五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種電腦系統，尤指一種小型尺寸規格之桌 上型電腦系統° 【先前技術】 [0002] 桌上型個人電腦（PC)殼體基於性能與擴充性考慮一般均 具有較大之體積並且内部安裝有較多之硬體，隨著電子 產業之發展電腦中之電子元件變得越來越小並且功能亦 更具集成化。根據不同之使用需求，市場上逐漸出現了 小型尺寸規格（SFF，small form factor) PC，該等 SFF PC具有較少之硬體配置且具有較小尺寸機殼，從而 能夠佔用較少之使用空間。此外，由於SFF PC硬體配置 相對P C簡單，S F F P C還能夠減少電量之消耗》 [0003] 習知的SFF PC機殼大部分由兩件或兩件以上鐵制板材組 裝而成，於該等機殼之生產過程中，不僅需要花費衝壓 制程中模具高額之研發與使用費用，還要承擔機殼之組 裝費用。 【新型内容】 [0004]鑒於以上内容，有必要提供一種具有較佳機殼結構之電 腦系統。 [00051 一種電腦系統，該電腦系統包括一機殼、一面板與一後 板，該機殼包括一頂板、一與該頂板平行之底板與兩相 互平行之側板，該頂板、該兩側板及該底板首尾相接， 該機殼為一體成型且兩面通透形成兩相對開口，該面板 表單编號A0101 第3頁/共18頁 M379962 與後板分別封閉該兩相對開口。 [0006] 優選地，該機殼之截面為正方形。 [0007] 優選地，該機殼為擠壓成型。 .V. New description: [New technology field] [0001] The present invention relates to a computer system, especially a small-sized desktop computer system. [Prior Art] [0002] Desktop Personal Computer (PC) The housing generally has a large volume based on performance and scalability considerations and has more hardware installed inside. With the development of the electronics industry, the electronic components in the computer become smaller and more integrated. According to different usage requirements, small form factor (SFF) PCs have emerged in the market. These SFF PCs have fewer hardware configurations and have smaller size casings, which can occupy less space. . In addition, since the SFF PC hardware configuration is simpler than the PC, the SFFPC can also reduce the power consumption. [0003] The conventional SFF PC case is mostly assembled of two or more pieces of iron plate. In the production process of the shell, it is not only necessary to spend a lot of research and development and use costs of the mold in the stamping process, but also to bear the assembly cost of the casing. [New Content] [0004] In view of the above, it is necessary to provide a computer system having a better casing structure. [00051] A computer system comprising a casing, a panel and a rear panel, the casing comprising a top plate, a bottom plate parallel to the top plate and two parallel side plates, the top plate, the two side plates and the The bottom plate is connected end to end. The casing is integrally formed and two sides are transparent to form two opposite openings. The panel form number A0101 3/18 M379962 and the rear plate respectively close the two opposite openings. [0006] Preferably, the casing has a square cross section. [0007] Preferably, the casing is extruded. .
[0008] 優選地，該機殼包括有四個拐角部，每一拐角部向内凸 設有一用於鎖固該面板之固定部。 [0009] 優選地，該機殼内設置有主機板，該四個固定部中至少 兩固定部開設有用於導入該主機板之固定槽。 [0010] 優選地，該機殼包括有四個拐角部，每一拐角部之外表 面設有倒角。 [0011] 優選地，電腦系統還包括一設置於該機殼内之隔板。 [0012] 優選地，每一側板内側凸設一截面呈“凹”形用於導入 該隔板之承載部。 [0013] 優選地，該承載部之延伸方向平行於該頂板。 [0014] 優選地，每一承載部位於所在側板之中部。 [0015] 相較於習知技術，該電腦系統採用一體成形之機殼結構 ，相對多件之鐵制機殼於一定程度上降低了生產費用。 【實施方式】 [0016] 請參閱圖1，本創作電腦系統為一小型尺寸規格（SFF， small form factor)電腦系統。該電腦系統包括一機 殼10、一隔板15、一面板20、一後板30及設置於該機殼 10與面板20内之複數電腦硬體。該電腦系統内之硬體包 括一設置於該面板20上之風扇40、複數磁碟機50，一電 表單編號A0101 第4頁/共18頁[0008] Preferably, the casing includes four corner portions, and each of the corner portions is convexly provided with a fixing portion for locking the panel. [0009] Preferably, a motherboard is disposed in the casing, and at least two fixing portions of the four fixing portions are provided with fixing slots for guiding the motherboard. [0010] Preferably, the casing includes four corner portions, and the outer surface of each corner portion is chamfered. [0011] Preferably, the computer system further includes a partition disposed in the casing. [0012] Preferably, a bearing surface having a "concave" shape for introducing into the partition is protruded inside the side plate. [0013] Preferably, the extending direction of the bearing portion is parallel to the top plate. [0014] Preferably, each of the carrying portions is located in the middle of the side plate. [0015] Compared with the prior art, the computer system adopts an integrally formed casing structure, and the relatively large number of iron casings reduce the production cost to a certain extent. [Embodiment] [0016] Referring to FIG. 1, the computer system of the present invention is a small form factor (SFF) computer system. The computer system includes a casing 10, a partition 15, a panel 20, a rear panel 30, and a plurality of computer hardware disposed in the casing 10 and the panel 20. The hardware in the computer system includes a fan 40, a plurality of disk drives 50 disposed on the panel 20, and an electric form number A0101. Page 4 of 18
M379962 * I 源60、一主機板70及分別安裝於該主機板70上之一散熱 器80、複數記憶體90及一擴充卡100。 [0017] 續請參閱圖2，該機殼10為鋁擠壓一體成型，該機殼10之 橫截面為正方形，該機殼10兩面通透而形成兩相對之開 口。該機殼10之通透方向為第一方向。該機殼10包括一 頂板11、一與該頂板11平行之底板13及兩相互平行之側 板12，該頂板11、兩側板12及該底板13首尾相接圍成一 容置空間。每一側板12内側凸設一沿第一方向延伸、截 面呈“凹”形之承載部122。該機殼10之四個拐角部向内 凸設有四個沿第一方向延伸之固定部124，每一固定部 124面向該機殼10之外側開設一固定孔1242，該機殼10 下端之兩固定部124相對開設有兩固定槽1246。該機殼 10之四個拐角部之外側表面設有倒角。M379962 * I source 60, a motherboard 70 and a heat sink 80, a plurality of memories 90 and an expansion card 100 respectively mounted on the motherboard 70. [0017] Referring to FIG. 2, the casing 10 is integrally formed by extrusion of aluminum. The casing 10 has a square cross section, and the casing 10 is transparent on both sides to form two opposite openings. The through direction of the casing 10 is the first direction. The casing 10 includes a top plate 11, a bottom plate 13 parallel to the top plate 11, and two side plates 12 that are parallel to each other. The top plate 11, the two side plates 12 and the bottom plate 13 are connected end to end to form an accommodation space. A bearing portion 122 extending in the first direction and having a "concave" cross-section is protruded from the inner side of each of the side plates 12. The four corner portions of the casing 10 are inwardly provided with four fixing portions 124 extending in the first direction. Each fixing portion 124 defines a fixing hole 1242 facing the outer side of the casing 10, and the lower end of the casing 10 Two fixing portions 124 are oppositely provided with two fixing grooves 1246. The outer side surfaces of the four corner portions of the casing 10 are chamfered.
[0018] 續請參閱圖3，該隔板15為塑膠材料，該隔板15可滑動卡 入該機殼10之兩承載部122之間而將該機殼10内之容置空 間分割為一上隔間及一下隔間。該隔板15之設置方向平 行於該頂板11與該底板13。於本實施方式中，該隔板15 平分該容置空間。 [0019] 該上隔間内安裝有該磁碟機50與電源60。於本實施方式 中，該磁碟機50包括多個，每一磁碟機50為一3. 5寸硬碟 機；該隔板15向上可凸設複數用於隔擋該複數磁碟機50 之隔擂塊（圖未示），為配合該磁碟機上端之固定，該機 殼10可相應之配置隔擋塊（圖未示）以卡固該磁碟機；該 電源60外殼為截面呈矩形之長方體。該上隔間之高度略 高於該磁碟機50之寬度。 表單編號A0101 第5頁/共18頁 M379962 [0020] 該下隔間内安裝有該主機板70、該散熱器80、該記憶體 90及該擴充卡100。該散熱器80、該記憶體90及該擴充 卡100分別插接於該主機板70上。該記憶體90及該擴充卡 100沿該第一方向設置。該散熱器80為一CPU散熱器。該 主機板70可從該機殼10之兩固定槽1246滑動卡入該機殼 10内。 [0021] 本創作實施方式中之電腦系統，具有上下分隔之隔間， 隔間内安裝有具有相適配大小之磁碟機5 0、電源6 0及主 機板70。這樣之配置方式可實現佔用最小體積之排配。 [0022] 續請參閱圖4，該面板20為塑膠材料。該面板20開設有複 數平行之散熱槽22。該面板20之四角部對應該機殼10之 四個固定孔設有四個螺孔24。該風扇40可藉由螺絲或卡 扣結構鎖固於該面板20靠近該散熱槽22之内側。於本實 施方式中，該風扇40之吹風面積約為該面板20橫截面面 積即該機殼10之橫截面面積之四分之一，該風扇40之吹 風面積最好不小於該機殼10橫截面面積之四分之一。 [0023] 續請參閱圖5，組裝時，先將該隔板15導入該機殼10内， 將‘該磁碟機50豎直間隔地裝入該上隔間内使每一磁碟機 50垂直於該隔板15設置並使每一磁碟機50之一側緊貼於 該頂板11以增加磁碟機50之散熱效果。再將該電源60沿 該第一方嚮導入該上隔間。此時，該磁碟機50與該電源 60下端直接接觸該隔板15。再將該散熱器80、該記憶體 90及該擴充卡100分別安裝於該主機板70，再將該主機板 70導入該下隔間内。此時，該散熱器80位於該磁碟機50 之正下方。將該風扇40鎖固於該面板20之内表面，再將 表單編號A0101 第6頁/共18頁 該面板20藉由螺絲鏔固於該機殼1〇上。將該後板3〇固定 於該機殼10之後側。此時，於該組裝後之電腦系統内， 該風扇40正向面對於該散熱器8〇，該風扇4〇之上端略高. 於該上隔間。 [0024] 續請參閱圖6，散熱時，該風扇4〇同時起到散熱器8〇散熱 及系統散熱之作用。該風扇4 〇吹出之氣流沿該第一方向 直線流動，該風扇40主要風力吹向該散熱器用於給電 腦系統内主要之散熱源散熱器8〇散熱，同時，該風扇4〇 產生之側向氣流流向該記憶體9 〇與該擴充卡丨〇 〇，上部氣 流流入該上隔板用於給該磁碟機50散熱。風扇4〇產生之 氣流可全部從該後板30流出。這樣之電腦系统配置，可 減少電腦系統内風扇之配置數量，無需添加額外之散熱 器導風罩，能夠於電腦系統有限之空間内擁有最直接與 最佳化之散熱效果。 [0025] 於一般之電腦系統中，磁磲機往往會受到周圍振動源， 如系統風扇之振動景> 響產生振動或共振，減小其使用壽 命。本創作之實衫式中’祕扇4()設置於該與該機殼 10分離安裝之面板20，該磁碟機50安裝於該機殼1〇内， 該風扇40遠離接觸該磁碟機5(^此外，該面板2〇與該機 殼10具有不同之材料，二者之接觸可有效地減小其間之 振動傳遞。這樣該電腦系統可有效地把磁碟機5〇與機殼 10内振動源風扇4G分離排配，最大程度地減小風扇4〇對 磁碟機50之振動影響。於本創作之其他實施方式中，為 達到該風扇40與該辦機5()隔離安裝之目該風扇4〇可根 據需要安裝於該後板3〇而實現同樣之效杲，因此，為實 第7頁/共18頁 表單編蜣A0101 M379962 現該風扇40與該磁碟機50隔離安裝，與該機殼10分離安 裝之面板2 0、後板30或其他固定元件定義為一固定板。 進一步，該磁碟機50工作時亦會產生振動，將該磁碟機 50與該主機板70有塑膠隔板15分隔設置可減小該磁碟機 50工作時對該主機板70之振動影響。 [0026] 本創作之實施方式中，該機殼10採用鋁擠壓一體成型之 方式製成，這樣即可省去一般機殼鐵件衝壓成型高額之 模具費用與組裝費用，又可直接藉由機殼10有效地加強 電腦系統内之散熱。 [0027] 本創作之另一實施方式中，該上下隔間内之硬體排配可 / 相互對調而不影響電腦系統之工作效能，這樣之電腦系 統中，該上隔間内安裝有該主機板70、該散熱器80、該 記憶體90及該擴充卡100 ;該下隔間内安裝有該磁碟機50 與電源60。該風扇40仍正向面對於該散熱器80又略低於 該上隔間而實現同樣之散熱效果。該機殼10内之上下隔 間可根據需要做進一步分割而使該機殼10内之隔間包括 至少兩個。 [0028] 綜上所述，本創作確已符合新型專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 [0029] 圖1係本創作電腦系統之立體分解圖。 表單編號A0101 第8頁/共18頁 M379962 [0030] 圖2係圖1電腦系統中機殼之立體放大圖。 [0031] 圖3係圖1機殼與機殼内硬體之立體組裝圖。 [0032] 圖4係圖1中前板與風扇另一視角之立體組裝圖。 [0033] 圖5係圖1組裝後移去前板之立體組裝示意圖。 [0034] 圖6係圖1組裝後之左視剖視圖。 【主要元件符號說明】 [0035] 機殼：10[0018] Referring to FIG. 3, the partition plate 15 is made of a plastic material, and the partition plate 15 is slidably inserted between the two bearing portions 122 of the casing 10 to divide the accommodation space in the casing 10 into one. Upper compartment and next compartment. The partition plate 15 is disposed in parallel with the top plate 11 and the bottom plate 13. In the embodiment, the partition 15 divides the accommodating space. [0019] The disk drive 50 and the power source 60 are mounted in the upper compartment. In this embodiment, the disk drive 50 includes a plurality of disks 50 each of which is a 3.5-inch hard disk drive; the partition plate 15 can be protruded upwardly for blocking the plurality of disk drives 50. The partitioning block (not shown), in order to cooperate with the fixing of the upper end of the disk drive, the casing 10 can be correspondingly configured with a blocking block (not shown) to fix the disk drive; the power supply 60 has a cross section A rectangular parallelepiped. The height of the upper compartment is slightly higher than the width of the disk drive 50. Form No. A0101 Page 5 of 18 M379962 [0020] The motherboard 70, the heat sink 80, the memory 90 and the expansion card 100 are mounted in the lower compartment. The heat sink 80, the memory 90 and the expansion card 100 are respectively inserted into the motherboard 70. The memory 90 and the expansion card 100 are disposed along the first direction. The heat sink 80 is a CPU heat sink. The motherboard 70 can be slid into the casing 10 from the two fixing slots 1246 of the casing 10. [0021] The computer system in the embodiment of the present invention has a compartment partitioned up and down, and a disk drive 50 having a suitable size, a power source 60, and a host board 70 are installed in the compartment. This configuration allows for a minimum footprint. [0022] Continuing to refer to FIG. 4, the panel 20 is a plastic material. The panel 20 is provided with a plurality of parallel heat sinks 22. The four corners of the panel 20 are provided with four screw holes 24 corresponding to the four fixing holes of the casing 10. The fan 40 can be locked to the inner side of the heat sink 20 by the screw or the snap structure. In the present embodiment, the air blowing area of the fan 40 is about one quarter of the cross-sectional area of the panel 20, that is, the air blowing area of the fan 40 is preferably not less than the horizontal cross-section of the casing 10. One quarter of the cross-sectional area. [0023] Continuing to refer to FIG. 5, when assembling, the partition 15 is first introduced into the casing 10, and the disk drive 50 is vertically spaced into the upper compartment to make each disk drive 50. Vertically disposed on the partition plate 15 and one side of each of the disk drives 50 is in close contact with the top plate 11 to increase the heat dissipation effect of the disk drive 50. The power source 60 is then introduced into the upper compartment in the first direction. At this time, the disk drive 50 directly contacts the partition 15 with the lower end of the power source 60. The heat sink 80, the memory 90 and the expansion card 100 are respectively mounted on the motherboard 70, and the motherboard 70 is introduced into the lower compartment. At this time, the heat sink 80 is located directly under the disk drive 50. The fan 40 is locked to the inner surface of the panel 20, and the form number A0101 is 6/18. The panel 20 is fastened to the casing 1 by screws. The rear plate 3 is fixed to the rear side of the casing 10. At this time, in the assembled computer system, the fan 40 faces the radiator 8 in the forward direction, and the upper end of the fan 4 is slightly higher. The upper compartment. [0024] Continuing to refer to FIG. 6, when the heat is dissipated, the fan 4 〇 simultaneously functions as a heat sink 8 〇 heat dissipation and system heat dissipation. The airflow blown by the fan 4 直线 flows straight along the first direction, and the fan 40 mainly blows the wind to the heat sink for dissipating heat to the main heat sink heat sink 8 in the computer system, and at the same time, the fan 4 〇 lateral direction The airflow flows to the memory 9 and the expansion cassette, and the upper airflow flows into the upper partition for dissipating heat to the disk drive 50. The airflow generated by the fan 4〇 can all flow out from the rear plate 30. Such a computer system configuration can reduce the number of fans in the computer system, without the need to add an additional radiator hood, and has the most direct and optimized cooling effect in the limited space of the computer system. [0025] In a general computer system, a magnetic boring machine is often subjected to vibration or resonance by a surrounding vibration source, such as a vibration view of a system fan, to reduce its service life. In the virtual shirt type of the present invention, the 'secret fan 4' is disposed in the panel 20 separately from the casing 10, and the disk drive 50 is installed in the casing 1 , and the fan 40 is away from the disk drive. 5 (In addition, the panel 2 具有 has a different material from the casing 10, and the contact between the two can effectively reduce the vibration transmission therebetween. Thus, the computer system can effectively drive the disk drive 5 to the casing 10 The inner vibration source fan 4G is separately arranged to minimize the influence of the fan 4 〇 on the vibration of the disk drive 50. In other embodiments of the present invention, the fan 40 is installed separately from the server 5 (). The fan 4 can be mounted on the rear plate 3〇 as needed to achieve the same effect. Therefore, the 7th/18th page is compiled A0101 M379962. The fan 40 is now installed separately from the disk drive 50. The panel 20, the rear panel 30 or other fixing component separately installed from the casing 10 is defined as a fixing plate. Further, the disk drive 50 also generates vibration during operation, and the disk drive 50 and the motherboard are 70 is provided with a plastic partition 15 to reduce the vibration of the motherboard 70 when the disk drive 50 is in operation. [0026] In the embodiment of the present invention, the casing 10 is formed by integrally molding aluminum, so that the high mold cost and assembly cost of the general casing iron stamping can be omitted, and The heat dissipation in the computer system is effectively enhanced by the casing 10. [0027] In another embodiment of the present invention, the hardware arrangement in the upper and lower compartments can be mutually adjusted without affecting the working performance of the computer system, such that In the computer system, the motherboard 70, the heat sink 80, the memory 90 and the expansion card 100 are installed in the upper compartment; the disk drive 50 and the power source 60 are installed in the lower compartment. 40 is still facing the surface for the heat sink 80 to be slightly lower than the upper compartment to achieve the same heat dissipation effect. The upper and lower compartments of the casing 10 can be further divided as needed to make the compartment in the casing 10 Including at least two. [0028] In summary, the creation has indeed met the requirements of the new patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the creation, and is familiar with the creative technique. People, convert to this creation Equivalent modifications or changes made by the spirit shall be covered by the following patent application. [Simplified illustration of the drawing] [0029] Figure 1 is an exploded view of the computer system of the creation. Form No. A0101 Page 8 of 18 [0030] FIG. 2 is a perspective enlarged view of the casing of the computer system of FIG. 1. [0031] FIG. 3 is a perspective assembled view of the casing and the inner hardware of the casing of FIG. 1. [0032] FIG. 3 is a three-dimensional assembly diagram of the front view of the front panel and the fan. [0033] FIG. 5 is a perspective view of the assembled front and rear panel of the first embodiment. [0034] FIG. 6 is a left side cross-sectional view of the assembly of Fig. 1. Description] [0035] Case: 10
[0036] 頂板：11 [0037] 側板：12 [0038] 承載部：122 [0039] 固定部：124 [0040] 固定孔：1242 [0041] 固定槽：1246[0036] Top plate: 11 [0037] Side plate: 12 [0038] Bearing portion: 122 [0039] Fixing portion: 124 [0040] Fixing hole: 1242 [0041] Fixing groove: 1246
[0042] 底板：13 [0043] 隔板：15 [0044] 面板：20 [0045] 後板：30 [0046] 風扇：40 [0047] 磁碟機：50 [0048] 電源：60 表單編號A0101 第9頁/共18頁 70M379962 [0049] 主機板 [0050] 散熱器 [0051] 記憶體 [0052] 擴充卡 8090100 表單編號A0101 第10頁/共18頁[0042] Base plate: 13 [0043] Partition: 15 [0044] Panel: 20 [0045] Rear plate: 30 [0046] Fan: 40 [0047] Disk drive: 50 [0048] Power supply: 60 Form number A0101 9 pages/total 18 pages 70M379962 [0049] Motherboard [0050] Heatsink [0051] Memory [0052] Expansion Card 8090100 Form No. A0101 Page 10 of 18