US12292238B2 - Heat dissipation member - Google Patents

Heat dissipation member Download PDF

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US12292238B2
US12292238B2 US17/802,127 US202117802127A US12292238B2 US 12292238 B2 US12292238 B2 US 12292238B2 US 202117802127 A US202117802127 A US 202117802127A US 12292238 B2 US12292238 B2 US 12292238B2
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heat dissipation
holes
intermediate member
hole
dissipation member
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US20230080077A1 (en
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Yuichi Abe
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Kyocera Corp
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Kyocera Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to a heat dissipation member.
  • a known heat dissipation member transfers heat from a high-temperature part to a low-temperature part by utilizing a cycle of evaporation and condensation of a working liquid.
  • Patent Document 1 discloses a metal heat pipe in which a plate-shaped intermediate member is interposed between a plate-shaped upper member and a plate-shaped lower member. Lattice-shaped grooves are formed on each of the lower surface of the upper member and the upper surface of the lower member. A plurality of vapor holes extending radially and a plurality of fine through holes generating capillary force are formed in the intermediate member.
  • the vapor holes communicate with respective recessed portions of the upper member and the lower member to form a vapor diffusion channel for diffusing the vapor of the working liquid in a plane direction.
  • Through holes communicate with each of the recessed portions of the upper member and the lower member, thereby forming a fine capillary channel for returning the working liquid in a direction orthogonal to the plane direction.
  • Patent Document 2 discloses a heat pipe made of a ceramic.
  • a heat dissipation member includes a plate-shaped intermediate member, a first member and a second member, made of a ceramic.
  • the intermediate member includes a plurality of through holes each penetrating through the first surface and the second surface located opposite to each other.
  • the first member includes a first groove portion on a third surface facing the first surface of the intermediate member.
  • the second member includes a plurality of second groove portions on a fourth surface facing the second surface of the intermediate member, and a heat source is arranged on a fifth surface located opposite to the fourth surface.
  • Each of the plurality of through holes decreases in diameter from the first surface side toward the second surface side.
  • FIG. 1 is a perspective view of a heat dissipation member according to an embodiment.
  • FIG. 2 is a view in which a first member according to an embodiment is viewed from a Z-axis negative direction side toward a Z-axis positive direction.
  • FIG. 3 is a view in which a second member according to an embodiment is viewed from a Z-axis positive direction side toward a Z-axis negative direction.
  • FIG. 4 is a view in which an intermediate member according to an embodiment is viewed from the Z-axis positive direction side toward the Z-axis negative direction.
  • FIG. 5 is an enlarged view of the periphery of the center portion in an intermediate member 30 .
  • FIG. 6 is a diagram in which a groove forming region illustrated in FIG. 2 and a groove forming region illustrated in FIG. 3 are superimposed on the intermediate member illustrated in FIG. 4 .
  • FIG. 7 is a diagram illustrating the flow of a working liquid in a heat dissipation member according to an embodiment.
  • FIG. 8 is a diagram illustrating the flow of a working liquid in a heat dissipation member according to an embodiment.
  • FIG. 9 is an enlarged view of an H portion illustrated in FIG. 8 .
  • FIG. 10 is a diagram illustrating the configuration of a through hole according to a first variation.
  • FIG. 11 is a diagram illustrating the configuration of a through hole according to a second variation.
  • FIG. 12 is a side view of a heat dissipation member according to a third variation.
  • FIG. 13 is a side view of a heat dissipation member according to a fourth variation.
  • FIG. 14 is a side view of a heat dissipation member according to a fifth variation.
  • FIG. 15 is a side view of a heat dissipation member according to a sixth variation.
  • FIG. 16 is a side view of a heat dissipation member according to a seventh variation.
  • an X-axis direction, a Y-axis direction, and a Z-axis direction that are orthogonal to each other may be defined to illustrate a rectangular coordinate system in which the Z-axis positive direction is the vertically upward direction.
  • FIG. 1 is a perspective view of a heat dissipation member according to an embodiment.
  • a heat dissipation member 1 includes a first member 10 , a second member 20 , and an intermediate member 30 .
  • the first member 10 , the second member 20 , and the intermediate member 30 are all plate-shaped, and are layered such that the intermediate member 30 is sandwiched between the first member 10 and the second member 20 .
  • the heat dissipation member 1 includes an internal space in which a working liquid is sealed.
  • a working liquid for example, water, a hydrocarbon-based compound, an organic liquid such as ethanol or methanol, or a liquid such as ammonia may be used.
  • the first member 10 includes a working liquid injection hole 14 and a gas discharge hole 15 .
  • the working liquid is injected from the working liquid injection hole 14 into the internal space of the heat dissipation member 1 .
  • the gas existing in the internal space of the first member 10 is discharged from the gas discharge hole 15 to the outside.
  • the working liquid injection hole 14 is located near one of the four corners of the first member 10
  • the gas discharge hole 15 is located near another corner located diagonally opposite the working liquid injection hole 14 .
  • the working liquid injection hole 14 and the gas discharge hole 15 are blocked by sealing members 4 and 5 , respectively.
  • the working liquid injection hole 14 and the gas discharge hole 15 are blocked, so that the internal space of the heat dissipation member 1 is closed and the working liquid is sealed in the internal space. This can withstand, for example, an increase in internal pressure during a high-temperature load, and enhance thermal diffusivity.
  • a ceramic of the same material as the first member 10 , the second member 20 and the intermediate member 30 can be used for the sealing members 4 and 5 , for example.
  • a ceramic of a different material from the first member 10 , the second member 20 and the intermediate member 30 can be used for the sealing members 4 and 5 , for example.
  • the sealing members 4 and 5 are not limited to a ceramic but may be a metal, a resin or the like.
  • a respective adhesive may be interposed between the working liquid injection hole 14 and the sealing member 4 , and between the gas discharge hole 15 and the sealing member 5 .
  • the adhesive may be, for example, a resin such as silicone or polyimide.
  • the working liquid is filled, for example, at a ratio of 10 vol % to 95 vol % with respect to the total volume of the internal space of the operating region 100 .
  • the ratio is 30 vol % to 75 vol %. More preferably, the ratio is 40 vol % to 65 vol %.
  • the remaining portion of the internal space of the heat dissipation member 1 other than the working liquid is in a vacuum state including some of the vaporized working liquid.
  • the first member 10 , the second member 20 and the intermediate member 30 are made of a ceramic.
  • the ceramic constituting the first member 10 , the second member 20 and the intermediate member 30 for example, alumina (Al 2 O 3 ), zirconia (ZrO 2 ), silicon carbide (SiC), silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), cordierite (Mg 2 Al 3 (AlSi 5 O 18 )), silicon impregnated silicon carbide (SiSiC) or the like, can be used.
  • the ceramic constituting the first member 10 , the second member 20 and the intermediate member 30 may be a single crystal.
  • the metal heat dissipation member 1 has room for improvement in corrosion resistance because the part in contact with the working liquid is metal.
  • the heat dissipation member 1 since the first member 10 , the second member 20 , and the intermediate member 30 , are all made of a ceramic, the heat dissipation member 1 can be made thinner and has excellent corrosion resistance as compared with a heat dissipation member made of a metal.
  • the heat dissipation member 1 is installed with the first member 10 facing upward, but the installation state of the heat dissipation member 1 is not limited to the example illustrated in FIG. 1 .
  • the heat dissipation member 1 may be installed with the first member 10 facing downward.
  • the heat dissipation member 1 is not limited to the horizontal arrangement as illustrated in FIG. 1 , but may be arranged vertically.
  • FIG. 2 is a view in which a first member 10 according to an embodiment is viewed from the Z-axis negative direction side toward the Z-axis positive direction.
  • FIG. 2 illustrates a lower surface of the first member 10 , specifically, a surface (third surface) facing the upper surface (first surface) of the intermediate member 30 .
  • the first member 10 includes a lattice-shaped first groove portion 11 on the third surface.
  • the first groove portion 11 includes a first recessed portion 11 a recessed with respect to the third surface and a plurality of first protruding portions 11 b located within the first recessed portion 11 a .
  • the first recessed portion 11 a is located at the center portion of the third surface, and its outline in plan view is, for example, a square.
  • the plurality of first protruding portions 11 b are arranged longitudinally (Y-axis direction) and laterally (X-axis direction) at intervals from each other within the first recessed portion 11 a .
  • the first recessed portion 11 a and the plurality of first protruding portions 11 b make the first groove portion 11 have a lattice shape.
  • a groove forming region 100 an area where the first groove portion 11 is located on the third surface of the first member 10 , will be referred to as a “groove forming region 100 ”.
  • the working liquid injection hole 14 and the gas discharge hole 15 are located in the groove forming region 100 .
  • FIG. 3 is a view in which the second member 20 according to an embodiment is viewed from the Z-axis positive direction side toward the Z-axis negative direction.
  • FIG. 3 illustrates the upper surface of the second member 20 , specifically, the surface (the fourth surface) facing the lower surface (the second surface) of the intermediate member 30 .
  • the second member 20 includes a lattice-shaped second groove portion 21 on the fourth surface.
  • the second groove portion 21 includes a second recessed portion 21 a recessed with respect to the fourth surface and a plurality of second protruding portions 21 b located within the second recessed portion 21 a .
  • the second recessed portion 21 a is located at the center portion of the fourth surface, and its outline in plan view is, for example, a square.
  • the plurality of second protruding portions 21 b are arranged longitudinally (Y-axis direction) and laterally (X-axis direction) at intervals from each other within the second recessed portion 21 a .
  • the second recessed portion 21 a and the plurality of second protruding portions 21 b make the second groove portion 21 have a lattice shape.
  • groove forming region 200 an area where the second groove portion 21 is located on the fourth surface of the second member 20 will be referred to as a “groove forming region 200 ”.
  • the size of the groove forming region 200 in the second member 20 is the same as the size of the groove forming region 100 in the first member 10 .
  • the position of the groove forming region 200 on the fourth surface of the second member 20 is the same as the position of the groove forming region 100 on the third surface of the first member 10 .
  • a heat source is arranged on the lower surface (fifth surface) located opposite to the upper surface (fourth surface) of the second member 20 .
  • each of the first groove portion 11 and the second groove portion 21 in a lattice shape, the working liquid can be efficiently circulated in the internal space of the heat dissipation member 1 .
  • each of the first groove portion 11 and the second groove portion 21 need not necessarily have a lattice shape.
  • FIG. 4 is a view in which an intermediate member 30 according to an embodiment is viewed from the Z-axis positive direction side toward the Z-axis negative direction.
  • the intermediate member 30 includes: an edge portion 31 having a rectangular frame shape; a center portion 32 having a circular shape in plan view located inside the edge portion 31 ; and a plurality of connecting portions 33 located between the center portion 32 and the edge portion 31 and connecting the center portion 32 and the edge portion 31 .
  • the center portion 32 is located at the center of intermediate member 30 .
  • the plurality of connecting portions 33 extend radially, widening from the center portion 32 toward the edge portion 31 , at intervals from each other.
  • the intermediate member 30 further includes a plurality of vapor holes 35 and a plurality of through holes 37 .
  • Each of the plurality of vapor holes 35 and each of the plurality of through holes 37 penetrate the upper surface (first surface) and the lower surface (second surface) of the intermediate member 30 .
  • the plurality of vapor holes 35 function as a part of a channel for the vapor of the working liquid.
  • Each of the plurality of vapor holes 35 is located between two adjacent connecting portions 33 . That is, each of the plurality of vapor holes 35 and each of the plurality of connecting portions 33 are alternately located in the circumferential direction.
  • the plurality of vapor holes 35 like the plurality of connecting portions 33 , extend radially, widening from the center portion 32 toward the edge portion 31 at intervals from each other.
  • the plurality of through holes 37 function as a part of a channel for the working liquid.
  • Each of the through holes 37 is a fine hole having a smaller opening area than the vapor hole 35 described above. Specifically, the through hole 37 is small enough to cause a capillary phenomenon in the working liquid passing the through hole 37 .
  • the plurality of through holes 37 are located at the center portion 32 and the plurality of connecting portions 33 , of the intermediate member 30 .
  • FIG. 5 is an enlarged view of the periphery of the center portion 32 in the intermediate member 30 .
  • the plurality of through holes 37 include a plurality of types (here, three types) of through holes having different opening diameters (in other words, the opening diameter on the first member 10 side), when the intermediate member 30 is viewed from the Z-axis positive direction toward the Z-axis negative direction.
  • the three types are a plurality of first through holes 37 a , a second through hole 37 b and a plurality of third through holes 37 c.
  • the second through hole 37 b is located at the center of the center portion 32 of the intermediate member 30 .
  • the second through hole 37 b has a larger diameter than the first through hole 37 a .
  • the opening diameter of the second through hole 37 b as viewed from the first member 10 side is, for example, from 550 ⁇ m to 900 ⁇ m. Note that a plurality of second through holes 37 b may be provided at the center portion 32 .
  • a plurality of third through holes 37 c is located at each of the connecting portions 33 of the intermediate member 30 . Specifically, a plurality of third through holes 37 c is located in a region within each of the connecting portions 33 , near the center portion 32 . A plurality of third through holes 37 c is also located at the center portion 32 of the intermediate member 30 . Specifically, a plurality of third through holes 37 c is located on the outer peripheral portion side of the center portion 32 , that is, in a region near the connecting portion 33 . The third through holes 37 c have a smaller diameter than the first through holes 37 a . For example, the opening diameter of the third through holes 37 c as viewed from the first member 10 side is, for example, from 200 to 400 ⁇ m.
  • the plurality of through holes 37 are located in the order of the second through hole 37 b having a large opening diameter, the third through holes 37 c each having a small opening diameter, and the first through holes 37 a each having a medium opening diameter, advancing from the center to the outer periphery of the intermediate member 30 .
  • the center portion 32 of the intermediate member 30 has a longer distance to each of the vapor holes 35 than the connecting portions 33 , the circulating flow of the working liquid tends to stagnate at the center portion 32 . That is, the center portion of the heat dissipation member 1 tends to be a heat spot.
  • the heat dissipation member 1 according to the embodiment by providing the center portion 32 of the intermediate member 30 with the second through hole 37 b having a large opening diameter, the vapor generated at the center portion 32 can be moved from the second through hole 37 b to the low-temperature side.
  • the circulating flow of the working liquid at the center portion of the heat dissipation member 1 can be promoted. Accordingly, the center portion of the heat dissipation member 1 can be suppressed from becoming a heat spot.
  • the density of the through holes 37 at the center portion 32 of the intermediate member 30 is smaller than the density of the through holes 37 at the connecting portions 33 of the intermediate member 30 .
  • the ratio of the opening area of the through holes 37 (the second through hole 37 b and the plurality of third through holes 37 c ) to the area of the center portion 32 is smaller than the ratio of the opening area of the through holes 37 (the plurality of first through holes 37 a and the plurality of third through holes 37 c ) to the area of the connecting portions 33 .
  • FIG. 6 is a diagram in which a groove forming region 100 illustrated in FIG. 2 and a groove forming region 200 illustrated in FIG. 3 are superimposed on the intermediate member 30 illustrated in FIG. 4 .
  • the internal space of the heat dissipation member 1 can be spread outward as compared with the case where the groove forming regions 100 and 200 are each made equal to the hole forming region.
  • the heat source is arranged at the center portion of the heat dissipation member 1 , and the temperature of the heat dissipation member 1 becomes lower with increasing distance from the heat source, that is, approaching the outer peripheral portion of the heat dissipation member 1 .
  • the vapor of the working liquid condenses into a liquid upon moving to a low-temperature region. Accordingly, by spreading the internal space of the heat dissipation member 1 outward, condensation of the working liquid is more likely to occur. This makes it difficult for dryout to occur.
  • first groove forming region 110 and the second groove forming region 120 spread outward from the hole forming region of the intermediate member 30 are illustrated; however, the configuration is not limited to this, the hole forming region of the intermediate member 30 may spread outward from the first groove forming region 110 and the second groove forming region 120 .
  • FIGS. 7 and 8 are diagrams illustrating the flow of the working liquid in the heat dissipation member 1 according to the embodiment.
  • FIG. 7 is a diagram in which the edge portion 31 is omitted from the view illustrated in FIG. 6
  • FIG. 8 is a cross-sectional diagram taken along an IX-IX arrow in FIG. 7 .
  • the vapor flow is indicated by a hollow arrow and the liquid flow is indicated by a black arrow.
  • the working liquid is vaporized into a vapor by being heated by a heat source.
  • the heat source is located at the center portion of the lower surface (fifth surface) of the second member 20 (see FIGS. 1 and 3 ).
  • the vapor of the working liquid is generated at the center portion of the high-temperature side space (space sandwiched between the second member 20 and the intermediate member 30 ) where the heat source is arranged.
  • the vapor of the working liquid is diffused (see the hollow arrow illustrated in FIG. 7 ) in the in-plane direction (XY plane direction) of the heat dissipation member 1 through the groove forming region 200 (second groove portion 21 ), and moves (see the white arrow illustrated in FIG. 8 ) to the upper low-temperature-side space (space between the first member 10 and the intermediate member 30 ) through the plurality of vapor holes 35 .
  • the vapor that has moved to the low-temperature-side space condenses into a liquid as the temperature decreases.
  • the liquefied working liquid moves (see the black arrow illustrated in FIG. 7 ) in the groove forming region 100 (first groove portion 11 ) toward the center portion of the heat dissipation member 1 , by the capillary force of the groove forming region 100 .
  • the working liquid enters the through holes 37 and is returned to the high-temperature-side space by the capillary force of the through holes 37 (see the black arrow in FIG. 8 ).
  • the heat dissipation member 1 can transfer heat from the heat source.
  • FIG. 9 is an enlarged view of the H portion illustrated in FIG. 8 .
  • the through hole 37 decreases in diameter from an upper surface 301 (the first surface) side, which is a low-temperature-side surface of the plate surfaces of the intermediate member 30 , toward the lower surface 302 (the second surface) side, which is a high-temperature-side surface.
  • the opening diameter of the through hole 37 narrows from the low-temperature side to the high-temperature side.
  • the working liquid can easily enter the through hole 37 .
  • the magnitude of the capillary force in the through hole 37 can be increased toward the high-temperature side.
  • the working liquid entering the through hole 37 from the low-temperature side can be pulled to the high-temperature side at an accelerated rate by the capillary force gradually increasing.
  • the heat dissipation member 1 by forming the through hole 37 in a tapered shape, allows the circulation efficiency of the working liquid to be enhanced.
  • the heat dissipation member 1 by forming the through hole 37 in a tapered shape, allows the reverse flow of the working liquid or vapor to be suppressed.
  • the second through hole 37 b (see FIG. 5 ) among the plurality of through holes 37 is also used as a channel for vapor.
  • the second through hole 37 b may be formed in a straight shape with a constant opening diameter configured to facilitate movement of the vapor.
  • the surface roughness of an inner surface 371 of the through hole 37 is larger than that of the upper surface 301 (the first surface) of the intermediate member 30 .
  • the working liquid is more likely to enter the through hole 37 having a larger surface roughness.
  • the circulation efficiency of the working liquid can be enhanced.
  • the surface roughness of the inner surface 211 of the second groove portion 21 is larger than that of the inner surface 371 of the through hole 37 . Thus, the working liquid is easily discharged from the inside of the through hole 37 to the second groove portion 21 .
  • respective green sheets are formed by a doctor blade method or a roll compaction method using respective materials of the first member 10 , the second member 20 and the intermediate member 30 . Then, by layering a plurality of the respective green sheets, a laminate is obtained.
  • the obtained laminate is subjected to laser beam machining or die punching, thereby obtaining a respective compact of the first member 10 , the second member 20 and the intermediate member 30 .
  • a compact of the intermediate member 30 having therein a plurality of vapor holes 35 and a plurality of through holes 37 formed can be obtained, by applying laser beam machining to the laminate.
  • the surface roughness of the inner surface 371 of the through hole 37 can be made larger than the surface roughness of the upper surface 301 (the first surface) of the intermediate member 30 by this laser beam machining.
  • Respective compacts of the first member 10 and the second member 20 on which the groove forming regions 100 and 200 are formed respectively are obtained by applying laser beam machining to the obtained laminate.
  • the surface roughness of the inner surface 211 of the second groove portion 21 can be made larger than the surface roughness of the inner surface 371 of the through hole 37 by adjusting the output of the laser in the laser beam machining.
  • the working liquid is injected into the sintered body from the working liquid injection hole 14 provided in the first member 10 .
  • the gas existing inside the sintered body is discharged to the outside from the gas discharge hole 15 of the first member 10 with the injection of the working liquid.
  • FIG. 10 is a diagram illustrating the configuration of a through hole according to a first variation. As illustrated in FIG. 10 , the heat dissipation member 1 A according to the first variation includes an intermediate member 30 A.
  • the intermediate member 30 A according to the first variation includes a chamfered portion 372 between the upper surface 301 (the first surface) and the through hole 37 .
  • the chamfered portion 372 includes a curved convex surface connecting, for example, the upper surface 301 (the first surface) and the inner surface 371 of the through hole 37 .
  • the working liquid can easily enter the through hole 37 .
  • the chamfered portion 372 is not necessarily curved (R-shaped), but may be planar (C-shaped), for example.
  • the output of the laser beam machining or the shape of the die may be adjusted. Thereafter, the obtained compact is fired together with the first member 10 and the second member 20 to obtain a sintered body in which the first member 10 , the second member 20 and the intermediate member 30 A are integrated.
  • FIG. 11 is a diagram illustrating the configuration of a through hole according to a second variation. As illustrated in FIG. 11 , the heat dissipation member 1 B according to the second variation includes an intermediate member 30 B.
  • the intermediate member 30 B according to the second variation is meandering with respect to the XY plane.
  • the heat dissipation member 1 B includes a first gap 310 between at least one of a plurality of first protruding portions 11 b of the first groove portion 11 and the upper surface 301 of the intermediate member 30 B.
  • the heat dissipation member 1 B enables the working liquid to circulate in not only the first groove portion 11 but also in the first gap 310 .
  • the working liquid is guided to the through hole 37 by capillary force in the first gap 310 and enters the through hole 37 .
  • the heat dissipation member 1 B enables the circulation efficiency of the working liquid to be further enhanced by including the first gap 310 .
  • the heat dissipation member 1 B includes a second gap 320 between at least one of the plurality of second protruding portions 21 b of the second groove portion 21 and the lower surface 302 of the intermediate member 30 B.
  • the heat dissipation member 1 B enables the vapor of the working liquid to circulate in not only the second groove portion 21 but also in the second gap 320 .
  • the heat dissipation member 1 B enables the diffusion of the vapor of the working liquid to accelerate by including the second gap 320 . That is, the circulation efficiency of the working liquid can be enhanced.
  • the pressure applied to the laminate at the time of layering the green sheets may be adjusted.
  • a compact of the intermediate member 30 B meandering with respect to the XY plane can be obtained.
  • the obtained compact is fired together with the first member 10 and the second member 20 to obtain a sintered body in which the first member 10 , the second member 20 and the intermediate member 30 B are integrated.
  • the surface roughness of the inner surface 211 of the second groove portion 21 is larger than that of the lower surface 302 (second surface) of the intermediate member 30 .
  • the working liquid is easily discharged from the lower surface 302 (second surface) of the intermediate member 30 to the second groove portion 21 .
  • the circulation efficiency of the working liquid can be enhanced.
  • the surface roughness of the upper surface 301 (the first surface) of the intermediate member 30 , the inner surface 371 of the through hole 37 , the lower surface 302 (the second surface), and the inner surface 211 of the second groove portion 21 may be adjusted within a range in which the arithmetic mean roughness Ra is, for example, from 0.08 ⁇ m to 0.4 ⁇ m, from 0.3 ⁇ m to 0.6 ⁇ m, from 0.08 ⁇ m to 0.4 ⁇ m, and from 0.5 ⁇ m to 0.8 ⁇ m, respectively.
  • FIG. 12 is a side view of a heat dissipation member according to a third variation.
  • a heat dissipation member 1 C may include a conductor 6 on the lower surface (the fifth surface) of the second member 20 that is on the high-temperature side.
  • the heat dissipation member itself serves as a conductor in the metal heat dissipation member, an insulator is required to be provided in order to form a circuit or the like.
  • an electronic component can be directly mounted thereon by using the conductor 6 as a wiring or an electrode.
  • FIG. 13 is a side view of a heat dissipation member according to a fourth variation.
  • a heat dissipation member 1 D may include a covering layer 7 covering at least a part of the conductor 6 on the lower surface (the fifth surface) of the second member 20 that is on the high-temperature side.
  • FIG. 14 is a side view of a heat dissipation member according to a fifth variation.
  • a heat dissipation member 1 E may include a heat sink 8 on the upper surface (sixth surface) of the first member 10 that is on the low-temperature side.
  • the heat sink 8 may be made of a metal or a ceramic.
  • the heat sink 8 includes, for example, a plurality of fins 81 .
  • the heat dissipation effect can be further enhanced.
  • FIG. 15 is a side view of a heat dissipation member according to a sixth variation.
  • the heat dissipation member 1 F may include a first member 10 F in which a plurality of fins 18 made of a ceramic are integrally formed on the upper surface (the sixth surface) of the first member 10 F.
  • the first member 10 F is obtained, for example, by firing a compact in which a plurality of fins 18 are formed by laser beam machining or die punching on a laminate of green sheets.
  • an adhesive or the like for attaching the fin 18 is not required, so that reliability can be improved. Heat dissipation is not hindered by an adhesive or the like.
  • Some of the fins 18 are preferably located outside the internal space, of the heat dissipation member 1 F, formed by the groove forming region 100 of the first member 10 F, the groove forming region 200 of the second member 20 , and the vapor holes 35 and the through holes 37 of the intermediate member 30 .
  • the heat dissipation effect can be further enhanced.
  • FIG. 16 is a side view of a heat dissipation member according to a seventh variation.
  • a heat dissipation member 1 G may include a temperature adjusting plate 9 on the upper surface (sixth surface) of the first member 10 that is on the low-temperature side.
  • the temperature adjusting plate 9 may be, for example, water-cooled, air-cooled, or resistance-heated.
  • the first member includes a first groove portion (e.g., first groove portion 11 ) on a third surface (e.g., lower surface) facing the first surface of the intermediate member.
  • the second member includes a plurality of second groove portions (e.g., the second groove portion 21 ) on a fourth surface (e.g., upper surface) facing the second surface of the intermediate member, and a heat source is arranged on a fifth surface (e.g., lower surface) located opposite to the fourth surface.
  • the surface roughness of the inner surface of the through hole is larger than that of the first surface.
  • the first groove portion and the second groove portion are lattice-shaped.
  • the working liquid can be efficiently circulated in the internal space of the heat dissipation member.
  • the surface roughness of the inner surface of the second groove portion is larger than that of the inner surface of the through hole. Therefore, the working liquid is easily discharged from the inside of the through hole to the second groove portion, so that the circulation efficiency of the working liquid can be enhanced.
  • the first groove portion includes a first recessed portion (e.g., first recessed portion 11 a ) recessed with respect to the third surface and a plurality of first protruding portions (the first protruding portions 11 b ) located in the first recessed portion.
  • the heat dissipation member according to the embodiment includes a gap (e.g., first gap 310 ) between at least one of the plurality of first protruding portions and the first surface.
  • the second groove portion includes a second recessed portion (e.g., the second recessed portion 21 a ) recessed with respect to the fourth surface and a plurality of second protruding portions (e.g., the second protruding portions 21 b ) located in the second recessed portion.
  • the heat dissipation member according to the embodiment includes a gap (e.g., second gap 320 ) between at least one of the plurality of second protruding portions and the second surface.
  • the intermediate member includes an edge portion (e.g., edge portion 31 ), a center portion (e.g., center portion 32 ), and a plurality of connecting portions (e.g., connecting portions 33 ) located between the center portion and the edge portion and connecting the center portion and the edge portion.
  • the plurality of through holes includes a plurality of first through holes (e.g., first through holes 37 a ) located at a connecting portion and at least one second through hole (e.g., second through hole 37 b ) located at a center portion and having an opening area larger than that of the first through hole.
  • the first groove portion and the second groove portion overlap the edge portion.
  • Each of the plurality of through holes decreases in diameter from the first surface side toward the second surface side.
  • the working liquid can easily enter the through hole.
  • the magnitude of the capillary force in the through hole can be increased toward the high-temperature side.
  • the circulation efficiency of the working liquid can be enhanced. That is, the heat dissipation efficiency can be further improved.
  • the intermediate member includes a chamfered portion (e.g., chamfered portion 372 ) between the first surface and the through hole.
  • a chamfered portion e.g., chamfered portion 372
  • the shape of the through hole is a shape (tapered shape) in which the through hole decreases in diameter from the first surface side toward the second surface side of the intermediate member
  • the shape of the through hole is not limited to a tapered shape.
  • the shape of the through hole may be a shape (reverse taper shape) in which the through hole spreads in diameter from the first surface side to the second surface side of the intermediate member.
  • the shape of the through hole may be a shape (straight shape) in which the through hole is substantially constant in diameter from the first surface side to the second surface side of the intermediate member.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US17/802,127 2020-02-26 2021-02-25 Heat dissipation member Active 2041-08-14 US12292238B2 (en)

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JP2020031035 2020-02-26
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JP2020-031049 2020-02-26
JP2020031059 2020-02-26
PCT/JP2021/007216 WO2021172479A1 (ja) 2020-02-26 2021-02-25 放熱部材

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JP (4) JP7451678B2 (enrdf_load_stackoverflow)
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CN218483134U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件以及电子设备
CN218483131U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件和电子设备

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JP7693043B2 (ja) 2025-06-16
JP2024069313A (ja) 2024-05-21
JP2024059978A (ja) 2024-05-01
JP7451678B2 (ja) 2024-03-18
EP4113596A1 (en) 2023-01-04
WO2021172479A1 (ja) 2021-09-02
JP7710554B2 (ja) 2025-07-18
JP2024059993A (ja) 2024-05-01
JPWO2021172479A1 (enrdf_load_stackoverflow) 2021-09-02
CN115136302A (zh) 2022-09-30
US20230080077A1 (en) 2023-03-16

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