hardening contraction of the resin, so that the land and bump are pressure-bond to form an electrical connection. Since the support member deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0010]
  • In addition, this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land. [0011]
  • 2) With this semiconductor device: [0012]
  • the support member may comprise a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically. [0013]
  • Since the adhesive deforms elastically, this ensures that the stress is partially absorbed thereby. [0014]
  • 3) With this semiconductor device: [0015]
  • the relationship between the elastic modulus E[0016] M of the resin and the elastic modulus EA of the adhesive may be such that:
  • EM>EA.
  • In other words, the adhesive is easier to deform elastically than the resin, so that the stress may be absorbed partially by the adhesive. [0017]
  • 4) With this semiconductor device: [0018]
  • the support member may be a substrate on which the interconnecting pattern is formed directly and which has deformed elastically. [0019]
  • Since the substrate deforms elastically, this ensures that the stress is partially absorbed thereby. [0020]
  • 5) With this semiconductor device: [0021]
  • the relationship between the elastic modulus E[0022] M of the resin and the elastic modulus ES of the substrate may be such that:
  • EM>ES.
  • In other words, the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate. [0023]
  • 6) A semiconductor device in accordance with another aspect of the present invention comprises: [0024]
  • a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween; [0025]
  • a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land; and [0026]
  • resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, [0027]
  • wherein the relationship between the elastic modulus E[0028] M of the resin and the elastic modulus EA of the adhesive is such that:
  • EM>EA
  • and the stress is partially absorbed by elastic deformation of at least the adhesive. [0029]
  • With this aspect of the invention, the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0030]
  • In addition, the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive. [0031]
  • 7) A semiconductor device in accordance with still another aspect of the present invention comprises: [0032]
  • a substrate on which is directly formed an interconnecting pattern including a land; [0033]
  • a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land; and [0034]
  • resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction, [0035]
  • wherein the relationship between the elastic modulus E[0036] M of the resin and the elastic modulus ES of the substrate is such that:
  • EM>ES
  • and the stress is partially absorbed by elastic deformation of at least the substrate. [0037]
  • With this aspect of the invention, the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the substrate deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin are also reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0038]
  • In addition, the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate. [0039]
  • 8) The present invention also applies to a circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween, [0040]
  • wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land; resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the adhesive, without changing the shape of the land. [0041]
  • With this aspect of the invention, the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0042]
  • In addition, this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land. [0043]
  • 9) With this circuit board: [0044]
  • the relationship between the elastic modulus E[0045] M of the resin and the elastic modulus EA of the adhesive may be such that:
  • EM>EA.
  • In other words, the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive. [0046]
  • 10) The present invention further applies to a circuit board on which is directly formed an interconnecting pattern including a land, [0047]
  • wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the circuit board, without changing the shape of the land. [0048]
  • With this aspect of the invention, the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the circuit board deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0049]
  • In addition, this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land. [0050]
  • 11) With this circuit board: [0051]
  • the relationship between the elastic modulus E[0052] M of the resin and the elastic modulus ES of the circuit board may be such that:
  • EM>ES.
  • In other words, the circuit board is easier to deform elastically than the resin, encouraging stress absorption by the circuit board. [0053]
  • 12) The present invention still further applies to a circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween, [0054]
  • wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction; [0055]
  • wherein the relationship between the elastic modulus E[0056] M of the resin and the elastic modulus EA of the adhesive is such that:
  • EM>EA; and
  • wherein the stress is partially absorbed by elastic deformation of at least the adhesive. [0057]
  • With this aspect of the invention, the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0058]
  • In addition, the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive. [0059]
  • 13) The present invention yet further applies to a circuit board on which is directly formed an interconnecting pattern including a land, [0060]
  • wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction; [0061]
  • wherein the relationship between the elastic modulus E[0062] M of the resin and the elastic modulus ES of the circuit board is such that:
  • EM>ES; and
  • wherein the stress is partially absorbed by elastic deformation of at least the circuit board. [0063]
  • With this aspect of the invention, the semiconductor chip and the circuit board are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the circuit board deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced so that force applied to the boundary surfaces between the semiconductor chip, the circuit board, and the resin are reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0064]
  • In addition, the circuit board is easier to deform elastically than the resin, encouraging stress absorption by the circuit board. [0065]
  • 14) Electronic equipment in accordance with further aspect of the present invention has the above described semiconductor device. [0066]
  • 15) Electronic equipment in accordance with still further aspect of the present invention has the above-described circuit board. [0067]
  • 16) A method of connecting a semiconductor chip in accordance with still further aspect of the present invention comprises: [0068]
  • a step of bonding a semiconductor chip in a face-down manner to a support member on which is formed an interconnecting pattern including a land, in such a manner that a bump for an electrode is disposed on the land; and [0069]
  • a step of providing a resin as an adhesive between the semiconductor chip and the support member, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, [0070]
  • wherein the shape of the land is maintained while the support member is deformed elastically, to absorb the stress partially. [0071]
  • With this aspect of the invention, the semiconductor chip and the support member are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the support member deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin can be reduced, thus preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0072]
  • In addition, this aspect of the invention makes it possible to maintain the shape of the land, enabling a stable electrical connection with no modification in the electrical characteristics of the land. [0073]
  • 17) With this method of connecting a semiconductor chip: [0074]
  • the support member may comprise a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically; and [0075]
  • the adhesive may be deformed elastically. [0076]
  • Since the adhesive deforms elastically, this ensures that the stress is partially absorbed thereby. [0077]
  • 18) With this method of connecting a semiconductor chip: [0078]
  • the relationship between the elastic modulus E[0079] M of the resin and the elastic modulus EA of the adhesive may be such that:
  • EM>EA.
  • In other words, the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive. [0080]
  • 19) With this method of connecting a semiconductor chip: [0081]
  • the support member may be a substrate on which the interconnecting pattern is formed directly; and [0082]
  • the substrate may be deformed elastically. [0083]
  • Since the substrate deforms elastically, this ensures that the stress is partially absorbed thereby. [0084]
  • 20) With this method of connecting a semiconductor chip: [0085]
  • the relationship between the elastic modulus E[0086] M of the resin and the elastic modulus ES of the substrate may be such that:
  • EM>ES.
  • In other words, the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate. [0087]
  • 21) A method of connecting a semiconductor chip in accordance with still further aspect of the present invention comprises: [0088]
  • a step of bonding a semiconductor chip in a face-down manner to a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween, in such a manner that a bump for an electrode is disposed on the land; [0089]
  • a step of providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, [0090]
  • wherein the relationship between the elastic modulus E[0091] M of the resin and the elastic modulus EA of the adhesive is such that:
  • EM>EA; and
  • wherein at least the adhesive is deformed elastically, to absorb the stress partially. [0092]
  • With this aspect of the invention, the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the adhesive deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the support member, and the resin can also be reduced, preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0093]
  • In addition, the adhesive is easier to deform elastically than the resin, encouraging stress absorption by the adhesive. [0094]
  • 22) A method of connecting a semiconductor chip in accordance with yet further aspect of the present invention comprises: [0095]
  • a step of bonding a semiconductor chip in a face-down manner to a substrate on which is directly formed an interconnecting pattern including a land, in such a manner that a bump for an electrode is disposed on the land; and [0096]
  • a step of providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction, [0097]
  • wherein the relationship between the elastic modulus E[0098] M of the resin and the elastic modulus ES of the substrate is such that:
  • EM>ES; and
  • wherein at least the substrate is deformed elastically, to absorb the stress partially. [0099]
  • With this aspect of the invention, the semiconductor chip and the substrate are pulled together by the stress generated by the hardening contraction of the resin, causing pressure-bonding of the land and the bump and ensuring an electrical connection therebetween. Since the substrate deforms elastically, the stress generated by the hardening contraction of the resin is partially absorbed thereby. As a result, reaction force is reduced and force applied to the boundary surfaces between the semiconductor chip, the substrate, and the resin can be reduced, thus preventing releasing. This improves the reliability of the electrical connection between the land and the bump, in a stable manner. [0100]
  • In addition, the substrate is easier to deform elastically than the resin, encouraging stress absorption by the substrate. [0101]
    • BRIEF DESCRIPTION OF DRAWINGS
  • FIGS. 1A to [0102] 1D illustrate a method of connecting a semiconductor chip and a connection configuration in accordance with an embodiment to which the present invention is applied;
  • FIG. 2 illustrates a modification on this embodiment of the invention; [0103]
  • FIG. 3 illustrates another modification on this embodiment of the invention; [0104]
  • FIG. 4 shows a semiconductor device fabricated in accordance with the present invention; [0105]
  • FIG. 5 shows electronic equipment having a circuit board or semiconductor device in accordance with the present invention.[0106]
    • BEST MODE FOR CARRYING OUT THE INVENTION
  • Preferred embodiments of the present invention are described below with reference to the accompanying drawings. [0107]
  • The description first concerns a method of connecting a semiconductor chip in accordance with an embodiment of the present invention, with reference to FIGS. 1A to [0108] 1D. In this embodiment of the invention, a semiconductor chip 10 is connected to a support member 20.
  • The [0109] semiconductor chip 10 has one or more bumps 12, where each of these bumps 12 acts as an electrode for electrical connection with the circuitry within the semiconductor chip 10. Note that these bumps 12 may be formed of a conductive material such as gold, copper, nickel, or solder, and may be formed to be spherical-shape or rectangular parallelepiped, provided they protrude from the base surface (active surface) of the semiconductor chip 10. Bumps 12 of a height on the order of 5 μm to 500 μm are often used; when they are of gold, they are often of a height on the order of 5 μm to 30 μm. Alternatively, these bumps may be formed on a land 24 side of an interconnecting pattern 22, and may be a structure called a bump TAB (BTAB) in which the lands 24 are etched.
  • The interconnecting [0110] pattern 22 is formed on the support member 20. The interconnecting pattern 22 comprises the lands 24 on which the bumps 12 of the semiconductor chip 10 will be mounted. The lands 24 are formed to correspond in number and position with the bumps 12.
  • In this application, the [0111] support member 20 refers to a member on which the interconnecting pattern 22 is formed. The support member 20 in this embodiment of the invention is an adhesive 26 and a substrate 28, by way of example. The adhesive 26 is interposed between the substrate 28 and the interconnecting pattern 22 to form a three-layer substrate. Alternatively, the configuration may be such that a multi-layer structure formed of a stack of layers of insulating resin and interconnecting patterns is formed on a substrate, or a plurality of substrates may be superimposed to form a multi-layer substrate. In addition to the interconnecting pattern 22 on one surface of the substrate 28, another interconnecting pattern may be formed on the other surface. Note that an example in which the substrate alone acts as a support member, with no adhesive, will be described later with reference to FIG. 3.
  • The [0112] substrate 28 that forms part of the support member 20 is a circuit board in accordance with this embodiment. The substrate 28 may be formed of either an organic or inorganic material, or it may be formed of a compound structure thereof. An example of the substrate 28 formed of an organic material is a flexible substrate made of a polyimide resin. Examples of the substrate 28 formed of an inorganic material include a ceramic substrate and a glass substrate. An example of a structure that is a compound of organic and inorganic materials is a glass epoxy substrate. The elastic modulus of the substrate 28 is not specifically limited in this embodiment, but it is preferably small. Note that the following examples are known as the elastic modulus of the substrate 28:
    Flexible substrate: 60 kg/mm2
    Glass epoxy substrate: 1,100 kg/mm2
    Ceramic substrate: 350,000 kg/mm2
  • In this embodiment of the invention, [0113] resin 30 is used to ensure that face-down bonding structure of the semiconductor chip 10 on the support member 20 is maintained. The resin 30 provides adhesion between the semiconductor chip 10 and the support member 20, and the bumps 12 and the lands 24 are pressure-bonded together by the stress induced by the contraction of the resin 30 on hardening, or the thermal contraction thereof (which will be described later), or both the hardening contraction and the thermal contraction. It is therefore general to use a light-hardening resin or thermal-hardening resin which contracts on hardening, as the resin 30. In addition, the resin 30 preferably has a high adhesive strength with respect to the semiconductor chip 10 and the support member 20.
  • In this embodiment, the relationship between the elastic modulus E[0114] A of at least a part (the adhesive 26) of the support member 20 after hardening and the elastic modulus EM of the resin after hardening is:
  • EM>EA
  • For example: [0115]
  • E[0116] M=150 kg/mm2;
  • E[0117] A=60 kg/mm2
  • In other words, the adhesive [0118] 26 is made to be easier than the resin 30 to deform elastically in the direction of thickness of the semiconductor chip 10 and the substrate 28, in response to internal stress due to the contraction on hardening of the resin 30, or internal stress due to the volumetric contraction generated by the cooling from a hot state of the resin 30 if it is a thermal-hardening resin, or internal stress due to both hardening contraction and volumetric contraction.
  • In this embodiment of the invention, the [0119] semiconductor chip 10 is connected by using a member of the above described configuration, as described below.
  • First of all, the [0120] support member 20 on which is formed the interconnecting pattern 22 is prepared, as shown in FIG. 1A. The support member 20 comprises the adhesive 26 and the substrate 28. The bumps 12 of the semiconductor chip 10 are then positioned above the lands 24 of the interconnecting pattern 22 so that the bumps 12 are disposed on the lands 24, as shown in FIG. 1B.
  • The [0121] resin 30 is then injected into the space between the semiconductor chip 10 and the support member 20 (the adhesive 26), as shown in FIG. 1C. The resin 30 is then subjected to hardening appropriate to the composition thereof, to cause the resin 30 to exhibit hardening contraction. Stress generated by the hardening contraction, thermal contraction, or both the hardening contraction and thermal contraction act to decrease the space between the semiconductor chip 10 and the support member 20. As a result, the bumps 12 and the lands 24 are pressure bonded to form electrical connections therebetween. Alternatively, the resin 30 may be painted or applied in a liquid form or sheet form on the surface of the semiconductor chip 10 on which the active elements are formed, or on the support member 20 facing that surface. The resin 30 used may also be an anisotropic conductive adhesive into which is mixed some conductive particles.
  • In this embodiment of the invention, the relationship between the elastic modulus E[0122] A of the adhesive 26 after hardening and the elastic modulus EM of the resin 30 after hardening is:
  • EM>EA.
  • Thus the adhesive [0123] 26 is deformed elastically by the stress generated by the hardening contraction of the resin 30, or the thermal contraction thereof, or both the hardening contraction and the thermal contraction thereof. The lands 24 sink into the layer formed of the adhesive 26, as shown by way of example in FIG. 1D. In addition, at least one of the bumps 12, the lands 24, and the substrate 28 may be made to deform elastically.
  • The thus obtained connection configuration makes it possible to partially absorb the stress generated by the hardening contraction of the [0124] resin 30 and also weaken the force that is generated in opposite directions in the boundary surfaces between the semiconductor chip, the support member 20, and the resin 30, thus making it difficult for releasing to occur. This also improves the reliability of the electrical connections between the bumps 12 and the lands 24.
  • A modification of the above described embodiment of the invention is shown in FIG. 2. This modification differs from the above described embodiment in that lands [0125] 34 shown in this figure are larger in plan, or are thinner, or are made of a softer material than the lands 24 of FIG. 1A, or the adhesive 26 is made to be softer than the lands 24 of FIG. 1A. All other components and methods are similar to those of the above described embodiment, and thus are denoted by the same reference numerals.
  • In the previously described embodiment of the invention, the [0126] lands 24 sink into the layer formed of the adhesive, without deforming substantially, as shown in FIG. 1D. In contrast thereto, the lands 34 of the example shown in FIG. 2 also deform due to the stress generated by the hardening contraction of the resin 30, as the adhesive 26 deforms elastically for the previously described reasons. Note that it is preferable that the deformation of the lands 34 is elastic deformation. This configuration makes it possible to achieve the same effects as those of the above described embodiment of the invention.
  • Another modification on the above described embodiment is shown in FIG. 3. In this modification, a [0127] support member 48 which does not include an adhesive is used. In other words, a conductive film of a material such as copper is deposited on the support member 48 by a method such as sputtering, then this is etched to form an interconnecting pattern 42 comprising lands 44. In this case, the interconnecting pattern 42 is formed directly on the support member 48 to configure a two-layer substrate with no adhesive therebetween. The relationship between the elastic modulus ES of the support member 48 and the elastic modulus EM of the resin 30 is:
  • EM>ES.
  • For example: [0128]
  • E[0129] M=150 kg/mm2;
  • E[0130] S=60 kg/mm2
  • In other words, the [0131] support member 48 is easier to deform elastically than the resin 30. This relationship can be achieved if the support member 48 is a flexible substrate made of a polyimide resin, by way of example. All other components and methods are similar to those of the above described embodiment, and thus are denoted by the same reference numerals.
  • In the example shown in FIG. 3, the [0132] support member 48, acting as a substrate, deforms elastically due to the stress generated by the hardening contraction of the resin 30. This elastic deformation makes it possible to partially absorb the stress generated by the hardening contraction and/or thermal contraction of the resin 30. In addition, the bumps 12 may also deform elastically. This configuration also makes it possible to achieve the same effects as those of the above described embodiments. Note that the support member 48 is shown in a greatly deformed state in FIG. 3, to make this state clear, but in actual practice it is considered that this deformation will not be discernible to the naked eye. In addition, the adhesive surface of the resin 30 with respect to the support member 48 may be deformed by being warped in a bimetal manner. Note that the support member 20 in the three-layer substrate of FIG. 1D is also thought to deform in accordance with the elastic modulus thereof, when viewed on a microscopic level.
  • A further modification of the above described embodiment is shown in FIG. 4. This example relates to the fabrication of a semiconductor device to which is applied the connection configuration of the semiconductor chip of the present invention. The semiconductor device is shown in FIG. 4 as a completed product. In this semiconductor device, the [0133] semiconductor chip 10 is bonded face-down to a support member 50. In this case, the support member 50 comprises an adhesive 56 and a substrate 58, and an interconnecting pattern 52 is formed thereon. The interconnecting pattern 52 comprises lands 52 that are connected electrically to external electrodes 60 by conductive members that pass through the substrate 58. Each of the external electrodes 60 is formed of a solder ball or the like.
  • Note that the previously described [0134] substrate 28 may also be selected for use as the support member 50. The configuration may be such that a multi-layer structure formed of a stack of layers of insulating resin and interconnecting patterns is formed on the support member 50, or a plurality of substrates may be superimposed to form a multi-layer substrate. All other components and methods are similar to those of the above described embodiment of the invention, and thus are denoted by the same reference numerals.
  • In the example shown in FIG. 4 too, the layer formed of the adhesive [0135] 56 deforms elastically in such a manner that at least part of each of the lands 52 sinks thereinto, so that the stress is partially absorbed. This example also makes it possible to achieve the same effects as those of the above described embodiment. Note that at least one of the bumps 12, the lands 52, and the substrate 58 may be made to deform elastically in this example too.
  • The present invention can be applied to a chip scale/size package (CSP) type of semiconductor device, or a face-down type of semiconductor device in which at least one semiconductor chip is mounted, or a module configuration thereof. A semiconductor device of face-down type may be a chip-on-flex/film (COF) or a chip-on-board (COB) structure, by way of example. The present invention can also be applied to a CSP semiconductor device in which a plurality of semiconductor chips are mounted. [0136]
  • The semiconductor device shown in FIG. 4 may have the [0137] external electrodes 60, or part of the substrate 58 may be extended to provide external connections therefrom. Part of the substrate 58 may form a connector lead, connectors may be installed on the substrate 58, or the interconnecting pattern 52 of the substrate 58 itself may be connected to other electronic equipment.
  • In addition, the configuration may be such that the [0138] external electrodes 60 are not formed in actuality, but a solder cream is provided to the motherboard side when the device is mounted on a motherboard is used effectively so that the surface tension of the solder cream when melted forms external electrodes. Such a semiconductor device is called a land grid array type of semiconductor device.
  • As described above, this embodiment of the invention ensure that local elastic deformation occurs within a structure formed of the semiconductor chip, bumps, lands, and support member, due to the hardening or thermal contraction force of resin in accordance with the elastic modulus of these components, to ensure that electrical connections between the bumps and the lands are maintained more stably. [0139]
  • A notebook-sized [0140] personal computer 100, which is an example of electronic equipment having a circuit board or semiconductor device to which the present invention is applied, is shown in FIG. 5.
  • Note that a semiconductor chip is used by way of example in this description of the invention, but the present invention may also be applied to an electronic component for surface mounting that requires a large number of bumps, similar to that of a semiconductor chip, regardless of whether this is an active component or a passive component. Examples of such electronic components include resistors, capacitors, coils, oscillators, filters, temperature sensors, thermistors, varistors, variable resistors, or fuses, by way of example. [0141]
  • In addition, a plurality of the semiconductor chips may be mounted in all of the previously described embodiments of the invention. In other words, it is possible to mix a semiconductor chip mounted by one of the previously described mounting methods, together with a semiconductor chip mounted by another mounting method, such as one that is mounted in a face-down manner, having a bonding portion around the semiconductor chip, or a semiconductor chip mounted by a wire bonding method. Furthermore, electronic components other than those semiconductor chips can be mixed with such semiconductor chips, to form a module type of semiconductor device. [0142]

Claims (27)

1. A semiconductor device comprising:
a support member on which is formed an interconnecting pattern including a land;
a semiconductor chip to be bonded face-down to the support member and having a bump for an electrode that is disposed on the land; and
resin which provides adhesion between the semiconductor chip and the support member and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction,
wherein the stress is partially absorbed by elastic deformation of the support member, without changing the shape of the land.
2. The semiconductor device as defined by claim 1,
wherein the support member comprises a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically.
3. The semiconductor device as defined by claim 2,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA.
4. The semiconductor device as defined by claim 1,
wherein the support member is a substrate on which the interconnecting pattern is formed directly and which has deformed elastically.
5. The semiconductor device as defined by claim 4,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
EM>ES.
6. A semiconductor device comprising:
a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween;
a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land; and
resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA
and the stress is partially absorbed by elastic deformation of at least the adhesive.
7. A semiconductor device comprising:
a substrate on which is directly formed an interconnecting pattern including a land;
a semiconductor chip to be bonded face-down to the substrate and having a bump for an electrode that is disposed on the land; and
resin which provides adhesion between the semiconductor chip and the substrate and which contracts on hardening, to cause the land and the bump to be pressure-bonded by stress due to the hardening contraction,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
EM>ES
and the stress is partially absorbed by elastic deformation of at least the substrate.
8. A circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween,
wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land; resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the adhesive, without changing the shape of the land.
9. The circuit board as defined by claim 8,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA.
10. A circuit board on which is directly formed an interconnecting pattern including a land,
wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, the land and the bump are pressure-bonded by stress due to the hardening contraction, and the stress is partially absorbed by elastic deformation of the circuit board, without changing the shape of the land.
11. The circuit board as defined by claim 10,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the circuit board is such that:
EM>ES.
12. A circuit board on which is formed an interconnecting pattern including a land, with an adhesive therebetween,
wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction;
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA; and
wherein the stress is partially absorbed by elastic deformation of at least the adhesive.
13. A circuit board on which is directly formed an interconnecting pattern including a land,
wherein a semiconductor chip is bonded face-down to the circuit board by disposing a bump for an electrode on the land, resin provides adhesion between the semiconductor chip and the circuit board and contracts on hardening, and the land and the bump are pressure-bonded by stress due to the hardening contraction;
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the circuit board is such that:
EM>ES; and
wherein the stress is partially absorbed by elastic deformation of at least the circuit board.
14. Electronic equipment having the semiconductor device as defined by any of claims 1 to 5.
15. Electronic equipment having the semiconductor device as defined by claim 6.
16. Electronic equipment having the semiconductor device as defined by claim 7.
17. Electronic equipment having the circuit board as defined by claim 8 or claim 9.
18. Electronic equipment having the circuit board as defined by claim 10 or claim 11.
19. Electronic equipment having the circuit board as defined by claim 12.
20. Electronic equipment having the circuit board as defined by claim 13.
21. A method of connecting a semiconductor chip, the method comprising:
a step of bonding a semiconductor chip in a face-down manner to a support member on which is formed an interconnecting pattern including a land, in such a manner that a bump for an electrode is disposed on the land; and
a step of providing a resin as an adhesive between the semiconductor chip and the support member, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction,
wherein the shape of the land is maintained while the support member is deformed elastically, to absorb the stress partially.
22. The method of connecting a semiconductor chip as defined by claim 21,
wherein the support member comprises a substrate and an adhesive which bonds the interconnecting pattern to the substrate and which also deforms elastically; and
wherein the adhesive is deformed elastically.
23. The method of connecting a semiconductor chip as defined by claim 22,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA.
24. The method of connecting a semiconductor chip as defined by claim 21,
wherein the support member is a substrate on which the interconnecting pattern is formed directly; and
wherein the substrate is deformed elastically.
25. The method of connecting a semiconductor chip as defined by claim 24,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
EM>ES.
26. A method of connecting a semiconductor chip, the method comprising:
a step of bonding a semiconductor chip in a face-down manner to a substrate on which is formed an interconnecting pattern including a land, with an adhesive therebetween, in such a manner that a bump for an electrode is disposed on the land;
a step of providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus EA of the adhesive is such that:
EM>EA; and
wherein at least the adhesive is deformed elastically, to absorb the stress partially.
27. A method of connecting a semiconductor chip, the method comprising:
a step of bonding a semiconductor chip in a face-down manner to a substrate on which is directly formed an interconnecting pattern including a land, in such a manner that a bump for an electrode is disposed on the land; and
a step of providing a resin as an adhesive between the semiconductor chip and the substrate, causing the resin to harden on contraction, and pressure-bonding the land and the bump by stress due to the hardening contraction,
wherein the relationship between the elastic modulus EM of the resin and the elastic modulus ES of the substrate is such that:
EM>ES; and
wherein at least the substrate is deformed elastically, to absorb the stress partially.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084769A1 (en) * 2002-10-30 2004-05-06 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
US20050051870A1 (en) * 2002-12-27 2005-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US20060115927A1 (en) * 2002-11-29 2006-06-01 Infineon Technologies Ag Attachment of flip chips to substrates
US20080142949A1 (en) * 2005-10-19 2008-06-19 Texas Instruments Incorporated Semiconductor Assembly for Improved Device Warpage and Solder Ball Coplanarity

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000019516A1 (en) * 1998-09-30 2000-04-06 Seiko Epson Corporation Semiconductor device, connection method for semiconductor chip, circuit board and electronic apparatus
JP4041675B2 (en) * 2000-04-20 2008-01-30 株式会社ルネサステクノロジ Semiconductor integrated circuit device
JP3591458B2 (en) * 2000-12-15 2004-11-17 松下電器産業株式会社 Semiconductor device mounting structure and semiconductor device
CN1383197A (en) * 2001-04-25 2002-12-04 松下电器产业株式会社 Mfg. method of semiconductor device and semiconductor device
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
JP2008227241A (en) * 2007-03-14 2008-09-25 Seiko Epson Corp Electronic device and its manufacturing method
JP2011210821A (en) * 2010-03-29 2011-10-20 Renesas Electronics Corp Semiconductor device, and method of manufacturing the same
CN115064454A (en) * 2022-06-06 2022-09-16 重庆平创半导体研究院有限责任公司 Interconnection method of power chips

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
JP2574369B2 (en) 1988-03-07 1997-01-22 松下電器産業株式会社 Semiconductor chip mounted body and mounting method thereof
JP2502794B2 (en) * 1990-07-24 1996-05-29 松下電器産業株式会社 Semiconductor device
JPH04352439A (en) 1991-05-30 1992-12-07 Toshiba Corp Manufacture of semiconductor device
JPH0563030A (en) 1991-09-03 1993-03-12 Rohm Co Ltd Bonding agent and mounting method based on its application
US5169056A (en) * 1992-02-21 1992-12-08 Eastman Kodak Company Connecting of semiconductor chips to circuit substrates
JP2571024B2 (en) * 1994-09-28 1997-01-16 日本電気株式会社 Multi-chip module
JP3270813B2 (en) 1995-07-11 2002-04-02 株式会社ピーエフユー Semiconductor device and manufacturing method thereof
JP3225800B2 (en) 1995-08-09 2001-11-05 三菱電機株式会社 Semiconductor device
EP0791960A3 (en) * 1996-02-23 1998-02-18 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having protruding contacts and method for making the same
US5926694A (en) 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
JPH1050771A (en) 1996-08-06 1998-02-20 Matsushita Electric Ind Co Ltd Mounting method for electronic component with bump, and circuit module
JP2812316B2 (en) 1996-11-18 1998-10-22 富士ゼロックス株式会社 Method for manufacturing semiconductor device
JPH10270496A (en) 1997-03-27 1998-10-09 Hitachi Ltd Electronic device, information processor, semiconductor device, semiconductor chip, and mounting method thereof
JP3064998B2 (en) * 1997-10-28 2000-07-12 日本電気株式会社 Semiconductor device and manufacturing method thereof
WO2000019516A1 (en) * 1998-09-30 2000-04-06 Seiko Epson Corporation Semiconductor device, connection method for semiconductor chip, circuit board and electronic apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040084769A1 (en) * 2002-10-30 2004-05-06 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
EP1420441A1 (en) * 2002-10-30 2004-05-19 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
US7132756B2 (en) 2002-10-30 2006-11-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
US20060290009A1 (en) * 2002-10-30 2006-12-28 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
US7390692B2 (en) 2002-10-30 2008-06-24 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for manufacturing the same
CN100442481C (en) * 2002-10-30 2008-12-10 松下电器产业株式会社 Semiconductor device and its mfg. method
US20060115927A1 (en) * 2002-11-29 2006-06-01 Infineon Technologies Ag Attachment of flip chips to substrates
US20050051870A1 (en) * 2002-12-27 2005-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and a method of manufacturing the same
US7230316B2 (en) * 2002-12-27 2007-06-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having transferred integrated circuit
US20080142949A1 (en) * 2005-10-19 2008-06-19 Texas Instruments Incorporated Semiconductor Assembly for Improved Device Warpage and Solder Ball Coplanarity
WO2007048090A3 (en) * 2005-10-19 2008-11-20 Texas Instruments Inc Semiconductor assembly for improved device warpage and solder ball coplanarity
US7462943B2 (en) 2005-10-19 2008-12-09 Texas Instruments Incorporated Semiconductor assembly for improved device warpage and solder ball coplanarity

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