US10408762B2 - Plasma processing apparatus, plasma processing method and plasma processing analysis method - Google Patents

Plasma processing apparatus, plasma processing method and plasma processing analysis method Download PDF

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US10408762B2
US10408762B2 US14/825,098 US201514825098A US10408762B2 US 10408762 B2 US10408762 B2 US 10408762B2 US 201514825098 A US201514825098 A US 201514825098A US 10408762 B2 US10408762 B2 US 10408762B2
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plasma processing
recipe
emission intensity
plasma
field
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US20160225681A1 (en
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Ryoji ASAKURA
Kenji Tamaki
Daisuke Shiraishi
Akira Kagoshima
Satomi Inoue
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/66—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light electrically excited, e.g. electroluminescence
    • G01N21/68—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light electrically excited, e.g. electroluminescence using high frequency electric fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the present invention relates to a plasma processing apparatus, plasma processing method, and plasma processing analysis method for processing a semiconductor wafer using a plasma.
  • etching may be performed using a substance in an ionized state (plasma state) to remove a substance on the wafer by action of the ionized substance (reaction on the wafer surface).
  • plasma state a substance in an ionized state
  • etching result The width and depth of the semiconductor device fine pattern and the processing speed of an etching apparatus for the fine pattern (etch rate) will be hereinafter called “etching result”. Due to various disturbances or change in the plasma state over time, it is difficult for the etching apparatus to achieve the same etching result even when processing is performed under the same etching conditions (hereinafter called “recipe”). For this reason, in order to stabilize the etching result, the etching apparatus adopts a control technique to change the recipe using apparatus monitor data obtained by measurement during etching (APC: Advanced Process Control).
  • the monitor data is spectroscopic measurement data which is obtained by measuring the light emitted from the plasma during etching and the reflected light on the wafer surface by a spectroscope.
  • the methods described in Japanese Unexamined Patent Application Publication No. 2013-105923 and Japanese Unexamined Patent Application Publication No. 2013-161913 are known as methods for adjusting the recipe using spectroscopic measurement data.
  • Japanese Unexamined Patent Application Publication No. 2013-105923 describes a method which uses, among apparatus monitor data including spectroscopic measurement data, a data parameter highly correlated with the etching result and adjusts the recipe based on the difference between the monitor data value and the target value for that data parameter.
  • Japanese Unexamined Patent Application Publication No. 2013-161913 describes a method which uses spectroscopic measurement data for data parameters highly correlated with the etching result (wavelength and time interval) among spectroscopic measurement data to estimate the etching result and adjusts the recipe using the estimation result.
  • the data parameters (wavelength and time interval for spectroscopic measurement data) to be used for APC are determined only according to the correlation between spectroscopic measurement data and etching result, and change in the correlation which is caused by change of the recipe is not taken into consideration. Since plasma light emission and the wafer surface condition change depending on the changed recipe parameter, the correlation between spectroscopic measurement data for the data parameters and the etching result may change. In APC, since change of the recipe is repeated using spectroscopic measurement data with a changed recipe, the correlation between spectroscopic measurement data with the data parameters used in APC and the etching result must be stabilized even with a changed recipe.
  • the present invention has an object to provide a plasma processing apparatus, plasma processing method, and plasma processing analysis method which determine a combination of a changed recipe parameter and data parameters (wavelength and time interval for spectroscopic measurement data) which ensures that change in the correlation is small even when the recipe is changed.
  • a plasma processing apparatus which performs plasma processing on a specimen under APC as control to suppress fluctuations in plasma processing by feedback control or feedforward control and has an analysis unit to find a suitable combination for APC of emission wavelength, time interval for the emission wavelength, and a parameter (recipe) for plasma processing.
  • the analysis unit obtains a first regression equation representing the correlation between emission intensity and plasma processing result, from temporal change data of the plasma processing, obtains a second regression equation representing the correlation between emission intensity and plasma processing result by changing the parameter, and finds a combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing which is suitable for APC, based on a coefficient of correlation of the first regression equation, and a difference between a gradient of the first regression equation and a gradient of the second regression equation.
  • a plasma processing apparatus which performs plasma processing on a specimen under APC as control to suppress fluctuations in plasma processing by feedback control or feedforward control and is connected with an analysis unit configured to select a suitable combination for APC of emission wavelength, time interval for the emission wavelength, and a parameter for the plasma processing.
  • the analysis unit obtains a first regression equation representing the correlation between emission intensity and plasma processing result, from temporal change data of the plasma processing, obtains a second regression equation representing the correlation between emission intensity and plasma processing result by changing the parameter, and finds a combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing which is suitable for APC, based on a coefficient of correlation of the first regression equation, and a difference between a gradient of the first regression equation and a gradient of the second regression equation.
  • a plasma processing method using a plasma processing apparatus which performs plasma processing on a specimen under APC as control to suppress fluctuations in plasma processing by feedback control or feedforward control and has an analysis unit to find a suitable combination for APC of emission wavelength, time interval for the emission wavelength, and a parameter for the plasma processing.
  • the method includes the steps of: obtaining a first regression equation representing the correlation between emission intensity and plasma processing result from temporal change data of the plasma processing by using the analysis unit; obtaining a second regression equation representing the correlation between emission intensity and plasma processing result by changing the parameter by using the analysis unit; finding a combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing which is suitable for APC, based on a coefficient of correlation of the first regression equation, and a difference between a gradient of the first regression equation and a gradient of the second regression equation by using the analysis unit; and performing plasma processing by using the plasma processing apparatus on the specimen under APC which uses the combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing as found by the analysis unit.
  • an analysis unit which finds a combination of wavelength, time interval for the wavelength, and a parameter for plasma processing which is suitable for control to suppress fluctuations in the plasma processing by feedback control or feedforward control.
  • a first regression equation representing the correlation between emission intensity and plasma processing result is obtained from temporal change data of the plasma processing;
  • a second regression equation representing the correlation between emission intensity and plasma processing result is obtained by changing the parameter;
  • a combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing which is suitable for the control is found based on a coefficient of correlation of the first regression equation, and a difference between a gradient of the first regression equation and a gradient of the second regression equation.
  • an analysis method which finds a combination of wavelength, time interval for the wavelength, and a parameter for plasma processing which is suitable for control to suppress fluctuations in the plasma processing by feedback control or feedforward control.
  • the method includes the steps of: obtaining a first regression equation representing the correlation between emission intensity and plasma processing result from temporal change data of the plasma processing; obtaining a second regression equation representing the correlation between emission intensity and plasma processing result by changing the parameter; and finding a combination of wavelength, time interval for the wavelength, and a parameter for the plasma processing which is suitable for the control, based on a coefficient of correlation of the first regression equation, and a difference between a gradient of the first regression equation and a gradient of the second regression equation.
  • the present invention it is possible to determine a combination of wavelength and time interval and a changed recipe parameter for spectroscopic measurement data which ensures that change in the correlation between spectroscopic measurement data and etching result is small even when the recipe is changed, so that etching results are stabilized.
  • FIG. 1 is a block diagram showing the general configuration of an etching apparatus according to an embodiment of the present invention
  • FIG. 2 is a block diagram showing the general configuration of the etching module of the etching apparatus according to an embodiment of the present invention
  • FIG. 3 is a graph for explaining an example of spectroscopic measurement data
  • FIG. 4 shows an example of an APC setup data table according to an embodiment of the present invention
  • FIG. 5 is a flowchart for explaining an example of control (APC) in which the recipe is changed;
  • FIG. 6 is a scatter diagram showing an example of the correlation between emission intensity monitor value and etching result
  • FIG. 7A is a diagram showing an example of change in emission intensity monitor value when APC is executed
  • FIG. 7B is a diagram showing an example of change in etching result when APC is executed.
  • FIG. 8A is a scatter diagram showing an example of the correlation between emission intensity monitor value and etching result when the recipe is fixed;
  • FIG. 8B is a scatter diagram showing an example of the correlation between emission intensity monitor value and etching result when the recipe is changed;
  • FIG. 9A is a scatter diagram showing an example of the correlation between emission intensity monitor value and etching result when the recipe is fixed, in which the difference between the correlation with the fixed recipe and the correlation with the changed recipe is small;
  • FIG. 9B is a scatter diagram showing the correlation between emission intensity monitor value and etching result when the recipe is changed, in which the difference between the correlation with the fixed recipe and the correlation with the changed recipe is small;
  • FIG. 10 shows an example of a fixed-recipe etching result data table according to an embodiment of the present invention
  • FIG. 11 shows an example of a fixed-recipe spectroscopic measurement data table according to an embodiment of the present invention
  • FIG. 12 shows an example of a changed-recipe etching result data table according to an embodiment of the present invention
  • FIG. 13 shows an example of a changed-recipe recipe data table according to an embodiment of the present invention
  • FIG. 14 shows an example of a changed-recipe spectroscopic measurement data table according to an embodiment of the present invention
  • FIG. 15 shows an example of an APC setup data candidate table according to an embodiment of the present invention
  • FIG. 16 is a flowchart showing the steps to be carried out by an apparatus manager according to an embodiment of the present invention.
  • FIG. 17 is a flowchart showing analysis steps to be taken in an arithmetic processing section according to an embodiment of the present invention.
  • FIG. 18 shows an example of an emission intensity monitor value data table according to an embodiment of the present invention.
  • FIG. 19 shows an example of an emission intensity monitor value data table in which data with a changed recipe is stored
  • FIG. 20 is a scatter diagram showing an example of the regression equation between emission intensity monitor value and etching result
  • FIG. 21A is a scatter diagram showing an example that the coefficient of the regression equation provides a high estimation accuracy
  • FIG. 21B is a scatter diagram showing an example that the coefficient of the regression equation provides a low estimation accuracy
  • FIG. 22A is a diagram showing an example of change in emission intensity monitor value with a fixed recipe
  • FIG. 22B is a diagram showing an example of change in etching result with a fixed recipe
  • FIG. 23 is a front view of the input display screen for analysis processing according to an embodiment of the present invention.
  • FIG. 24 is a front view of the display screen which shows analysis results according to an embodiment of the present invention.
  • the present invention concerns a plasma processing apparatus, plasma processing method, and plasma processing analysis method for performing etching, in which spectroscopic measurement data indicating emission intensity at different wavelengths and times in the etching process and the etching result are acquired, and as for different combinations of wavelength and time interval for spectroscopic measurement data and a changeable recipe parameter, comparison is made between the regression equation between average emission intensity and etching result with a fixed recipe and the regression equation between average emission intensity and etching result with a changed recipe for each combination of wavelength and time interval, and the combination of wavelength, time interval, and a changed recipe parameter for spectroscopic measurement data to be used for APC is determined based on the difference between the coefficients of the two regression equations. The combination thus determined is applied to the plasma processing method and plasma processing apparatus for etching or the like.
  • the above processes (1) to (3) are carried out and using the wavelength and time interval in the above-determined combination of wavelength, time interval and changed recipe parameter, an emission intensity monitor value as spectroscopic measurement data at the wavelength and time interval is calculated and the value of the changed recipe parameter determined in the above processes is changed according to the difference between the calculated emission intensity monitor value and the target emission intensity monitor value.
  • the above processes (1) to (3) are carried out, and using the wavelength and time interval in the above-determined combination of wavelength, time interval and changed recipe parameter, an emission intensity monitor value as spectroscopic measurement data at the wavelength and time interval is calculated and the value of the changed recipe parameter determined in the above processes is changed according to the difference between the calculated emission intensity monitor value and the target emission intensity monitor value.
  • the etching apparatus 1 in this embodiment includes an etching module 10 , an analysis module 20 , an input module 30 , an output module 31 , and a communication interface module (communication IF module) 32 which are interconnected through a bus 33 .
  • the etching module 10 includes a plasma processing section 11 , a spectroscope 12 , a control section 13 , a storage 14 , and an interface section (IF section) 110 .
  • the plasma processing section 11 generates plasma to process a wafer and the spectroscope 12 acquires spectroscopic measurement data including plasma light emission data and reflected light on the wafer surface while etching is under way.
  • the spectroscopic measurement data is stored in the storage 22 of the analysis module 20 through the IF sections 110 and 210 .
  • the control section 13 controls processing which is performed in the plasma processing section 11 .
  • the storage 14 has an APC setup data storage area 15 which stores the wavelength, time interval and changed recipe parameter to be used for control (APC) by the control section 13 to change the recipe. Details of the etching module 10 will be given later, referring to FIG. 2 . Also, the APC process by the control section 13 will be described in detail later.
  • the analysis module 20 performs processing to determine the combination of wavelength, time interval, and changed recipe parameter which is used for APC as control to suppress fluctuations in plasma processing by feedback control or feedforward control.
  • the analysis module 20 includes an arithmetic processing section 21 for data analysis, a storage 22 , and an interface section (IF section) 210 .
  • the storage 22 includes a fixed-recipe etching result data storage area 23 for storing results of etching with a fixed recipe, a fixed-recipe spectroscopic measurement data storage area 24 for storing spectroscopic measurement data obtained during an etching process with a fixed recipe, a changed-recipe etching result data storage area 25 for storing results of etching with a changed recipe, a changed-recipe recipe data storage area 26 for storing recipe setting values in an etching process with a changed recipe, a changed-recipe spectroscopic measurement data storage area 27 for storing spectroscopic measurement data obtained during an etching process with a changed recipe, and an APC setup data candidate storage area 28 for storing candidates for the combination of wavelength, time interval, and changed recipe parameter to be used for APC, and evaluation results thereof.
  • the arithmetic processing section 21 compares the regression equation between emission intensity and etching result with a fixed recipe with the regression equation between emission intensity and etching result with a changed recipe for each combination of wavelength, time interval, and changed recipe parameter, using the etching result data stored in the fixed-recipe etching result data storage area 23 of the storage 22 , the spectroscopic measurement data stored in the fixed-recipe spectroscopic measurement data storage area 24 , the etching result data stored in the changed-recipe etching result data storage area 25 , and the spectroscopic measurement data stored in the changed-recipe spectroscopic measurement data storage area 27 , and performs processing to determine the combination of wavelength, time interval, and changed recipe parameter to be used in APC, based on the difference in coefficient between the two regression equations.
  • the analysis processing by the arithmetic processing section 21 will be described in detail later.
  • the input module 30 includes devices to receive information entered by a user, such as a mouse and a keyboard.
  • the output module 31 includes devices to output information to the user, such as a display and a printer.
  • the communication IF module 32 is an interface which is connected to another apparatus (connectable to an inspection device for measuring the etching result, etc.) or system (connectable to an existing production management system, etc.) through the bus 33 or an external network, etc. to transmit and receive information.
  • the bus 33 interconnects the various modules ( 10 , 20 , 30 , 31 , 32 ).
  • the IF sections ( 110 , 210 , etc.) are interfaces to transmit and receive information through the bus 33 .
  • the analysis module 20 may be an independent analysis unit which is connected to the etching apparatus including the etching section 10 through the IF section 210 .
  • the etching module 10 includes a plasma processing section 11 , a spectroscope 12 , a control section 13 , a storage 14 , and an IF section 110 .
  • the plasma processing section 11 includes a chamber 111 the inside of which is air-evacuated by a vacuum exhaust means (not shown), a pair of electrodes 112 a and 112 b which generates a plasma in the air-evacuated chamber 111 supplied with radio frequency power from a power source (not shown), a window 115 for observing the inside of the chamber 111 from outside, and a gas supply section 117 for supplying etching gas for etching a wafer 114 into the air-evacuated chamber 111 .
  • the gas supply section 117 can supply several types of gas (CF4, CHF3, Ar, etc.), in which the flow rate of each type of gas is controlled.
  • the plasma processing section 11 is supplied with etching gas from the gas supply section 117 while the wafer 114 is set inside the chamber 111 and the inside of the chamber 111 is air-evacuated by the exhaust means (not shown). Then, the etching gas is supplied into the chamber 111 and a radio frequency discharge is generated between the electrodes 112 a and 112 b by applying radio frequency power from the power source (not shown) to the electrodes 112 a and 112 b to generate plasma. The wafer 114 is processed by collision of the plasma gas 113 against the wafer 114 .
  • the plasma gas 113 contains elements of the etching gas supplied from the gas supply section 117 and elements generated during processing of the wafer 114 and generates light 116 with wavelength corresponding to the elements contained in the plasma gas 113 .
  • the generated light 116 is measured by the spectroscope 12 through the window 115 .
  • the measured data is stored in the fixed-recipe spectroscopic measurement data storage area 24 of the storage 22 of the analysis module 20 through the IF section 110 .
  • an external light source (not shown) may be used to irradiate the wall surface of the chamber 111 and the wafer 114 with light so that the reflected light is measured by the spectroscope 12 .
  • the control section 13 gives commands to the plasma processing section 11 and receives spectroscopic measurement data obtained by the spectroscope 12 and performs processing to change the recipe as described later in recipe change control (Advanced Process control: APC).
  • APC Advanced Process control
  • the APC setup data storage area 15 of the storage 14 stores data which the control section 13 uses for APC.
  • FIG. 4 shows an APC setup data table 15 a as an example of the APC setup data storage area 15 .
  • the table contains a wavelength 1 field 15 b , a time interval 1 field 15 c , a wavelength 2 field 15 d , a time interval 2 field 15 e , and a changed recipe parameter field 15 f.
  • the wavelength 1 field 15 b stores information to identify the wavelength for spectroscopic measurement data to calculate the average emission intensity.
  • the time interval 1 field 15 c stores information to identify the time interval for spectroscopic measurement data to calculate the average emission intensity.
  • the wavelength 2 field 15 d stores information to identify the wavelength for spectroscopic measurement data to calculate the average emission intensity.
  • the time interval 2 field 15 e stores information to identify the time interval for spectroscopic measurement data to calculate the average emission intensity.
  • the changed recipe parameter field 15 f stores information to identify the recipe parameter (gas flow rate, etc.) to be changed in APC.
  • the processed wafer 114 is taken out from the chamber 111 and transported to another device (inspection device or the like), and then another wafer 114 is set in the etching module 10 and the wafer 114 is processed by etching.
  • the processed wafer 114 is measured in another device (inspection device or the like) to obtain pattern dimensions as the result of etching.
  • the measured pattern dimensions are stored in the etching result data storage area 23 of the storage 22 as etching result data.
  • FIG. 3 shows a waveform signal 301 as an example of spectroscopic measurement data of plasma emission measured by the spectroscope 12 .
  • the waveform signal 301 as spectroscopic measurement data has two-dimensional factors, wavelength and time, and represents the value of emission intensity measured at each wavelength and each time.
  • the value of emission intensity at each wavelength and each time is stored in the spectroscopic measurement data storage area 24 (described later) together with the ID of the wafer corresponding to the spectroscopic measurement data.
  • FIG. 5 shows an example of APC processing which is performed in the control section 13 .
  • the control section 13 loads the information on wavelength, time interval, and changed recipe parameter stored in the APC setup data storage area 15 of the storage 14 (S 101 ).
  • the control section 13 loads the information on wavelength, time interval, and changed recipe parameter stored in the APC setup data storage area 15 of the storage 14 (S 101 ).
  • a plurality of wafers are processed sequentially using the wavelength, time interval, and changed recipe parameter stored in the APC setup data storage area 15 , except for the first wafer for which the preset conditions are used.
  • the average emission intensity calculated from the waveform signal 301 stored in the fixed-recipe spectroscopic measurement data storage area 24 based on the combination of wavelength and time interval stored in the spectroscopic measurement data wavelength 1 field 15 b and time interval 1 field 15 c of the APC setup data table 15 a is divided by the average emission intensity calculated from the waveform signal 301 stored in the fixed-recipe spectroscopic measurement data storage area 24 based on the combination of wavelength and time interval stored in the spectroscopic measurement data wavelength 2 field 15 d and time interval 2 field 15 e .
  • the result of dividing the average emission intensity by the other average emission intensity as mentioned above will be hereinafter called an emission intensity monitor value.
  • the average emission intensity calculated from the waveform signal 301 stored in the fixed-recipe spectroscopic measurement data storage area 24 based on the combination of wavelength and time interval stored in the wavelength 1 field 15 b and time interval 1 field 15 c may be directly taken as an emission intensity monitor value.
  • the maximum or median value of emission intensity extracted from the waveform signal 301 stored in the fixed-recipe spectroscopic measurement data storage area 24 based on the combination of wavelength and time interval stored in the wavelength 1 field 15 b and time interval 1 field 15 c may be taken as an emission intensity monitor value.
  • control section 13 calculates the difference between the emission intensity monitor value calculated at S 102 and the target emission intensity monitor value preset by the apparatus manager is calculated (S 103 ).
  • control section 13 calculates the amount of recipe change, for example, the flow rate of etching gas supplied from the gas supply section 117 (gas flow rate) according to the difference between the emission intensity monitor value calculated at S 103 and the target emission intensity monitor value (S 104 ).
  • the recipe parameter which is changed here is the recipe parameter stored in the changed recipe parameter field 15 f.
  • the graph A 101 on the right in FIG. 5 shows an example of calculation of the amount of recipe change which is made at S 104 .
  • a 101 is a scatter diagram in which the value of each wafer (A 102 ) is plotted on the horizontal axis representing the recipe setting value and the vertical axis representing the emission intensity monitor value. The example shown in A 101 reveals that the recipe setting value and the emission intensity monitor value are correlated.
  • Line A 103 is a regression line which represents the relation between the emission intensity monitor values obtained from a plurality of points A 102 and the recipe setting value. For example, the line A 103 is drawn so that the sum of squares of the distance from each of the points A 102 is minimum.
  • ei 1 denotes the emission intensity monitor value calculated at S 102 and eit denotes the target emission intensity monitor value.
  • the amount of recipe change (drc) for the recipe parameter stored in the changed-recipe parameter field 15 f is calculated from the difference between the emission intensity monitor value (ei 1 ) and the target emission intensity monitor value (eit) using the regression line A 103 as indicated by dotted lines.
  • the control section 13 changes the recipe by the amount of recipe change calculated here for etching the next wafer. As a result of this recipe change, the emission intensity monitor value becomes closer to the target emission intensity monitor value (eit).
  • FIG. 6 is a scatter diagram in which the value of each wafer (A 201 ) is plotted on the horizontal axis representing the emission intensity monitor value and the vertical axis representing the etching result.
  • the etching result for example, er 1
  • the emission intensity monitor value for example, ei 1
  • the etching result can be made closer to the target value (ert) by executing APC so as to make the emission intensity monitor value closer to the target value (eit).
  • FIGS. 7A and 7B show changes in emission intensity monitor value and etching result when etching is performed under APC, respectively.
  • Points (A 301 , A 401 ) in FIGS. 7A and 7B represent the emission intensity monitor value and etching result for each etched wafer respectively and from the figures, it is known that the points converge around the target values (eit, ert).
  • FIG. 8A is a scatter diagram in which the value of each wafer (A 501 ) is plotted on the horizontal axis representing the emission intensity monitor value and the vertical axis representing the etching result when the recipe is fixed.
  • FIG. 22A (to which reference will be made later) is a diagram in which the emission intensity monitor value with a fixed recipe is plotted for each wafer. The figure suggests that the emission intensity monitor value changes over time.
  • FIG. 22B plots the etching result with a fixed recipe for each wafer. It also suggests temporal change.
  • FIG. 8A indicates the relation between emission intensity monitor value and etching result when temporal change occurs as shown in FIGS. 22A and 22B .
  • Line A 502 is a regression line which expresses the correlation between the emission intensity monitor values obtained from a plurality of points A 501 and the etching result. For example, the line A 502 is drawn so that the sum of squares of distance from each of the points A 501 is minimum.
  • FIG. 8B is a scatter diagram in which the value of each wafer (A 601 ) is plotted on the horizontal axis representing the emission intensity monitor value and the vertical axis representing the etching result when the recipe is changed.
  • FIG. 8B is created from data collected by experiments before execution of APC. The figure indicates the relation between the emission intensity monitor value and etching result which have changed due to recipe change, in which line A 603 is a regression line which expresses the correlation between emission intensity monitor value and etching result by the change of recipe.
  • a 602 represents the target emission intensity monitor value (eit) and the target etching result (ert).
  • Line A 502 ′ represents the regression line (A 502 ) with a fixed recipe as explained above in reference to FIG. 8A , which is included in this scatter diagram.
  • the etching result (er 1 ) changes as indicated by line A 603 ′ parallel to line A 603 and the etching result under control becomes er 2 .
  • the difference between the gradients of the lines A 603 ′ and A 502 ′ is smaller, the difference between the target etching result value (ert) and the etching result (er 2 ) at the emission intensity monitor value equal to the target value is smaller.
  • the information about the etching performed without changing a predetermined standard recipe is stored in the fixed-recipe etching result data storage area 23 and fixed-recipe spectroscopic measurement data storage area 24 of the storage 22 shown in FIG. 1 .
  • FIG. 10 shows a fixed-recipe etching result data table 23 a as an example of the fixed-recipe etching result data storage area 23 .
  • the table includes a wafer ID field 23 b and an etching result field 23 c.
  • the wafer ID field 23 b stores information which identifies the wafer 114 .
  • the value stored in the wafer ID field 23 b is associated with the value stored in the wafer ID field 24 b of the spectroscopic measurement data table 24 a (described later) so that the spectroscopic measurement data obtained during etching of each wafer is associated with the etching result.
  • the etching result field 23 c stores information which identifies the etching result. For example, it stores the result of surface pattern measurement of the etched wafer 114 identified in the wafer ID field 23 b measured by an inspection device connected to the etching apparatus 1 (for example, the dimensions of patterns formed on the wafer 114 and inter-pattern distances as measured by a measuring SEM). For each wafer, the surface pattern dimensional information is stored in the etching result data storage area 23 through the communication IF module 32 .
  • FIG. 11 shows a fixed-recipe spectroscopic measurement data table 24 a as an example of the fixed-recipe spectroscopic measurement data storage area 24 .
  • the table includes a wafer ID field 24 b , a wavelength field 24 c , a time field 24 d , and an emission intensity value field 24 e . This table is provided in the same number as the number of wafers.
  • the wafer ID field 24 b stores information which identifies the wafer 114 .
  • the value stored in the wafer ID field 24 b is associated with the value stored in the wafer ID field 23 b of the fixed-recipe etching result data table 23 a described above in reference to FIG. 10 .
  • the emission intensity value field 24 e stores measured emission intensity values at wavelengths in the wavelength field 24 c and at times in the time field 24 d.
  • the changed-recipe etching result data storage area 25 , changed-recipe recipe data storage area 26 , and changed-recipe spectroscopic measurement data storage area 27 of the storage 22 shown in FIG. 1 store information about etching performed with the predetermined standard recipe partially changed.
  • FIG. 12 shows a changed-recipe etching result data table 25 a as an example of the changed-recipe etching result data storage area 25 .
  • the table includes a wafer ID field 25 b and an etching result field 25 c.
  • the wafer ID field 25 b stores information which identifies the wafer 114 .
  • the value stored in the wafer ID field 25 b is associated with the value stored in the wafer ID field 26 b of the changed-recipe recipe data table 26 a (described later) and the value stored in the wafer ID field 27 b of the spectroscopic measurement data table 27 a (described later) so that the amount of recipe change used for etching each wafer is associated with the spectroscopic measurement data and etching result obtained by etching.
  • the etching result field 25 c stores information which identifies the etching result. For example, it stores the result of surface pattern measurement of the etched wafer 114 identified in the wafer ID field 25 b measured by an inspection device connected to the etching apparatus 1 (for example, the dimensions of patterns formed on the wafer 114 and inter-pattern distances as measured by a measuring SEM).
  • the information stored here is the result of measurement of a spot on the wafer as information which is the same as or comparable to the information in the etching result field 23 c of the fixed-recipe etching result data table 23 a .
  • the etching result field 25 c also stores the inter-pattern distance in the center of the wafer.
  • FIG. 13 shows a changed-recipe recipe data table 26 a as an example of the changed-recipe recipe data storage area 26 .
  • the table includes a wafer ID field 26 b and a recipe change amount field 26 c.
  • the wafer ID field 26 b stores information which identifies the wafer 114 .
  • the value stored in the wafer ID field 26 b is associated with the value stored in the wafer ID field 25 b of the changed-recipe etching result table 25 a (described above in reference to FIG. 12 ) and the value stored in the wafer ID field 27 b of the changed-recipe spectroscopic measurement data table 27 a (described later).
  • the recipe change amount field 26 c stores the amount of change from the standard recipe for each recipe parameter (for example, flow rate for each gas type) which is used to etch the wafer identified in the wafer ID field 26 b .
  • FIG. 13 shows gas flow rates in the recipe change amount field 26 c as an example, the parameter stored in this field is not limited to gas flow rates but the field may store recipe data such as processing chamber internal pressure, processing time, and voltage applied to the electrodes 112 a or 112 b as well.
  • FIG. 14 shows a changed-recipe spectroscopic measurement data table 27 a as an example of the changed-recipe spectroscopic measurement data storage area 27 .
  • the table includes a wafer ID field 27 b , a wavelength field 27 c , a time field 27 d , and an emission intensity field 27 e .
  • This table is provided in the same number as the number of wafers for which spectroscopic measurement data has been obtained.
  • the wafer ID field 27 b stores information which identifies the wafer 114 .
  • the value stored in the wafer ID field 27 b is associated with the value stored in the wafer ID field 25 b of the changed-recipe etching result data table 25 a described above in reference to FIG. 12 and the value stored in the wafer ID field 26 b of the changed-recipe recipe data table 26 a described above in reference to FIG. 13 .
  • the emission intensity field 27 e stores measured emission intensity values at wavelengths in the wavelength field 27 c and at times in the time field 27 d.
  • the APC setup data candidate storage area 28 of the storage 22 shown in FIG. 1 stores information as candidates for APC setup data to be stored in the APC setup data storage area 15 of the storage 14 and information on results of estimation of candidates.
  • FIG. 15 shows an APC setup data candidate table 28 a as an example of the APC setup data candidate storage area 28 .
  • the table includes an ID field 28 b , an APC setup candidates field 281 , and an evaluation result field 282 .
  • the APC setup candidates field 281 includes a monitor 1 field 281 a , a monitor 2 field 281 b , and a changed recipe parameter field 28 g .
  • the monitor 1 field 281 a includes a wavelength 1 field 28 c and a time interval 1 field 28 d
  • the monitor 2 field 281 b includes a wavelength 2 field 28 e and a time interval 2 field 28 f .
  • the evaluation result field 282 includes a fixed-recipe residual field 28 h , a changed-recipe residual field 28 i , a model difference field 28 j , and an overall evaluation field 28 k.
  • the ID field 28 b stores information which identifies the combination of data stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , time interval 2 field 28 f , and changed-recipe parameter field 28 g.
  • the wavelength 1 field 28 c stores information which identifies the candidate for the wavelength to be used for APC.
  • the value stored in row i of the wavelength 1 field (column) 28 c is called WL 1 for later explanation.
  • the time interval 1 field 28 d stores information which identifies the candidate for the time interval to be used for APC.
  • the information stored in the time interval 1 field 28 d is associated with the information stored in the wavelength 1 field 28 c .
  • the value stored in row i of the time interval 1 field (column) 28 d is called WLT 1 for later explanation.
  • the wavelength 2 field 28 e stores information which identifies the candidate for the wavelength to be used for APC.
  • the value stored in row i of the wavelength 2 field (column) 28 e is called WL 2 for later explanation.
  • the time interval 2 field 28 f stores information which identifies the candidate for the time interval to be used for APC.
  • the information stored in the time interval 2 field 28 f is associated with the information stored in the wavelength 2 field 28 e .
  • the value stored in row i of the time interval 2 field (column) 28 f is called WLT 2 for later explanation.
  • the changed-recipe parameter field 28 g stores information which identifies the candidate for the recipe parameter to be used for APC.
  • the value stored in row i of the changed-recipe parameter field (column) 28 g is called Rcp for later explanation.
  • the values in each row represent a combination of APC setting values.
  • the average emission intensity at wavelength WL 1 in the wavelength field 24 c of the spectroscopic measurement data table 24 a shown in FIG. 11 at time interval WLT 1 in the time interval field 24 d is divided by the average emission intensity at wavelength WL 2 in the wavelength field 24 c at time interval WLT 2 in the time interval field 24 d and the result of the division (quotient) is defined as an emission intensity monitor value.
  • the recipe parameter specified by changed-recipe parameter Rcp stored in row i of the changed-recipe parameter field 28 g is changed.
  • the result of dividing the average emission intensity at wavelength WL 1 in the wavelength field 27 c of the spectroscopic measurement data table 27 a shown in FIG. 14 at time interval WLT 1 in the time interval field 27 d by the average emission intensity at wavelength WL 2 in the wavelength field 27 c at time interval WLT 2 in the time interval field 27 d is also defined as an emission intensity monitor value.
  • the fixed-recipe residual field 28 h stores information which identifies the degree of correlation between emission intensity monitor value and etching result for data with a fixed-recipe when the values stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , and time interval 2 field 28 f , and the emission intensity monitor value calculated from the values in the spectroscopic measurement data table 24 a shown in FIG. 11 are used.
  • the changed-recipe residual field 28 i stores information which identifies the degree of correlation between emission intensity monitor value and etching result for data with a changed recipe when the values stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , and time interval 2 field 28 f , and the emission intensity monitor value calculated from the spectroscopic measurement data table 27 a shown in FIG. 14 are used.
  • the model difference field 28 j stores information which identifies the magnitude of difference between the following two functions: the function representing the relation between emission intensity monitor value and etching result when the values stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , and time interval 2 field 28 f and the emission intensity monitor value calculated from the spectroscopic measurement data table 24 a shown in FIG. 11 are used, and the function representing the relation between emission intensity monitor value and etching result when the values stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , and time interval 2 field 28 f and the emission intensity monitor value calculated from the spectroscopic measurement data table 27 a shown in FIG. 14 are used.
  • the smaller the value is the smaller the difference between the two functions is.
  • the overall evaluation field 28 k stores information which indicates the degree of suitableness for APC of the combination of the wavelengths, time intervals, and recipe as stored in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , time interval 2 field 28 f , and changed-recipe parameter field 28 g .
  • the field stores the weighted sum of the values stored in the relevant row of the fixed-recipe residual field 28 h , changed-recipe residual field 28 i , and model difference field 28 j .
  • a combination for which the value in the overall evaluation field 28 k is relatively small is presented to the apparatus manager and used for APC.
  • the analysis method according to this embodiment is an analysis method which determines the combination of wavelength, time interval, and recipe parameter for spectroscopic measurement data to be used for APC in the semiconductor etching process for etching a semiconductor wafer using plasma.
  • an evaluation is made of the degree of correlation between emission intensity monitor value and etching result with a fixed recipe, the degree of correlation between emission intensity monitor value and etching result with a changed recipe, and the difference between the correlation between emission intensity monitor value and etching result with a fixed recipe and the correlation between emission intensity monitor value and etching result with a changed recipe, and a suitable combination of wavelength, time interval, and recipe parameter for APC is determined.
  • This analysis method is used not only to determine the combination of wavelength, time interval and recipe but also can be used to determine the wavelength for use in APC, the time interval for use in APC, or the recipe for use in APC. For example, if one candidate is previously selected for any one factor (for example, time interval and recipe), the value of the other factor (for example, wavelength) for use in APC can be determined.
  • the apparatus manager who operates the etching apparatus 1 carries out analysis using the analysis module 20 to determine the combination of wavelength, time interval, and recipe parameter to be used in APC.
  • FIG. 16 shows the steps which the apparatus manager carries out for analysis by the analysis module 20 .
  • the apparatus manager collects spectroscopic measurement data and etching result data by etching a plurality of wafers sequentially with a fixed standard recipe (S 201 ). Data is thus stored in the fixed-recipe etching result data table 23 a shown in FIG. 10 and the fixed-recipe spectroscopic measurement data table 24 a shown in FIG. 11 .
  • the apparatus manager changes the recipe and collects spectroscopic measurement data and etching result data by etching a plurality of wafers sequentially (S 202 ).
  • the flow rate of the gas type specified by the apparatus manager is changed.
  • the amount of change may be specified by the apparatus manager or the gas flow rate may be automatically changed by a predetermined amount.
  • data may be collected by changing two or more recipe parameters.
  • the recipe may be changed for a specific part of the etching time: for example, the gas flow rate in the latter half of the etching time may be changed. Consequently, data is stored in the changed-recipe etching result data table 25 a shown in FIG. 12 , the changed-recipe recipe data table 26 a shown in FIG. 13 , and the changed-recipe spectroscopic measurement data table 27 a shown in FIG. 14 .
  • the apparatus manager enters candidates for wavelength, time interval, and changed recipe parameter on an input display screen shown in FIG. 23 (S 203 ) and starts analysis processing (S 204 ).
  • wavelength candidates wavelengths within a specific numerical range such as 201 nm and 211 nm, the emission wavelength of an element related to the etching process, such as 251 nm (emission wavelength of Si), and 675 nm (emission wavelength of Ar) may be entered.
  • etching time information such as a time interval (51-100) in the latter half of the etching time or the entire etching time (1-100) is entered.
  • As a changed recipe parameter candidate information on the changed recipe parameter used in the etching process at S 202 is entered.
  • the apparatus manager gives a command to perform analysis processing and the analysis module 20 performs analysis processing.
  • the apparatus manager enters settings for APC using the result of analysis by the analysis module 20 to perform etching (S 205 ).
  • the analysis module 20 starts analysis processing. First, combinations of wavelength candidates D 101 and D 103 , time interval candidates D 102 and D 104 , and changed recipe candidate D 105 are created from the information on wavelength candidates, time interval candidates and changed recipe candidates as entered on the display D 100 , and stored in the APC setup data candidate table 28 a shown in FIG. 15 (S 301 ).
  • the emission intensity monitor value is calculated from data with a fixed recipe (S 302 ). Also, as information indicating the degree of correlation between emission intensity and etching result with a fixed recipe, the residual of the regression equation (regression line) between emission intensity monitor value and etching result is calculated (S 303 ). Furthermore, the coefficient of the regression equation (regression line) between emission intensity monitor value and etching result is calculated (S 304 ).
  • the emission intensity monitor value with the changed recipe at the wavelength and time interval in this combination is calculated (S 305 ).
  • the residual of the regression equation (regression line) between emission intensity monitor value and etching result is calculated (S 306 ).
  • the coefficient of the regression equation (regression line) between emission intensity monitor value and etching result is calculated (S 307 ) and the estimation error of the coefficient of the regression equation (regression line) is calculated ( 308 ).
  • the difference between the coefficients of the regression equations is calculated as the information indicating the difference between the correlation of emission intensity monitor value and etching result with a fixed recipe and the correlation of emission intensity monitor value and etching result with a changed recipe (S 309 ).
  • the overall evaluation value 28 k which indicates the degree of suitableness for APC of a combination of wavelength, time interval, and changed recipe parameter is calculated from the residuals of the regression equations (regression lines) as calculated at S 303 and S 306 and the difference between the coefficients of the regression equations (equation lines) as calculated at S 309 (S 310 ).
  • the steps from S 302 to S 310 are carried out for all the combinations of wavelength candidates D 101 , D 103 , time interval candidates D 102 , D 104 , and changed recipe parameter candidate D 105 and when all calculations are finished (Yes at S 311 ), a combination of wavelength, time interval, and changed recipe parameter for which the overall evaluation value 28 k is small is presented to the apparatus manager as the wavelength, time interval, and changed recipe parameter to be used for APC (S 312 ).
  • the arithmetic processing section 21 creates a plurality of combinations of two wavelengths, two time intervals, and a changed recipe parameter, using the wavelength candidates and time interval candidate entered in the wavelength 1 input field D 101 and time interval 1 input field D 102 of the display D 100 shown in FIG.
  • the wavelength candidates and time interval candidate entered in the wavelength 2 input field D 103 and time interval 2 input field D 104 , and the changed recipe parameter candidate entered in the changed recipe parameter input field D 105 and stores each combination of wavelengths, time intervals and changed recipe parameter in the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , time interval 2 field 28 f , and changed recipe parameter field 28 g of the APC setup data candidate table 28 a shown in FIG. 15 , respectively.
  • the combinations stored there may be combinations of all wavelengths, time intervals, and changed recipe parameters entered in the input fields D 101 , D 102 , D 103 , D 104 , and D 105 .
  • the arithmetic processing section 21 assigns numbers to the first and subsequent rows in the ID field 28 b sequentially.
  • the arithmetic processing section 21 performs steps S 302 to S 310 for the combination of wavelengths, time intervals, and changed recipe parameter which is stored in each row of the APC setup data candidate table 28 a .
  • the row for which processing is performed will be called “the row concerned”.
  • the arithmetic processing section 21 creates an emission intensity monitor value data table 29 a which includes the wafer ID field 29 b , emission intensity monitor value field 29 c , and etching result field 29 d , as shown in FIG. 18 .
  • the wafer ID field 29 b of the emission intensity monitor value data table 29 a stores information which indicates the wafer for which data has been acquired, for example, information stored in the wafer ID field 23 b of the fixed-recipe etching result data table 23 a shown in FIG. 10 .
  • the emission intensity monitor value field 29 c stores the emission intensity monitor value as the first average emission intensity value (described below) divided by the second average emission intensity value (described below).
  • the first average emission intensity value is the average of values stored in the column identified by the wavelength stored in the row concerned of the wavelength 1 field 28 c of the APC setup data candidate table 28 a shown in FIG. 15 and in the time row identified by the time interval 1 field 28 d , in the emission intensity value field 24 e of the fixed-recipe spectroscopic measurement data table 24 a shown in FIG. 11 .
  • the second average emission intensity value is the average of values stored in the column identified by the wavelength stored in the row concerned of the wavelength 2 field 28 e of the APC setup data candidate table 28 a and in the time row identified by the time interval 2 field 28 f , in the emission intensity value field 24 e of the fixed-recipe spectroscopic measurement data table 24 a.
  • the etching result field 29 d of the emission intensity monitor value data table 29 a shown in FIG. 18 stores information stored in the etching result field 23 c of the fixed-recipe etching result data table 23 a.
  • the arithmetic processing section 21 calculates the square average (AveSe 1 ) of the residual of the regression equation as information which indicates the degree of correlation between emission intensity monitor value and etching result for data with a fixed recipe, using the data stored in the emission intensity monitor value data table 29 a and the following equations (Equation 1) to (Equation 5).
  • X 11 ⁇ ⁇ ⁇ x i 2 - ( ⁇ ⁇ ⁇ x i ) 2 n ( Equation ⁇ ⁇ 1 )
  • X 12 ⁇ ⁇ ⁇ y i 2 - ( ⁇ ⁇ ⁇ y i ) 2 n ( Equation ⁇ ⁇ 2 )
  • X 13 ⁇ ⁇ ⁇ x i ⁇ y i - ( ⁇ ⁇ ⁇ x i ) ⁇ ( ⁇ ⁇ ⁇ y i ) n ( Equation ⁇ ⁇ 3 )
  • a 1 X 13
  • AveSe 1 ( X 12 - a 1 ⁇ X 13 ) n ( Equation ⁇ ⁇ 5 )
  • the graph of FIG. 20 is a scatter diagram which plots the values stored in the emission intensity monitor value field 29 c and the values stored in the etching result field 29 d for each wafer ID 29 b in the emission intensity monitor value data table 29 a shown in FIG. 18 .
  • points such as A 601 which represent the values stored in the columns of the emission intensity monitor value field 29 c of the emission intensity monitor value data table 29 a , are plotted with the values stored in the emission intensity monitor value field 29 c on the horizontal axis and the values stored in the etching result field 29 d on the vertical axis.
  • the value (X 11 ) calculated by (Equation 1) represents dispersion of plotted points in FIG. 20 in the horizontal axis direction (emission intensity monitor value) and the value (X 12 ) calculated by (Equation 2) represents dispersion of plotted points in FIG. 20 in the horizontal axis direction (etching result).
  • the value (X 13 ) calculated by (Equation 3) represents the sum of products of deviation of plotted points in FIG. 20 in the horizontal axis direction and vertical axis direction, in which when the value of a plotted point in the vertical axis direction is larger, its value in the horizontal axis direction is also larger.
  • line A 602 represents a line (regression equation) in which the average square sum of distances from points is minimum.
  • the first residual square average (AveSe 1 ) calculated by (Equation 5) represents the square average of distances (residuals) between points and the line.
  • the first residual square average (AveSe 1 ) calculated by (Equation 5) is stored in the row concerned of the fixed-recipe residual field 28 h of the APC setup data candidate table 28 a shown in FIG. 15 as information for evaluation of the combination of wavelengths and time intervals in the row concerned.
  • a value other than the residual square average thus calculated may be used, provided that it indicates the degree of correlation between emission intensity monitor value and etching result.
  • it may be the reciprocal of the absolute value of the coefficient of correlation between emission intensity monitor value and etching result or the reciprocal of the square of the coefficient of correlation.
  • the arithmetic processing section 21 calculates the gradient of the regression equation (regression line) between emission intensity monitor value and etching result for data with a fixed recipe as information which indicates the direction of correlation between emission intensity monitor value and etching result.
  • the arithmetic processing section 21 calculates variable (a 1 ) on the left-hand side of (Equation 4), using (Equation 1), (Equation 3), and (Equation 4) and the values stored in the emission intensity monitor field 29 c and etching result field 29 d of the emission intensity monitor value data table 29 a shown in FIG. 18 .
  • This variable (a 1 ) represents the gradient of line A 602 in FIG. 20 .
  • the arithmetic processing section 21 uses the calculated gradient (a 1 ) at the step S 310 which will be described later.
  • the arithmetic processing section 21 creates a data table corresponding to the emission intensity monitor value data table 29 a shown in FIG. 18 , using data with a changed recipe.
  • FIG. 19 shows an emission intensity monitor value data table 29 - 2 a in which data with a changed recipe is used.
  • Rcp denotes the value stored in the row concerned with the changed recipe parameter field 28 g of the APC setup data candidate table 28 a shown in FIG. 15 .
  • the emission intensity monitor data table 29 - 2 a shown in FIG. 19 stores the data on the wafer for which the recipe parameter identified by Rcp has been changed, among the wafers for which the etching result and spectroscopic measurement data have been obtained.
  • the wafer ID field 29 - 2 b stores, as information indicating the wafer for which data has been obtained, a wafer ID among wafer IDs stored in the wafer ID field 23 b of the changed-recipe etching result data table 23 a shown in FIG. 10 , for which the value of the recipe parameter corresponding to Rcp in the recipe change amount field 26 c of the changed-recipe recipe data table 26 a shown in FIG. 13 is not 0.
  • the emission intensity monitor value field 29 - 2 c stores an emission intensity monitor value as the third average emission intensity value (described below) divided by the fourth average emission intensity value (described below).
  • the third average emission intensity value is the average of values stored in the column identified by the wavelength stored in the row concerned with the wavelength 1 field 28 c of the APC setup data candidate table 28 a shown in FIG. 15 and in the time row identified by the time interval 1 field 28 d , in the emission intensity value field 27 e of the changed-recipe spectroscopic measurement data table 27 a shown in FIG. 14 .
  • the fourth average emission intensity value is the average of values stored in the column identified by the wavelength stored in the row concerned with the wavelength 2 field 28 e of the APC setup data candidate table 28 a and in the time row identified by the time interval 2 field 28 f , in the emission intensity value field 27 e of the changed-recipe spectroscopic measurement data table 27 a .
  • the value of the wafer for which the recipe parameter identified by Rcp has been changed is stored here.
  • the etching result field 29 - 2 d of the emission intensity monitor value data table 29 - 2 a stores the value of the wafer for which the value of the recipe parameter corresponding to Rcp in the recipe change amount field 26 c shown in FIG. 13 is not 0, among the data stored in the etching result field 25 c of the changed-recipe etching result table 25 a shown in FIG. 12 .
  • the arithmetic processing section 21 calculates the residual square average (AveSe 2 ) of the regression equation as information which indicates the degree of correlation between emission intensity monitor value and etching result for data with a fixed recipe, using the following equations, (Equation 6) to (Equation 10), which are obtained by substituting the data stored in the emission intensity monitor value data table 29 a - 2 a shown in FIG. 19 in (Equation 1) to (Equation 5).
  • X 11 ′ ⁇ ⁇ ⁇ x i ′2 - ( ⁇ ⁇ ⁇ x i ′ ) 2 n ′ ( Equation ⁇ ⁇ 6 )
  • X 12 ′ ⁇ ⁇ ⁇ y i ′2 - ( ⁇ ⁇ ⁇ y i ′ ) 2 n ′ ( Equation ⁇ ⁇ 7 )
  • X 13 ′ ⁇ ⁇ ⁇ x i ′ ⁇ y i ′ - ( ⁇ ⁇ ⁇ x i ′ ) ⁇ ( ⁇ ⁇ ⁇ y i ′ ) n ′ ( Equation ⁇ ⁇ 8 )
  • a 2 X 13 ′ X 11 ′ ( Equation ⁇ ⁇ 9 )
  • AveSe 2 ( X 12 ′ - a 2 ⁇ X 13 ′ ) n ′ ( Equation ⁇ ⁇ 10 )
  • x′ i denotes the value stored in the i-th column of the emission intensity monitor value field 29 - 2 c of the emission intensity monitor value data table 29 - 2 a shown in FIG. 19 ; y′ i denotes the value stored in the i-th column of the emission intensity monitor value field 29 - 2 c ; n′ denotes the number of columns of the emission intensity monitor value data table 29 - 2 a ; and ⁇ denotes the sum of values in all the columns of the emission intensity monitor value data table 29 - 2 a.
  • the second residual square average (AveSe 2 ) calculated by (Equation 10) represents the square average of distances (residuals) between the line and the regression equation as in the case of (Equation 5).
  • the second residual square average (AveSe 2 ) is smaller.
  • the second residual square average (AveSe 2 ) calculated here is stored in the row concerned of the changed-recipe residual field 28 i of the APC setup data candidate table 28 a shown in FIG. 15 as information for evaluation of the combination of wavelengths and time intervals in the row concerned.
  • a value other than the residual square average thus calculated may be used, provided that it indicates the degree of correlation between emission intensity monitor value and etching result.
  • it may be the reciprocal of the absolute value of the coefficient of correlation between emission intensity monitor value and etching result or the reciprocal of the square of the coefficient of correlation.
  • the arithmetic processing section 21 calculates the gradient of the regression equation (regression line) between emission intensity monitor value and etching result for data with a changed recipe as information which indicates the direction of correlation between emission intensity monitor value and etching result.
  • the arithmetic processing section 21 calculates variable (a 2 ) on the left-hand side of (Equation 9), using (Equation 6), (Equation 8), and (Equation 9) and the values stored in the emission intensity monitor field 29 - 2 c and etching result field 29 - 2 d of the emission intensity monitor value data table 29 - 2 a shown in FIG. 19 .
  • This variable (a 2 ) represents the gradient of the regression equation (regression line) created from data with a changed recipe.
  • the arithmetic processing section 21 calculates information which indicates a gradient estimation error of the regression equation (regression line) obtained from data with a changed recipe, using the following equation (Equation 11):
  • FIGS. 21A and 21B are scatter diagrams which plot the values stored in the emission intensity monitor value field 29 - 2 c and the values stored in the etching result field 29 - 2 d for each wafer ID 29 - 2 b in the emission intensity monitor value data table 29 - 2 a shown in FIG. 19 .
  • points such as A 701 and A 801 which represent the values stored in the columns of the emission intensity monitor value field 29 - 2 c of the emission intensity monitor value data table 29 - 2 a shown in FIG. 19 , are plotted with the values stored in the emission intensity monitor value field 29 - 2 c on the horizontal axis and the values stored in the etching result field 29 - 2 d on the vertical axis.
  • Lines A 702 and A 802 represent lines (regression equations) in which the average square sum of distances from points is minimum.
  • Points A 703 and A 803 represent data missing from the emission intensity monitor value data table 29 - 2 a (due to a failure in data transfer from the inspection device, etc.) and lines A 704 and A 804 represent regression equations obtained by adding points A 703 and A 803 to points A 701 and A 801 .
  • the arithmetic processing section 21 calculates the value of evaluation of the difference between the direction of correlation with a fixed recipe and the direction of correlation with a changed recipe from the following (Equation 12), using the variables (a 1 ) and (a 2 ) calculated by (Equation 4) and (Equation 9) and the variable ( ⁇ a 2 ) indicating the gradient estimation error calculated by (Equation 11).
  • Equation 12 suggests that when the difference between the gradient of the regression equation with a fixed recipe and the gradient of the regression equation with a changed recipe is larger or the gradient estimation error is larger, the value (E a ) of evaluation of gradient difference on the left-hand side is larger.
  • ⁇ ei on the right-hand side represents the difference between the emission intensity monitor value control target eit and the minimum emission intensity monitor value eimin with a fixed recipe as shown in FIG. 22A .
  • the equation suggests that when the difference from the control target is larger, the amount of recipe change is larger and the contribution of gradient difference is larger.
  • the gradient estimation error of the regression equation may be calculated and added to the inside of the parentheses of (Equation 12). Also, ⁇ a 2 may be multiplied by a constant factor (1.5, 2 and so on). (X 11 ), which indicates dispersion of emission intensity monitor values with a fixed recipe, may be used instead of ⁇ ei 2 .
  • the arithmetic processing section 21 stores the value (E a ) of evaluation of gradient difference as calculated by (Equation 12) in the row concerned with the model difference field 28 j of the APC setup data candidate table 28 a.
  • the first term is a term for evaluating the degree of correlation with a fixed recipe
  • the second term is a term for evaluating the degree of correlation with a changed recipe
  • the third term is a term for evaluating the difference in correlation tendency between a fixed recipe and a changed recipe.
  • Coefficients ⁇ 1 , ⁇ 2 , and ⁇ 3 are weighting factors of the terms which are determined by the apparatus manager, etc.
  • Equation 13 suggests that when the evaluation value (E all ) calculated by (Equation 13) for a combination of wavelength, time interval, and recipe is small, it is a combination which ensures that the correlation is strong with a fixed recipe and with a changed recipe and the direction of correlation with a fixed recipe is the same as with a changed recipe.
  • the arithmetic processing section 21 stores the calculated evaluation value (E all ) in the row concerned with the overall evaluation field 28 k of the APC setup data candidate table 28 a shown in FIG. 15 .
  • step S 311 If the arithmetic processing section 21 has finished calculating overall evaluation values (E all ) for all combinations of wavelength, time interval, and changed recipe parameter, it proceeds to step S 312 or if it has not finished, it returns to step S 302 and performs processing for the next combination of wavelength, time interval and changed recipe parameter.
  • the arithmetic processing section 21 outputs the result of analysis processing on the display, specifically the values stored in the APC setup data candidate table 28 a shown in FIG. 15 and data related to scatter diagrams, and ends the processing sequence.
  • FIG. 24 shows an example of the output display screen of the output module 31 which is presented to the operator by the arithmetic processing section 21 .
  • the output display screen D 200 shown in FIG. 24 includes a table D 201 which lists the values stored in the rows of the wavelength 1 field 28 c , time interval 1 field 28 d , wavelength 2 field 28 e , time interval 2 field 28 f , changed recipe parameter field 28 g , and overall evaluation field 28 k , in the ascending order of the value stored in the overall evaluation field 28 k of the APC setup data candidate table 28 a shown in FIG. 15 .
  • D 202 is a scatter diagram of emission intensity monitor value and etching result with a fixed recipe as obtained by calculation of emission intensity monitor values using the relevant wavelengths and time intervals.
  • D 203 is a scatter diagram of emission intensity monitor value and etching result for data with a changed recipe in which the value of the relevant changed recipe parameter is changed.
  • the apparatus manager can know the combination of wavelengths, time intervals and changed recipe parameter to be used for APC by checking the output display screen D 200 shown in FIG. 24 .
  • the combination of wavelengths 2402 , 2404 , time intervals 2403 , 2405 , and changed recipe parameter 2406 which corresponds to the smallest value of overall evaluation 2407 and the first place of overall evaluation ranking 2401 in the table D 201 shown in FIG. 24 is stored in the columns of the APC setup data candidate table 15 a shown in FIG. 4 .
  • the control section 13 of the etching module 10 controls the plasma processing section 11 using the data stored in the APC setup data table 15 a so that the wafers 114 are etched sequentially.
  • the combination of wavelengths, time intervals and changed recipe parameter to be used for APC can be selected among many combinations of wavelengths, time intervals and changed recipe parameter, using the analysis method which is performed by the etching apparatus 1 (analysis module 20 ) according to this embodiment.
  • the wavelengths and time intervals for calculation of emission intensity monitor values can be appropriately determined from spectroscopic measurement data.
  • the recipe parameter to be changed for APC can be appropriately determined among a plurality of recipe parameters. Consequently, even when the recipe is changed, the correlation between emission intensity monitor value and etching result is stabilized with a constant tendency and the etching result is controlled with high accuracy.

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JP6730941B2 (ja) * 2017-01-10 2020-07-29 東京エレクトロン株式会社 基板処理方法及び基板処理装置
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