TWM632079U - Pumpless liquid cooling radiator - Google Patents

Abstract

The pumpless liquid cooling radiator disclosed in the present invention includes, for example, a cold head assembly and a condensing assembly, the cold head assembly and the condensing assembly are in circular communication with each other through a communication assembly, and both the cold head assembly and the condensing assembly are filled with There is liquid refrigerant, using refrigerant as cooling medium now has better water cooling effect and better overall heat dissipation effect, and overcomes the shortcomings of complex wiring of water-cooled radiators and poor heat dissipation of heat pipes, and can quickly cool the temperature of components, compared with the existing water-cooled heat dissipation The structure of the device is simpler, the loop cooling can be achieved without mechanical drive (water pump), and there is no redundant water pipe extension, which is more convenient to install and makes the main casing more tidy.

Description

Pumpless liquid cooling radiator

The new model belongs to the technical field of radiators, in particular to a pumpless liquid cooling radiator.

With the continuous improvement of computer performance, the heat generation of the computer's central processing unit and display core is increasing. Therefore, water-cooled radiators or heat-pipe radiators are more and more used in computers in order to provide the central processing unit and The display core quickly dissipates heat.

The water-cooled radiator includes a water-cooled head and a water-cooled row. The water-cooled head is in contact with heat sources such as the central processing unit and the display core. The water-cooled liquid flowing in the water-cooled head can absorb heat from the heat source, and the water-cooled row can dissipate the heat in the water-cooled liquid. into the air; through the liquid pump, the water-cooled liquid is driven to circulate between the water-cooled head and the water-cooled row, so that the water-cooled liquid continuously absorbs heat from the heat source and cools it at the water-cooled row, thereby rapidly dissipating heat from the heat source.

The heat pipe radiator includes a heat pipe and a fin group. The heat pipe absorbs heat from heat sources such as the central processing unit and the display core through metal block contact or direct contact, and conducts the heat to the fin group. The fin group is in contact with the air. The large area is conducive to heat dissipation, so as to quickly dissipate heat for the heat source; a fan can also be used to drive the air flow in the gap of the fin group to improve the heat dissipation performance.

However, water-cooled radiators and heat-pipe radiators still have shortcomings. For example, although the water-cooled liquid of the water-cooled radiator can fill the entire water-cooled head and has a large heat-absorbing area, the heat-absorbing performance of the water-cooled liquid itself is not strong enough; Although a refrigerant with strong heat absorption performance is used as the heat conduction medium, the insufficient contact area between the heat pipe and the heat source also restricts the overall heat dissipation performance of the heat pipe radiator.

The purpose of the present invention is to provide a pumpless liquid cooling radiator to solve the above-mentioned problems in the background art.

In order to achieve the above purpose, the present invention provides the following technical solutions: the present invention provides a pumpless liquid cooling radiator including a cold head assembly and a condensing assembly, wherein the cold head assembly and the condensing assembly are in circular communication with each other through a communication assembly, Both the cold head assembly and the condensation assembly are filled with liquid refrigerant.

In a further technical solution, the condensing assembly includes a lower box, an upper box and a plurality of communication pipes; the lower box is divided into a first half box and a second half box through a partition plate, and half of the communication pipes are connected to each other. The first half box and the upper box body, and the other half of the communication pipes are connected to the second half box and the upper box body; the cold head assembly is respectively connected with the first half box of the lower box body. The half box is in communication with the second half box.

In a further technical solution, the outer wall of the lower box body of the condensing assembly is provided with a communication component, and the communication component forms at least two refrigerant passages that communicate with the cold head assembly, and a part of the refrigerant passages are connected to the lower casing. The first half-tank is communicated with, and another part of the refrigerant passage is communicated with the second half-tank of the lower casing.

In a further technical solution, the condensing assembly further includes a plurality of fin groups one, and the fin group one is arranged between the adjacent communicating pipes.

In a further technical solution, the condensing assembly further includes a fastener for fastening the communication pipe and the first fin set.

In a further technical solution, at least one installation position is formed on the fastener, and a fan is installed on the installation position.

In a further technical solution, the air outlet surface of the fan faces the communication pipe and the fin group one.

In a further technical solution, the cold head assembly includes an integrally formed contact plate and a casing, the contact plate and the casing enclose a space for storing refrigerant, and a refrigerant communicating with the refrigerant channel is formed on the casing. import and export.

In a further technical solution, the communicating component is a communicating portion extending downward from the outer wall of the lower case body, the refrigerant passage is formed in the communicating portion, and the lower case body is fixedly connected with the cold head assembly. .

In a further technical solution, the refrigerant inlet of the refrigerant inlet and outlet is provided with a pipeline extending to the inner space.

In a further technical solution, the communication components are at least two refrigerant pipes.

In a further technical solution, the first half-tank and the second half-tank are provided with quick joints for connecting the refrigerant pipes.

In a further technical solution, the quick connector for connecting the refrigerant passage is inserted at the refrigerant inlet and outlet of the cold head assembly.

In a further technical solution, the contact plate of the cold head assembly is provided with two sets of fins.

The beneficial effects of this new type: The pumpless liquid-cooled radiator provided by this new model uses refrigerant as the cooling medium, which has better water-cooling effect and better overall heat-dissipation effect, and overcomes the complex wiring of the water-cooled radiator and the shortcomings of poor heat dissipation by heat pipes, and can quickly cool components. Compared with the existing water-cooled radiator, the structure is simpler, the loop cooling can be achieved without mechanical drive (water pump), and there is no redundant water pipe extension, which is more convenient to install and makes the main casing more tidy.

Other features and advantages of the present invention will be described in detail in the detailed description section that follows.

1: cold head assembly

11: Contact board

111: fin group two

12: Shell

121: Refrigerant import and export

122: Pipes

2: Condensing components

21: Lower box

211: The first half box

212: Second half box

213: Connectivity

214: Refrigerant channel

215: Clapboard

22: Upper box

23: Connecting pipe

24: fin group one

25: Fasteners

3: Refrigerant tube

4: quick connector

FIG. 1 is a schematic three-dimensional structural diagram of a pumpless liquid-cooled radiator according to a new embodiment of the present invention.

FIG. 2 is an exploded schematic diagram of the pumpless liquid cooling radiator shown in FIG. 1 .

FIG. 3 is a cross-sectional view of the pumpless liquid cooling radiator shown in FIG. 1 .

FIG. 4 is a schematic structural diagram of the first form of the novel pumpless liquid cooling radiator.

FIG. 5 is a schematic structural diagram of the second form of the novel pumpless liquid cooling radiator.

FIG. 6 is a schematic diagram showing the disassembly of the second form of the novel pumpless liquid cooling radiator.

FIG. 7 is a schematic diagram of the internal structure of the second form of the novel pumpless liquid cooling radiator.

FIG. 8 is a schematic view of the structure of the new cold head assembly.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

The pumpless liquid-cooling radiator provided by the new embodiment is mainly used in computers, and can rapidly cool down the temperature of the processor (CPU) and the discrete graphics core (GPU), and the pumpless liquid-cooling radiator dissipates heat compared with the existing water-cooling radiator. The structure is simpler in terms of the device, the loop cooling can be realized without mechanical drive (water pump), and there is no redundant water pipe extension, the installation is more convenient, and the main casing is more tidy. Manufactured and applied to devices with different heat dissipation requirements, such as small external radiators specially applied to mobile phones, in order to deal with the performance of the mobile phone when playing games. The heat affects the performance and causes the game to freeze. Therefore, it should not be limited by the use of objects.

Take cooling the processor in the computer as an example to illustrate. Referring to Figure 1, before use, install the cold head assembly 1 on the processor so that the two are in full contact. The cold head assembly 1 continuously absorbs the heat from the processor, so that the The liquid refrigerant in the cold head assembly 1 is continuously evaporated to form a gaseous state. At this time, the liquid refrigerant in the cold head assembly 1 is constantly decreasing. The refrigerant in the condensing assembly 2 flows into the cold head assembly 1 through the communication assembly, and the gaseous refrigerant rises through the The communicating component enters into the condensing component 2, and after the cooling of the condensing component 2, the gaseous refrigerant reliquefies and flows to the cold head component 1 for circulation. A part of the space is reserved for the transition of refrigerant vaporization and liquefaction. In this new embodiment, the refrigerant is used as the cooling medium, which has better water cooling effect and better overall heat dissipation effect, and overcomes the complex wiring of the water cooling radiator and the heat dissipation of the heat pipe. Bad downside.

The condensing assembly in this embodiment is described below, please refer to FIG. 1 and FIG. 4 ; the condensing assembly 2 includes a lower tank 21, an upper tank 22 and a plurality of communication pipes 23; the lower tank 21 is divided into a first half tank 211 and a second tank Two half boxes 212, one half of the communication pipes 23 connect the first half box 211 and the upper box 22, the other half of the communication pipes 23 communicate with the second half box 212 and the upper box 22; the cold head assembly 1 and the lower box 21 respectively The first half-tank 211 and the second half-tank 212 are communicated with each other, the outer wall of the lower casing 21 of the condensing assembly 2 is provided with a communicating component, and the communicating component forms at least two refrigerant passages 214 that communicate with the cold head assembly 1, and a part of the refrigerant The channel 214 is communicated with the first half box 211 of the lower box 21, and the other part of the refrigerant channel 214 is communicated with the second half box 212 of the lower box 21; the refrigerant in the cold head assembly 1 is vaporized and enters through the communication component into the In the lower box 21, the lower box 21 can divide the internal space into two parts through the partition 215, namely the first half box 211 and the second half box 212, and the first half box 211 and the second half box 212 are both inside. There is liquid refrigerant, the vaporized refrigerant enters the first half tank 211, and then rises to the communication pipe 23. By dividing the lower tank 21 into two parts, the gaseous refrigerant and the liquid in the second half tank 212 are avoided. The refrigerant is mixed; the specific refrigerant flow trajectory is: the vaporized refrigerant enters the first half tank 211 through the refrigerant passage 214 in the communication component, and the liquid refrigerant enters the second half tank 212 or the first half tank at this time. 211 flows into the cold head assembly 1, and the gaseous refrigerant continues to rise It enters the communication pipe 23 communicating with the first half-tank 211, the upper case 22 and the communicating pipe 23 communicating with the second half-tank 212 successively.

The condensing assembly 2 further includes a plurality of fin groups 24, and the fin group 1 24 is arranged between the adjacent communicating pipes 23. The condensing assembly 2 also includes a fin group 24 for fastening the communicating pipes 23 and the fin group 1 24. At least one installation position is formed on the fastener 25, and a fan is installed on the installation position, and the air outlet surface of the fan faces the communication pipe 23 and the fin group 1 24. In order to further improve the heat dissipation speed, in the phase A group of fins 24 is arranged between the adjacent communication pipes 23, and the group of fins 1 24 is fully in contact with the communication pipe 23 so as to fully absorb the heat of the communication pipe 23, to achieve the purpose of accelerating heat dissipation, and to make the structure more compact. , fasteners 25 are installed on both sides of the condensing assembly 2, so that the communication pipe 23 and the fin group one 24 can be fastened and fixed, and further expanded, there is at least one installation position on the fasteners 25 for installing the fan. In this embodiment, the air outlet surface of the fan faces the communication pipe 23 and the fin group 1 24, which further improves the heat dissipation effect.

The radiator of the new type has different shapes according to the structure of the communication components, and the details are as follows: In the first form, referring to FIG. 2 and FIG. 3 , the communication component is that the outer wall of the lower box 21 extends downward to form a communication portion 213 , and a refrigerant passage 214 is formed in the communication portion 213 . The half box 211 is connected, and the other part is connected with the second half box 212. This form is suitable for equipment with small heat dissipation requirements, that is, the radiator has one or two installation positions, and one or two fans are installed. Because the cold head assembly 1 and the condensing assembly 2 are fixed to each other, the refrigerant inlet and outlet 121 in the cold head assembly 1 can be directly connected to the refrigerant passage 214; the radiator of this form does not need to be additionally provided for the installation position of the condensing assembly 2 , making the overall installation more convenient; For the second form, refer to Figures 5 to 7, wherein Figure 5 is a three-dimensional structural view of the second form, Figure 6 is a schematic diagram of the use state of the second form, and Figure 7 is an internal structure diagram of the second state, and the communication components are at least Two refrigerant pipes 3, each refrigerant pipe 3 is a refrigerant passage 214, and a part of the refrigerant pipes 3 It is connected with the first half box 211, and the other part is connected with the second half box 212. This form of radiator is suitable for equipment with large heat dissipation requirements, that is, it has three or more installation positions, and three or more radiators are installed. At this time, the first half box 211 and the second half box 212 are provided with quick joints 4 for connecting the refrigerant pipes 3, and the cooling medium inlet and outlet 121 of the cold head assembly 1 are inserted with the cooling medium channel 214. Another quick connector 4 needs to use screws to fix the condensing assembly 2 at a position higher than the cold head assembly 1, such as the top of the main casing, during installation, the radiator installation of this form is more troublesome than the first form. However, it is still easier to install than a water-cooled radiator, and the second form has a larger volume and better heat dissipation effect.

The specific heat dissipation principles of the above two types of heat sinks are the same as those in the foregoing embodiments, and are not repeated here; In addition, the structure of the cold head assembly 1 includes a contact plate 11 and a housing 12. The housing 12 is formed with a refrigerant inlet and outlet 121 that communicates with the refrigerant passage 214. For the radiator of the first form, as shown in FIG. 3, at this time the radiator is For vertical installation, when the liquid refrigerant is heated and vaporized, the refrigerant inlet of the refrigerant inlet and outlet is provided with a pipe 122 extending to the inner space, and the pipe 122 is immersed in the liquid refrigerant, so most of the formed bubbles will pass from the outlet. It is discharged into the communication pipe 23, then to the upper box 22, and then moved to another part of the communication pipe 23 for cooling. This design increases the movement trajectory of the gaseous refrigerant, which is conducive to heat dissipation and avoids excessive gaseous refrigerant from accumulating in the radiator. top; The second form of installation will be described. The cold head assembly 1 in this form of radiator is suitable for vertical installation, that is to say, the inlet and outlet of the cold head assembly 1 are up and down. When the liquid refrigerant is heated and vaporized, it is naturally It will enter the refrigerant pipe 3 from the outlet upward, and the liquid refrigerant will enter the cold head assembly 1 from the lower inlet to supplement, so as to achieve mutual non-interference; Referring to FIGS. 6 and 8 , a second fin group 111 is provided on the contact plate 11 , and the liquid refrigerant is placed in the space enclosed by the casing 12 and the contact plate 11 . Setting the second fin group 111 can improve the contact between the contact plate 11 and the refrigerant. The contact area is increased, thereby improving the heat conduction efficiency between the contact plate 11 and the refrigerant.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which is therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalent requirements of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a Overall, the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

1: cold head assembly

11: Contact board

12: Shell

121: Refrigerant import and export

21: Lower box

213: Connectivity

214: Refrigerant channel

22: Upper box

23: Connecting pipe

24: fin group one

25: Fasteners

Claims (14)

A pumpless liquid cooling radiator includes a cold head assembly and a condensing assembly, wherein the cold head assembly and the condensing assembly are in circular communication with each other through a communication assembly, and both the cold head assembly and the condensing assembly are filled with Liquid refrigerant. The pumpless liquid-cooling radiator according to the first item of the patent application scope, wherein the condensing assembly comprises a lower tank, an upper tank and a plurality of communication pipes; the lower tank is divided into a first half tank through a partition plate and the second half tank, half of the communication pipes are connected to the first half tank and the upper tank body, and the other half of the communication pipes are connected to the second half tank and the upper tank body; the cooling The head assemblies are respectively communicated with the first half box and the second half box of the lower box body. The pumpless liquid-cooled radiator according to item 2 of the patent application scope, wherein the outer wall of the lower casing of the condensing component is provided with a communicating component, and the communicating component forms at least two refrigerant passages that communicate with the cold head component , wherein a part of the refrigerant passages are communicated with the first half of the lower case, and another part of the refrigerant passages are communicated with the second half of the lower case. The pumpless liquid-cooling radiator according to claim 3, wherein the condensing assembly further comprises a plurality of fin sets, and the fin sets are arranged between the adjacent communication pipes. The pumpless liquid cooling radiator as claimed in claim 4, wherein the condensing assembly further comprises a fastener for fastening the communication pipe and the first set of fins. The pumpless liquid cooling radiator as described in claim 5, wherein at least one mounting position is formed on the fastener, and a fan is mounted on the mounting position. The pumpless liquid cooling radiator as claimed in claim 6, wherein the air outlet surface of the fan faces the communication pipe and the fin set one. The pumpless liquid cooling radiator according to any one of claims 3 to 7, wherein the cold head assembly comprises an integrally formed contact plate and a housing, the contact plate and the outer A space for storing refrigerant is formed around the shell, and a refrigerant inlet and outlet communicated with the refrigerant passage is formed on the outer casing. The pumpless liquid-cooling radiator according to claim 8, wherein the communicating component is a communicating portion extending downward from the outer wall of the lower case, and the refrigerant passage is formed in the communicating portion, and The lower case is fixedly connected with the cold head assembly. The pumpless liquid-cooled radiator as described in item 9 of the patent application scope, wherein a pipeline extending to the inner space is provided at the refrigerant inlet of the refrigerant inlet and outlet. The pumpless liquid-cooling radiator as claimed in claim 8, wherein the communication components are at least two refrigerant pipes. The pumpless liquid-cooling radiator according to claim 11, wherein the first half-tank and the second half-tank are provided with quick joints for connecting the refrigerant pipes. The pumpless liquid-cooled radiator as claimed in claim 12, wherein the quick connector for connecting the refrigerant passage is inserted at the refrigerant inlet and outlet of the cold head assembly. The pumpless liquid cooling radiator as claimed in claim 13, wherein the contact plate of the cold head assembly is provided with two sets of fins.

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