UA100554C2 - Устройство и способ для термической обработки заготовок, прежде всего, с помощью конвективного теплообмена - Google Patents

Устройство и способ для термической обработки заготовок, прежде всего, с помощью конвективного теплообмена

Info

Publication number
UA100554C2
UA100554C2 UAA201013633A UAA201013633A UA100554C2 UA 100554 C2 UA100554 C2 UA 100554C2 UA A201013633 A UAA201013633 A UA A201013633A UA A201013633 A UAA201013633 A UA A201013633A UA 100554 C2 UA100554 C2 UA 100554C2
Authority
UA
Ukraine
Prior art keywords
heating
sensor element
temperature
workpieces
thermally treating
Prior art date
Application number
UAA201013633A
Other languages
English (en)
Ukrainian (uk)
Inventor
Рихард Крессманн
Михаэль Шефер
Йоханнес Шталь
Кристоф Вольперт
Original Assignee
Ерза Гмбх
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ерза Гмбх filed Critical Ерза Гмбх
Publication of UA100554C2 publication Critical patent/UA100554C2/ru

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Furnace Details (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

Устройство для термической обработки заготовок, прежде всего, оснащенных электрическими и электронными элементами печатных плат, по крайней мере, с одной технологической камерой, в которой выполнена или находится, по крайней мере, одна зона нагрева или охлаждения, в которую вводится термостатированная, газообразная текучая среда, при этом заготовки проходят через зону нагрева или зону охлаждения и между заготовками и термостатированной текучей средой происходит, прежде всего, конвективный теплообмен, и, по крайней мере, с одним расположенным в технологической камере температурным измерительным элементом, в котором предусмотрен, по крайней
UAA201013633A 2008-04-28 2009-01-30 Устройство и способ для термической обработки заготовок, прежде всего, с помощью конвективного теплообмена UA100554C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008021240A DE102008021240B4 (de) 2008-04-28 2008-04-28 Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung
PCT/DE2009/000124 WO2009132607A1 (de) 2008-04-28 2009-01-30 Vorrichtung und verfahren zur thermischen behandlung von werkstücken durch insbesondere konvektiven wärmeübergang

Publications (1)

Publication Number Publication Date
UA100554C2 true UA100554C2 (ru) 2013-01-10

Family

ID=40873327

Family Applications (1)

Application Number Title Priority Date Filing Date
UAA201013633A UA100554C2 (ru) 2008-04-28 2009-01-30 Устройство и способ для термической обработки заготовок, прежде всего, с помощью конвективного теплообмена

Country Status (15)

Country Link
US (1) US9168604B2 (ru)
EP (1) EP2268441B1 (ru)
JP (1) JP5134140B2 (ru)
KR (1) KR101313451B1 (ru)
CN (1) CN102015184B (ru)
AU (1) AU2009242789B2 (ru)
BR (1) BRPI0910670A2 (ru)
CA (1) CA2722338A1 (ru)
DE (1) DE102008021240B4 (ru)
EA (1) EA201001646A1 (ru)
IL (1) IL208924A (ru)
MX (1) MX2010011596A (ru)
UA (1) UA100554C2 (ru)
WO (1) WO2009132607A1 (ru)
ZA (1) ZA201007181B (ru)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9915475B2 (en) * 2011-04-12 2018-03-13 Jiaxiong Wang Assembled reactor for fabrications of thin film solar cell absorbers through roll-to-roll processes
CN103286408B (zh) * 2012-02-24 2017-03-01 联想企业解决方案(新加坡)私人有限公司 一种热源系统
KR101491992B1 (ko) * 2013-01-08 2015-02-10 (주)에스티아이 반도체 웨이퍼의 연속 처리방법
US9029740B2 (en) * 2013-01-15 2015-05-12 Nordson Corporation Air impingement heater
US10364195B2 (en) * 2014-07-28 2019-07-30 Rolls-Royce Corporation Braze for ceramic and ceramic matrix composite components
EP3009220B1 (de) * 2014-10-17 2018-12-19 Rehm Thermal Systems GmbH Rolle-zu-Rolle-Fertigungsanlage und -verfahren für verkettete kontinuierliche und diskontinuierliche Verarbeitungsprozesse
US10293424B2 (en) 2015-05-05 2019-05-21 Rolls-Royce Corporation Braze for ceramic and ceramic matrix composite components
DE102016110040A1 (de) * 2016-05-31 2017-11-30 Endress + Hauser Gmbh + Co. Kg Fertigungslinie zum Löten
JP7156897B2 (ja) * 2018-10-10 2022-10-19 シチズン時計株式会社 工作機械
CN110919122B (zh) * 2019-11-12 2021-10-26 怡洋超微电子科技(惠州)有限公司 一种显卡生产用回流焊锡机
JP7486234B2 (ja) * 2020-05-15 2024-05-17 ピンク ゲーエムベーハー テルモジステーメ 電子アセンブリを接続するためのシステム
DE102021129131B4 (de) * 2021-11-09 2024-02-29 Ersa Gmbh Lötanlage, insbesondere eine Reflowlötanlage mit seitlich neben einem Prozesskanal vorgesehenen Lüftereinheiten

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2492220A (en) * 1945-07-16 1949-12-27 Cook Electric Co Heat-treating furnace
JPH0241770A (ja) * 1988-08-03 1990-02-09 Matsushita Electric Ind Co Ltd リフロー装置
DE3920573A1 (de) * 1989-06-23 1991-01-10 Ver Glaswerke Gmbh Kuehlkanal zum gesteuerten abkuehlen von duennen glasscheiben
KR930007148B1 (ko) * 1990-03-27 1993-07-30 마쓰다 가부시끼가이샤 열 처리장치
DE4027791C1 (ru) * 1990-09-01 1991-10-24 Karl 7298 Lossburg De Hehl
GB2248318B (en) * 1990-09-06 1994-11-02 Perkin Elmer Ltd Temperature control systems
US5232145A (en) * 1991-03-29 1993-08-03 Watkins-Johnson Company Method of soldering in a controlled-convection surface-mount reflow furnace
NL9202279A (nl) * 1992-07-29 1994-02-16 Soltec Bv Reflow-soldeermachine.
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5440101A (en) * 1993-04-19 1995-08-08 Research, Incorporated Continuous oven with a plurality of heating zones
US5577658A (en) * 1995-06-23 1996-11-26 Electrovert Usa Corp. Gas knife cooling system
US5861609A (en) * 1995-10-02 1999-01-19 Kaltenbrunner; Guenter Method and apparatus for rapid thermal processing
US5678323A (en) * 1995-11-01 1997-10-21 Domingue; Hille Apparatus and method for controlled drying of sludge
US5737851A (en) * 1996-03-01 1998-04-14 Congoleum Corporation Thermal processing unit for the preparation of plastisol-based floor coverings
US6145734A (en) * 1996-04-16 2000-11-14 Matsushita Electric Industrial Co., Ltd. Reflow method and reflow device
JPH10145037A (ja) * 1996-11-06 1998-05-29 Nihon Dennetsu Keiki Co Ltd リフローはんだ付け装置
DE29704601U1 (de) * 1997-03-13 1997-06-19 Rehm Anlagenbau Gmbh & Co Heizvorrichtung
US6222161B1 (en) * 1998-01-12 2001-04-24 Tokyo Electron Limited Heat treatment apparatus
US6062728A (en) * 1998-02-27 2000-05-16 Electronic Controls Design, Inc. Method and apparatus for profiling a conveyor oven
EP1133219A4 (en) * 1998-10-13 2004-10-27 Matsushita Electric Ind Co Ltd HEATING DEVICE AND HEATING METHOD
DE19953654A1 (de) * 1999-11-08 2001-05-23 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
DE10025472C2 (de) * 2000-05-23 2003-04-24 Rehm Anlagenbau Gmbh Dampfphasenlötanlage mit überhitztem Dampf
JP2002181634A (ja) * 2000-12-12 2002-06-26 Micro Com Co Ltd リフロー炉温度プロファイル計測用規格化センサーブロック
US6533577B2 (en) * 2001-02-02 2003-03-18 Cvd Equipment Corporation Compartmentalized oven
US6670623B2 (en) * 2001-03-07 2003-12-30 Advanced Technology Materials, Inc. Thermal regulation of an ion implantation system
JP2003031940A (ja) * 2001-07-17 2003-01-31 Sony Corp リフロー半田装置
EP1424543B1 (en) * 2001-07-27 2014-05-21 Nippon Steel & Sumitomo Metal Corporation Molten metal temperature measuring instrument
JP2003071562A (ja) * 2001-08-30 2003-03-11 Matsushita Electric Ind Co Ltd リフロー装置の排気制御方法及びリフロー装置
JP4344682B2 (ja) * 2004-12-02 2009-10-14 エスペック株式会社 流体加熱装置、並びに、試験装置
US7284389B2 (en) * 2005-01-21 2007-10-23 Hewlett-Packard Development Company, L.P. Two-fluid spray cooling system
GB0512184D0 (en) * 2005-06-15 2005-07-20 Rolls Royce Plc Method and apparatus for the treatment of a component
TWI501828B (zh) * 2012-03-13 2015-10-01 晶片壓合裝置及方法

Also Published As

Publication number Publication date
EP2268441B1 (de) 2017-03-22
EA201001646A1 (ru) 2011-06-30
BRPI0910670A2 (pt) 2018-03-27
WO2009132607A1 (de) 2009-11-05
IL208924A (en) 2013-11-28
IL208924A0 (en) 2011-01-31
KR101313451B1 (ko) 2013-10-01
AU2009242789B2 (en) 2012-03-22
CA2722338A1 (en) 2009-11-05
CN102015184B (zh) 2015-04-22
ZA201007181B (en) 2011-06-29
EP2268441A1 (de) 2011-01-05
KR20110018873A (ko) 2011-02-24
CN102015184A (zh) 2011-04-13
DE102008021240B4 (de) 2012-11-22
US9168604B2 (en) 2015-10-27
US20110039219A1 (en) 2011-02-17
MX2010011596A (es) 2011-05-25
JP5134140B2 (ja) 2013-01-30
DE102008021240A1 (de) 2009-10-29
JP2011519154A (ja) 2011-06-30
AU2009242789A1 (en) 2009-11-05

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