US11929454B2 - Light emitting device including electronic components and pin holes - Google Patents

Light emitting device including electronic components and pin holes Download PDF

Info

Publication number
US11929454B2
US11929454B2 US17/345,335 US202117345335A US11929454B2 US 11929454 B2 US11929454 B2 US 11929454B2 US 202117345335 A US202117345335 A US 202117345335A US 11929454 B2 US11929454 B2 US 11929454B2
Authority
US
United States
Prior art keywords
light emitting
emitting device
frame
electronic component
pin hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US17/345,335
Other versions
US20210305467A1 (en
Inventor
Shinya OKURA
Takanobu SOGAI
Koji Oshodani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to US17/345,335 priority Critical patent/US11929454B2/en
Publication of US20210305467A1 publication Critical patent/US20210305467A1/en
Priority to US18/184,752 priority patent/US11935991B2/en
Application granted granted Critical
Publication of US11929454B2 publication Critical patent/US11929454B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/395—Linear regulators
    • H05B45/397—Current mirror circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present disclosure relates to a light emitting device.
  • Light emitting devices are known in which a light emitting element and an electronic component are mounted on a base member. By mounting light emitting elements and electronic components on one base member, a light emitting device can be reduced in size as compared to a case where such components are separately provided, and connected. It is desired to improve the light extraction efficiency of the light emitting device. (See, for example, Japanese Patent Publication No. 2017-139404.)
  • One object of the present disclosure is to provide a light emitting device with improved light extraction efficiency.
  • a light emitting device includes: a base member having a first surface including a first region and a second region; a first frame provided on the base member and surrounding the first region; a light emitting element provided on the base member while being in the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; a second frame provided on the base member and surrounding the second region; an electronic component provided on the base member while being in the second region; and a non-light-transmissive second member provided inward of the second frame and covering the electronic component.
  • a part of the first frame and a part of the second frame are integrated with each other.
  • An upper surface of the first member is positioned higher than an upper surface of the first frame, an upper surface of the second frame, and an upper surface of the second member.
  • the light extraction efficiency of a light emitting device can be improved.
  • FIG. 1 is a perspective view illustrating a light emitting device according to an embodiment.
  • FIG. 2 is a top view illustrating the light emitting device according to the embodiment.
  • FIG. 3 is a top view illustrating the light emitting device according to the embodiment.
  • FIG. 4 is a top view illustrating a base member of the light emitting device according to the embodiment.
  • FIG. 5 is a sectional view taken along line A-A′ in FIG. 2 .
  • FIG. 6 is a sectional view taken along line B-B′ in FIG. 2 .
  • FIG. 7 is a circuit diagram illustrating a circuit configuration of the light emitting device according to the embodiment.
  • FIG. 8 is a top view illustrating a light emitting device according to a modification of the embodiment.
  • FIG. 9 is a top view illustrating the light emitting device according to the modification of the embodiment.
  • FIG. 10 is a sectional view taken along line C-C′ in FIG. 8 .
  • FIG. 1 is a perspective view illustrating a light emitting device according to the embodiment.
  • FIGS. 2 and 3 are top views illustrating the light emitting device according to the embodiment.
  • FIG. 4 is a top view illustrating a base member of the light emitting device according to the embodiment.
  • FIG. 3 is a diagram in which some constituent elements are omitted or seen through to show the internal structure of the light emitting device.
  • a light emitting device 1 includes a base member 10 , at least a light emitting element 20 , at least an electronic component 30 , a first frame 41 , a second frame 42 , a first member 51 and a second member 52 .
  • the base member 10 is an insulating member having a flat plate shape.
  • the base member 10 has a first surface 10 a on which a wiring pattern 14 is formed.
  • the first surface 10 a includes a first region 11 and a second region 12 as shown in FIG. 4 .
  • the first region 11 is a region in which the light emitting elements 20 are mounted
  • the second region 12 is a region in which the electronic components 30 are mounted.
  • the light emitting elements 20 and the electronic components 30 are mounted on the first region 11 and the second region 12 , respectively, and electrically connected to the wiring pattern 14 of the base member 10 .
  • the base member 10 is formed of, for example, a ceramic material such as alumina or aluminum nitride.
  • the base member 10 may be formed using an electrically insulating resin material such as phenol resin, epoxy resin, polyimide resin, BT resin or polyphthalamide.
  • the wiring pattern 14 is formed using an electrically conductive material, such as gold, silver, copper or aluminum.
  • the base member 10 may be configured with a metal member and an insulating member that is provided on a surface of the metal member in a layered structure, and in this case, the wiring pattern 14 is formed on the insulating member.
  • the light emitting element 20 is, for example, a light emitting diode.
  • the specific configuration of the light emitting element 20 may be appropriately determined as long as light having a predetermined wavelength can be emitted.
  • an LED chip housed in a package, or an LED chip alone (i.e., bare chip) may be employed as the light emitting element 20 . It is desirable that the light emitting element 20 is a bare chip being flip-chip-mounted on the base member 10 .
  • the wavelength of light that is emitted from the light emitting element 20 is appropriately set according to a use of the light emitting device 1 .
  • the light emitting element 20 may contain a nitride-based semiconductor (In X Al Y Ga 1-X-Y N, 0 ⁇ X, 0 ⁇ Y, X+Y ⁇ 1), and emit blue light.
  • a plurality of light emitting elements 20 may be provided on the first region 11 .
  • a plurality of light emitting elements 20 a to 20 c is connected in series as shown in FIG. 3 .
  • the electronic component 30 is, for example, a thermistor, a transistor, a rectifying diode or the like.
  • a semiconductor chip housed in a package, or a semiconductor chip alone (i.e., bare chip) may be employed as the electronic component 30 .
  • a plurality of electronic components 30 may be provided on the second region 12 .
  • a plurality of electronic components 30 a to 30 g are electrically connected to the wiring pattern 14 of the base member 10 directly or through a bonding wire W.
  • a plurality of electronic components 30 a to 30 g may be bare chips that respectively are a thermistor, a transistor and a rectifying diode.
  • a portion of the electronic component 30 may be covered with the second frame 42 .
  • the first frame 41 and the second frame 42 are provided on the base member 10 .
  • the first frame 41 surrounds the first region 11
  • the second frame 42 surrounds the second region 12 . That is, the light emitting elements 20 provided on the first region 11 are surrounded by the first frame 41 .
  • the electronic components 30 provided on the second region 12 are surrounded by the second frame 42 .
  • the first frame 41 and the second frame 42 are non-light-transmissive.
  • a part of the frame 41 and a part of the second frame 42 are integrated with each other as shown in FIG. 2 . That is, the first frame 41 and the second frame 42 share a part of each other.
  • the first member 51 is provided inside the first frame 41 , and covers or encapsulates a plurality of light emitting elements 20 .
  • An upper surface of the first member 51 is positioned higher than an upper surface of the first frame and an upper surface of the second frame, and constitutes a light emitting surface of the light emitting device 1 .
  • the first member 51 has light-transmissivity so as to transmit light emitted from the light emitting element 20 .
  • the second member 52 is provided inward of the second frame 42 , and covers or encapsulates a plurality of electronic components 30 and the bonding wires.
  • the second member 52 is non-light-transmissive.
  • the first frame 41 , the second frame 42 , the first member 51 and the second member 52 contain, for example, a resin.
  • a resin phenyl silicone resin, dimethyl silicone resin or the like can be used.
  • the specific compositions of the first frame 41 , the second frame 42 , the first member 51 and the second member 52 may be the same or different.
  • a pigment may be added to impart non-light-transmissivity.
  • a white pigment or the like may be added to the resin for enhancing the reflectivity.
  • titanium oxide or alumina may be used as the white pigment.
  • the first member 51 may contain a fluorescent material.
  • the fluorescent material is excited by light emitted by the light emitting element 20 , and emits light having a wavelength different from the wavelength of light emitted by the light emitting element 20 .
  • a fluorescent material a YAG-based fluorescent material, a ⁇ -SiAlON-based fluorescent material, a KSF-based fluorescent material or the like can be used.
  • the light emitting element 20 emits blue light
  • the first member 51 contains a YAG fluorescent material that emits yellow light. In this case, white light is emitted from the upper surface (i.e., light emitting surface) of the first member 51 .
  • the light emitting element 20 emits blue light
  • the first member 51 contains a nitride fluorescent material that emits red light, and a YAG fluorescent material that emits yellow light.
  • light having a color such as red or amber is emitted from the light emitting surface.
  • FIG. 5 is a sectional view taken along line A-A′ in FIG. 2 .
  • FIG. 6 is a sectional view taken along line B-B′ in FIG. 2 .
  • an upper surface 51 a of the first member 51 is positioned higher than an upper surface 41 a of the first frame 41 , an upper surface 42 a of the second frame 42 , and an upper surface 52 a of the second member 52 .
  • the upper surface 52 a of the second member 52 may be flush with the upper surface 41 a of the first frame 41 and the upper surface 42 a of the second frame 42 , or may be positioned lower than these upper surfaces as shown in FIGS. 5 and 6 .
  • the light emitting device 1 is produced by, for example, the following method.
  • the light emitting elements 20 and the electronic components 30 are mounted on the base member 10 provided with the wiring pattern 14 . Subsequently, an uncured resin material is disposed on the base member 10 in such a manner as to surround the light emitting elements 20 and the electronic components 30 , and cured to form the first frame 41 and the second frame 42 .
  • the first frame 41 and the second frame 42 are formed by, for example, setting a needle of a resin discharging apparatus above the base member 10 , and moving the needle while discharging the uncured resin material from the tip of the needle onto the base member 10 .
  • the uncured resin material discharged from the needle is wetted and spread on the base member 10 to form the first frame 41 and the second frame 42 , which have a substantially semicircular shape in a sectional view.
  • a light-transmissive resin material to be the first member 51 is poured inside the first frame 41
  • a non-light-transmissive resin material to be the second member 52 is poured inside the second frame 42 .
  • These resins are cured to form the first member 51 and the second member 52 , so that the light emitting element 20 and the electronic component 30 are encapsulated.
  • the first member 51 may be formed before or after forming the second member 52 .
  • the upper surface 51 a of the first member 51 that covers the light emitting element 20 is positioned higher than the upper surface 41 a of the first frame 41 , the upper surface 42 a of the second frame 42 and the upper surface 52 a of the second member 52 as shown in FIGS. 5 and 6 .
  • Light emitted from the light emitting element 20 is extracted from the upper surface 51 a of the first member 51 .
  • the upper surface 51 a is positioned higher than the upper surfaces 41 a , 42 a and 52 a of other members, thus the extracted light is less likely to be reflected or absorbed by other members.
  • the light extraction efficiency of the light emitting device 1 can be improved.
  • the area of the second region 12 on which the electronic component 30 be larger than the area of the first region 11 on which the light emitting element 20 is mounted. This is because the second region 12 having a larger area than the area of the first region 11 can allow a larger number of electronic components 30 to be mounted on the second region 12 .
  • the second region 12 having a large area, a plurality of electronic components 30 can be mounted on a plane surface without overlapping the electronic components 30 on one another even if the light emitting device 1 includes a large number of electronic components 30 .
  • the upper surface 52 a of the second member 52 covering the electronic component 30 can be at a lower position. Locating the upper surface 52 a at the lower position can make the upper surface 51 a of the first member 51 to be at a lower position necessary to satisfy the above-described relationship. As a result, the height of the light emitting device 1 can be reduced, so that the light emitting device 1 can be reduced in size.
  • first frame 41 and the second frame 42 it is desirable that a part of the first frame 41 and a part of the second frame 42 be integrated with each other as shown in FIG. 2 .
  • the area occupied by the first frame 41 and the second frame 42 can be reduced on the base member 10 , so that the light emitting device 1 can be reduced in size.
  • the electronic components 30 and the base member 10 (substantially the wiring pattern 14 ) be electrically connected to each other using a bonding wires W.
  • the flexibility of arrangement of the electronic component 30 can be improved, so that the electronic component 30 can be efficiently arranged on the second region 12 .
  • the upper surface 52 a of the second member 52 be positioned lower than the upper surface 41 a of the first frame 41 and the upper surface 42 a of the second frame 42 .
  • the volume per unit area of the second member 52 inside the second frame 42 can be decreased.
  • the temperature of the light emitting device 1 increases or decreases, the temperature of the second member 52 is changed, and at this time, the volume of the second member 52 is changed according to the temperature change. Decrease in the volume of the second member 52 can decrease the amount change of the volume of the second member 52 due to a temperature change, so that stress applied to the electronic component 30 can be reduced. As a result, damage to the electronic component 30 and occurrence of connection failure can be attenuated, to thereby improve the reliability of the light emitting device 1 .
  • the second member 52 when the bonding wire W is used, it is desirable that the second member 52 have a small volume. Decrease in the volume change of the second member 52 due to a temperature change can reduce the possibility of breakage occurrence of the bonding wire W, thus the reliability of the light emitting device 1 can further be improved.
  • the light emitting element 20 is flip-chip-mounted on the base member 10 .
  • electrodes of the light emitting elements 20 and conductive wiring on the base member are electrically connected to each other using a paste-like bonding member having electrical conductivity, such as solder, a thin film-like or bump-like bonding member, or the like.
  • the electronic component 30 be a bare chip of one of a thermistor, a transistor and a diode.
  • Using a bare chip can reduce the proportion of the area that the electronic component 30 occupies on the base member 10 , as compared to a case in which a packaged component is used.
  • using a bare chip can allow the second member 52 to easily embed the electronic components, so that the light emitting device 1 can be reduced in size.
  • the second frame 42 has a plurality of corner portions C.
  • the second frame 42 has a polygonal shape constituted by a plurality of straight-line portions and curved line portions in a top view. It is desirable that the interior angle of the corner portion C be 90 degrees or more as shown in FIGS. 2 and 3 .
  • the second member 52 is formed by pouring an uncured resin material inward of the second frame 42 , and curing the resin material. At this time, in the case where the interior angle of the corner portion C is less than 90 degrees, the uncured resin material easily runs onto the second frame 42 at the corner portion C. That is, there is a possibility that the upper surface 52 a of the second member 52 is positioned higher than other portions at the corner portion C. When the position of the upper surface 52 a partially rises, the upper surface 51 a is required to be higher than the rising part of the upper surface 52 a , resulting in increase of size of the light emitting device 1 .
  • the interior angle of the corner portion C is 90 degrees or more, the resin material is easily drawn off at the corner portion C, so that rising of the position of the upper surface 52 a at the corner portion C can be suppressed. As a result, rising of the position of the upper surface 51 a is also suppressed, so that the light emitting device 1 can be reduced in size.
  • the shape of the first frame 41 be a polygonal shape with four or more sides, or a substantially elliptical shape. Accordingly, the resin material is easily sunk in formation of the first member 51 , thereby attenuating rise of the upper surface 51 a of the first member 51 , so that the light emitting device 1 can be reduced in size.
  • the tips of corner portions of the polygonal shape may have a rounded shape due to spreading of the resin material discharged onto the base member.
  • printed resistors 15 a to 15 c , a protective glass 16 , a protective resin 17 , an electronic component 18 a , an electronic component 18 b and the like are further provided on the base member 10 .
  • the printed resistors 15 a to 15 c are printed on the first surface 10 a of the base member 10 , and connected between predetermined portions of the wiring pattern 14 .
  • the protective glass 16 covers a part of the wiring pattern 14 and the printed resistors 15 a to 15 c .
  • the protective resin 17 is provided on the protective glass 16 in such a manner as to overlap the printed resistors 15 a to 15 c.
  • the base member 10 is provided with pin holes 19 a and 19 b .
  • an external plug i.e., terminal
  • the electronic components 18 a and 18 b are electrically connected to the wiring pattern 14 , and connected between a terminal on the pin hole 19 a side and a terminal on the pin hole 19 b side.
  • the first frame 41 is disposed at substantially the center of the base member 10 , and the pin holes 19 a and 19 b are positioned in the vicinity of the outer edge of the base member.
  • the second frame is disposed along an outer edge opposite to the outer edge positioned close to the pin holes 19 a and 19 b .
  • Such configuration is preferable because the pin holes 19 a and 19 b which are electrical connection portions to the outside can be disposed separately from the electronic components, and therefore, for example, when a heat sink is disposed directly under the electronic component, the heat sink is easily separated from the external connection terminals.
  • FIG. 7 is a circuit diagram illustrating a circuit configuration of the light emitting device according to the embodiment.
  • the light emitting device 1 has a circuit configuration as shown in, for example, FIG. 7 .
  • three light emitting elements 20 a to 20 c two printed resistors 15 a to 15 c , one protective element 18 a , one capacitor 18 b , one rectifying diode 30 a , three transistors 30 b to 30 d and three thermistors 30 e to 30 g are provided.
  • one rectifying diode 30 a , three transistors 30 b to 30 d and three thermistors 30 e to 30 g are disposed as electronic components in the second frame 42 .
  • a positive electrode terminal is inserted into the pin hole 19 a
  • a negative electrode terminal is inserted into the pin hole 19 b .
  • the positive electrode terminal is connected to the rectifying diode 30 a .
  • the light emitting elements 20 a to 20 c are connected to the printed resistor 15 a in parallel.
  • the negative electrode side of the light emitting elements 20 a to 20 c are connected to collectors of two transistors 30 b and 30 c .
  • the transistors 30 b and 30 c are connected in parallel.
  • the negative electrode side of the printed resistor 15 a is connected to bases of the transistors 30 b and 30 c .
  • the negative electrode side of the printed resistor 15 a is also connected to a collector of the transistor 30 d .
  • Emitters of the transistors 30 b and 30 c are connected to a base of the transistor 30 d .
  • the printed resistors 15 b and 15 c and the thermistors 30 e to 30 g are connected in parallel between the emitters of the transistors 30 b and 30 c and an emitter of the transistor 30 d .
  • the emitter of the transistor 30 d is connected to the negative electrode terminal.
  • Value of current passing through the light emitting device 1 is determined by voltage between the base and the emitter (i.e., base-emitter voltages V BE ) of the transistors 30 b to 30 d , electric resistances of the printed resistors 15 b and 15 c , and electric resistances of the thermistors 30 e to 30 g .
  • V BE base-emitter voltages
  • the temperatures of the transistors 30 b and 30 c are elevated, and the voltage V BE decreases.
  • the thermistors 30 e to 30 g have inverse characteristics so as to compensate for a change of the voltage V BE due to a temperature change.
  • the electronic component 18 a and the electronic component 18 b are further connected in parallel between the negative electrode side of the rectifying diode and the negative electrode terminal.
  • the electronic component 18 a is a Zener diode. In case of generation of a temporarily large voltage (i.e., surge) in the circuit, a current passes through the Zener diode, so that other electronic components can be protected from breakage.
  • the electronic component 18 b is a capacitor. Provision of the capacitor can attenuate passage of current noise components through the light emitting elements 20 a to 20 c.
  • the light emitting device 1 having the above-mentioned circuit configuration is used for, for example, lighting in direction indicators of vehicles, DRL (i.e., daytime running lamps) and the like.
  • the circuit configuration shown in FIG. 7 is a merely example.
  • the light emitting device 1 may have another circuit configuration.
  • the circuit configuration of the light emitting device 1 can be appropriately changed according to a use application and the like of the light emitting device 1 .
  • FIGS. 8 and 9 are top views illustrating a light emitting device according to a modification of the embodiment.
  • FIG. 9 is a diagram in which some constituent elements are omitted or seen through to show the internal structure of the light emitting device.
  • the light emitting device 2 shown in FIGS. 8 and 9 further includes a third member 53 covering lateral surfaces of a first member 51 .
  • the first member 51 and the third member 53 are provided on a base member 10 in a first region 11 .
  • the first member 51 is surrounded by the third member 53 , and covers a plurality of light emitting elements 20 . That is, the first member 51 is provided on the light emitting element 20 while being inward of a first frame 41 , and the third member 53 is packed in other portions.
  • the first member 51 is light-transmissive, and the third member 53 is non-light-transmissive.
  • the first member 51 has a plate shape, and is, for example, a glass plate.
  • the glass plate may contain a fluorescent material, and/or may be colored. Alternatively, a material containing a fluorescent material may be formed on a surface of the glass plate by printing or the like.
  • the first member 51 may be a sintered body of a fluorescent material, a resin, a ceramic, or other inorganic substance, which contain a fluorescent material.
  • the third member 53 contains, for example, a resin.
  • the third member 53 may contain a white pigment in the same manner as the second member 52 .
  • Providing the first member 51 and the third member 53 in the first region 11 can define a light emitting surface (i.e. an upper surface of the first member 51 ) in a predetermined region, so that a range of light emission by the light emitting device 2 can be limited.
  • the shape of a first frame 41 in a top view is a polygonal shape with six or more sides (an octagonal shape in this example).
  • the shape of the first frame 41 in a top view may be a circular shape as shown in FIGS. 1 to 3 .
  • FIG. 10 is a sectional view taken along line C-C′ in FIG. 8 .
  • the upper surface 51 a of the first member 51 is positioned higher than an upper surface 41 a of the first frame 41 , an upper surface 42 a of a second frame 42 , and an upper surface 52 a of the second member 52 as shown in FIG. 10 .
  • the upper surface 51 a is positioned higher than the upper surface 53 a of the third member 53 . This can improve light extraction efficiency of the light emitting device 2 as in the light emitting device 1 . In this way, the specific configuration of the light emitting device can be appropriately changed as long as the upper surface 51 a of the first member 51 and the upper surfaces of other members satisfy the above-described positional relationship.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Devices (AREA)

Abstract

A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame provided on the base member and surrounding the first region; a light emitting element provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; an electronic component provided on the base member in the second region and electrically connected with the light emitting element; and a plurality of pin holes arrayed in a first direction and electrically connected with the electronic component, the first direction being orthogonal to a thickness direction of the base member. The electronic component is provided on a side opposite the plurality of pin holes with respect to the light emitting element in a second direction that is orthogonal to the thickness direction and the first direction.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of U.S. patent application Ser. No. 16/517,109, filed on Jul. 19, 2019, which claims priority to Japanese Patent Application No. 2018-136824, filed on Jul. 20, 2018, the disclosures of which are hereby incorporated by reference in their entireties.
BACKGROUND
The present disclosure relates to a light emitting device.
Light emitting devices are known in which a light emitting element and an electronic component are mounted on a base member. By mounting light emitting elements and electronic components on one base member, a light emitting device can be reduced in size as compared to a case where such components are separately provided, and connected. It is desired to improve the light extraction efficiency of the light emitting device. (See, for example, Japanese Patent Publication No. 2017-139404.)
SUMMARY
One object of the present disclosure is to provide a light emitting device with improved light extraction efficiency.
A light emitting device according to one aspect of the present disclosure includes: a base member having a first surface including a first region and a second region; a first frame provided on the base member and surrounding the first region; a light emitting element provided on the base member while being in the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; a second frame provided on the base member and surrounding the second region; an electronic component provided on the base member while being in the second region; and a non-light-transmissive second member provided inward of the second frame and covering the electronic component. A part of the first frame and a part of the second frame are integrated with each other. An upper surface of the first member is positioned higher than an upper surface of the first frame, an upper surface of the second frame, and an upper surface of the second member.
According to certain embodiments of the present disclosure, the light extraction efficiency of a light emitting device can be improved.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view illustrating a light emitting device according to an embodiment.
FIG. 2 is a top view illustrating the light emitting device according to the embodiment.
FIG. 3 is a top view illustrating the light emitting device according to the embodiment.
FIG. 4 is a top view illustrating a base member of the light emitting device according to the embodiment.
FIG. 5 is a sectional view taken along line A-A′ in FIG. 2 .
FIG. 6 is a sectional view taken along line B-B′ in FIG. 2 .
FIG. 7 is a circuit diagram illustrating a circuit configuration of the light emitting device according to the embodiment.
FIG. 8 is a top view illustrating a light emitting device according to a modification of the embodiment.
FIG. 9 is a top view illustrating the light emitting device according to the modification of the embodiment.
FIG. 10 is a sectional view taken along line C-C′ in FIG. 8 .
 DETAILED DESCRIPTION
Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same reference numerals are assigned to the same constituent elements, and repeated descriptions thereof are omitted as appropriate.
FIG. 1 is a perspective view illustrating a light emitting device according to the embodiment.
FIGS. 2 and 3 are top views illustrating the light emitting device according to the embodiment.
FIG. 4 is a top view illustrating a base member of the light emitting device according to the embodiment.
FIG. 3 is a diagram in which some constituent elements are omitted or seen through to show the internal structure of the light emitting device.
As shown in FIGS. 1 to 3 , for example, a light emitting device 1 according to one embodiment includes a base member 10, at least a light emitting element 20, at least an electronic component 30, a first frame 41, a second frame 42, a first member 51 and a second member 52.
The base member 10 is an insulating member having a flat plate shape. The base member 10 has a first surface 10 a on which a wiring pattern 14 is formed. The first surface 10 a includes a first region 11 and a second region 12 as shown in FIG. 4 . The first region 11 is a region in which the light emitting elements 20 are mounted, and the second region 12 is a region in which the electronic components 30 are mounted. As shown in FIGS. 2 and 3 , the light emitting elements 20 and the electronic components 30 are mounted on the first region 11 and the second region 12, respectively, and electrically connected to the wiring pattern 14 of the base member 10.
The base member 10 is formed of, for example, a ceramic material such as alumina or aluminum nitride. The base member 10 may be formed using an electrically insulating resin material such as phenol resin, epoxy resin, polyimide resin, BT resin or polyphthalamide. The wiring pattern 14 is formed using an electrically conductive material, such as gold, silver, copper or aluminum. The base member 10 may be configured with a metal member and an insulating member that is provided on a surface of the metal member in a layered structure, and in this case, the wiring pattern 14 is formed on the insulating member.
The light emitting element 20 is, for example, a light emitting diode. The specific configuration of the light emitting element 20 may be appropriately determined as long as light having a predetermined wavelength can be emitted. For example, an LED chip housed in a package, or an LED chip alone (i.e., bare chip) may be employed as the light emitting element 20. It is desirable that the light emitting element 20 is a bare chip being flip-chip-mounted on the base member 10.
The wavelength of light that is emitted from the light emitting element 20 is appropriately set according to a use of the light emitting device 1. For example, the light emitting element 20 may contain a nitride-based semiconductor (InXAlYGa1-X-YN, 0≤X, 0≤Y, X+Y≤1), and emit blue light. A plurality of light emitting elements 20 may be provided on the first region 11. In the light emitting device 1, a plurality of light emitting elements 20 a to 20 c is connected in series as shown in FIG. 3 .
The electronic component 30 is, for example, a thermistor, a transistor, a rectifying diode or the like. For example, a semiconductor chip housed in a package, or a semiconductor chip alone (i.e., bare chip) may be employed as the electronic component 30. A plurality of electronic components 30 may be provided on the second region 12. As shown in FIG. 3 , for example, a plurality of electronic components 30 a to 30 g are electrically connected to the wiring pattern 14 of the base member 10 directly or through a bonding wire W. For example, a plurality of electronic components 30 a to 30 g may be bare chips that respectively are a thermistor, a transistor and a rectifying diode. As shown in FIG. 3 , a portion of the electronic component 30 may be covered with the second frame 42.
The first frame 41 and the second frame 42 are provided on the base member 10. The first frame 41 surrounds the first region 11, and the second frame 42 surrounds the second region 12. That is, the light emitting elements 20 provided on the first region 11 are surrounded by the first frame 41. The electronic components 30 provided on the second region 12 are surrounded by the second frame 42. The first frame 41 and the second frame 42 are non-light-transmissive. In the first light emitting device 1, a part of the frame 41 and a part of the second frame 42 are integrated with each other as shown in FIG. 2 . That is, the first frame 41 and the second frame 42 share a part of each other.
The first member 51 is provided inside the first frame 41, and covers or encapsulates a plurality of light emitting elements 20. An upper surface of the first member 51 is positioned higher than an upper surface of the first frame and an upper surface of the second frame, and constitutes a light emitting surface of the light emitting device 1. The first member 51 has light-transmissivity so as to transmit light emitted from the light emitting element 20. The second member 52 is provided inward of the second frame 42, and covers or encapsulates a plurality of electronic components 30 and the bonding wires. The second member 52 is non-light-transmissive.
The first frame 41, the second frame 42, the first member 51 and the second member 52 contain, for example, a resin. As the resin, phenyl silicone resin, dimethyl silicone resin or the like can be used. The specific compositions of the first frame 41, the second frame 42, the first member 51 and the second member 52 may be the same or different.
In the first frame 41, the second frame 42, and the second member 52, a pigment may be added to impart non-light-transmissivity. For example, in the first frame 41, the second frame 42, and the second member 52, a white pigment or the like may be added to the resin for enhancing the reflectivity. As the white pigment, titanium oxide or alumina may be used.
The first member 51 may contain a fluorescent material. The fluorescent material is excited by light emitted by the light emitting element 20, and emits light having a wavelength different from the wavelength of light emitted by the light emitting element 20. As the fluorescent material, a YAG-based fluorescent material, a β-SiAlON-based fluorescent material, a KSF-based fluorescent material or the like can be used. As one example, the light emitting element 20 emits blue light, and the first member 51 contains a YAG fluorescent material that emits yellow light. In this case, white light is emitted from the upper surface (i.e., light emitting surface) of the first member 51. As another example, the light emitting element 20 emits blue light, and the first member 51 contains a nitride fluorescent material that emits red light, and a YAG fluorescent material that emits yellow light. In this case, light having a color such as red or amber is emitted from the light emitting surface.
FIG. 5 is a sectional view taken along line A-A′ in FIG. 2 .
FIG. 6 is a sectional view taken along line B-B′ in FIG. 2 .
As shown in FIGS. 5 and 6 , an upper surface 51 a of the first member 51 is positioned higher than an upper surface 41 a of the first frame 41, an upper surface 42 a of the second frame 42, and an upper surface 52 a of the second member 52. The upper surface 52 a of the second member 52 may be flush with the upper surface 41 a of the first frame 41 and the upper surface 42 a of the second frame 42, or may be positioned lower than these upper surfaces as shown in FIGS. 5 and 6 .
The light emitting device 1 is produced by, for example, the following method.
The light emitting elements 20 and the electronic components 30 are mounted on the base member 10 provided with the wiring pattern 14. Subsequently, an uncured resin material is disposed on the base member 10 in such a manner as to surround the light emitting elements 20 and the electronic components 30, and cured to form the first frame 41 and the second frame 42. Specifically, the first frame 41 and the second frame 42 are formed by, for example, setting a needle of a resin discharging apparatus above the base member 10, and moving the needle while discharging the uncured resin material from the tip of the needle onto the base member 10. The uncured resin material discharged from the needle is wetted and spread on the base member 10 to form the first frame 41 and the second frame 42, which have a substantially semicircular shape in a sectional view.
Subsequently, a light-transmissive resin material to be the first member 51 is poured inside the first frame 41, and a non-light-transmissive resin material to be the second member 52 is poured inside the second frame 42. These resins are cured to form the first member 51 and the second member 52, so that the light emitting element 20 and the electronic component 30 are encapsulated. The first member 51 may be formed before or after forming the second member 52.
Effects of the embodiments will next be described.
In the light emitting device 1 according to one embodiment, the upper surface 51 a of the first member 51 that covers the light emitting element 20 is positioned higher than the upper surface 41 a of the first frame 41, the upper surface 42 a of the second frame 42 and the upper surface 52 a of the second member 52 as shown in FIGS. 5 and 6 . Light emitted from the light emitting element 20 is extracted from the upper surface 51 a of the first member 51. The upper surface 51 a is positioned higher than the upper surfaces 41 a, 42 a and 52 a of other members, thus the extracted light is less likely to be reflected or absorbed by other members. As a result, light emitted from the light emitting element 20 can be efficiently extracted outside. That is, according to this embodiment, the light extraction efficiency of the light emitting device 1 can be improved.
In the light emitting device 1, it is desirable that the area of the second region 12 on which the electronic component 30 be larger than the area of the first region 11 on which the light emitting element 20 is mounted. This is because the second region 12 having a larger area than the area of the first region 11 can allow a larger number of electronic components 30 to be mounted on the second region 12.
With the second region 12 having a large area, a plurality of electronic components 30 can be mounted on a plane surface without overlapping the electronic components 30 on one another even if the light emitting device 1 includes a large number of electronic components 30. Accordingly, the upper surface 52 a of the second member 52 covering the electronic component 30 can be at a lower position. Locating the upper surface 52 a at the lower position can make the upper surface 51 a of the first member 51 to be at a lower position necessary to satisfy the above-described relationship. As a result, the height of the light emitting device 1 can be reduced, so that the light emitting device 1 can be reduced in size.
Regarding the first frame 41 and the second frame 42, it is desirable that a part of the first frame 41 and a part of the second frame 42 be integrated with each other as shown in FIG. 2 . With this configuration, the area occupied by the first frame 41 and the second frame 42 can be reduced on the base member 10, so that the light emitting device 1 can be reduced in size.
It is desirable that the electronic components 30 and the base member 10 (substantially the wiring pattern 14) be electrically connected to each other using a bonding wires W. By connecting the electronic components 30 and the wiring pattern 14 to each other with the bonding wires W, the flexibility of arrangement of the electronic component 30 can be improved, so that the electronic component 30 can be efficiently arranged on the second region 12.
It is desirable that the upper surface 52 a of the second member 52 be positioned lower than the upper surface 41 a of the first frame 41 and the upper surface 42 a of the second frame 42. With this configuration, the volume per unit area of the second member 52 inside the second frame 42 can be decreased. When the temperature of the light emitting device 1 increases or decreases, the temperature of the second member 52 is changed, and at this time, the volume of the second member 52 is changed according to the temperature change. Decrease in the volume of the second member 52 can decrease the amount change of the volume of the second member 52 due to a temperature change, so that stress applied to the electronic component 30 can be reduced. As a result, damage to the electronic component 30 and occurrence of connection failure can be attenuated, to thereby improve the reliability of the light emitting device 1.
In particular, when the bonding wire W is used, it is desirable that the second member 52 have a small volume. Decrease in the volume change of the second member 52 due to a temperature change can reduce the possibility of breakage occurrence of the bonding wire W, thus the reliability of the light emitting device 1 can further be improved.
Preferably, the light emitting element 20 is flip-chip-mounted on the base member 10. With flip-chip-mounting, electrodes of the light emitting elements 20 and conductive wiring on the base member are electrically connected to each other using a paste-like bonding member having electrical conductivity, such as solder, a thin film-like or bump-like bonding member, or the like.
It is desirable that the electronic component 30 be a bare chip of one of a thermistor, a transistor and a diode. Using a bare chip can reduce the proportion of the area that the electronic component 30 occupies on the base member 10, as compared to a case in which a packaged component is used. In addition, using a bare chip can allow the second member 52 to easily embed the electronic components, so that the light emitting device 1 can be reduced in size.
In addition, the second frame 42 has a plurality of corner portions C. In other words, the second frame 42 has a polygonal shape constituted by a plurality of straight-line portions and curved line portions in a top view. It is desirable that the interior angle of the corner portion C be 90 degrees or more as shown in FIGS. 2 and 3 .
As described above, the second member 52 is formed by pouring an uncured resin material inward of the second frame 42, and curing the resin material. At this time, in the case where the interior angle of the corner portion C is less than 90 degrees, the uncured resin material easily runs onto the second frame 42 at the corner portion C. That is, there is a possibility that the upper surface 52 a of the second member 52 is positioned higher than other portions at the corner portion C. When the position of the upper surface 52 a partially rises, the upper surface 51 a is required to be higher than the rising part of the upper surface 52 a, resulting in increase of size of the light emitting device 1.
When the interior angle of the corner portion C is 90 degrees or more, the resin material is easily drawn off at the corner portion C, so that rising of the position of the upper surface 52 a at the corner portion C can be suppressed. As a result, rising of the position of the upper surface 51 a is also suppressed, so that the light emitting device 1 can be reduced in size.
Similarly, it is desirable that the shape of the first frame 41 be a polygonal shape with four or more sides, or a substantially elliptical shape. Accordingly, the resin material is easily sunk in formation of the first member 51, thereby attenuating rise of the upper surface 51 a of the first member 51, so that the light emitting device 1 can be reduced in size.
When at least one of the first frame 41 and the second frame 42 has a polygonal shape, the tips of corner portions of the polygonal shape may have a rounded shape due to spreading of the resin material discharged onto the base member.
As shown in FIGS. 1 to 3 , printed resistors 15 a to 15 c, a protective glass 16, a protective resin 17, an electronic component 18 a, an electronic component 18 b and the like are further provided on the base member 10. As shown in FIG. 3 , the printed resistors 15 a to 15 c are printed on the first surface 10 a of the base member 10, and connected between predetermined portions of the wiring pattern 14. As shown in FIG. 2 , the protective glass 16 covers a part of the wiring pattern 14 and the printed resistors 15 a to 15 c. The protective resin 17 is provided on the protective glass 16 in such a manner as to overlap the printed resistors 15 a to 15 c.
The base member 10 is provided with pin holes 19 a and 19 b. At the time of mounting the light emitting device 1 in a socket or the like, an external plug (i.e., terminal) passes through each of the pin holes 19 a and 19 b to establish electrical connection to the wiring pattern 14. The electronic components 18 a and 18 b are electrically connected to the wiring pattern 14, and connected between a terminal on the pin hole 19 a side and a terminal on the pin hole 19 b side.
At this time, the first frame 41 is disposed at substantially the center of the base member 10, and the pin holes 19 a and 19 b are positioned in the vicinity of the outer edge of the base member. The second frame is disposed along an outer edge opposite to the outer edge positioned close to the pin holes 19 a and 19 b. Such configuration is preferable because the pin holes 19 a and 19 b which are electrical connection portions to the outside can be disposed separately from the electronic components, and therefore, for example, when a heat sink is disposed directly under the electronic component, the heat sink is easily separated from the external connection terminals.
FIG. 7 is a circuit diagram illustrating a circuit configuration of the light emitting device according to the embodiment.
The light emitting device 1 has a circuit configuration as shown in, for example, FIG. 7 . In the example shown in FIG. 7 , three light emitting elements 20 a to 20 c, two printed resistors 15 a to 15 c, one protective element 18 a, one capacitor 18 b, one rectifying diode 30 a, three transistors 30 b to 30 d and three thermistors 30 e to 30 g are provided.
In the light emitting device according to this embodiment, one rectifying diode 30 a, three transistors 30 b to 30 d and three thermistors 30 e to 30 g are disposed as electronic components in the second frame 42.
For example, a positive electrode terminal is inserted into the pin hole 19 a, and a negative electrode terminal is inserted into the pin hole 19 b. The positive electrode terminal is connected to the rectifying diode 30 a. On the negative electrode side of the rectifying diode, the light emitting elements 20 a to 20 c are connected to the printed resistor 15 a in parallel. The negative electrode side of the light emitting elements 20 a to 20 c are connected to collectors of two transistors 30 b and 30 c. The transistors 30 b and 30 c are connected in parallel.
The negative electrode side of the printed resistor 15 a is connected to bases of the transistors 30 b and 30 c. The negative electrode side of the printed resistor 15 a is also connected to a collector of the transistor 30 d. Emitters of the transistors 30 b and 30 c are connected to a base of the transistor 30 d. The printed resistors 15 b and 15 c and the thermistors 30 e to 30 g are connected in parallel between the emitters of the transistors 30 b and 30 c and an emitter of the transistor 30 d. The emitter of the transistor 30 d is connected to the negative electrode terminal.
Value of current passing through the light emitting device 1 is determined by voltage between the base and the emitter (i.e., base-emitter voltages VBE) of the transistors 30 b to 30 d, electric resistances of the printed resistors 15 b and 15 c, and electric resistances of the thermistors 30 e to 30 g. As a current passes through the light emitting device 1, the temperatures of the transistors 30 b and 30 c are elevated, and the voltage VBE decreases. The thermistors 30 e to 30 g have inverse characteristics so as to compensate for a change of the voltage VBE due to a temperature change. That is, when the temperatures of the thermistors 30 e to 30 g are elevated, the electric resistances of the thermistors decrease. This can attenuate variance in a value of current passing through the light emitting device 1 even if the temperature of the light emitting device 1 is changed by heat generation. Parallel connection of a plurality of transistors, and parallel connection of a plurality of thermistors can allow a larger current to pass through the light emitting device 1.
The electronic component 18 a and the electronic component 18 b are further connected in parallel between the negative electrode side of the rectifying diode and the negative electrode terminal. The electronic component 18 a is a Zener diode. In case of generation of a temporarily large voltage (i.e., surge) in the circuit, a current passes through the Zener diode, so that other electronic components can be protected from breakage. The electronic component 18 b is a capacitor. Provision of the capacitor can attenuate passage of current noise components through the light emitting elements 20 a to 20 c.
The light emitting device 1 having the above-mentioned circuit configuration is used for, for example, lighting in direction indicators of vehicles, DRL (i.e., daytime running lamps) and the like. The circuit configuration shown in FIG. 7 is a merely example. The light emitting device 1 may have another circuit configuration. The circuit configuration of the light emitting device 1 can be appropriately changed according to a use application and the like of the light emitting device 1.
Modification
FIGS. 8 and 9 are top views illustrating a light emitting device according to a modification of the embodiment.
FIG. 9 is a diagram in which some constituent elements are omitted or seen through to show the internal structure of the light emitting device.
The light emitting device 2 shown in FIGS. 8 and 9 further includes a third member 53 covering lateral surfaces of a first member 51. The first member 51 and the third member 53 are provided on a base member 10 in a first region 11. The first member 51 is surrounded by the third member 53, and covers a plurality of light emitting elements 20. That is, the first member 51 is provided on the light emitting element 20 while being inward of a first frame 41, and the third member 53 is packed in other portions.
The first member 51 is light-transmissive, and the third member 53 is non-light-transmissive. The first member 51 has a plate shape, and is, for example, a glass plate. The glass plate may contain a fluorescent material, and/or may be colored. Alternatively, a material containing a fluorescent material may be formed on a surface of the glass plate by printing or the like. As other examples, the first member 51 may be a sintered body of a fluorescent material, a resin, a ceramic, or other inorganic substance, which contain a fluorescent material. The third member 53 contains, for example, a resin. The third member 53 may contain a white pigment in the same manner as the second member 52. Providing the first member 51 and the third member 53 in the first region 11 can define a light emitting surface (i.e. an upper surface of the first member 51) in a predetermined region, so that a range of light emission by the light emitting device 2 can be limited.
In the light emitting device 2, the shape of a first frame 41 in a top view is a polygonal shape with six or more sides (an octagonal shape in this example). The shape of the first frame 41 in a top view may be a circular shape as shown in FIGS. 1 to 3 .
FIG. 10 is a sectional view taken along line C-C′ in FIG. 8 .
In the light emitting device 2, the upper surface 51 a of the first member 51 is positioned higher than an upper surface 41 a of the first frame 41, an upper surface 42 a of a second frame 42, and an upper surface 52 a of the second member 52 as shown in FIG. 10 . The upper surface 51 a is positioned higher than the upper surface 53 a of the third member 53. This can improve light extraction efficiency of the light emitting device 2 as in the light emitting device 1. In this way, the specific configuration of the light emitting device can be appropriately changed as long as the upper surface 51 a of the first member 51 and the upper surfaces of other members satisfy the above-described positional relationship.
The foregoing embodiment is an example of implementation of the present disclosure, and the scope of the present disclosure is not limited to the embodiment herein. Embodiments achievable with a design change made to the aforementioned embodiment as appropriate by those skilled in the art are within the scope of the present disclosure as long as they include the spirit of the present disclosure.

Claims (20)

What is claimed is:
1. A light emitting device comprising:
a base member having a first surface including a first region and a second region;
a first frame provided on the base member and surrounding the first region;
a light emitting element provided on the base member in the first region;
a light-transmissive first member provided inward of the first frame, and covering the light emitting element;
a plurality of electronic components provided on the base member in the second region and electrically connected with the light emitting element, wherein the plurality of electronic components includes a first electronic component and a second electronic component;
a plurality of pin holes arrayed in a first direction and electrically connected with the plurality of electronic components, the first direction being orthogonal to a thickness direction of the base member, the plurality of pin holes penetrating the base member along the thickness direction;
a resistor provided on the base member; and
a resin overlapping the resistor in a top view;
wherein the first electronic component is provided on a side opposite the plurality of pin holes with respect to the light emitting element in a second direction that is orthogonal to the thickness direction and the first direction, and
wherein the second electronic component is aligned with the light emitting element in the first direction.
2. The light emitting device according to claim 1, wherein an upper surface of the first member is positioned higher than an upper surface of the first frame.
3. The light emitting device according to claim 1, further comprising:
a second frame provided on the base member and surrounding the second region; and
a non-light-transmissive second member provided inward of the second frame, and covering the plurality of electronic components.
4. The light emitting device according to claim 3, wherein
a part of the first frame and a part of the second frame are integrated with each other; and
an upper surface of the first member is positioned higher than an upper surface of the first frame, an upper surface of the second frame, and an upper surface of the second member.
5. The light emitting device according to claim 3, wherein an upper surface of the second member is positioned lower than an upper surface of the first frame and an upper surface of the second frame.
6. The light emitting device according to claim 1, wherein the plurality of electronic components includes a bare chip of at least one of a thermistor, a transistor, or a rectifying diode.
7. The light emitting device according to claim 1, wherein the plurality of electronic components includes a bare chip of a thermistor.
8. The light emitting device according to claim 1, wherein the first member contains a fluorescent material.
9. The light emitting device according to claim 1, wherein the plurality of electronic components includes a thermistor, a transistor, and a rectifying diode.
10. The light emitting device according to claim 9, wherein:
the plurality of pin holes includes a first pin hole and a second pin hole; and
a distance between the first pin hole and the thermistor is longer than a distance between the second pin hole and the thermistor.
11. The light emitting device according to claim 9, wherein:
the plurality of pin holes includes a first pin hole and a second pin hole; and
a distance between the first pin hole and the transistor is longer than a distance between the second pin hole and the transistor.
12. The light emitting device according to claim 9, wherein:
the plurality of pin holes includes a first pin hole and a second pin hole; and
a distance between the first pin hole and the rectifying diode is longer than a distance between the second pin hole and the rectifying diode.
13. The light emitting device according to claim 9, wherein:
the plurality of pin holes includes a first pin hole and a second pin hole;
a distance between the first pin hole and the thermistor is longer than a distance between the second pin hole and the thermistor;
a distance between the first pin hole and the transistor is longer than a distance between the second pin hole and the transistor; and
a distance between the first pin hole and the rectifying diode is longer than a distance between the second pin hole and the rectifying diode.
14. The light emitting device according to claim 1, wherein:
the light emitting element is positioned between the resistor and the second electronic component in the first direction.
15. The light emitting device according to claim 1, wherein:
the first electronic component is a thermistor.
16. The light emitting device according to claim 1, wherein:
the second electronic component is a rectifying diode.
17. The light emitting device according to claim 1, wherein:
the first electronic component is a thermistor; and
the second electronic component is a rectifying diode.
18. The light emitting device according to claim 1, further comprising:
a third electronic component located between the first electronic component and the second electronic component.
19. The light emitting device according to claim 18, wherein:
the third electronic component is a transistor.
20. The light emitting device according to claim 18, wherein:
the first electronic component is a thermistor;
the second electronic component is a rectifying diode; and
the third electronic component is a transistor.
US17/345,335 2018-07-20 2021-06-11 Light emitting device including electronic components and pin holes Active US11929454B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/345,335 US11929454B2 (en) 2018-07-20 2021-06-11 Light emitting device including electronic components and pin holes
US18/184,752 US11935991B2 (en) 2018-07-20 2023-03-16 Light emitting device including electronic components and pin holes

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP2018-136824 2018-07-20
JP2018136824A JP6879270B2 (en) 2018-07-20 2018-07-20 Light emitting device
JP2018-136824 2018-07-20
US16/517,109 US11063187B2 (en) 2018-07-20 2019-07-19 Light emitting device
US17/345,335 US11929454B2 (en) 2018-07-20 2021-06-11 Light emitting device including electronic components and pin holes

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US16/517,109 Continuation US11063187B2 (en) 2018-07-20 2019-07-19 Light emitting device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/184,752 Continuation US11935991B2 (en) 2018-07-20 2023-03-16 Light emitting device including electronic components and pin holes

Publications (2)

Publication Number Publication Date
US20210305467A1 US20210305467A1 (en) 2021-09-30
US11929454B2 true US11929454B2 (en) 2024-03-12

Family

ID=69161347

Family Applications (3)

Application Number Title Priority Date Filing Date
US16/517,109 Active US11063187B2 (en) 2018-07-20 2019-07-19 Light emitting device
US17/345,335 Active US11929454B2 (en) 2018-07-20 2021-06-11 Light emitting device including electronic components and pin holes
US18/184,752 Active US11935991B2 (en) 2018-07-20 2023-03-16 Light emitting device including electronic components and pin holes

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US16/517,109 Active US11063187B2 (en) 2018-07-20 2019-07-19 Light emitting device

Family Applications After (1)

Application Number Title Priority Date Filing Date
US18/184,752 Active US11935991B2 (en) 2018-07-20 2023-03-16 Light emitting device including electronic components and pin holes

Country Status (2)

Country Link
US (3) US11063187B2 (en)
JP (3) JP6879270B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6879270B2 (en) * 2018-07-20 2021-06-02 日亜化学工業株式会社 Light emitting device
JP1695410S (en) * 2021-01-26 2021-09-21

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157486A (en) 2008-12-31 2010-07-15 Chi Mei Lighting Technology Corp Lighting device
US20110128304A1 (en) 2009-12-02 2011-06-02 Mitsubishi Electric Corporation Light emitting element circuit and liquid crystal display device
US20120098458A1 (en) 2010-10-22 2012-04-26 Shih-Neng Dai Multichip package structure for directly electrically connecting to an ac power source
US20130113015A1 (en) 2011-11-07 2013-05-09 Shinko Electric Industries Co., Ltd. Substrate, Light Emitting Device and Method for Manufacturing Substrate
JP2013115368A (en) 2011-11-30 2013-06-10 Rohm Co Ltd Led module
US20130194795A1 (en) 2010-09-08 2013-08-01 Mitsubishi Chemical Corporation Light-emitting apparatus, lighting apparatus and lens
JP2013222782A (en) 2012-04-16 2013-10-28 Citizen Holdings Co Ltd Led module
US20140175595A1 (en) 2012-12-26 2014-06-26 Nichia Corporation Semiconductor device and method for manufacturing the same
US20150188004A1 (en) * 2013-12-27 2015-07-02 Nichia Corporation Semiconductor light emitting device
US20150262987A1 (en) * 2014-03-12 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device And Method For Manufacturing The Same
JP2015220035A (en) 2014-05-15 2015-12-07 スタンレー電気株式会社 Led module and vehicle lamp fitting including the same
WO2016052550A1 (en) 2014-09-29 2016-04-07 シチズンホールディングス株式会社 Led module
JP2016106350A (en) 2015-02-23 2016-06-16 東芝ライテック株式会社 Vehicular luminaire and vehicular lighting fixture
US20160276553A1 (en) * 2015-03-18 2016-09-22 Nichia Corporation Light-emitting device
US20170009953A1 (en) 2015-07-10 2017-01-12 Toshiba Lighting & Technology Corporation Light Emitting Device for Vehicle, Lighting Device for Vehicle, and Lighting Tool for Vehicle
US20170154880A1 (en) * 2015-11-30 2017-06-01 Nichia Corporation Method of manufacturing light emitting device
US20170162768A1 (en) * 2015-12-04 2017-06-08 Epistar Corporation Light-emitting device
JP2017139404A (en) 2016-02-05 2017-08-10 シチズン時計株式会社 LED module
US20170268753A1 (en) 2016-03-18 2017-09-21 Rohm Co., Ltd. Led lighting apparatus
JP2017168274A (en) 2016-03-15 2017-09-21 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
JP2017168207A (en) 2016-03-14 2017-09-21 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
JP2017174798A (en) 2016-03-18 2017-09-28 ローム株式会社 LED lighting device
US20170343180A1 (en) 2016-05-27 2017-11-30 Toshiba Lighting & Technology Corporation Vehicle Lighting Device and Vehicle Lamp
JP2017224466A (en) 2016-06-15 2017-12-21 東芝ライテック株式会社 Vehicle lighting device and vehicle lamp fitting
JP2018063851A (en) 2016-10-13 2018-04-19 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
JP2018085300A (en) 2016-11-25 2018-05-31 東芝ライテック株式会社 Vehicular illumination device and vehicular lighting fixture
JP2020004688A (en) 2018-07-02 2020-01-09 株式会社小糸製作所 Lighting fixture unit and vehicular lighting fixture and lighting fixture unit manufacturing method
US20200271308A1 (en) 2019-02-27 2020-08-27 Rohm Co., Ltd. Led lighting device
US11063187B2 (en) * 2018-07-20 2021-07-13 Nichia Corporation Light emitting device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209338A (en) * 1997-01-22 1998-08-07 Matsushita Electric Ind Co Ltd Semiconductor circuit device and its manufacture
JP2002151741A (en) 2000-11-08 2002-05-24 Murata Mfg Co Ltd Light emitting device, mounting substrate, and electronic equipment using the device and substrate
JP3888284B2 (en) 2002-10-25 2007-02-28 松下電器産業株式会社 Electronic component manufacturing method
WO2005104249A1 (en) * 2004-04-21 2005-11-03 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device and lighting equipment
JP2006224440A (en) 2005-02-17 2006-08-31 Toshiba Hokuto Electronics Corp Thermal head
JP2008108861A (en) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light emitting diode package where flexible pcb is directly linked with light source
JP2011071242A (en) * 2009-09-24 2011-04-07 Toshiba Lighting & Technology Corp Light emitting device and illuminating device
JP2012028699A (en) * 2010-07-27 2012-02-09 Panasonic Corp Semiconductor device, lead frame assembly and manufacturing method of the same
US8876334B2 (en) * 2012-01-16 2014-11-04 Paragon Semiconductor Lighting Technology Co., Ltd. Light-mixing multichip package structure
TWI518955B (en) 2013-08-30 2016-01-21 柏友照明科技股份有限公司 Multichip package structure
US9373762B2 (en) * 2014-06-17 2016-06-21 Panasonic Intellectual Property Management Co., Ltd. Electronic part package
JP6790602B2 (en) * 2015-10-30 2020-11-25 日亜化学工業株式会社 Light emitting device and its manufacturing method
JP6790416B2 (en) * 2016-03-31 2020-11-25 日亜化学工業株式会社 Light emitting device
JP6683000B2 (en) * 2016-05-09 2020-04-15 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157486A (en) 2008-12-31 2010-07-15 Chi Mei Lighting Technology Corp Lighting device
US20110128304A1 (en) 2009-12-02 2011-06-02 Mitsubishi Electric Corporation Light emitting element circuit and liquid crystal display device
JP2011119387A (en) 2009-12-02 2011-06-16 Mitsubishi Electric Corp Light-emitting element circuit and liquid crystal display device
US20130194795A1 (en) 2010-09-08 2013-08-01 Mitsubishi Chemical Corporation Light-emitting apparatus, lighting apparatus and lens
US20120098458A1 (en) 2010-10-22 2012-04-26 Shih-Neng Dai Multichip package structure for directly electrically connecting to an ac power source
JP2012094866A (en) 2010-10-22 2012-05-17 Paragon Semiconductor Lighting Technology Co Ltd Multi-chip package having direct electric connection with alternating current power supply
US20130113015A1 (en) 2011-11-07 2013-05-09 Shinko Electric Industries Co., Ltd. Substrate, Light Emitting Device and Method for Manufacturing Substrate
JP2013115368A (en) 2011-11-30 2013-06-10 Rohm Co Ltd Led module
JP2013222782A (en) 2012-04-16 2013-10-28 Citizen Holdings Co Ltd Led module
US20140175595A1 (en) 2012-12-26 2014-06-26 Nichia Corporation Semiconductor device and method for manufacturing the same
JP2014143396A (en) 2012-12-26 2014-08-07 Nichia Chem Ind Ltd Semiconductor device and manufacturing method of the same
US20150188004A1 (en) * 2013-12-27 2015-07-02 Nichia Corporation Semiconductor light emitting device
US20150262987A1 (en) * 2014-03-12 2015-09-17 Toyoda Gosei Co., Ltd. Light Emitting Device And Method For Manufacturing The Same
JP2015220035A (en) 2014-05-15 2015-12-07 スタンレー電気株式会社 Led module and vehicle lamp fitting including the same
WO2016052550A1 (en) 2014-09-29 2016-04-07 シチズンホールディングス株式会社 Led module
US20170236982A1 (en) 2014-09-29 2017-08-17 Citizen Watch Co., Ltd. Led module
JP2016106350A (en) 2015-02-23 2016-06-16 東芝ライテック株式会社 Vehicular luminaire and vehicular lighting fixture
US20160245470A1 (en) 2015-02-23 2016-08-25 Toshiba Lighting & Technology Corporation Vehicle Lighting Device and Vehicle Lamp
US20160276553A1 (en) * 2015-03-18 2016-09-22 Nichia Corporation Light-emitting device
US20170009953A1 (en) 2015-07-10 2017-01-12 Toshiba Lighting & Technology Corporation Light Emitting Device for Vehicle, Lighting Device for Vehicle, and Lighting Tool for Vehicle
JP2017021988A (en) 2015-07-10 2017-01-26 東芝ライテック株式会社 Vehicular light emitting device, vehicular illuminating device, and vehicular lighting fixture
US20170154880A1 (en) * 2015-11-30 2017-06-01 Nichia Corporation Method of manufacturing light emitting device
US20170162768A1 (en) * 2015-12-04 2017-06-08 Epistar Corporation Light-emitting device
JP2017139404A (en) 2016-02-05 2017-08-10 シチズン時計株式会社 LED module
JP2017168207A (en) 2016-03-14 2017-09-21 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
JP2017168274A (en) 2016-03-15 2017-09-21 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
US20170268753A1 (en) 2016-03-18 2017-09-21 Rohm Co., Ltd. Led lighting apparatus
JP2017174798A (en) 2016-03-18 2017-09-28 ローム株式会社 LED lighting device
US20170343180A1 (en) 2016-05-27 2017-11-30 Toshiba Lighting & Technology Corporation Vehicle Lighting Device and Vehicle Lamp
JP2017212166A (en) 2016-05-27 2017-11-30 東芝ライテック株式会社 Vehicular illuminating device, and vehicular lighting fixture
JP2017224466A (en) 2016-06-15 2017-12-21 東芝ライテック株式会社 Vehicle lighting device and vehicle lamp fitting
JP2018063851A (en) 2016-10-13 2018-04-19 東芝ライテック株式会社 Vehicular lighting device and vehicular lighting fixture
US20180106448A1 (en) 2016-10-13 2018-04-19 Toshiba Lighting & Technology Corporation Lighting Device For Vehicle And Lighting Tool For Vehicle
JP2018085300A (en) 2016-11-25 2018-05-31 東芝ライテック株式会社 Vehicular illumination device and vehicular lighting fixture
JP2020004688A (en) 2018-07-02 2020-01-09 株式会社小糸製作所 Lighting fixture unit and vehicular lighting fixture and lighting fixture unit manufacturing method
US11063187B2 (en) * 2018-07-20 2021-07-13 Nichia Corporation Light emitting device
US20200271308A1 (en) 2019-02-27 2020-08-27 Rohm Co., Ltd. Led lighting device

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Non-Final Office Action in U.S. Appl. No. 18/184,752 dated Oct. 12, 2023.
Notice of Allowance on U.S. Appl. No. 16/517,109 dated Mar. 19, 2021.
Transistor Technology Editorial Department, "Practical Electronic Circuit Handbook (1)", 33rd Edition, Japan, CQ Publishing Co., Ltd., Mar. 10, 1990, pp. 375-377.
U.S. Office Action on U.S. Appl. No. 16/517,109 dated Nov. 25, 2020.

Also Published As

Publication number Publication date
US20210305467A1 (en) 2021-09-30
JP7058388B2 (en) 2022-04-22
US20230223500A1 (en) 2023-07-13
JP2020013949A (en) 2020-01-23
US11935991B2 (en) 2024-03-19
US11063187B2 (en) 2021-07-13
US20200028034A1 (en) 2020-01-23
JP2021121019A (en) 2021-08-19
JP6879270B2 (en) 2021-06-02
JP7393717B2 (en) 2023-12-07
JP2022079733A (en) 2022-05-26

Similar Documents

Publication Publication Date Title
US10950759B2 (en) LED module
US11935991B2 (en) Light emitting device including electronic components and pin holes
KR101360732B1 (en) Led package
KR100863864B1 (en) Light emitting diode package and fabricating method thereof
US7652306B2 (en) Light emitting diode package
US8860069B2 (en) Light-emitting device package having a molding member with a low profile, and method of manufacturing the same
CN102270631B (en) Light-emitting device
US8106411B2 (en) Light emitting device
EP2479810B1 (en) Light-emitting device package and method of manufacturing the same
JP2001015815A (en) Semiconductor light-emitting device
US10714460B2 (en) Light emitting device and manufacturing method thereof
US8030835B2 (en) Light emitting device
US8138517B2 (en) Light-emitting diode package
US10026676B2 (en) Semiconductor lead frame package and LED package
US9203007B2 (en) Light emitting diode assembly
JP6855663B2 (en) LED lighting device
US9605837B2 (en) Lighting device
TWI549323B (en) Semiconductor lead frame package and led package
KR20110034123A (en) Light emitting device package
KR20080087405A (en) Light emitting diode package and method for fabricating the same diode
JP2022127340A (en) Semiconductor light-emitting device
KR20100038249A (en) Light emitting device of lamp type
KR20120104817A (en) Light emitting device package
KR20090046308A (en) Light emitting diode package

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE

STPP Information on status: patent application and granting procedure in general

Free format text: WITHDRAW FROM ISSUE AWAITING ACTION

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE