US11183771B2 - Array antenna device - Google Patents

Array antenna device Download PDF

Info

Publication number
US11183771B2
US11183771B2 US16/638,715 US201816638715A US11183771B2 US 11183771 B2 US11183771 B2 US 11183771B2 US 201816638715 A US201816638715 A US 201816638715A US 11183771 B2 US11183771 B2 US 11183771B2
Authority
US
United States
Prior art keywords
ground plane
dielectric substrate
conductor ground
patch antennas
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US16/638,715
Other languages
English (en)
Other versions
US20200395676A1 (en
Inventor
Kei Yokokawa
Narihiro NAKAMOTO
Toru Fukasawa
Tomohiro Takahashi
Masataka Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, TOMOHIRO, YOKOKAWA, KEI, FUKASAWA, TORU, NAKAMOTO, Narihiro, OTSUKA, MASATAKA
Publication of US20200395676A1 publication Critical patent/US20200395676A1/en
Application granted granted Critical
Publication of US11183771B2 publication Critical patent/US11183771B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0075—Stripline fed arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0464—Annular ring patch

Definitions

  • the present invention relates to an array antenna device including a plurality of patch antennas.
  • array antenna devices used for wireless communication for example, have a high gain and a high axial ratio even with a weak radio wave when scanning with a beam is performed in a wide-angle direction in order to enable wireless communication over the wide angle.
  • the wide-angle direction is a direction in which a radio wave is transmitted/received at ends of the beam width.
  • a decrease in the gain and the a decrease in the axial ratio when scanning with the beam is performed in the wide-angle direction are caused by a difference in the amplitude between a vertically polarized wave and a horizontally polarized wave in the wide-angle direction, in addition to surface waves generated in a dielectric substrate on which patch antennas are formed.
  • Patent Literature 1 employs a substrate having a low dielectric constant characteristic such as foam as a dielectric substrate in order to suppress a decrease in the gain and a decrease in the axial ratio when scanning with a beam is performed in a wide-angle direction.
  • a substrate having a low dielectric constant characteristic such as foam as a dielectric substrate
  • a difference in the amplitude between a vertically polarized wave and a horizontally polarized wave in the wide-angle direction can be changed by adjusting the thickness of the substrate having a low dielectric constant characteristic such as foam.
  • a screw is used to adjust the thickness of the substrate.
  • Patent Literature 1 JP 2009-188895 A
  • the thickness of the substrate can be adjusted by the screws.
  • the amount of adjustment of the thickness of the substrate is proportional to the amount of rotation of the screw, and the amount of rotation of the screw is dependent on the pitch of the screw thread. For this reason, the adjustment accuracy of the thickness of a substrate can be improved as the pitch of a screw thread becomes narrower.
  • the frequency band of a beam is high such as the Kurz-above (Ka) band or a millimeter wave band
  • Ka the Kurz-above
  • millimeter wave band it is necessary to use a screw having a thread pitch in the order of micrometers in order to implement a desired adjustment accuracy.
  • the present invention has been devised in order to solve the above disadvantage, and it is an object of the present invention to obtain an array antenna device capable of suppressing a decrease in the gain and a decrease in the axial ratio when scanning with a beam is performed in the wide-angle direction.
  • An array antenna device includes a first dielectric substrate provided with a first conductor ground plane on a front surface or a back surface thereof, a plurality of patch antennas provided in the first conductor ground plane, a plurality of conductive members, ends of which are connected to the first conductor ground plane to surround the patch antennas individually, and a second conductor ground plane connected to each of other ends of the conductive members, wherein in a case where the first conductor ground plane is provided on the front surface of the first dielectric substrate, a part of the plurality of conductive members penetrates the first dielectric substrate, and a remaining part of the plurality of conductive members functions as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and in a case where the first conductor ground plane is provided on the back surface of the first dielectric substrate, the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane, and wherein the conductive member adjacent to at least two or
  • the plurality of conductive members in a case where the first conductor ground plane is formed on the front surface of the first dielectric substrate, a part of the plurality of conductive members penetrates the first dielectric substrate, and the remaining part of the plurality of conductive members functions as spacers for providing an air layer between the first dielectric substrate and the second conductor ground plane, and in a case where the first conductor ground plane is formed on the back surface of the first dielectric substrate, the plurality of conductive members functions as spacers for providing an air layer between the first conductor ground plane and the second conductor ground plane. Therefore, there is an effect of suppressing a decrease in the gain and a decrease in the axial ratio when scanning with a beam is performed in the wide-angle direction.
  • FIG. 1 is a plan view illustrating an array antenna device according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating the array antenna device according to the first embodiment of the invention.
  • FIG. 3 is an explanatory diagram illustrating an effective radius.
  • FIG. 4 is a cross-sectional view illustrating another array antenna device according to the first embodiment of the invention.
  • FIG. 5 is a cross-sectional view illustrating an array antenna device according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating another array antenna device according to the second embodiment of the invention.
  • FIG. 7 is a cross-sectional view illustrating an array antenna device according to a third embodiment of the invention.
  • FIG. 8 is an explanatory diagram illustrating the positional relationship among a first stripline 13 , a second stripline 15 , and a slot 17 in the array antenna device illustrated in FIG. 7 .
  • FIG. 9 is a cross-sectional view illustrating another array antenna device according to the third embodiment of the invention.
  • FIG. 10 is an explanatory diagram illustrating the positional relationship among a first stripline 13 , a second stripline 15 , and a slot 17 .
  • FIG. 11 is an explanatory diagram illustrating the positional relationship among the first stripline 13 , the second stripline 15 , and the slot 17 .
  • FIG. 12 is a cross-sectional view illustrating an array antenna device according to a fourth embodiment of the invention.
  • FIG. 13 is a cross-sectional view illustrating another array antenna device according to the fourth embodiment of the invention.
  • FIG. 14 is a cross-sectional view illustrating an array antenna device according to a fifth embodiment of the invention.
  • FIG. 15 is a cross-sectional view illustrating an array antenna device according to a sixth embodiment of the invention.
  • FIG. 16 is a cross-sectional view illustrating another array antenna device according to the sixth embodiment of the invention.
  • FIG. 17 is a cross-sectional view illustrating an array antenna device according to a seventh embodiment of the invention.
  • FIG. 18 is a cross-sectional view illustrating another array antenna device according to the seventh embodiment of the invention.
  • FIG. 19 is a cross-sectional view illustrating an array antenna device according to an eighth embodiment of the invention.
  • FIG. 20 is a plan view illustrating the positional relationship between a first stripline 13 and a second stripline 15 .
  • FIG. 1 is a plan view illustrating an array antenna device according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating the array antenna device according to the first embodiment of the present invention.
  • a first dielectric substrate 1 is provided with a first conductor ground plane 2 formed on a front surface thereof.
  • the front surface of the first dielectric substrate 1 is the surface on the upper side in FIG. 2 out of the two surfaces of the first dielectric substrate 1
  • the back surface of the first dielectric substrate 1 is the surface on the lower side in FIG. 2 .
  • the first conductor ground plane 2 is a ground plane of copper foil formed on the front surface of the first dielectric substrate 1 .
  • Patch antennas 3 - 1 to 3 - 9 are circular patch antennas provided on the first conductor ground plane 2 .
  • the individual patch antennas 3 - 1 to 3 - 9 may be referred to as the patch antennas 3 .
  • the patch antennas 3 - 1 to 3 - 9 are formed by scraping the first conductor ground plane 2 in annular shapes.
  • a conductor-cut-out portion 2 a indicates an annular cut-out portion in the first conductor ground plane 2 .
  • patch antennas 3 Although nine patch antennas 3 are illustrated as an example in FIGS. 1 and 2 , the number of patch antennas 3 is only required to be plural and not limited to nine.
  • the patch antennas 3 - 7 to 3 - 9 are representatively illustrated in FIG. 2 .
  • each of the patch antennas 3 - 1 to 3 - 9 has a circular shape; however, the shape is not limited to a circle and may be, for example, a polygon.
  • Conductive members 4 each include a first connection conductor 4 a and a second connection conductor 4 b , and ends of the conductive members 4 are coupled to the first conductor ground plane 2 so as to surround the patch antennas 3 - 1 to 3 - 9 individually.
  • the first connection conductor 4 a which is a part of the conductive member 4 is provided so as to penetrate the first dielectric substrate 1 , and one end thereof is coupled to the first conductor ground plane 2 at a position surrounding any of the patch antennas 3 - 1 to 3 - 9 .
  • the second connection conductor 4 b which is the remaining part of the conductive member 4 , is a copper core ball that conducts between the other end of the first connection conductor 4 a and a second conductor ground plane 5 .
  • the second connection conductor 4 b functions as a spacer for providing an air layer 6 between the first dielectric substrate 1 and the second conductor ground plane 5 .
  • the second connection conductor 4 b is a copper core ball
  • the second connection conductor 4 b is not limited to a sphere and may be, for example, a cube or a rectangular parallelepiped.
  • a land 4 c is a portion where the first connection conductor 4 a and the second connection conductor 4 b are coupled by solder.
  • the second conductor ground plane 5 is a ground plane of copper foil coupled to each of the other ends of second connection conductors 4 b in a plurality of conductive members 4 .
  • the air layer 6 is a layer between the first dielectric substrate 1 and the second conductor ground plane 5 formed by the second connection conductors 4 b.
  • the patch antennas 3 - 1 to 3 - 9 are formed by removing the first conductor ground plane 2 in the annular shapes like in the conductor-cut-out portions 2 a illustrated in FIG. 1 .
  • the plurality of conductive members 4 is provided in the first dielectric substrate 1 in such a manner that ends of the conductive members 4 surround the patch antennas 3 - 1 to 3 - 9 individually.
  • the conductive members 4 each include a first connection conductor 4 a and a second connection conductor 4 b , and the first connection conductors 4 a are provided so as to penetrate the first dielectric substrate 1 with the ends thereof coupled to the first conductor ground plane 2 at positions surrounding one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 .
  • An end of a second connection conductor 4 b is coupled to the other end of a first connection conductor 4 a , and the other end of the second connection conductor 4 b is coupled to the second conductor ground plane 5 .
  • the second connection conductor 4 b functions as a spacer for providing the air layer 6 between the first dielectric substrate 1 and the second conductor ground plane 5 .
  • the size of the air layer 6 which is the length of an interval between the first dielectric substrate 1 and the second conductor ground plane 5 , corresponds to the diameter of the second connection conductor 4 b which is a copper core ball.
  • a low dielectric constant substrate can be equivalently implemented.
  • a difference in the amplitude between a vertically polarized wave and a horizontally polarized wave in the wide-angle direction can be reduced by adjusting the size of the air layer 6 .
  • the size of the air layer 6 corresponds to the diameter of the second connection conductor 4 b , it is only required to use a second connection conductor 4 b having a diameter that allows a difference in the amplitude between the vertically polarized wave and the horizontally polarized wave in the wide-angle direction to be reduced.
  • the size of the air layer 6 needs to be adjusted in the order of micrometers, and thus it is necessary to use second connection conductors 4 b manufactured with accuracy in the order of micrometers.
  • the example in which the patch antennas 3 - 1 to 3 - 9 are formed is illustrated in the first embodiment. Focusing on three adjacent patch antennas 3 out of the patch antennas 3 - 1 to 3 - 9 , it is desirable that the three patch antennas 3 are disposed in such a manner that a distance between the centers of each pair of the three patch antennas 3 approximately equals a half the wavelength of a frequency of the beam to be transmitted and received.
  • the patch antennas 3 - 2 , 3 - 3 , and 3 - 6 are disposed in such a manner that lines connecting the centers of the three patch antennas become an equilateral triangle A.
  • the distance between the center of patch antenna 3 - 2 and the center of patch antenna 3 - 3 is approximately half the wavelength of the frequency of the beam, and the distance between the center of patch antenna 3 - 3 and the center of patch antenna 3 - 6 is approximately half the wavelength of the frequency of the beam.
  • the distance between the center of patch antenna 3 - 6 and the center of patch antenna 3 - 2 is approximately half the wavelength of the frequency of the beam.
  • the radius r of the patch antennas 3 - 1 to 3 - 9 is expressed as the following equation (1), using an effective dielectric constant ⁇ r calculated from the first dielectric substrate 1 and the air layer 6 .
  • Equation (1) c represents the speed of light, and f represents the frequency of the beam.
  • the effective dielectric constant ⁇ r is expressed as the following equation (2), where the thickness of the first dielectric substrate 1 is denoted by t 1 , a dielectric constant of the first dielectric substrate 1 is denoted by ⁇ r1 , the thickness of the air layer 6 is denoted by t 2 , and the dielectric constant of the air layer 6 is denoted by ⁇ r2 .
  • ⁇ r t 1 + t 2 t 1 ⁇ r ⁇ ⁇ 1 + t 2 ⁇ r ⁇ ⁇ 2 ( 2 )
  • the conductive members 4 are disposed at positions surrounding the patch antennas 3 - 1 to 3 - 9 individually.
  • the center of gravity of the equilateral triangle A which is a position equidistant from the patch antennas 3 - 2 , 3 - 3 , and 3 - 6 is conceivable.
  • the diameter of the conductor-cut-out portions 2 a surrounding the patch antennas 3 - 1 to 3 - 9 is determined in such a manner that an equivalent patch radius from the center of the patch antennas 3 - 1 to 3 - 9 (hereinafter referred to as “effective radius”) results in an axial ratio characteristic of approximately 0 dB in a target maximum angle of the beam scanning angle.
  • an equivalent patch radius from the center of the patch antennas 3 - 1 to 3 - 9 hereinafter referred to as “effective radius” results in an axial ratio characteristic of approximately 0 dB in a target maximum angle of the beam scanning angle.
  • the target maximum angle of the beam scanning angle for example, a beam scanning angle of ⁇ 60 degrees is conceivable.
  • An effective radius is an electrical radius of the patch antennas 3 in consideration of the spread of an electric field B generated in the patch antennas 3 when the power is being fed as illustrated in FIG. 3 .
  • FIG. 3 is an explanatory diagram illustrating an effective radius.
  • the axial ratio of the patch antennas 3 - 1 to 3 - 9 can be adjusted by the effective radius.
  • the effective dielectric constant ⁇ r is about 1.3 and when the effective radius of the patch antennas 3 - 1 to 3 - 9 is about 0.26 ⁇ , the axial ratio in the wide-angle direction is obtained as 0 dB, and a resonance characteristic is obtained at the frequency of the beam.
  • Symbol ⁇ represents the wavelength at the frequency of a beam used.
  • the first conductor ground plane 2 positioned between about 0.26 ⁇ away from the center of the patch antennas 3 - 1 to 3 - 9 and the perimeters of the patch antennas 3 - 1 to 3 - 9 is each cut out into an annual shape.
  • conductor-cut-out portions 2 a of adjacent patch antennas 3 overlap with each other since the radius r of the adjacent patch antennas 3 is large and thus intervals in the arrangement of the adjacent patch antenna 3 become narrow. Since it is only required that adjacent patch antennas 3 do not overlap with each other, conductor-cut-out portions 2 a of the adjacent patch antennas 3 may overlap with each other.
  • parts of the plurality of conductive members 4 penetrate the first dielectric substrate 1 while the remaining parts of the plurality of conductive members 4 function as spacers for providing the air layer 6 between the first dielectric substrate 1 and the second conductor ground plane 5 , thereby exercising effects of suppressing a decrease in the gain and a decrease in the axial ratio when scanning with a beam is performed in the wide-angle direction.
  • the size of the air layer 6 can be adjusted in the order of micrometers, thereby suppressing a decrease in the gain and a decrease in the axial ratio when scanning with a beam is performed in the wide-angle direction.
  • the example is illustrated in the first embodiment in which the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 ; however as illustrated in FIG. 4 , the first conductor ground plane 2 may be formed on the back surface of the first dielectric substrate 1 .
  • FIG. 4 is a cross-sectional view illustrating another array antenna device according to the first embodiment of the invention.
  • the same symbol as that in FIGS. 1 and 2 represents the same or a corresponding part and thus description thereof is omitted.
  • a conductive member 4 illustrated in FIG. 2 includes a first connection conductor 4 a and a second connection conductor 4 b , whereas a conductive member 4 illustrated in FIG. 4 includes only a first connection conductor 4 d.
  • the first connection conductor 4 d is a copper core ball one end of which is coupled to a first conductor ground plane 2 at a position surrounding any one of patch antennas 3 - 1 to 3 - 9 , and the other end of which is coupled to a second conductor ground plane 5 .
  • the first connection conductor 4 d functions as a spacer for providing an air layer 6 between the first conductor ground plane 2 and the second conductor ground plane 5 .
  • a low dielectric constant substrate can be equivalently implemented like in the array antenna device illustrated in FIGS. 1 and 2 .
  • the first embodiment has illustrated the array antenna device including the first dielectric substrate 1 , whereas in a second embodiment an array antenna device including a first dielectric substrate 1 and a second dielectric substrate 7 will be described.
  • FIG. 5 is a cross-sectional view illustrating an array antenna device according to the second embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the second embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 5 the same symbol as that in FIGS. 1 and 2 represents the same or a corresponding part and thus description thereof is omitted.
  • the second dielectric substrate 7 is disposed between the first dielectric substrate 1 and a second conductor ground plane 5 .
  • Conductive members 4 each include a first connection conductor 4 a , a second connection conductor 4 e , and a third connection conductor 4 f , and ends of the conductive members 4 are coupled to the first conductor ground plane 2 so as to surround each of patch antennas 3 - 1 to 3 - 9 .
  • a second connection conductor 4 e which is a part of a conductive member 4 is provided so as to penetrate the second dielectric substrate 7 , and one end thereof is coupled to the second conductor ground plane 5 .
  • a third connection conductor 4 f which is the remaining part of the conductive member 4 , is a copper core ball that conducts between the other end of the first connection conductor 4 a and the other end of the second connection conductor 4 e.
  • the third connection conductor 4 f functions as a spacer for providing an air layer 6 between the first dielectric substrate 1 and the second dielectric substrate 7 .
  • the third connection conductor 4 f is a copper core ball
  • the third connection conductor 4 f is not limited to a sphere and may be, for example, a cube, or a rectangular parallelepiped.
  • a land 4 g is a portion where the second connection conductor 4 e and the third connection conductor 4 f are coupled by solder.
  • the second dielectric substrate 7 is included in addition to the first dielectric substrate 1 in the second embodiment, since the air layer 6 is provided, a low dielectric constant substrate can be equivalently implemented like in the first embodiment.
  • the effective dielectric constant ⁇ r is calculated from the first dielectric substrate 1 , the second dielectric substrate 7 , and the air layer 6 .
  • the effective dielectric constant ⁇ r is expressed as the following equation (3), where the thickness of the first dielectric substrate 1 is denoted by t 1 , the dielectric constant of the first dielectric substrate 1 is denoted by ⁇ r1 , the thickness of the air layer 6 is denoted by t 2 , the dielectric constant of the air layer 6 is denoted by ⁇ r2 , the thickness of the second dielectric substrate 7 is denoted by t 3 , the dielectric constant of the second dielectric substrate 7 is denoted by ⁇ r3 .
  • ⁇ r t 1 + t 2 + t 3 t 1 ⁇ r ⁇ ⁇ 1 + t 2 ⁇ r ⁇ ⁇ 2 + ⁇ t 3 ⁇ r ⁇ ⁇ 3 ( 3 )
  • the example is illustrated in the second embodiment in which the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 ; however as illustrated in FIG. 6 , the first conductor ground plane 2 may be formed on the back surface of the first dielectric substrate 1 .
  • FIG. 6 is a cross-sectional view illustrating another array antenna device according to the second embodiment of the invention.
  • the same symbol as that in FIGS. 1 and 5 represents the same or a corresponding part and thus description thereof is omitted.
  • the conductive members 4 illustrated in FIG. 5 each include a first connection conductors 4 a , a second connection conductors 4 e , and a third connection conductor 4 f
  • conductive members 4 illustrated in FIG. 6 each include only a first connection conductor 4 h and a second connection conductor 4 e.
  • the first connection conductor 4 h is a copper core ball one end of which is coupled to a first conductor ground plane 2 at a position surrounding any one of patch antennas 3 - 1 to 3 - 9 .
  • the first connection conductor 4 h functions as a spacer for providing an air layer 6 between the first conductor ground plane 2 and a second dielectric substrate 7 .
  • a low dielectric constant substrate can be equivalently implemented like in the array antenna device illustrated in FIG. 5 .
  • FIG. 7 is a cross-sectional view illustrating an array antenna device according to the third embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the third embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 7 the same symbol as that in FIGS. 1 and 2 represents the same or a corresponding part and thus description thereof is omitted.
  • a second dielectric substrate 11 is disposed on, out of the two planes of a second conductor ground plane 5 , a plane opposite to the plane to which conductive members 4 are coupled.
  • a third conductor ground plane 12 is a ground plane of copper foil disposed on, out of the two planes of the second dielectric substrate 11 , a plane opposite to the plane on which the second conductor ground plane 5 is disposed.
  • a first stripline 13 is provided at a position facing one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 inside the second dielectric substrate 11 .
  • a second stripline 15 is provided at a position facing one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 inside the second dielectric substrate 11 .
  • a via 14 is a connecting member for electrically connecting a first stripline 13 and an adjustment circuit for, for example, adjusting the phase and the amplitude of signals.
  • a via 16 is a connecting member for electrically connecting a second stripline 15 and an adjustment circuit for, for example, adjusting the phase and the amplitude of signals.
  • a slot 17 is included in the second conductor ground plane 5 at a position facing one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 .
  • the slot 17 excites the patch antenna 3 at the opposite position when power is fed from the first stripline 13 and the second stripline 15 .
  • FIG. 8 is an explanatory diagram illustrating the positional relationship among a first stripline 13 , a second stripline 15 , and a slot 17 in the array antenna device illustrated in FIG. 7 .
  • the explanatory diagram of FIG. 8 is a view in which the first stripline 13 , the second stripline 15 , and the slot 17 are viewed transparently from the lower side toward the upper side of FIG. 7 .
  • FIG. 7 in order to simplify the drawing, the positions where vias 14 and 16 are drawn are schematic, and the exact positions of the vias 14 and 16 are illustrated in FIG. 8 .
  • One end of the first stripline 13 is coupled to the via 14 .
  • the first stripline 13 is branched into two on the way, and two branch lines 13 a of the first stripline 13 are disposed in parallel so as to maintain the symmetry of the first stripline 13 .
  • One end of the second stripline 15 is coupled to the via 16 .
  • the second stripline 15 is branched into two on the way, and two branch lines 15 a of the second stripline 15 are disposed in parallel so as to maintain the symmetry of the second stripline 15 .
  • the shape of the slot 17 is substantially cruciform, and the center 17 a of the slot 17 substantially coincides with the center of a patch antenna 3 at the opposite position.
  • the length from a midpoint 13 b at a position overlapping with the slot 17 to a tip 13 c is approximately a quarter of the wavelength of a frequency of the beam in order to enhance the feeding efficiency of the slot 17 .
  • the length from a midpoint 15 b at a position overlapping with the slot 17 to a tip 15 c is approximately a quarter of the wavelength of a frequency of the beam in order to enhance the feeding efficiency of the slot 17 .
  • the first stripline 13 in the feed line portion 10 is fed with, for example, a first polarized wave
  • the second stripline 15 is fed with a second polarized wave orthogonal to the first polarized wave.
  • the slot 17 in the feed line portion 10 has a cross slot structure in which orthogonal polarized waves can be excited, and the first polarized wave and the second polarized wave are fed with power in a contactless manner from the first stripline 13 and the second stripline 15 .
  • the slot 17 is coupled to the patch antenna 3 at the opposite position and excites the patch antenna 3 at the opposite position when the first polarized wave and the second polarized wave are fed with power in a contactless manner from the first stripline 13 and the second stripline 15 .
  • the slot 17 and the patch antenna 3 operate as an antenna.
  • the patch antennas 3 are excited using the slots 17 in the third embodiment, it is possible to implement an array antenna device in which cross polarization is suppressed.
  • polarized waves orthogonal to each other are fed to the first striplines 13 and the second striplines 15 , a circularly polarized wave can be radiated from the patch antennas 3 .
  • the example is illustrated in the third embodiment in which the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 ; however as illustrated in FIG. 9 , the first conductor ground plane 2 may be formed on the back surface of the first dielectric substrate 1 .
  • FIG. 9 is a cross-sectional view illustrating another array antenna device according to the third embodiment of the invention.
  • FIG. 9 the same symbol as that in FIGS. 1, 4, and 7 represents the same or a corresponding part.
  • a slot 17 can excite a patch antenna 3 at the opposite position like in the case where the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 .
  • first stripline 13 and the second stripline 15 are each branched into two on the way; however, the present invention is not limited to those branching into two, and a first stripline 13 and a second stripline 15 may be linear as illustrated in FIG. 10 .
  • FIG. 10 is an explanatory diagram illustrating the positional relationship among a first stripline 13 , a second stripline 15 , and a slot 17 .
  • FIG. 10 the example is illustrated in which the first stripline 13 and the second stripline 15 are disposed in such a manner that each of a midpoint 13 b of the first stripline 13 and a midpoint 15 b of the second stripline 15 coincides with the center 17 a of the slot 17 .
  • a first stripline 13 and a second stripline 15 may be disposed in such a manner that each of a midpoint 13 b of the first stripline 13 and a midpoint 15 b of the second stripline 15 is offset from the center 17 a of a slot 17 .
  • FIG. 11 is an explanatory diagram illustrating the positional relationship among the first stripline 13 , the second stripline 15 , and the slot 17 .
  • an array antenna device including first striplines 23 , second striplines 24 , and slots 17 as feed line portions will be described.
  • FIG. 12 is a cross-sectional view illustrating an array antenna device according to the fourth embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the fourth embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 12 the same symbol as that in FIGS. 1 and 5 represents the same or a corresponding part and thus description thereof is omitted.
  • a third dielectric substrate 21 is disposed on, of the two planes of a second conductor ground plane 5 , a plane opposite to the plane to which conductive members 4 are coupled.
  • a third conductor ground plane 22 is a ground plane of copper foil disposed on, of the two planes of the third dielectric substrate 21 , a plane opposite to the plane on which the second conductor ground plane 5 is disposed.
  • a first stripline 23 is provided at a position facing one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 on a plane opposite to the plane on which the second conductor ground plane 5 is disposed.
  • a second stripline 24 is provided at a position facing one patch antenna 3 out of the patch antennas 3 - 1 to 3 - 9 inside the third dielectric substrate 21 .
  • FIG. 8, 10 The positional relationship among a first stripline 23 , a second stripline 24 , and a slot 17 in the array antenna device illustrated in FIG. 12 is represented by FIG. 8, 10 , or 11 as in the third embodiment.
  • a first stripline 23 in a feed line portion is fed with, for example, a first polarized wave
  • a second stripline 24 is fed with a second polarized wave orthogonal to the first polarized wave.
  • a slot 17 in the feed line portion has a cross slot structure in which the polarized waves orthogonal to each other can be excited, and the first polarized wave and the second polarized wave are fed with power in a contactless manner from the first stripline 23 and the second stripline 24 .
  • the slot 17 is coupled to a patch antenna 3 at the opposite position and excites the patch antenna 3 at the opposite position when the first polarized wave and the second polarized wave are fed with power in a contactless manner from the first stripline 23 and the second stripline 24 .
  • the slot 17 and the patch antenna 3 operate as an antenna.
  • the patch antennas 3 are excited using the slots 17 in the fourth embodiment, it is possible to implement an array antenna device in which cross polarization is suppressed.
  • polarized waves orthogonal to each other are fed to the first striplines 23 and the second striplines 24 , a circularly polarized wave can be radiated from the patch antennas 3 .
  • the example is illustrated in the fourth embodiment in which the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 ; however as illustrated in FIG. 13 , the first conductor ground plane 2 may be formed on the back surface of the first dielectric substrate 1 .
  • FIG. 13 is a cross-sectional view illustrating another array antenna device according to the fourth embodiment of the invention.
  • FIG. 13 the same symbol as that in FIGS. 1, 6, and 12 represents the same or a corresponding part. Even in a case where the first conductor ground plane 2 is formed on the back surface of the first dielectric substrate 1 , a slot 17 can excite a patch antenna 3 at the opposite position like in the case where the first conductor ground plane 2 is formed on the front surface of the first dielectric substrate 1 .
  • an array antenna device including an adjustment circuit 32 for adjusting the phase and the amplitude of signals transmitted or received by patch antennas 3 - 1 to 3 - 9 will be described.
  • FIG. 14 is a cross-sectional view illustrating an array antenna device according to the fifth embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the fifth embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 14 the same symbol as that in FIGS. 1, 2, and 7 represents the same or a corresponding part and thus description thereof is omitted.
  • a third dielectric substrate 31 is disposed on, of the two planes of a third conductor ground plane 12 , a plane opposite to the plane on which a second dielectric substrate 11 is disposed.
  • An adjustment circuit 32 is disposed on, of the two planes of the third dielectric substrate 31 , a plane opposite to the plane on which the third conductor ground plane 12 is disposed and is electrically coupled to a first stripline 13 via a via 14 and to a second stripline 15 via a via 16 .
  • the adjustment circuit 32 is an integrated circuit (IC) for adjusting the phase and the amplitude of a signal transmitted or received by one patch antenna 3 out of patch antennas 3 - 1 to 3 - 9 that is provided at the opposite position.
  • IC integrated circuit
  • adjustment circuits 32 may be provided in the array antenna device in which the first conductor ground plane 2 is used in the back surface of the first dielectric substrate 1 .
  • adjustment circuits 32 may be used in the array antenna device including the first striplines 23 , the second striplines 24 , and the slots 17 as the feed line portions.
  • the third dielectric substrate 31 illustrated in FIG. 14 is regarded as a fourth dielectric substrate.
  • An adjustment circuit 32 is electrically coupled to a first stripline 23 via a via 14 and is electrically coupled to a second stripline 24 via a via 16 .
  • an array antenna device capable of beam scanning in a desired direction can be implemented.
  • each of the patch antennas 3 - 1 to 3 - 9 formed in a first conductor ground plane 2 is a first patch antenna.
  • an array antenna device will be described in which second patch antennas 8 - 1 to 8 - 9 are provided on, of the two planes of a second dielectric substrate 7 , a plane to which a plurality of conductive members 4 is coupled.
  • FIG. 15 is a cross-sectional view illustrating an array antenna device according to the sixth embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the sixth embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 15 the same symbol as that in FIGS. 1, 5, and 6 represents the same or a corresponding part and thus description thereof is omitted.
  • the second patch antennas 8 - 1 to 8 - 9 are provided on, of the two planes of the second dielectric substrate 7 , the plane to which the plurality of conductive members 4 is coupled.
  • the second patch antennas 8 - 1 to 8 - 9 are disposed at positions overlapping with the patch antennas 3 - 1 to 3 - 9 , respectively, when viewed from the first dielectric substrate 1 toward the second dielectric substrate 7 side.
  • the second patch antennas 8 - 1 to 8 - 9 perform multiple resonance with the patch antennas 3 - 1 to 3 - 9 , respectively.
  • the array antenna device of the sixth embodiment includes the second patch antennas 8 - 1 to 8 - 9 , the resonance frequency of the antenna is expanded than that of the array antenna device of the first embodiment. Therefore, the array antenna device of the sixth embodiment is capable of performing beam scanning at a wide angle over a broadband as compared with the array antenna device of the first embodiment.
  • the second patch antennas 8 - 1 to 8 - 9 are used in the array antenna device in which a first conductor ground plane 2 is provided on the front surface of the first dielectric substrate 1 .
  • the second patch antennas 8 - 1 to 8 - 9 may be used in the array antenna device in which the first conductor ground plane 2 is formed on the back surface of the first dielectric substrate 1 as illustrated in FIG. 16 .
  • FIG. 16 is a cross-sectional view illustrating another array antenna device according to the sixth embodiment of the invention.
  • an array antenna device will be described in which an air layer 6 is a first air layer, third connection conductors 4 f are first spacers, and second spacers for forming a second air layer 9 between a second conductor ground plane 5 and a second dielectric substrate 7 are included.
  • FIG. 17 is a cross-sectional view illustrating an array antenna device according to the seventh embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the seventh embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 17 the same symbol as that in FIGS. 1 and 15 represents the same or a corresponding part and thus description thereof is omitted.
  • Fourth connection conductors 4 i function as the second spacers that form the second air layer 9 between the second conductor ground plane 5 and the second dielectric substrate 7 .
  • a land 4 j is a portion where a second connection conductor 4 e and the fourth connection conductor 4 i are coupled by solder.
  • the array antenna device of the seventh embodiment includes the second patch antennas 8 - 1 to 8 - 9 , the resonance frequency of the antenna is expanded than that of the array antenna device of the first embodiment. Therefore, the array antenna device of the seventh embodiment is capable of performing beam scanning at a wide angle over a wide band as compared with the array antenna device of the first embodiment.
  • the array antenna device of the seventh embodiment includes the second air layer 9 , better axial ratio characteristics in the wide-angle direction can be obtained than in the array antenna device of the first embodiment.
  • the second air layer 9 is formed in the array antenna device in which a first conductor ground plane 2 is provided on the front surface of a first dielectric substrate 1 .
  • the second air layer 9 may be formed in the array antenna device in which the first conductor ground plane 2 is formed on the back surface of the first dielectric substrate 1 as illustrated in FIG. 18 .
  • FIG. 18 is a cross-sectional view illustrating another array antenna device according to the seventh embodiment of the invention.
  • first striplines 13 and second striplines 15 are wired in the same plane, and each of the first striplines 13 and the second striplines 15 excites patch antennas 3 - 1 to 3 - 9 .
  • FIG. 19 is a cross-sectional view illustrating an array antenna device according to the eighth embodiment of the present invention.
  • FIG. 1 A plan view of the array antenna device of the eighth embodiment is illustrated in FIG. 1 as in the first embodiment.
  • FIG. 19 the same symbol as that in FIGS. 1, 7 , and 9 represents the same or a corresponding part and thus description thereof is omitted.
  • first striplines 13 and second striplines 15 are wired on the same plane inside a second dielectric substrate 11 .
  • One end of a via 18 is coupled to a first stripline 13 , and the other end protrudes from the array antenna device.
  • One end of a via 19 is coupled to a second stripline 15 , and the other end protrudes from the array antenna device.
  • the vias 18 and the vias 19 have the same length.
  • FIG. 20 is a plan view illustrating the positional relationship between a first stripline 13 and a second stripline 15 .
  • the first stripline 13 is disposed in such a manner that a midpoint 13 d overlaps with a slot extending in the lateral direction in the drawing of a slot 17 .
  • the second stripline 15 is also disposed in such a manner that a midpoint 15 d overlaps with a slot extending in the longitudinal direction in the drawing of a slot 17 in FIG. 20 .
  • the array antenna device of the eighth embodiment Since the first striplines 13 and the second striplines 15 are wired on the same plane in the array antenna device of the eighth embodiment, the impedance characteristics of the antenna seen from the input side are substantially the same. Therefore, the array antenna device of the eighth embodiment has better symmetry and better axial ratio characteristics than the array antenna device of the third and fourth embodiments.
  • the present invention may include a flexible combination of the respective embodiments, a modification of any component of the embodiments, or an omission of any component in the embodiments within the scope of the present invention.
  • the present invention is suitable for an array antenna device including a plurality of patch antennas.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
US16/638,715 2017-09-28 2018-05-18 Array antenna device Active 2038-05-29 US11183771B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
WOPCT/JP2017/035232 2017-09-28
JPPCT/JP2017/035232 2017-09-28
PCT/JP2017/035232 WO2019064430A1 (ja) 2017-09-28 2017-09-28 アレーアンテナ装置
PCT/JP2018/019225 WO2019064683A1 (ja) 2017-09-28 2018-05-18 アレーアンテナ装置

Publications (2)

Publication Number Publication Date
US20200395676A1 US20200395676A1 (en) 2020-12-17
US11183771B2 true US11183771B2 (en) 2021-11-23

Family

ID=65901063

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/638,715 Active 2038-05-29 US11183771B2 (en) 2017-09-28 2018-05-18 Array antenna device

Country Status (5)

Country Link
US (1) US11183771B2 (de)
EP (1) EP3667821B1 (de)
JP (1) JP6516939B1 (de)
KR (1) KR102218801B1 (de)
WO (2) WO2019064430A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7267089B2 (ja) * 2019-05-14 2023-05-01 新光電気工業株式会社 半導体装置
TW202103284A (zh) * 2019-07-11 2021-01-16 矽品精密工業股份有限公司 電子封裝件

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190351A (ja) 1996-12-25 1998-07-21 Mitsubishi Electric Corp ミリ波帯平面アンテナ
US20070080864A1 (en) * 2005-10-11 2007-04-12 M/A-Com, Inc. Broadband proximity-coupled cavity backed patch antenna
JP2009188895A (ja) 2008-02-08 2009-08-20 Mitsubishi Electric Corp アンテナ装置
US20120154238A1 (en) 2010-12-20 2012-06-21 Stmicroelectronics Sa Integrated millimeter wave transceiver
WO2012167283A2 (en) 2011-06-02 2012-12-06 Brigham Young University Planar array feed for satellite communications
WO2013121732A1 (ja) 2012-02-15 2013-08-22 パナソニック株式会社 無線モジュール
US20160049723A1 (en) 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
US20160190704A1 (en) * 2014-12-31 2016-06-30 Trimble Navigation Limited Circularly polarized connected-slot antenna

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
WO2007049376A1 (ja) * 2005-10-27 2007-05-03 Murata Manufacturing Co., Ltd. 高周波モジュール
JP4498292B2 (ja) * 2006-03-07 2010-07-07 株式会社東芝 半導体モジュール及び半導体モジュールの製造方法
JP2007324712A (ja) * 2006-05-30 2007-12-13 Mitsubishi Electric Corp アンテナ装置
WO2008108413A1 (ja) * 2007-03-05 2008-09-12 Kyocera Corporation 微小構造体装置および微小構造体装置の製造方法
JP2011097526A (ja) * 2009-11-02 2011-05-12 Fujikura Ltd ミリ波無線装置
JP5909707B2 (ja) * 2011-12-02 2016-04-27 パナソニックＩｐマネジメント株式会社 無線モジュール
US9444135B2 (en) * 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
JP6288294B2 (ja) * 2014-10-31 2018-03-07 株式会社村田製作所 アンテナモジュール及び回路モジュール
US9941226B2 (en) * 2014-12-15 2018-04-10 Industrial Technology Research Institute Integrated millimeter-wave chip package

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190351A (ja) 1996-12-25 1998-07-21 Mitsubishi Electric Corp ミリ波帯平面アンテナ
US20070080864A1 (en) * 2005-10-11 2007-04-12 M/A-Com, Inc. Broadband proximity-coupled cavity backed patch antenna
JP2009188895A (ja) 2008-02-08 2009-08-20 Mitsubishi Electric Corp アンテナ装置
US20120154238A1 (en) 2010-12-20 2012-06-21 Stmicroelectronics Sa Integrated millimeter wave transceiver
WO2012167283A2 (en) 2011-06-02 2012-12-06 Brigham Young University Planar array feed for satellite communications
WO2013121732A1 (ja) 2012-02-15 2013-08-22 パナソニック株式会社 無線モジュール
US20140151860A1 (en) 2012-02-15 2014-06-05 Panasonic Corporation Wireless module
US20160049723A1 (en) 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
US20160190704A1 (en) * 2014-12-31 2016-06-30 Trimble Navigation Limited Circularly polarized connected-slot antenna

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
European Search Report dated Jul. 29, 2020 in corresponding European Patent Application No. 18 863 538.7.
International Search Report for PCT/JP2018/019225 dated Aug. 7, 2018.
Japanese Office Action for Japanese Patent Application No. 2018-557058 dated Dec. 25, 2018.
Khandelwal N. et al: "Active Antenna Module for Low-Cost Electronically Scanned Phased Arrays", IEEE Transactions on Microwave Theory and Techniques, vol. 56, No. 10, Oct. 1, 2008, pp. 2286-2292.
Pinel et al., "3D integrated LTCC module using μBGA technology for compact C-band RF Front-End Module", 2002 IEEE MTT-S International Microwave Symposium Digest, IEEE, 2002, pp. 1553-1556.

Also Published As

Publication number Publication date
EP3667821A1 (de) 2020-06-17
WO2019064430A1 (ja) 2019-04-04
KR20200035161A (ko) 2020-04-01
EP3667821B1 (de) 2023-11-29
WO2019064683A1 (ja) 2019-04-04
JPWO2019064683A1 (ja) 2019-11-14
EP3667821A4 (de) 2020-08-26
JP6516939B1 (ja) 2019-05-22
US20200395676A1 (en) 2020-12-17
KR102218801B1 (ko) 2021-02-22

Similar Documents

Publication Publication Date Title
US20220393356A1 (en) Patch antenna
US9698487B2 (en) Array antenna
JP6807707B2 (ja) アンテナ装置
US9548544B2 (en) Antenna element for signals with three polarizations
US9590314B2 (en) Circularly polarized connected-slot antenna
EP2917963B1 (de) Dualpolarisationsstromschleifenradiator mit integriertem balun
US9735475B2 (en) Low cost antenna array and methods of manufacture
EP2533362B1 (de) Mikrostreifenantenne und radarmodul
US6166692A (en) Planar single feed circularly polarized microstrip antenna with enhanced bandwidth
EP3642906B1 (de) Breitbandige antennengruppe
WO2014008508A1 (en) Compact dual band gnss antenna design
US11183771B2 (en) Array antenna device
US10804609B1 (en) Circular polarization antenna array
TWI786852B (zh) 天線結構和天線封裝
US10230172B1 (en) Thin metal ultra-wideband antenna array systems and methods
JP2015171108A (ja) パッチアンテナ
CN216750286U (zh) 小型化圆极化天线
Kittiyanpunya et al. Design of pattern reconfigurable printed Yagi-Uda antenna
CN110767982A (zh) 天线结构及具有该天线结构的电子装置
KR101862753B1 (ko) 다중대역 적층 마이크로 스트립 패치안테나
JP6398653B2 (ja) パッチアンテナ
JP2013187731A (ja) アンテナ装置
JP2013135262A (ja) アンテナ装置及び電子機器
GB2598131A (en) Miniature antenna with omnidirectional radiation field
JP2007143021A (ja) アンテナ装置

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

AS Assignment

Owner name: MITSUBISHI ELECTRIC CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOKOKAWA, KEI;NAKAMOTO, NARIHIRO;FUKASAWA, TORU;AND OTHERS;SIGNING DATES FROM 20191217 TO 20191223;REEL/FRAME:051809/0856

STPP Information on status: patent application and granting procedure in general

Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE