TWM653819U - Heat dissipation device and mini host with the heat dissipation device - Google Patents

Abstract

The present invention relates to a heat dissipation device and a mini mainframe with the heat dissipation device, wherein the heat dissipation device is used to be installed in a mini case, the mini case is provided with a mainframe, the heat dissipation device comprises a support frame fixed to one side of the mainframe; a fan fixed to the support frame; a heat conduction component having a heat conduction end and a heat dissipation end, the heat conduction end being used to be attached to the other side of the mainframe; a heat dissipation component having a plurality of heat dissipation fins, each heat dissipation fin being connected to the heat dissipation end, and each heat dissipation fin being located on one side of the mainframe; thereby achieving the improvement of heat dissipation efficiency, the entire heat dissipation device can also be combined with the mainframe and the mini case in a compact manner, and has the effect of improving heat dissipation efficiency without increasing the overall volume.

Description

Heat dissipation device and mini host with the heat dissipation device

The invention relates to a heat dissipation device, in particular to a heat dissipation device used for a mini host and a mini host having the heat dissipation device.

In order to pursue the trend of being thinner and smaller, the overall size of existing computer hosts has been greatly reduced compared to previous hosts. Its length and width are only about 10 centimeters, and its height is about 5 centimeters. Therefore, the overall internal space has been greatly reduced. However, in order to maintain a certain performance, the heat generated by the internal electronic components will also increase. High temperature will reduce the operating performance of electronic components and even cause damage to electronic components. Therefore, how to improve the heat dissipation performance of electronic components in a limited space and maintain the stability of computer operation is a topic that needs to be improved.

In view of the shortcomings and deficiencies of the prior art, the present invention provides a heat dissipation device and a mini host having the heat dissipation device, which achieves the purpose of improving the heat dissipation performance without increasing the additional volume by compactly arranging various heat dissipation components in a mini case.

In order to achieve the above-mentioned creative purpose, the technical means adopted by the present invention is to design a heat dissipation device, which is used to be installed in a mini case, the mini case is provided with a motherboard, the motherboard has a CPU, and the heat dissipation device includes: A support frame, which is used to be fixed on one side of the motherboard; A fan, which has an air inlet and an air outlet, and the fan is fixed on the support frame; A heat conduction component, which has a heat conduction end and a heat dissipation end, the heat conduction end is used to be attached to the CPU and is located on the other side of the motherboard; A heat dissipation component, which has a plurality of heat dissipation fins, each of which is connected to the heat dissipation end of the heat conduction component, and each of which is located on one side of the motherboard and adjacent to the air outlet.

In order to achieve the above-mentioned creative purpose, the technical means further adopted by the present invention is to design a mini host, which includes: A mini case, one side of which is formed with a plurality of heat dissipation holes; A heat dissipation device as described above, which is arranged in the mini case, and each heat dissipation fin is adjacent to each heat dissipation hole.

Furthermore, the heat dissipation device, wherein the heat conductive component comprises a water-cooled heat sink, a pump and a plurality of water pipes, the heat dissipation component comprises a water-cooled radiator, the water-cooled heat sink has a first water inlet and a first water outlet, the water-cooled heat sink is fixedly mounted on the heat conductive component, the pump has a second water inlet and a second water outlet, the pump is fixedly mounted on the motherboard, each of the heat dissipation fins is installed in the water-cooled radiator, the water-cooled radiator has a third water inlet and a third water outlet, the water-cooled radiator is arranged on the fixing frame and is adjacent to each of the heat dissipation holes, the two ends of one of the water pipes are respectively connected to the first water outlet and the third water inlet, the two ends of another of the water pipes are respectively connected to the third water outlet and the second water inlet, and the two ends of another of the water pipes are respectively connected to the second water outlet and the first water inlet.

Furthermore, in the heat dissipation device, the pump is located between the water-cooled heat sink and the water-cooling row.

Furthermore, in the heat dissipation device, the heat conducting component and the heat dissipation component are arranged in adjacent straight lines.

Furthermore, in the heat dissipation device, the heat conducting component is an ultra-thin heat spreader.

Furthermore, in the heat dissipation device, the pump is a thin pump.

Furthermore, in the heat dissipation device, the air inlet and the air outlet of the fan are located on two side surfaces that are perpendicular to each other.

Furthermore, in the heat dissipation device, the support frame includes a top plate and a plurality of supporting legs, the top plate is penetrated by a vent hole, each supporting leg is protruded on a side surface of the top plate, each supporting leg is used to be fixed to the motherboard, and the air inlet of the fan is connected to the vent hole.

The advantage of the present invention is that the overall heat dissipation device is compactly combined with the motherboard and the mini case, so that the heat dissipation performance can be improved without increasing the overall volume, which has the effect of saving costs and reducing the overall volume. The aforementioned structure can be applied to both air cooling and water cooling, and has a high degree of versatility.

The following is a combination of drawings and preferred embodiments of the present invention to further illustrate the technical means used by the present invention to achieve the intended creative purpose.

Please refer to FIG. 1 and FIG. 2 , the heat dissipation device of the first embodiment of the present invention is used to be installed in a mini case 50 . In order to facilitate viewing of the internal structure, part of the outer case is removed first. A motherboard 60 is disposed in the mini case 50 . The heat dissipation device includes a support frame 10 , a fan 20 , a heat conducting component 30 and a heat dissipation component 40 .

Please refer to Figures 2 and 3. The support frame 10 includes a top plate 11 and a plurality of support legs 12. The top plate 11 is penetrated by a vent hole 111. Each support leg 12 is protruded from a side surface of the top plate 11. Each support leg 12 is used to be fixed to the aforementioned motherboard 60, but this is not limited to this. The form of the support frame 10 can be changed according to user needs.

Please refer to Figures 1 to 5. The fan 20 has an air inlet 21 and an air outlet 22. The fan 20 is fixed on the support frame 10 and the air inlet 21 is aligned with the vent 111. The air inlet 21 is connected to the vent 111. In this embodiment, the fan 20 is a blower fan, and its air inlet 21 and air outlet 22 are located on two side surfaces that are perpendicular to each other, but this is not limited to this. The form of the fan 20 can be changed according to user needs.

The heat conducting component 30 is a T-shaped sheet material having a heat conducting end 31 and a heat dissipating end 32. The heat conducting component 30 is disposed on the motherboard 60 and the heat conducting end 31 is close to the heat source of the motherboard 60, and the heat dissipating end 32 is close to the air outlet 22 of the fan 20. In this embodiment, the heat conducting component 30 is an ultra-thin vapor chamber (VC), which has the advantages of a large contact area and can be directly attached to the heat source, but is not limited to this. The form of the heat conducting component 30 can be changed according to user needs.

The heat dissipation assembly 40 has a plurality of heat dissipation fins 41 . The heat dissipation assembly 40 is disposed at the heat dissipation end 32 of the heat conductive assembly 30 and is located in front of the air outlet 22 of the fan 20 . The heat conductive assembly 30 and the heat dissipation assembly 40 are arranged in adjacent straight lines, but not limited thereto.

When assembling the present invention, the mini case 50 mentioned above is used as an example. A plurality of heat dissipation holes 51 are formed on one side of the mini case 50. A motherboard 60 is installed in the mini case 50. The motherboard 60 is provided with a CPU 61. The support frame 10 is locked to one side of the motherboard 60 by each support foot 12. The heat conducting end 31 of the heat conducting assembly 30 is attached to the CPU 71 and is located at the motherboard. On the other side of the board 60, the heat dissipation end 32 extends laterally out of the motherboard 60, so that one side of each heat dissipation fin 41 of the heat dissipation assembly 40 faces the air outlet 22 of the fan 20, and each heat dissipation fin 41 is located on one side of the motherboard 60 and extends toward the opposite sides of the motherboard 60, and the other side of each heat dissipation fin 41 faces the position of each heat dissipation hole 51 of the mini case 50.

The heat generated by the CPU 61 is conducted to the heat dissipation end 32 to each heat dissipation fin 41 by the heat conduction end 31 of the heat conduction assembly 30. After the fan 20 is started, cold air can be sucked in from the air inlet 21 and blown out from the air outlet 22 toward each heat dissipation fin 41 to cool each heat dissipation fin 41. The hot air can be discharged from the heat dissipation hole 51 to the outside of the mini case 50. In addition to improving the heat dissipation performance, the overall heat dissipation device can also be compactly connected to the motherboard 60 and the mini case 50. By combining the heat conducting component 30, in particular, the flat and large contact area characteristics of the heat conducting component 30 can improve the heat dissipation performance without increasing the overall volume compared to the existing technology that mainly uses heat pipes for heat dissipation, and can be used for electronic components with higher power and higher heat generation. At the same time, compared to covering the heat source by splicing heat pipes, the new type can reduce the amount of materials produced and the complexity of manufacturing, and has the effect of saving costs and reducing the overall volume. The first embodiment mentioned above is an embodiment of air-cooled heat dissipation.

Please refer to FIG. 6 to FIG. 10 , which are the second embodiment of the present invention (water cooling heat dissipation form), wherein the support frame 10 and the fan 20 are the same as those of the first embodiment, and the main difference lies in the difference between the heat conduction component 30A and the heat dissipation component 40A. The heat conduction component 30A is fixed to the motherboard 60 and is close to the CPU 61. The heat conduction component 30A includes a water cooling heat sink 42A, a pump 43A and a plurality of water pipes 45A. The heat dissipation component 40A includes a water cooling radiator 44A and a fixing member 46A. The water cooling heat sink 42A has a cavity, and a plurality of heat dissipation fins are arranged in the cavity. The water cooling heat sink 42A has a first water inlet 421A and a first water outlet 422A and is connected to the cavity. The water cooling heat sink 42A is fixed to the CPU 61. The pump 43A has a second water inlet 431A and a second water outlet 432A. In this embodiment, the pump 43A is a thin pump, which helps to reduce the height of the Z axis of the overall structure. The pump 43A is fixed to the motherboard 60 by the fixing member 46A and is connected to the water cooling heat sink 42A. Therefore, when different specifications of water cooling heat sinks 42A are set for different types of heat sources, different shapes can be replaced. The fixing member 46A is connected correspondingly, so that the pump 43A and the water cooling heat sink 42A can be closely arranged, reducing the volume occupied, and the overall modular advantage, but not limited to this, the pump 43A can also be directly fixed to the motherboard 60, the water cooling radiator 44A includes the aforementioned heat sink fin 41 structure, only the structure is changed to the form of water cooling, which is a prior art and will not be repeated. The water cooling radiator 44A has a third water inlet 441A and a third water outlet 442A. The water cooling radiator 44A is arranged adjacent to each heat dissipation hole 51, and the water cooling radiator 44A is directly opposite to the fan 20, specifically, the water-cooling radiator 44A is simultaneously connected to the fixing member 46A and is located on the other side of the pump 43A relative to the water-cooling heat sink 42A, so it also has a compact component connection relationship; wherein the number of water pipes 45A is three, wherein the two ends of one water pipe 45A are respectively connected to the first water outlet 422A and the third water inlet 441A, the two ends of another water pipe 45A are respectively connected to the third water outlet 442A and the second water inlet 431A, and the two ends of another water pipe 45A are respectively connected to the second water outlet 432A and the first water inlet 421A.

By filling the pump 43A, the radiator 44A and each water pipe 45A with coolant, and using the pump 43A to drive the coolant circulation, the heat generated by the CPU 61 can be transferred to the coolant through the heat conducting component 30A, and then transported to the radiator 44A by the coolant, and the cool air blown by the fan 20 is used to dissipate the heat of the radiator 44A, thereby achieving a better heat dissipation performance than the first embodiment, and the overall structure is also compactly assembled in the mini case 50, especially the water cooling heat sink 42A, the pump 43A and the radiator 44A are arranged in a straight line and closely, which can further reduce the length of the water pipe 45A to reduce the cost, thereby achieving the effect of improving the heat dissipation performance in a limited space.

The above is only the preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as the preferred embodiment, it is not used to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes or modifications to the technical contents disclosed above as equivalent embodiments within the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

10: Support frame 11: Top plate 111: Ventilation hole 12: Support foot 20: Fan 21: Air inlet 22: Air outlet 30: Heat conduction assembly 30A: Heat conduction assembly 31: Heat conduction end 32: Heat dissipation end 40: Heat dissipation assembly 40A: Heat dissipation assembly 41: Heat dissipation fin 42A: Water cooling heat sink 421A: First water inlet 422A: First water outlet 43A: Pump 431A: Second water inlet 432A: Second water outlet 44A: Radiator 441A: Third water inlet 442A: Third water outlet 45A: Water pipe 46A: Fixing parts 50: Mini case 51: Heat dissipation hole 60: Motherboard 61: CPU

Figure 1 is a three-dimensional external view of the first embodiment of the present invention. Figure 2 is a disassembled view of the first embodiment of the present invention. Figure 3 is another disassembled view of the first embodiment of the present invention. Figure 4 is an upper view of the first embodiment of the present invention. Figure 5 is a partial cross-sectional view of the first embodiment of the present invention. Figure 6 is a three-dimensional external view of the second embodiment of the present invention. Figure 7 is a partial side view of the second embodiment of the present invention. Figure 8 is another disassembled view of the second embodiment of the present invention. Figure 9 is a partial disassembled view of the second embodiment of the present invention. Figure 10 is a partial bottom view of the second embodiment of the present invention.

10: Support frame

11: Top plate

20: Fan

40: Heat dissipation component

41: Heat sink fins

50:Mini case

51: Heat dissipation hole

Claims (9)

A heat dissipation device is used to be installed in a mini case. The mini case is provided with a motherboard. The motherboard has a CPU. The heat dissipation device includes: A support frame, which is used to be fixed on one side of the motherboard; A fan, which has an air inlet and an air outlet, and the fan is fixed on the support frame; A heat conduction component, which has a heat conduction end and a heat dissipation end, and the heat conduction end is used to be attached to the CPU and is located on the other side of the motherboard; A heat dissipation component, which has a plurality of heat dissipation fins, each of which is connected to the heat dissipation end of the heat conduction component, and each of which is located on one side of the motherboard and adjacent to the air outlet. A heat dissipation device as described in claim 1, wherein the heat conductive component comprises a water-cooled heat sink, a pump and a plurality of water pipes, the heat dissipation component comprises a water-cooled radiator, the water-cooled heat sink has a first water inlet and a first water outlet, the water-cooled heat sink is fixedly mounted on the heat conductive component, the pump has a second water inlet and a second water outlet, the pump is fixedly mounted on the motherboard, each heat sink fin is installed in the water-cooled radiator, the water-cooled radiator has a third water inlet and a third water outlet, the water-cooled radiator is arranged on the fixing frame and is adjacent to each heat dissipation hole, the two ends of one of the water pipes are respectively connected to the first water outlet and the third water inlet, the two ends of another of the water pipes are respectively connected to the third water outlet and the second water inlet, and the two ends of another of the water pipes are respectively connected to the second water outlet and the first water inlet. A heat dissipation device as described in claim 2, wherein the pump is located between the water-cooled heat sink and the water-cooling row. A heat sink as described in any one of claims 1 to 3, wherein the heat conducting component and the heat sink component are arranged in adjacent straight lines. A heat dissipation device as described in claim 4, wherein the heat conductive component is an ultra-thin heat sink. A heat sink as described in claim 2, wherein the pump is a thin pump. A heat dissipation device as described in claim 4, wherein the air inlet and the air outlet of the fan are located on two side surfaces that are perpendicular to each other. A heat dissipation device as described in claim 7, wherein the support frame includes a top plate and a plurality of supporting legs, the top plate is penetrated by a vent hole, each of the supporting legs is protruded from a side surface of the top plate, each of the supporting legs is used to be fixed to the motherboard, and the air inlet of the fan is connected to the vent hole. A mini host computer comprises: A mini case, one side of which is formed with a plurality of heat dissipation holes; A heat dissipation device as described in any one of claims 1 to 8, which is arranged in the mini case, and each heat dissipation fin is adjacent to each heat dissipation hole.