五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種電腦系統，尤指一種小型尺寸規格之桌 上型電腦系統。 【先前技術】 [0002] 桌上型個人電腦（PC)殼體基於性能與擴充性考慮一般均 具有較大之體積並且内部安裝有較多之硬體，隨著電子 產業之發展電腦中之電子元件變得越來越小並且功能亦 更具集成化。根據不同之使用需求，市場上逐漸出現了 小型尺寸規格（SFF, small form factor) PC，該等 SFF PC具有較少之硬體配置且具有較小尺寸機殼，從而 能夠佔用較少之使用空間。此外，由於SFF PC硬體配置 相對PC簡單，SFF PC還能夠減少電量之消耗。 [0003] 由於SFF PC最大之特點在於其之小巧性與機殼内部硬體 排配。習知的SFF PC很多均採用繼承PC内部硬體排配之 系統結構，僅更換内部硬體之大小規格。該等繼承PC硬 體排配之系統結構具有與PC較相近之可擴充性特點，内 部還留有一定擴充空間，不利於把SFF PC之具有相同硬 體大小結構而佔用最小體積之特點體現出來。 【新型内容】 [0004] 鑒於以上内容，有必要提供一種具有較佳内部硬體排配 之電腦系統。 [0005] 一種電腦系統，該電腦系統包括一機殼、一安裝於該機 殼内之隔板、一主機板及至少一磁碟機，該機殼圍成一 表單編號A0101 第3頁/共17頁 M379961 容置空間，該主機板與該至少一磁碟機設置於該容置空 間内，該隔板將該容置空間分成至少兩隔間，該主機板 與該至少一磁碟機位於不同之隔間内。 [0006] 優選地，該隔板平分該容置空間。 [0007] 優選地，該至少兩隔間包括一上隔間與一下隔間，該至 少一磁碟機位於該上隔間，該主機板位於該下隔間。 [0008] 優選地，該電腦系統還包括一設置於該上隔間内之電源 〇 [0009] 優選地，該電腦系統還包括一設置於該主機板上之散熱 器。 [0010] 優選地，該電腦系統還包括一設置於該容置空間一側之 風扇。 [0011] 優選地，該隔板之設置方向垂直於該風扇產生氣流之流 動方向。 [0012] 優選地，該電腦系統還包括設置於該主機板上之一擴充 卡及一記憶體。 [0013] 優選地，該電腦系統還包括用於封閉該容置空間之一面 板及一後板。 [0014] 優選地，該至少一磁碟機之設置方向垂直於該隔板。 [0015] 相較於習知技術，該電腦系統利用不同之隔間將不同類 別之硬體分別配置，有效地利用了機殼内之容置空間。 【實施方式】 表單编號A0101 第4頁/共17頁 [0016] 請參閱圖1，本創作電腦系統為一小型尺寸規格（SFF， small form factor)電腦系統。該電腦系統包括一機 殼10 ' —隔板15、一面板20 ' —後板3〇及設置於該機殼 10與面板20内之複數電腦硬體。該電腦系統内之硬體包 括一設置於該面板20上之風扇40、複數磁碟機5〇，一電 源60、一主機板70及分別安裝於該主機板7〇上之一散熱 器80、複數記憶體90及一擴充卡1〇〇。 [0017] 續請參閱圖2，該機殼1〇為鋁擠壓一體成型，該機殼1〇之 橫截面為正方形，該機殼10兩面通透而形成兩相對之開 口。該機设10之通透方向為第一方向。該機殼10包括一 頂板11、一與該頂板11平行之底板13及兩相互平行之側 板12，該頂板11、兩側板12及該底板13首尾相接圍成一 容置空間。每一側板12内侧凸設一沿第一方向延伸、截 面呈凹形之承載部122。該機殼1〇之四個拐角部向内 凸設有四個沿第一方向延伸之固定部丨2 4，每一固定部 124面向該機殼10之外側開設一固定孔丨242，該機殼1〇 下端之兩固定部124相對開設有兩固定槽丨246。該機殼 10之四個拐角部之外側表面設有倒角。 [0018] 續請參閱圖3，該隔板15為塑膠材料，該隔板15可滑動卡 入該機殼10之兩承載部122之間而將該機殼1〇内之容置空 間分割為一上隔間及一下隔間《該隔板丨5之設置方向平 it於該頂板11與該底板13。於本實施方式中，該隔板a 平分該容置空間。 [0019] 該上隔間内安裝有該磁碟機50與電源6〇 ^於本實施方式 中’該磁碟機50包括多個’每一磁碟機5〇為一3 5寸硬碟 表單編號A0101 第5頁/共17頁 M379961 機；該隔板15向上可凸設複數用於隔擋該複數磁碟機50 之隔擋塊（圖未示），為配合該磁碟機上端之固定，該機 殼10可相應之配置隔擋塊（圖未示）以卡固該磁碟機；該 電源60外殼為截面呈矩形之長方體。該上隔間之高度略 高於該磁碟機50之寬度。 [0020] 該下隔間内安裝有該主機板70、該散熱器80、該記憶體 90及該擴充卡100。該散熱器80、該記憶體90及該擴充 卡100分別插接於該主機板70上。該記憶體90及該擴充卡 100沿該第一方向設置。該散熱器80為一CPU散熱器。該 主機板70可從該機殼10之兩固定槽1246滑動卡入該機殼 10内。 [0021] 本創作實施方式中之電腦系統，具有上下分隔之隔間， 隔間内安裝有具有相適配大小之磁碟機50、電源60及主 機板70。這樣之配置方式可實現佔用最小體積之排配。 [0022] 續請參閲圖4，該面板20為塑膠材料。該面板20開設有複 數平行之散熱槽22。該面板20之四角部對應該機殼10之 四個固定孔設有四個螺孔24。該風扇40可藉由螺絲或卡 扣結構鎖固於該面板20靠近該散熱槽22之内側。於本實 施方式中，該風扇40之吹風面積約為該面板20橫截面面 積即該機殼10之橫截面面積之四分之一，該風扇40之吹 風面積最好不小於該機殼10橫截面面積之四分之一。 [0023] 續請參閱圖5，組裝時，先將該隔板15導入該機殼10内， 將該磁碟機50豎直間隔地裝入該上隔間内使每一磁碟機 50垂直於該隔板15設置並使每一磁碟機50之一側緊貼於 表單編號A0101 第6頁/共17頁 該頂板11以增加磁碟機50之散熱效果。再將該電源60沿 該第一方嚮導入該上隔間。此時，該磁碟機50與該電源 60下端直接接觸該隔板15。再將該散熱器80、該記憶體 90及該擴充卡100分別安裝於該主機板70，再將該主機板 70導入該下隔間内。此時，該散熱器80位於該磁碟機50 之正下方。將該風扇40鎖固於該面板20之内表面，再將 該面板20藉由螺絲鎖固於該機殼10上。將該後板30固定 於該機殼10之後側。此時，於該組裝後之電腦系統内， 該風扇40正向面對於該散熱器80，該風扇40之上端略高 於該上隔間。 [0024] 續請參閱圖6，散熱時，該風扇40同時起到散熱器80散熱 及系統散熱之作用。該風扇40吹出之氣流沿該第一方向 直線流動，該風扇40主要風力吹向該散熱器80用於給電 腦系統内主要之散熱源散熱器80散熱，同時，該風扇40 產生之側向氣流流向該記憶體90與該擴充卡100，上部氣 流流入該上隔板用於給該磁碟機50散熱。風扇40產生之 氣流可全部從該後板30流出。這樣之電腦系統配置，可 減少電腦系統内風扇之配置數量，無需添加額外之散熱 器導風罩，能夠於電腦系統有限之空間内擁有最直接與 最佳化之散熱效果。 [0025] 於一般之電腦系統中，磁碟機往往會受到周圍振動源， 如系統風扇之振動影響產生振動或共振，減小其使用壽 命。本創作之實施方式中，該風扇40設置於該與該機殼 10分離安裝之面板20，該磁碟機50安裝於該機殼10内， 該風扇40遠離接觸該磁碟機50。此外，該面板20與該機 表單编號A0101 第7頁/共17頁 M379961 殼ίο具有不同之材料，二者之接觸可有效地減小其間之 振動傳遞。這樣該電腦系統可有效地把磁碟機50與機殼 10内振動源風扇40分離排配，最大程度地減小風扇40對 磁碟機50之振動影響。於本創作之其他實施方式中，為 達到該風扇40與該磁碟機50隔離安裝之目該風扇40可根 據需要安裝於該後板30而實現同樣之效果，因此，為實 現該風扇40與該磁碟機50隔離安裝，與該機殼10分離安 裝之面板20、後板30或其他固定元件定義為一固定板。 進一步，該磁碟機50工作時亦會產生振動，將該磁碟機 50與該主機板70有塑膠隔板15分隔設置可減小該磁碟機 50工作時對該主機板70之振動影響。 [0026] 本創作之實施方式中，該機殼10採用鋁擠壓一體成型之 方式製成，這樣即可省去一般機殼鐵件衝壓成型高額之 模具費用與組裝費用，又可直接藉由機殼10有效地加強 電腦系統内之散熱。 [0027] 本創作之另一實施方式中，該上下隔間内之硬體排配可 相互對調而不影響電腦系統之工作效能，這樣之電腦系 統中，該上隔間内安裝有該主機板70、該散熱器80、該 記憶體90及該擴充卡100 ;該下隔間内安裝有該磁碟機50 與電源60。該風扇40仍正向面對於該散熱器80又略低於 該上隔間而實現同樣之散熱效果。該機殼10内之上下隔 間可根據需要做進一步分割而使該機殼1 0内之隔間包括 至少兩個。 [0028] 綜上所述，本創作確已符合新型專利要求，爰依法提出 專利申請。惟，以上所述者僅為本創作之較佳實施方式 表單編號A0101 第8頁/共17頁 M379961 ，舉凡熟悉本創作技藝之人士，爰依本創作之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 【圖式簡單說明】 [0029] 圖1係本創作電腦系統之立體分解圖。 [0030] 圖2係圖1電腦系統中機殼之立體放大圖。 [0031] 圖3係圖1機殼與機殼内硬體之立體組裝圖。 [0032] 圖4係圖1中前板與風扇另一視角之立體組裝圖。V. New description: [New technology field] [0001] This creation relates to a computer system, especially a small-size desktop computer system. [Prior Art] [0002] The desktop PC (PC) case generally has a large size based on performance and scalability considerations and has more hardware installed inside. With the development of the electronics industry, the electronics in the computer Components are getting smaller and smaller and their functions are more integrated. According to different usage requirements, small form factor (SFF) PCs have emerged on the market. These SFF PCs have fewer hardware configurations and have smaller cabinet sizes, which can take up less space. . In addition, because the SFF PC hardware configuration is simpler than the PC, the SFF PC can also reduce the power consumption. [0003] The biggest feature of the SFF PC is its compactness and internal hardware assembly. Many of the conventional SFF PCs adopt a system structure that inherits the internal hardware arrangement of the PC, and only replaces the size specifications of the internal hardware. The system structure of the inherited PC hardware is similar to the PC, and has a certain expansion space inside, which is not conducive to the SFF PC having the same hardware size structure and occupying the smallest volume. . [New Content] [0004] In view of the above, it is necessary to provide a computer system with better internal hardware arrangement. [0005] A computer system comprising a casing, a partition mounted in the casing, a motherboard and at least one disk drive, the casing enclosing a form number A0101 page 3 / total 17: M379961 accommodating space, the motherboard and the at least one disk drive are disposed in the accommodating space, the partition divides the accommodating space into at least two compartments, and the motherboard is located at the at least one disk drive In different compartments. [0006] Preferably, the partition bisects the accommodating space. [0007] Preferably, the at least two compartments comprise an upper compartment and a lower compartment, wherein at least one disk drive is located in the upper compartment, and the motherboard is located in the lower compartment. Preferably, the computer system further includes a power supply disposed in the upper compartment. [0009] Preferably, the computer system further includes a heat sink disposed on the motherboard. [0010] Preferably, the computer system further includes a fan disposed on one side of the accommodating space. [0011] Preferably, the partition is disposed in a direction perpendicular to the flow direction of the airflow generated by the fan. [0012] Preferably, the computer system further includes an expansion card and a memory disposed on the motherboard. [0013] Preferably, the computer system further includes a panel for closing the accommodating space and a rear panel. [0014] Preferably, the at least one disk drive is disposed perpendicular to the partition. [0015] Compared with the prior art, the computer system uses different compartments to separately configure different types of hardware, and effectively utilizes the housing space in the casing. [Embodiment] Form No. A0101 Page 4 of 17 [0016] Referring to Figure 1, the computer system is a small form factor (SFF) computer system. The computer system includes a casing 10' - a partition 15, a panel 20' - a rear panel 3, and a plurality of computer hardware disposed in the casing 10 and the panel 20. The hardware in the computer system includes a fan 40 disposed on the panel 20, a plurality of disks 5, a power source 60, a motherboard 70, and a heat sink 80 respectively mounted on the motherboard 7 The complex memory 90 and an expansion card 1〇〇. [0017] Continuing to refer to FIG. 2, the casing 1 is integrally formed by extrusion of aluminum. The casing 1 has a square cross section, and the casing 10 is transparent on both sides to form two opposite openings. The penetration direction of the machine 10 is the first direction. The casing 10 includes a top plate 11, a bottom plate 13 parallel to the top plate 11, and two side plates 12 that are parallel to each other. The top plate 11, the two side plates 12 and the bottom plate 13 are connected end to end to form an accommodation space. A bearing portion 122 extending in the first direction and having a concave cross-section is protruded from the inner side of each of the side plates 12. The four corner portions of the casing 1 are provided with four fixing portions 丨 2 4 extending in the first direction. Each fixing portion 124 defines a fixing hole 242 facing the outer side of the casing 10 . Two fixing portions 124 of the lower end of the shell 1 are oppositely provided with two fixing grooves 246. The outer side surfaces of the four corner portions of the casing 10 are chamfered. [0018] Referring to FIG. 3, the partition plate 15 is made of a plastic material, and the partition plate 15 is slidably inserted between the two bearing portions 122 of the casing 10 to divide the accommodation space in the casing 1 into An upper compartment and a lower compartment "the partitioning direction of the partitioning jaw 5 is flat on the top panel 11 and the bottom panel 13. In the embodiment, the partition plate a divides the accommodating space. [0019] The disk drive 50 and the power source 6 are mounted in the upper compartment. In the present embodiment, the disk drive 50 includes a plurality of disks 5 each of which is a 35-inch hard disk form. No. A0101, page 5 of 17 M379961 machine; the partition 15 can be upwardly provided with a plurality of blocking blocks (not shown) for blocking the complex disk drive 50, in order to match the upper end of the disk drive. The casing 10 can be correspondingly configured with a baffle (not shown) to secure the disk drive; the power source 60 has a rectangular parallelepiped in cross section. The height of the upper compartment is slightly higher than the width of the disk drive 50. [0020] The motherboard 70, the heat sink 80, the memory 90, and the expansion card 100 are mounted in the lower compartment. The heat sink 80, the memory 90 and the expansion card 100 are respectively inserted into the motherboard 70. The memory 90 and the expansion card 100 are disposed along the first direction. The heat sink 80 is a CPU heat sink. The motherboard 70 can be slid into the casing 10 from the two fixing slots 1246 of the casing 10. [0021] The computer system in the embodiment of the present invention has a compartment partitioned up and down, and a disk drive 50 having a suitable size, a power source 60, and a main board 70 are mounted in the compartment. This configuration allows for a minimum footprint. [0022] Continuing to refer to FIG. 4, the panel 20 is a plastic material. The panel 20 is provided with a plurality of parallel heat sinks 22. The four corners of the panel 20 are provided with four screw holes 24 corresponding to the four fixing holes of the casing 10. The fan 40 can be locked to the inner side of the heat sink 20 by the screw or the snap structure. In the present embodiment, the air blowing area of the fan 40 is about one quarter of the cross-sectional area of the panel 20, that is, the air blowing area of the fan 40 is preferably not less than the horizontal cross-section of the casing 10. One quarter of the cross-sectional area. [0023] Continuing to refer to FIG. 5, when assembling, the partition 15 is first introduced into the casing 10, and the disk drive 50 is vertically spaced into the upper compartment so that each disk drive 50 is vertical. The partition plate 15 is disposed such that one side of each of the disk drives 50 is in close contact with the top plate 11 of the form number A0101, and the heat dissipation effect of the disk drive 50 is increased. The power source 60 is then introduced into the upper compartment in the first direction. At this time, the disk drive 50 directly contacts the partition 15 with the lower end of the power source 60. The heat sink 80, the memory 90 and the expansion card 100 are respectively mounted on the motherboard 70, and the motherboard 70 is introduced into the lower compartment. At this time, the heat sink 80 is located directly under the disk drive 50. The fan 40 is locked to the inner surface of the panel 20, and the panel 20 is locked to the casing 10 by screws. The rear plate 30 is fixed to the rear side of the casing 10. At this time, in the assembled computer system, the fan 40 faces the radiator 80 in the forward direction, and the upper end of the fan 40 is slightly higher than the upper compartment. [0024] Continuing to refer to FIG. 6, when the heat is dissipated, the fan 40 simultaneously serves to dissipate heat from the heat sink 80 and dissipate heat from the system. The airflow blown by the fan 40 flows straight along the first direction, and the fan 40 mainly blows the wind to the heat sink 80 for dissipating heat to the main heat sink heat sink 80 in the computer system, and the lateral airflow generated by the fan 40 Flowing toward the memory 90 and the expansion card 100, an upper airflow flows into the upper partition for dissipating heat to the disk drive 50. The airflow generated by the fan 40 can all flow out of the rear plate 30. Such a computer system configuration can reduce the number of fans in the computer system, without the need to add an additional radiator hood, and has the most direct and optimized cooling effect in the limited space of the computer system. [0025] In a general computer system, a disk drive is often subjected to vibration or resonance by a surrounding vibration source, such as a vibration of a system fan, to reduce its service life. In the embodiment of the present invention, the fan 40 is disposed on the panel 20 separately from the casing 10. The disk drive 50 is mounted in the casing 10, and the fan 40 is away from the disk drive 50. In addition, the panel 20 has a different material from the machine form number A0101, page 7 of 17 M379961 shell ίο, and the contact between the two can effectively reduce the vibration transmission therebetween. Thus, the computer system can effectively separate the disk drive 50 from the vibration source fan 40 in the casing 10, thereby minimizing the influence of the fan 40 on the vibration of the disk drive 50. In other implementations of the present invention, in order to achieve the isolation of the fan 40 from the disk drive 50, the fan 40 can be mounted on the rear plate 30 as needed to achieve the same effect. Therefore, to achieve the fan 40 and The disk drive 50 is mounted in isolation, and the panel 20, the rear plate 30 or other fixing elements that are separately mounted from the casing 10 are defined as a fixed plate. Further, the disk drive 50 also generates vibration during operation, and the disk drive 50 is separated from the motherboard 70 by the plastic partition 15 to reduce the vibration of the motherboard 70 when the disk drive 50 is in operation. . [0026] In the embodiment of the present invention, the casing 10 is formed by integrally molding aluminum, so that the high mold cost and assembly cost of the general casing iron stamping can be omitted, and the utility model can be directly used. The housing 10 effectively enhances heat dissipation within the computer system. [0027] In another embodiment of the present invention, the hardware arrangement in the upper and lower compartments can be mutually adjusted without affecting the working performance of the computer system. In the computer system, the motherboard is installed in the upper compartment. 70. The heat sink 80, the memory 90 and the expansion card 100; the disk drive 50 and the power source 60 are mounted in the lower compartment. The fan 40 is still facing in the opposite direction for the heat sink 80 to be slightly lower than the upper compartment to achieve the same heat dissipation effect. The upper and lower compartments in the casing 10 can be further divided as needed to include at least two compartments within the casing 10. [0028] In summary, the creation has indeed met the requirements of the new patent, and the patent application is filed according to law. However, the above is only the preferred embodiment of this creation. Form No. A0101 Page 8 of 17 M379961, for those who are familiar with the creative techniques, the equivalent modifications or changes made in accordance with the spirit of this creation are It should be included in the scope of the following patent application [Simplified illustration of the drawings] [0029] FIG. 1 is an exploded perspective view of the computer system of the present invention. 2 is a perspective enlarged view of a casing in the computer system of FIG. 1. 3 is a perspective assembled view of the casing of FIG. 1 and the inner hardware of the casing. 4 is an assembled, isometric view of the front panel and the fan in FIG.
[0033] 圖5係圖1組裝後移去前板之立體组裝示意圖。 [0034] 圖6係圖1組裝後之左視剖視圖。 【主要元件符號說明】 [0035] 機殼：1 0 [0036] 頂板：11[0033] FIG. 5 is a schematic perspective view of the assembled front panel of FIG. 6 is a left side cross-sectional view of FIG. 1 assembled. [Main component symbol description] [0035] Case: 1 0 [0036] Top plate: 11
[0037] 側板：12 [0038] 承載部：122 [0039] 固定部：1 2 4 [0040] 固定孔：1242 [0041] 固定槽：1246 [0042] 底板：13 [0043]隔板：15 表單編號A0101 第9頁/共17頁 M379961 [0044] 面板：20 [0045] 後板：30 [0046] 風扇：4 0 [0047] 磁碟機：50 [0048] 電源：6 0 [0049] 主機板：70 [0050] 散熱器：80 [0051] 記憶體：90 [0052] 擴充卡：100 表單編號A0101 第10頁/共17頁Side plate: 12 [0038] Bearing portion: 122 [0039] Fixing portion: 1 2 4 [0040] Fixing hole: 1242 [0041] Fixing groove: 1246 [0042] Base plate: 13 [0043] Partition: 15 Form No. A0101 Page 9 of 17 M379961 [0044] Panel: 20 [0045] Rear panel: 30 [0046] Fan: 4 0 [0047] Disk drive: 50 [0048] Power supply: 6 0 [0049] Motherboard :70 [0050] Heatsink: 80 [0051] Memory: 90 [0052] Expansion Card: 100 Form No. A0101 Page 10 of 17