US12114464B2 - Liquid immersion cooler - Google Patents
Liquid immersion cooler Download PDFInfo
- Publication number
- US12114464B2 US12114464B2 US17/725,169 US202217725169A US12114464B2 US 12114464 B2 US12114464 B2 US 12114464B2 US 202217725169 A US202217725169 A US 202217725169A US 12114464 B2 US12114464 B2 US 12114464B2
- Authority
- US
- United States
- Prior art keywords
- heat conduction
- laid
- liquid immersion
- layer
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 24
- 238000007654 immersion Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 238000005476 soldering Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002918 waste heat Substances 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
Definitions
- the disclosure relates to a cooler, particularly to a liquid immersion cooler.
- a cooler used for the electronic element includes a heat conduction plate and multiple fins on the heat conduction plate.
- the cooling effect can be implemented by the thermal contact between the heat conduction plate and the electronic element and air as a heat conduction medium.
- the thermal conductivity of air is too low to have good efficiency of heat conduction.
- the heat to be dissipated is limited by its structure, so current using demands cannot be satisfied.
- An object of the disclosure is to provide a liquid immersion cooler, which may rapidly dissipate the waste heat from an electronic heat source.
- a liquid immersion cooler which includes a metal case, a soldering layer, a heat conduction layer and a porous structure.
- the metal case has a heated surface and a cooling surface disposed on back of the heated surface.
- the soldering layer is laid on the cooling surface.
- the heat conduction layer is laid on the soldering layer.
- the porous structure is laid on the heat conduction layer.
- the disclosure further has the following functions.
- pores of the porous structure may not be jammed by soldering material in the manufacturing process.
- the pores being limited in a specific range, there is much more cooling surface area in the same unit area, and the liquid may easily penetrate in or out to flow.
- FIG. 1 is a schematic assembled view of the liquid immersion cooler of the disclosure and an electronic element
- FIG. 2 is a partially enlarged view of FIG. 1 ;
- FIG. 3 is an assembled cross-sectional view of the liquid immersion cooler of the disclosure and an electronic element.
- the disclosure provides a liquid immersion cooler, which includes a metal case 10 , a soldering layer 20 , a heat conduction layer 30 and a porous structure 40 .
- the metal case 10 is made of copper, aluminum, magnesium, or an alloy thereof and includes a substrate 11 and multiple side plates 12 downward extended from a periphery of the substrate 11 .
- a lower surface of the substrate 11 has a heated surface 111 .
- An upper surface of the substrate 11 has a cooling surface 112 which is formed on the back of the heated surface 111 .
- the soldering layer 20 is laid on the cooling surface 112 .
- the soldering layer 20 may be solder paste such as Sn42Bi58, which has a melting temperature of about 138° C., a thickness of less than or equal to about 0.05 millimeters (mm), and a thermal conductivity of 19 W/mk.
- the heat conduction layer 30 is laid on the soldering layer 20 .
- the heat conduction layer 30 may be C1100 copper foil, which has a thickness of less than or equal to about 0.5 millimeters (mm) and a thermal conductivity of greater than or equal to 390 W/mk.
- the porous structure 40 is laid on the heat conduction layer 30 .
- the porous structure 40 may be a woven metal mesh such as a copper mesh with mesh value greater than or equal to 65 (that is, the gap is less than or equal to about 0.2 mm). In some embodiments, a mesh value is between 120 and 300.
- the woven metal mesh is connected to the heat conduction layer 30 in a diffusion bonding manner.
- the woven metal mesh includes multiple mesh units 41 .
- the mesh units 41 are stacked layer by layer to be laid and assembled on the cooling surface 112 .
- Each woven mesh unit 41 may be made of C1100 copper mesh, with wire diameter being about 0.05 millimeter (mm), thickness being about 0.1 millimeter (mm), porosity being 50%, and thermal conductivity being greater than or equal to 390 W/mk.
- the liquid immersion cooler of the disclosure may be applied to any electronic element 8 .
- the electronic element 8 includes a circuit board 81 and an electronic heat source 82 disposed on the circuit board 81 .
- the metal case covers on the electronic heat source 82 , each side plate 12 abuts against the circuit board 81 , and a top surface of the electronic heat source 82 abuts against the heated surface 111 or a heat conduction medium (not shown in figures) is filled between the electronic heat source 82 and the heated surface 111 .
- the abovementioned structure When using, the abovementioned structure is placed in a liquid container (not shown in figures).
- the liquid in the liquid container is non-conductive liquid with a low boiling point.
- the waste heat from the working electronic heat source 82 is directly conducted to the cooling surface 112 , the heat conduction layer 30 and the porous structure 40 through the heated surface 111 , the waste heat is rapidly dissipated by the non-conductive liquid flowing through the heat conduction layer 30 and the pores 42 of each mesh unit 41 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.
Description
The disclosure relates to a cooler, particularly to a liquid immersion cooler.
With the flourishing development and applications of the network technology, users have higher and higher requirements for the booting speed of computers, the reading speed of software and the playing speed of pictures and videos. Effectively saving time is one of the conditions for a customer to select a product.
With the increase of the performance and the reading speed, heat and temperature from electronic elements also continuously rise. High temperature not only makes aging of most components speed up, but also makes the reading and writing speed of an electronic element such as a hard disk drive slow down. Thus, how to keep the working temperature is an issue of the disclosure.
A cooler used for the electronic element includes a heat conduction plate and multiple fins on the heat conduction plate. The cooling effect can be implemented by the thermal contact between the heat conduction plate and the electronic element and air as a heat conduction medium. However, the thermal conductivity of air is too low to have good efficiency of heat conduction. Although there is a liquid immersion cooler in the market, the heat to be dissipated is limited by its structure, so current using demands cannot be satisfied.
In view of this, the inventors have devoted themselves to the above-mentioned related art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems. Finally, the invention which is reasonable and effective to overcome the above drawbacks is provided.
An object of the disclosure is to provide a liquid immersion cooler, which may rapidly dissipate the waste heat from an electronic heat source.
To accomplish the above object, the disclosure provides a liquid immersion cooler, which includes a metal case, a soldering layer, a heat conduction layer and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer.
The disclosure further has the following functions. By the arrangement of the heat conduction layer, pores of the porous structure may not be jammed by soldering material in the manufacturing process. By the pores being limited in a specific range, there is much more cooling surface area in the same unit area, and the liquid may easily penetrate in or out to flow.
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
Please refer to FIGS. 1-3 . The disclosure provides a liquid immersion cooler, which includes a metal case 10, a soldering layer 20, a heat conduction layer 30 and a porous structure 40.
The metal case 10 is made of copper, aluminum, magnesium, or an alloy thereof and includes a substrate 11 and multiple side plates 12 downward extended from a periphery of the substrate 11. A lower surface of the substrate 11 has a heated surface 111. An upper surface of the substrate 11 has a cooling surface 112 which is formed on the back of the heated surface 111.
The soldering layer 20 is laid on the cooling surface 112. In an embodiment, the soldering layer 20 may be solder paste such as Sn42Bi58, which has a melting temperature of about 138° C., a thickness of less than or equal to about 0.05 millimeters (mm), and a thermal conductivity of 19 W/mk.
The heat conduction layer 30 is laid on the soldering layer 20. In an embodiment, the heat conduction layer 30 may be C1100 copper foil, which has a thickness of less than or equal to about 0.5 millimeters (mm) and a thermal conductivity of greater than or equal to 390 W/mk.
The porous structure 40 is laid on the heat conduction layer 30. The porous structure 40 may be a woven metal mesh such as a copper mesh with mesh value greater than or equal to 65 (that is, the gap is less than or equal to about 0.2 mm). In some embodiments, a mesh value is between 120 and 300. The woven metal mesh is connected to the heat conduction layer 30 in a diffusion bonding manner.
In some embodiments, the woven metal mesh includes multiple mesh units 41. The mesh units 41 are stacked layer by layer to be laid and assembled on the cooling surface 112. Each woven mesh unit 41 may be made of C1100 copper mesh, with wire diameter being about 0.05 millimeter (mm), thickness being about 0.1 millimeter (mm), porosity being 50%, and thermal conductivity being greater than or equal to 390 W/mk.
Please refer to FIG. 3 . The liquid immersion cooler of the disclosure may be applied to any electronic element 8. The electronic element 8 includes a circuit board 81 and an electronic heat source 82 disposed on the circuit board 81. When assembling, the metal case covers on the electronic heat source 82, each side plate 12 abuts against the circuit board 81, and a top surface of the electronic heat source 82 abuts against the heated surface 111 or a heat conduction medium (not shown in figures) is filled between the electronic heat source 82 and the heated surface 111.
When using, the abovementioned structure is placed in a liquid container (not shown in figures). The liquid in the liquid container is non-conductive liquid with a low boiling point. When the waste heat from the working electronic heat source 82 is directly conducted to the cooling surface 112, the heat conduction layer 30 and the porous structure 40 through the heated surface 111, the waste heat is rapidly dissipated by the non-conductive liquid flowing through the heat conduction layer 30 and the pores 42 of each mesh unit 41.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Claims (8)
1. A liquid immersion cooler comprising:
a metal case, comprising a heated surface and a cooling surface disposed on back of the heated surface;
a soldering layer, laid on the cooling surface;
a heat conduction layer, laid on the soldering layer; and
a porous structure, laid on the heat conduction layer,
wherein the porous structure is a woven metal mesh;
wherein a mesh value of the woven metal mesh is greater than or equal to 65.
2. The liquid immersion cooler of claim 1 , wherein the mesh value of the woven metal mesh is between 120 and 300.
3. The liquid immersion cooler of claim 1 , wherein the woven metal mesh is a copper mesh.
4. A liquid immersion cooler comprising:
a metal case, comprising a heated surface and a cooling surface disposed on back of the heated surface;
a soldering layer, laid on the cooling surface;
a heat conduction layer, laid on the soldering layer; and
a porous structure, laid on the heat conduction layer,
wherein the porous structure is a woven metal mesh;
wherein the woven metal mesh comprises multiple mesh units stacked with each other.
5. A liquid immersion cooler comprising:
a metal case, comprising a heated surface and a cooling surface disposed on back of the heated surface;
a soldering layer, laid on the cooling surface;
a heat conduction layer, laid on the soldering layer; and
a porous structure, laid on the heat conduction layer
wherein the porous structure is a woven metal mesh;
wherein the woven metal mesh is connected to the heat conduction layer in a diffusion bonding manner.
6. The liquid immersion cooler of claim 1 , wherein the soldering layer comprises a solder paste.
7. The liquid immersion cooler of claim 1 , wherein the heat conduction layer comprises a copper foil.
8. The liquid immersion cooler of claim 1 , wherein the metal case comprises a substrate and multiple side plates downward extended from a periphery of the substrate, the heated surface is disposed on a lower surface of the substrate, and the cooling surface is disposed on an upper surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/725,169 US12114464B2 (en) | 2022-04-20 | 2022-04-20 | Liquid immersion cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/725,169 US12114464B2 (en) | 2022-04-20 | 2022-04-20 | Liquid immersion cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20230345666A1 US20230345666A1 (en) | 2023-10-26 |
| US12114464B2 true US12114464B2 (en) | 2024-10-08 |
Family
ID=88415140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US17/725,169 Active 2043-03-09 US12114464B2 (en) | 2022-04-20 | 2022-04-20 | Liquid immersion cooler |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US12114464B2 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM299458U (en) | 2006-04-21 | 2006-10-11 | Taiwan Microloops Corp | Heat spreader with composite micro-structure |
| CN205789937U (en) | 2016-06-01 | 2016-12-07 | 益阳市菲美特新材料有限公司 | A kind of nickel foam copper alloy heat sink |
| JP2018046245A (en) | 2016-09-16 | 2018-03-22 | トヨタ自動車株式会社 | Boiling cooling device |
| US20190246518A1 (en) * | 2016-10-28 | 2019-08-08 | Dawning Information Industry (Beijing) Co., Ltd | Cooling device and manufacturing method therefor |
| US20220007542A1 (en) * | 2020-07-01 | 2022-01-06 | Pusan National University Industry-University Cooperation Foundation | Composite pin fin heat sink with improved heat dissipation performance |
| TWM631419U (en) | 2022-03-25 | 2022-09-01 | 邁萪科技股份有限公司 | Liquid immersion radiator |
| US20230253288A1 (en) * | 2022-02-09 | 2023-08-10 | Intel Corporation | Immersion cooling for integrated circuit devices |
-
2022
- 2022-04-20 US US17/725,169 patent/US12114464B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM299458U (en) | 2006-04-21 | 2006-10-11 | Taiwan Microloops Corp | Heat spreader with composite micro-structure |
| CN205789937U (en) | 2016-06-01 | 2016-12-07 | 益阳市菲美特新材料有限公司 | A kind of nickel foam copper alloy heat sink |
| JP2018046245A (en) | 2016-09-16 | 2018-03-22 | トヨタ自動車株式会社 | Boiling cooling device |
| US20190246518A1 (en) * | 2016-10-28 | 2019-08-08 | Dawning Information Industry (Beijing) Co., Ltd | Cooling device and manufacturing method therefor |
| US20220007542A1 (en) * | 2020-07-01 | 2022-01-06 | Pusan National University Industry-University Cooperation Foundation | Composite pin fin heat sink with improved heat dissipation performance |
| US20230253288A1 (en) * | 2022-02-09 | 2023-08-10 | Intel Corporation | Immersion cooling for integrated circuit devices |
| TWM631419U (en) | 2022-03-25 | 2022-09-01 | 邁萪科技股份有限公司 | Liquid immersion radiator |
Non-Patent Citations (1)
| Title |
|---|
| Office Action dated Dec. 6, 2022 of the corresponding Taiwan patent application No. 111111392. |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230345666A1 (en) | 2023-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10945352B2 (en) | Cooling device and manufacturing method therefor | |
| CN101557697B (en) | Heat dissipation module and heat dissipation system using phase change metal thermal interface foil | |
| US20040017656A1 (en) | Heat sink and package surface design | |
| US20080017975A1 (en) | Capillary underflow integral heat spreader | |
| US7295441B1 (en) | Heat dissipating type printed circuit board and structure thereof for conducting heat with heap pipe | |
| US20230200022A1 (en) | Two-phase immersion type heat dissipation substrate | |
| US12010814B2 (en) | Liquid immersion cooling sheet with improved surface structure | |
| TWM631419U (en) | Liquid immersion radiator | |
| US12114464B2 (en) | Liquid immersion cooler | |
| TWM630294U (en) | Heat sink with improved surface structure for liquid immersion cooling heat source | |
| CN106852082A (en) | A kind of heat abstractor and electronic equipment | |
| CN218072202U (en) | Liquid immersion cooling heat source radiating fin with improved surface structure | |
| CN102244756A (en) | Heat radiation structure for liquid crystal television | |
| CN110868796B (en) | PCB heat dissipation device | |
| CN217904913U (en) | Liquid immersion type radiator | |
| CN209731686U (en) | A kind of circuit board | |
| TWI831163B (en) | Immersed heat sink | |
| CN215834516U (en) | Heat conducting device for electronic element | |
| CN116940046A (en) | Liquid immersion radiator | |
| JPH10145064A (en) | Highly radiative thermal conduction component | |
| CN106922081A (en) | A kind of single-clad board | |
| TW202338288A (en) | Liquid immersion to improve surface structure of heat pad to cool heat source | |
| CN116940047A (en) | Liquid immersion cooling heat sink with improved surface structure | |
| US20050199377A1 (en) | Heat dissipation module with heat pipes | |
| TWI813026B (en) | Two-phase immersion-cooled heat-dissipation substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: TAIWAN MICROLOOPS CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHIU, CHUN-TENG;REEL/FRAME:059654/0302 Effective date: 20220408 |
|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |