US11144142B2 - Flexible touch screen, manufacturing method thereof and display device - Google Patents

Flexible touch screen, manufacturing method thereof and display device Download PDF

Info

Publication number
US11144142B2
US11144142B2 US16/390,216 US201916390216A US11144142B2 US 11144142 B2 US11144142 B2 US 11144142B2 US 201916390216 A US201916390216 A US 201916390216A US 11144142 B2 US11144142 B2 US 11144142B2
Authority
US
United States
Prior art keywords
flexible substrate
layer
protecting layer
manufacturing
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US16/390,216
Other languages
English (en)
Other versions
US20200026381A1 (en
Inventor
Ting ZENG
Yuan Li
Qicheng CHEN
Yangjie Li
Liuyue Yin
Binghong Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Assigned to HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD. reassignment HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, QICHENG, LI, Yangjie, LI, YUAN, WANG, Binghong, YIN, Liuyue, ZENG, Ting
Publication of US20200026381A1 publication Critical patent/US20200026381A1/en
Application granted granted Critical
Publication of US11144142B2 publication Critical patent/US11144142B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H01L2251/5338—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
    • H01L51/003—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the technical field of touch display, in particular to a flexible touch screen, a manufacturing method thereof and a display device.
  • OLED organic light-emitting diode
  • the principle of the OLED display is a self-luminous technology, namely, electronic energy level transition luminescence is implemented by electron-hole filling.
  • the OLED display was first used on a mobile phone product, and lots of top-grade mobile phone products in the markets at present use OLED displays, such as S6/S7/S8 models of Samsung mobile phones and the R9 model of OPPO mobile phones.
  • flexible touch screens which are developed along with the development of the OLED displays have been gradually popularized in the field of OLED display.
  • the embodiment of the present disclosure provides a manufacturing method of the flexible touch screen.
  • the manufacturing method includes: attaching a first protecting layer to a surface of a flexible substrate; attaching a surface of the flexible substrate away from the first protecting layer to a base substrate; removing the first protecting layer; forming a touch electrode layer on a side of the flexible substrate away from the base substrate; attaching a second protecting layer to a surface of the touch electrode layer; separating the flexible substrate from the base substrate; and removing the second protecting layer.
  • a difference between a coefficient of thermal expansion of the first protecting layer and a coefficient of thermal expansion of the flexible substrate is smaller than 0.05%; and a difference between a coefficient of thermal expansion of the second protecting layer and the coefficient of thermal expansion of the flexible substrate is smaller than 0.05%.
  • a material of the first protecting layer is phenolic resin, polyethylene terephthalate or cyclo olefin polymer; and a material of the second protecting layer is phenolic resin, polyethylene terephthalate or cyclo olefin polymer.
  • attaching the surface of the flexible substrate away from the first protecting layer to the base substrate includes: forming a temperature-controlled bonding layer on the base substrate; and attaching the flexible substrate to the base substrate through the temperature-controlled bonding layer.
  • removing the second protecting layer includes: after dividing the flexible substrate on which the touch electrode layer is formed, removing the second protecting layer.
  • the method before attaching the first protecting layer to the surface of the flexible substrate, the method further includes: forming a hardened layer on each of two surfaces of the flexible substrate.
  • attaching the first protecting layer to the surface of the flexible substrate includes: forming an index matching layer on any one surface of the flexible substrate; and attaching the first protecting layer to the index matching layer.
  • forming the touch electrode layer on the side of the flexible substrate away from the base substrate includes: forming a plurality of first touch electrodes and a plurality of second touch electrodes on the side of the flexible substrate away from the base substrate; wherein the first touch electrodes and the second touch electrodes are intersected with each other, each first touch electrode has a strip-shaped structure, and each second touch electrode includes a plurality of sub-electrodes; forming a plurality of signal lines; wherein the signal lines are connected with the first touch electrodes or the second touch electrodes; forming an insulating layer on a layer where the signal lines are located; and forming a plurality of bridging lines on the insulating layer; wherein the bridging lines are configured to connect the sub-electrodes in the second touch electrodes.
  • the material of the first protecting layer is the same as the material of the second protecting layer.
  • the material of the first protecting layer and the material of the second protecting layer are the same as the material of the flexible substrate.
  • a material of the temperature-controlled bonding layer is an optically clear adhesive material.
  • the embodiment of the present disclosure provides a flexible touch screen, and the flexible touch screen is manufactured by the manufacturing method above.
  • the embodiment of the present disclosure provides a display which includes the flexible touch screen above.
  • FIG. 1 is a flow chart of a manufacturing method of a flexible touch screen according to an embodiment of the present disclosure
  • FIG. 2A to FIG. 2G are schematic diagrams of various structures corresponding to the manufacturing method according to the embodiment of the present disclosure.
  • FIG. 3A to FIG. 3M are schematic diagrams of various structures corresponding to the manufacturing method according to the embodiment of the present disclosure.
  • touch electrodes made of metal materials have lots of shortcomings, but touch electrodes made of transparent conductive oxides are relatively good in conductivity and transmittance, for example, the touch electrode can be made of indium tin oxide (ITO), and the flexible touch screen made of the transparent conductive material may occupy the market share of OLED displays for a long time.
  • ITO indium tin oxide
  • touch electrodes are required to have low sheet resistance so as to make driving chips (IC) to have driving ability; and moreover, in order to reduce power consumption of the OLED displays on touch screens, the touch electrodes are also required to be developed towards the direction of low sheet resistance value.
  • the touch electrodes of the flexible touch screens are required to have low sheet resistance, then the thicknesses of transparent conductive oxide films which are used for manufacturing the touch electrodes are required to be increased, the pressure stress of the transparent conductive oxide films can be increased along with increasing of the thicknesses of the transparent conductive oxide films, moreover flexible substrate is relatively thin generally, after being manufactured, the flexible touch screens are easy to curl when torn off from base substrate, and therefore, the yield of the flexible touch screens is affected.
  • an embodiment of the present disclosure provides a flexible touch screen, a manufacturing method thereof and a display device.
  • the embodiment of the present disclosure provides a manufacturing method of the flexible touch screen, and as shown in FIG. 1 , the manufacturing method includes the following steps.
  • a first protecting layer 102 is attached to the surface of a flexible substrate 101 , as shown in FIG. 2A .
  • the surface of the flexible substrate 101 facing away from the first protecting layer 120 is attached to a base substrate 103 , as shown in FIG. 2B .
  • the first protecting layer is removed, resulting in a structure as shown in FIG. 2C .
  • a touch electrode layer 104 is formed on the side of the flexible substrate 101 facing away from the base substrate 103 , as shown in FIG. 2D .
  • a second protecting layer 105 is attached to the surface of the touch electrode layer 104 , as shown in FIG. 2E .
  • the flexible substrate 101 is separated from the base substrate, to obtain a structure as shown in FIG. 2F .
  • the second protecting layer is removed, resulting in a structure as shown in FIG. 2G .
  • the first protecting layer is attached to the surface of the flexible substrate, the first protecting layer has a supporting effect, then the flexible substrate can be flatly attached to the base substrate, after the flexible substrate is attached to the base substrate, the first protecting layer is removed, the structure of the flexible touch screen cannot be affected.
  • the second protecting layer is attached to the flexible substrate after the touch electrode layer is manufactured, therefore the flexible substrate may not curl when separated from the base substrate, and the yield of products is improved.
  • the manufacturing method of the flexible touch screen provided by the embodiment of the present disclosure is mainly used for manufacturing an external touch screen, in other words, after being manufactured, the flexible touch screen can be attached to a display panel to realize touch display, for example, the flexible touch screen can be attached to a light exiting surface of an OLED display panel to implement flexible touch display. Moreover, the flexible touch screen can also be applied to other display panels such as a liquid crystal display panel, and the application scenarios of the foregoing manufacturing method are not limited here.
  • a touch electrode is manufactured from a transparent conductive material optionally, for example, the touch electrode can be manufactured from an ITO material, and can also be manufactured from another transparent conductive material, the material of the touch electrode is not limited here, and in the embodiment of the present disclosure, ITO is taken as an example for illustration.
  • the sheet resistance of the most commonly used ITO is 100 ⁇ / ⁇
  • a touch electrode layer can be manufactured by a roll-to-roll coating process, and because of influences of limitation of coating equipment and cracks and the like which are easily caused during rolling after coating, the minimum sheet resistance of ITO which can be manufactured by existing coating equipment is 70 ⁇ / ⁇ .
  • the widths of signal lines which are connected to the touch electrode are required to be smaller and smaller, for example, the required widths of the signal lines at present are 20 ⁇ m or below, but the resistance value of the signal lines is increased along with narrowing of the signal lines, then the sheet resistance of the touch electrode (ITO) is required to be reduced to meet the driving requirement of a driving chip (IC), and the sheet resistance of ITO is required to be 30-40 ⁇ / ⁇ at present.
  • ITO sheet resistance of the touch electrode
  • the sheet resistance is the ratio of resistivity to thickness, therefore, the lower sheet resistance value only can be achieved by increasing the thickness of ITO, ITO is thick comparatively, therefore, pressure stress is large, moreover the flexible substrate is relatively thin, and the flexible substrate on which the touch electrode layer is manufactured quite easily curls when torn off from the base substrate.
  • the first protecting layer is attached to the surface of the flexible substrate
  • the second protecting layer is attached to the flexible substrate after the touch electrode layer is manufactured, therefore, the flexible substrate is unlikely to curl when separated from the base substrate, and therefore, the comparatively thick touch electrode layer can be manufactured to meet the requirement for low sheet resistance.
  • the resistance value may be increased when the signal lines are narrowed, the resistance value of the touch electrode accounts for about 70%-80% of the total resistance, therefore, RC can be reduced by reducing the sheet resistance of the touch electrode layer, wherein R represents channel resistance, C represents capacitance, the charging time of a display device (such as a mobile phone) is shortened, and touch sensitivity is improved.
  • the flexible touch screen by manufacturing the touch electrode layer on the flexible substrate, the flexible touch screen can be obtained.
  • the flexible substrate is optionally made from a cyclo olefin polymer (COP), moreover, other materials can also be adopted, as long as the materials are flexible materials, for example, polyimide (PI), polyethersulfone resin (PES) and polyethylene terephthalate (PET) materials can also be adopted, and the material of the flexible substrate is not limited here.
  • COP cyclo olefin polymer
  • the flexible substrate is comparatively thin and soft, the flexible substrate is generally attached to the base substrate at first, then various film layers in the touch electrode layer are then manufactured on the surface of the flexible substrate, optionally the base substrate is a glass substrate, moreover, the base substrate can also be another hard substrate, and the material of the base substrate is not limited here.
  • the flexible substrate is comparatively soft and cannot be easily attached to the base substrate directly, therefore, in the embodiment of the present disclosure, the first protecting layer is attached to the surface of the flexible substrate at first and can have effect of supporting the flexible substrate, the flexible substrate can be flatly attached to the base substrate, the circumstance that excessive bubbles are generated in a process of attaching the flexible substrate to the base substrate is prevented to avoid affecting the smoothness of the touch electrode layer which is formed on the flexible substrate later, then the first protecting layer is removed, and the structure of the flexible touch screen cannot be affected.
  • the second protecting layer is attached to the touch electrode layer, is similar to the first protecting layer, and can also have a supporting effect, the flexible substrate is unlikely to curl when separated from the base substrate, then the second protecting layer is removed, and thus, the structure of the flexible touch screen cannot be affected.
  • the difference between the coefficient of thermal expansion of the first protecting layer and the coefficient of thermal expansion of the flexible substrate is smaller than 0.05%.
  • the difference between the coefficient of thermal expansion of the second protecting layer and the coefficient of thermal expansion of the flexible substrate is smaller than 0.05%.
  • the flexible substrate has certain film shrinking force, namely, when the temperature changes, the flexible substrate stretches and retracts to a certain degree, for example, the film shrinking value of the flexible substrate manufactured from a COP material is 0.4+/ ⁇ 0.05%.
  • the difference between the coefficient of thermal expansion of the first protecting layer and the coefficient of thermal expansion of the flexible substrate is large, the flexible substrate cannot be quite smooth when the first protecting layer is attached to the surface of the flexible substrate, therefore, bubbles are easily generated when the flexible substrate is attached to the base substrate, the smoothness of the flexible substrate is affected, and the various film layers of the touch electrode layer formed later also have uneven surfaces.
  • the surface of the touch electrode layer is uneven easily when the second protecting layer is attached to the touch electrode layer, and the smoothness of the flexible substrate can even be affected.
  • the first protecting layer and the second protecting layer are made from materials of which the coefficient of thermal expansion is similar to the coefficient of thermal expansion of the flexible substrate to ensure the smoothness of the various film layers on the flexible substrate, in the embodiment of the present disclosure, the difference between the coefficient of thermal expansion of the first protecting layer and the coefficient of thermal expansion of the flexible substrate and the difference between the coefficient of thermal expansion of the second protecting layer and the coefficient of thermal expansion of the flexible substrate are smaller than 0.05% optionally, moreover, the first protecting layer and the second protecting layer can also be made from the materials which are the same as the material of the flexible substrate so as to be matched with the coefficient of thermal expansion of the flexible substrate, and thus, the smoothness of the flexible substrate is ensured.
  • the material of the first protecting layer can be phenolic resin (PF), polyethylene terephthalate (PET) or cyclo olefin polymer (COP).
  • PF phenolic resin
  • PET polyethylene terephthalate
  • COP cyclo olefin polymer
  • the material of the second protecting layer is phenolic resin (PF), polyethylene terephthalate (PET) or cyclo olefin polymer (COP).
  • PF phenolic resin
  • PET polyethylene terephthalate
  • COP cyclo olefin polymer
  • the material of the first protecting layer and the material of the second protecting layer are the same. Moreover, the material of the first protecting layer and the material of the second protecting layer can be different, and are not limited here.
  • the PF, PET or COP are only optional materials provided by the embodiment of the present disclosure, and during specific implementation, the material of the first protecting layer and the material of the second protecting layer can also be other flexible materials, and are not limited here.
  • the flexible substrate is made from a COP material
  • the material of the first protecting layer and the material of the second protecting layer can be the same as the material of the flexible substrate so as to be matched with the coefficient of thermal expansion of the flexible substrate, and therefore, the contractility of the first protecting layer (or the second protecting layer) can be consistent to that of the flexible substrate.
  • a PET material or a PF material which is low in price can also be adopted, and the material of the first protecting layer and the material of the second protecting layer are not limited here.
  • the step S 102 may include the followings.
  • a temperature-controlled bonding layer 203 is formed on the base substrate 103 .
  • the flexible substrate is attached to the base substrate through the temperature-controlled bonding layer.
  • the flexible substrate is comparatively thin, the surface of the flexible substrate is comparatively smooth, therefore bubbles are easily generated between the flexible substrate and the base substrate when the flexible substrate is directly attached to the base substrate, the temperature-controlled bonding layer is formed on the base substrate, viscosity between the flexible substrate and the base substrate can be improved, and the bubbles are avoided.
  • the viscosity of the temperature-controlled bonding layer is related to the temperature, for example, the viscosity of temperature-controlled bonding layers made from some materials is gradually increased along with increasing of the temperature, thus, the flexible substrate can be attached to the base substrate well by the relation between the temperature and the viscosity, for example, the temperature-controlled bonding layer is made from the material of which the viscosity is increased along with increasing of the temperature, the flexible substrate can be flatly laid on the base substrate when the temperature is low, then the base substrate is heated to increase the viscosity of the temperature-controlled bonding layer, and therefore, the flexible substrate adheres to the base substrate. Because the viscosity of the temperature-controlled bonding layer can be controlled through the temperature, before the flexible substrate adheres to the base substrate, it can have enough time to flatly lay the flexible substrate onto the base substrate, and the smoothness of the flexible substrate can be good.
  • the temperature-controlled bonding layer can be made from an optically clear adhesive (OCA) material, the viscosity of the OCA material is increased along with increasing of the temperature.
  • OCA optically clear adhesive
  • the temperature-controlled bonding layer can also be made from other materials, and the material of the temperature-controlled bonding layer is not limited here.
  • the step S 107 can include: after the flexible substrate on which the touch electrode layer is formed is cut, the second protecting layer is removed.
  • the flexible substrate on which the touch electrode layer is formed is still quite thin, when the flexible substrate is cut after the second protecting layer is removed, the flexible substrate curls easily due to stress generated in a cutting process, or the structure of the touch electrode layer on the surface is easy to scratch, and therefore, the second protecting layer only can be removed after the flexible touch screen is cut into a plurality of single flexible touch screen bodies.
  • some module processes can further be carried out possibly, for example, the signal lines are bound, and the second protecting layer can serve as a growing film of a binding process.
  • the following step in the manufacturing method, before the step S 101 , the following step can be carried out.
  • a hardened layer 201 is formed on each of two surfaces of the flexible substrate 101 .
  • the flexibility of the flexible substrate can be improved by the hardened layers which are separately formed on the two surfaces of the flexible substrate, and then the flexible substrate is unlikely to break off.
  • the surface of the flexible substrate is comparatively smooth, the flexible substrate is directly attached to the base substrate, the flexible substrate easily slips relative to the base substrate, the bubbles are easily generated in an attaching process, the hardened layers can further be used as isolating layers, the viscosity between the flexible substrate and the base substrate is improved, and therefore, the flexible substrate is prevented from slipping relative to the base substrate.
  • the step S 101 in the manufacturing method, can the following steps.
  • an index-matching layer 202 is formed on any one surface of the flexible substrate 101 .
  • the first protecting layer 102 is attached to the index-matching layer 202 .
  • the index-matching layer is arranged on the surface of the flexible substrate and has an index-matched effect, people cannot recognize the difference between the transmittances with eyes, and the display effect can be improved.
  • the flexible substrate, the hardened layers disposed on the two surfaces of the flexible substrate and the index-matching layer can be taken as a whole to be subjected to a follow-up process.
  • FIG. 3C in order to clearly illustrate the flexible substrate, the hardened layers and the index-matching layer as a whole, the flexible substrate 101 , the hardened layers 201 and the index-matching layer 202 are enclosed with a black thick line box in the figure.
  • the flexible substrate which is manufactured in advance and is provided with the hardened layers and the index-matching layer can be attached to the first protecting layer to obtain a structure as shown in FIG. 3C . Then the structure as shown in FIG. 3C is attached to a structure as shown in FIG.
  • the temperature-controlled bonding layer is arranged on the surface of the base substrate 103 as shown in FIG. 3D
  • the hardened layers 201 are arranged on the surfaces of the flexible substrate 101 as shown in FIG. 3C to ensure that the flexible substrate 101 can be flatly attached to the surface of the base substrate 101 so as to obtain a structure as shown in FIG. 3E
  • the first protecting layer is removed to obtain a structure as shown in FIG. 3F
  • the first protecting layer is prevented from affecting the structure of the flexible touch screen.
  • the step S 104 can specifically include the following steps.
  • a plurality of first touch electrodes and a plurality of second touch electrodes are formed on the side of the flexible substrate 103 away from the base substrate 103 ; wherein the first touch electrodes and the second touch electrodes can be made of the same material by the same process, as shown in a first transparent conductive layer 204 in the figure.
  • the first touch electrodes and the second touch electrodes are intersected with each other, each first touch electrode is of a strip-shaped structure, and each second touch electrode includes a plurality of sub-electrodes.
  • a plurality of signal lines are formed.
  • the signal lines are connected with the first touch electrodes or the second touch electrodes; and the signal lines are generally disposed in a bezel region, therefore, the signal lines can be made of a metal material, and as shown in FIG. 3H , a metal layer 205 located on the first transparent conductive layer 204 shows a layer where the multiple signal lines are located.
  • an insulating layer 206 is formed on the layer (namely the metal layer 205 ) where the signal lines are located.
  • a plurality of bridging lines are formed on the insulating layer 206 .
  • the bridging lines are located in the layer where the second transparent conductive layer 207 is located.
  • the bridging lines are configured to connect the various sub-electrodes in the second touch electrodes, and therefore, each second touch electrode and the corresponding first touch electrode form a mutual capacitor to detect touch.
  • the touch electrode layer includes the first transparent conductive layer, the metal layer, the insulating layer and the second transparent conductive layer.
  • the structures of the mutual capacitors are taken as an example to illustrate the manufacturing flow of the touch electrode layer.
  • the touch electrode layer can also be of another structure, for example, a self-capacitor mode or a mutual capacitor mode of another structure can be adopted, and the structure and manufacturing flow of the touch electrode layer are not limited here.
  • the second protecting layer 105 is attached to the second transparent conductive layer 207 , so that the flexible touch screen can be smoothly separated from the base substrate to obtain a structure as shown in FIG. 3L .
  • the second protecting layer is removed to obtain a structure as shown in FIG. 3M .
  • the embodiment of the present disclosure provides a flexible touch screen, and the flexible touch screen is manufactured by the manufacturing method of the flexible touch screen. Since the principle of solving problems of the flexible touch screen is similar to the principle of solving problems of the manufacturing method, implementation of the flexible touch screen can be referred to implementation of the manufacturing method, and repeated description is omitted here.
  • the embodiment of the present disclosure provides a display device, and the display device includes the flexible touch screen, and can be applied to any of products or components with display functions such as a mobile phone, a tablet computer, a television set, a display, a notebook computer, a digital photo frame and a navigator. Since the principle of solving problems of the display device is similar to the principle of solving problems of the flexible touch screen, implementation of the display device can be referred to implementation of the flexible touch screen, and repeated description is omitted here.
  • the first protecting layer is attached to the surface of the flexible substrate, the first protecting layer has a supporting effect, the flexible substrate can be flatly attached to the base substrate, after the flexible substrate is attached to the base substrate, the first protecting layer is removed, the structure of the flexible touch screen is not affected.
  • the second protecting layer is attached to the flexible substrate after the touch electrode layer is manufactured, therefore, the flexible substrate cannot curl when separated from the base substrate, and the yield of products is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
US16/390,216 2018-07-20 2019-04-22 Flexible touch screen, manufacturing method thereof and display device Active 2039-05-09 US11144142B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810803180.5 2018-07-20
CN201810803180.5A CN109002236B (zh) 2018-07-20 2018-07-20 一种柔性触摸屏、其制作方法及显示装置

Publications (2)

Publication Number Publication Date
US20200026381A1 US20200026381A1 (en) 2020-01-23
US11144142B2 true US11144142B2 (en) 2021-10-12

Family

ID=64597203

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/390,216 Active 2039-05-09 US11144142B2 (en) 2018-07-20 2019-04-22 Flexible touch screen, manufacturing method thereof and display device

Country Status (2)

Country Link
US (1) US11144142B2 (zh)
CN (1) CN109002236B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111596779A (zh) * 2019-02-20 2020-08-28 上海和辉光电有限公司 柔性显示装置及其制造方法
CN110231891A (zh) * 2019-07-24 2019-09-13 蓝思科技（长沙）有限公司 一种柔性盖板及其制备方法、柔性oled显示屏

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7936338B2 (en) * 2002-10-01 2011-05-03 Sony Corporation Display unit and its manufacturing method
CN102729549A (zh) 2011-04-01 2012-10-17 杨子德 一种柔性转移膜及其制造方法
US20140285733A1 (en) * 2013-03-22 2014-09-25 Innolux Corporation Touch display apparatus and method for manufacturing the same
US20140367644A1 (en) * 2013-06-13 2014-12-18 Samsung Display Co., Ltd. Display apparatus having improved bending properties and method of manufacturing same
US20150185911A1 (en) * 2013-12-27 2015-07-02 Samsung Display Co., Ltd. Flexible touch panel and manufacturing method thereof
US20150216057A1 (en) * 2013-07-30 2015-07-30 Lg Chem, Ltd. Method for manufacturing flexible-embedded electrode film using heat-pressure welding transcription
US20160035801A1 (en) * 2014-08-04 2016-02-04 Lg Display Co., Ltd. Flexible display device and method of fabricating the same
CN105632347A (zh) 2016-04-01 2016-06-01 京东方科技集团股份有限公司 一种柔性面板及其制作方法、显示装置
CN106155431A (zh) 2015-03-31 2016-11-23 南昌欧菲光学技术有限公司 薄膜触控传感器组件、电容触摸屏及其贴合工艺
CN106373917A (zh) 2015-07-20 2017-02-01 Tcl集团股份有限公司 柔性显示屏的制造方法和柔性显示屏的制造设备
CN106935547A (zh) 2017-04-13 2017-07-07 京东方科技集团股份有限公司 一种柔性显示装置的制作方法及柔性显示装置
CN107357454A (zh) 2017-06-21 2017-11-17 天津宝兴威科技股份有限公司 一种带有ito消影膜的触控屏的生产工艺
CN207008583U (zh) 2017-08-16 2018-02-13 信利光电股份有限公司 一种柔性触摸屏及柔性触摸显示装置
US20180053790A1 (en) * 2014-08-30 2018-02-22 Lg Display Co., Ltd. Flexible Display Device with Side Crack Protection Structure and Manufacturing Method for the Same
US20180129317A1 (en) * 2016-11-09 2018-05-10 Dongwoo Fine-Chem Co., Ltd. Touch sensor laminate and method of manufacturing the same
CN108287622A (zh) 2017-01-10 2018-07-17 昆山国显光电有限公司 触控显示装置及其制造方法
US20180212167A1 (en) * 2016-07-11 2018-07-26 Boe Technology Group Co., Ltd. Flexible display panel, flexible display apparatus having the same, and fabricating method thereof
US20190004642A1 (en) * 2017-06-29 2019-01-03 Hannstar Display (Nanjing) Corporation Flexible panel and manufacturing method thereof
US20190165327A1 (en) * 2017-11-24 2019-05-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for manufacturing flexible touch control display screen
US20190361586A1 (en) * 2018-05-24 2019-11-28 Innolux Corporation Display device and display method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968703A (zh) * 2010-08-24 2011-02-09 深圳市中显微电子有限公司 电容式触摸屏及其厚度一致性的控制方法
KR102021564B1 (ko) * 2012-11-23 2019-09-17 삼성디스플레이 주식회사 플렉서블 터치스크린패널 및 그 제조방법
KR20170025107A (ko) * 2015-08-27 2017-03-08 크루셜텍 (주) 플렉서블 터치 스크린을 포함하는 터치 검출 장치 및 방법

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7936338B2 (en) * 2002-10-01 2011-05-03 Sony Corporation Display unit and its manufacturing method
CN102729549A (zh) 2011-04-01 2012-10-17 杨子德 一种柔性转移膜及其制造方法
US20140285733A1 (en) * 2013-03-22 2014-09-25 Innolux Corporation Touch display apparatus and method for manufacturing the same
US20140367644A1 (en) * 2013-06-13 2014-12-18 Samsung Display Co., Ltd. Display apparatus having improved bending properties and method of manufacturing same
US20150216057A1 (en) * 2013-07-30 2015-07-30 Lg Chem, Ltd. Method for manufacturing flexible-embedded electrode film using heat-pressure welding transcription
US20150185911A1 (en) * 2013-12-27 2015-07-02 Samsung Display Co., Ltd. Flexible touch panel and manufacturing method thereof
US20160035801A1 (en) * 2014-08-04 2016-02-04 Lg Display Co., Ltd. Flexible display device and method of fabricating the same
US20180053790A1 (en) * 2014-08-30 2018-02-22 Lg Display Co., Ltd. Flexible Display Device with Side Crack Protection Structure and Manufacturing Method for the Same
CN106155431A (zh) 2015-03-31 2016-11-23 南昌欧菲光学技术有限公司 薄膜触控传感器组件、电容触摸屏及其贴合工艺
CN106373917A (zh) 2015-07-20 2017-02-01 Tcl集团股份有限公司 柔性显示屏的制造方法和柔性显示屏的制造设备
CN105632347A (zh) 2016-04-01 2016-06-01 京东方科技集团股份有限公司 一种柔性面板及其制作方法、显示装置
US20180212167A1 (en) * 2016-07-11 2018-07-26 Boe Technology Group Co., Ltd. Flexible display panel, flexible display apparatus having the same, and fabricating method thereof
US20180129317A1 (en) * 2016-11-09 2018-05-10 Dongwoo Fine-Chem Co., Ltd. Touch sensor laminate and method of manufacturing the same
CN108287622A (zh) 2017-01-10 2018-07-17 昆山国显光电有限公司 触控显示装置及其制造方法
CN106935547A (zh) 2017-04-13 2017-07-07 京东方科技集团股份有限公司 一种柔性显示装置的制作方法及柔性显示装置
CN107357454A (zh) 2017-06-21 2017-11-17 天津宝兴威科技股份有限公司 一种带有ito消影膜的触控屏的生产工艺
US20190004642A1 (en) * 2017-06-29 2019-01-03 Hannstar Display (Nanjing) Corporation Flexible panel and manufacturing method thereof
CN207008583U (zh) 2017-08-16 2018-02-13 信利光电股份有限公司 一种柔性触摸屏及柔性触摸显示装置
US20190165327A1 (en) * 2017-11-24 2019-05-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for manufacturing flexible touch control display screen
US20190361586A1 (en) * 2018-05-24 2019-11-28 Innolux Corporation Display device and display method thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Chinese Office Action for corresponding application 201810803180.5 dated Apr. 14, 2021.
Chinese Office Action for corresponding application 201810803180.5 dated Dec. 3, 2020, 9 pages.
English translation of Chinese Office action for corresponding application 201810803180.5 dated Dec. 3, 2020, 13 pages (Year: 2020). *

Also Published As

Publication number Publication date
CN109002236A (zh) 2018-12-14
CN109002236B (zh) 2022-08-23
US20200026381A1 (en) 2020-01-23

Similar Documents

Publication Publication Date Title
US11042241B2 (en) Display device including touch sensor and driving method thereof
US9582041B2 (en) Touch-control display and fabrication method thereof
KR101613773B1 (ko) 터치 패널 및 그 제조 방법
US10622386B2 (en) Substrate, chip on film and electronic equipment
US10088941B2 (en) Touch control substrate and display device
US20110012841A1 (en) Transparent touch panel capable of being arranged before display of electronic device
EP2267519B1 (en) Display device
CN103064552A (zh) 触控面板显示器及其组装方法以及触控感测模块
US10671224B2 (en) Cell touch screen, method for driving the same, and display device
TWI477853B (zh) 觸控面板及其製造方法
US20170200750A1 (en) Method for manufacturing array substrate
US20160252766A1 (en) Color film substrate, method for fabricating the same touch display device
CN102645772A (zh) 触控显示面板
US20120206406A1 (en) Touch screen
CN105094394A (zh) 触控显示面板
US10950671B2 (en) Flexible touch panel, method for manufacturing the same and flexible touch device
US11144142B2 (en) Flexible touch screen, manufacturing method thereof and display device
US10620735B2 (en) Force touch module, manufacturing method thereof, display screen and display device
US20090321147A1 (en) Touch panel with patterned layer
JP2021501379A (ja) フレキシブルディスプレイ及び表示装置
CN203909741U (zh) 触控显示面板
CN103576965A (zh) 单片式触控模块
CN203455796U (zh) 触控结构
CN101763204A (zh) 触控式显示装置及其包含的触控模块
US20150103262A1 (en) Touchscreen panel and manufacturing method thereof

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

AS Assignment

Owner name: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, TING;LI, YUAN;CHEN, QICHENG;AND OTHERS;REEL/FRAME:050743/0096

Effective date: 20190318

Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, TING;LI, YUAN;CHEN, QICHENG;AND OTHERS;REEL/FRAME:050743/0096

Effective date: 20190318

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED

STCF Information on status: patent grant

Free format text: PATENTED CASE