TW201407041A - Dual-phase change circulation type water cooling module and its use method - Google Patents

Dual-phase change circulation type water cooling module and its use method Download PDF

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TW201407041A
TW201407041A TW101129388A TW101129388A TW201407041A TW 201407041 A TW201407041 A TW 201407041A TW 101129388 A TW101129388 A TW 101129388A TW 101129388 A TW101129388 A TW 101129388A TW 201407041 A TW201407041 A TW 201407041A
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heat
liquid
heat dissipating
phase change
cooling module
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TW101129388A
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TWI513904B (en
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an-zhi Wu
Mu-Shu Fan
Jian-Zhi Su
Zheng-Shuan Jiang
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Auras Technology Co Ltd
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Abstract

A dual-phase change circulation type water cooling module and its use method are provided. The module includes a heat collecting body, a heat dissipating body, an air guiding pipe, a liquid guiding pipe, and a heat dissipating medium, wherein the internal of the heat collecting body is provided with a first air-liquid coexisting area, the internal of the heat dissipating body is provided with a second air-liquid coexisting area higher than or equal to that of the heat collecting body; the air guiding pipe is connected between the heat collecting body and the heat dissipating body so as to form an air channel, the liquid guiding pipe is connected between the heat collecting body and the heat dissipating body so as to form a liquid channel, and the heat dissipating medium is filled therein. When in use, the heat dissipating medium is vaporized by heating in the heat collecting body and moves to the heat dissipating body, and is cooled down in the heat dissipating body for returning to liquid state and moves back to the heat collecting body, such that a closed circulation loop is formed to effectively dissipate heat.

Description

雙相變化循環式水冷模組及其使用方法 Two-phase change circulating water cooling module and using method thereof

本案係屬於電子裝置散熱設備的領域,尤指一種利用液相及氣相來達到快速驅散熱量的雙相變化循環式水冷模組及其使用方法。 This case belongs to the field of heat dissipation equipment for electronic devices, especially a two-phase variable circulation water-cooling module that uses liquid phase and gas phase to achieve rapid heat dissipation and its use method.

按,現行的電腦或電子產業中,大量運用各種處理晶片,如:中央處理器及繪圖晶片,或是其他如南北橋處理晶片等,隨著集成密度越來越高,且運作頻率越來越快,相對在運作時所產生之熱能也隨之增高,亦稱之為發熱元件。由於該等發熱元件在運作溫度太高時會導致運作不正常的問題,甚至有可能發生燒毀的情況,因此,為了能夠有效降低熱量,市面上也出現了各式各樣的散熱裝置,其係緊密貼設於該等發熱元件的溢熱表面,從而利用傳導、對流或輻射等方式協助其散熱,以保持該等發熱元件在正常的工作溫度下運作。 According to the current computer or electronics industry, a large number of processing chips, such as central processing units and graphics chips, or other processing chips such as north and south bridges, are used, and the integration density is increasing and the operating frequency is increasing. Fast, the heat energy generated during operation is also increased, also known as heating elements. Since these heating elements may cause abnormal operation when the operating temperature is too high, and even burn out may occur, in order to effectively reduce the heat, various heat dissipating devices appear on the market. Tightly attached to the heat-absorbing surface of the heating elements to assist in heat dissipation by conduction, convection or radiation to keep the heating elements operating at normal operating temperatures.

一般最常見的散熱裝置係利用易導熱金屬(如:鋁或銅等)經各種加工而製得,其係由一底座、複數個散熱鰭片及一散熱風扇所構成,利用該底座緊密接觸該發熱元件後,將熱能直接傳導至該等散熱鰭片,並利用其表面與外界空氣產生熱對流,進而將熱能散逸至外界。或有結合一熱導管而加強散熱效果的,該熱導管係於一封閉管體內填充 有呈液態之一散熱介質,該散熱介質之主要成分為水,其餘則是能增加液體熱傳輸能力的特殊成分所構成。該熱導管之一端係為蒸發端而與該發熱元件相接觸,供以吸收其熱量而使該散熱介質吸熱後蒸發成氣態,並移動至該熱導管另一端之冷凝端驅散熱量,使之形成一個封閉的散熱循環行程,且可利用該散熱介質一次帶走大量的熱量,進而達到提昇散熱效率之目的。另外,還有單純利用液體循環散熱的水冷散熱模組,係利用一循環泵浦帶動比熱大且可吸熱之一散熱液體(通常為水),其流經該發熱元件時可同時吸附熱量,並利用該散熱液體的流動將熱量帶離該發熱元件,而於行經的管路間或儲水槽內排放熱量,以達到驅散熱量之目的。 Generally, the most common heat dissipating device is made by various heat processing metals (such as aluminum or copper), which is composed of a base, a plurality of heat dissipating fins and a cooling fan, and the base is closely contacted with the base. After the heating element, the heat energy is directly transmitted to the heat dissipating fins, and the surface is thermally convected with the outside air, thereby dissipating the heat energy to the outside. Or a heat pipe is combined with a heat pipe to fill the closed body. There is a heat-dissipating medium in the liquid state, the main component of the heat-dissipating medium is water, and the rest is composed of a special component capable of increasing the heat transfer capability of the liquid. One end of the heat pipe is an evaporation end and is in contact with the heating element, so as to absorb the heat thereof, so that the heat dissipation medium absorbs heat and evaporates into a gaseous state, and moves to the condensation end of the other end of the heat pipe to dissipate heat, thereby forming A closed heat-dissipating cycle, and the heat-dissipating medium can be used to take away a large amount of heat at a time, thereby achieving the purpose of improving heat dissipation efficiency. In addition, there is also a water-cooling heat-dissipating module that uses only liquid circulation heat dissipation, which uses a circulating pump to drive a heat-dissipating liquid (usually water) which is large in heat and absorbs heat, and simultaneously absorbs heat when flowing through the heating element, and The flow of the heat-dissipating liquid is used to carry heat away from the heat-generating component, and heat is discharged between the pipelines or the water storage tanks to achieve the purpose of dissipating heat.

然而,以上各種散熱裝置或水冷散熱模組,都有各自在使用上的缺點,最常見的問題是受到空間的限制,而造成其使用效能不彰。尤其是針對具有大發熱量之該發熱元件,要如何在受空間限制的條件下,增加散熱裝置或水冷散熱模組的熱傳導面積(Thermal Conduction Area)或散熱面積,並利用熱對流效應(Heat Convection)以有效地提升散熱效率,一直是各家廠商戮力之目標。 However, the above various heat sinks or water-cooled heat sink modules have their own shortcomings in use. The most common problem is that they are limited by space, and their use efficiency is not good. Especially for the heating element with large heat generation, how to increase the thermal conduction area or heat dissipation area of the heat sink or the water-cooling heat dissipation module under the space-limited condition, and utilize the heat convection effect (Heat Convection) In order to effectively improve the efficiency of heat dissipation, it has always been the goal of various manufacturers.

有鑑於此,本發明之一目的,旨在提供一種雙相變化循環式水冷模組,俾於一集熱體及一散熱體 之間利用一散熱介質的氣、液二相變化,而能夠隨著管路的設計而快速驅散大量熱量之功效。 In view of the above, an object of the present invention is to provide a two-phase change circulating water cooling module, which is disposed on a heat collector and a heat sink. The gas-liquid two-phase change between a heat-dissipating medium can quickly dissipate a large amount of heat with the design of the pipeline.

本發明之次一目的,旨在提供一種雙相變化循環式水冷模組,俾利用該集熱體及該散熱體之間的管路設計係對應該散熱進行二相變化時的體積變化量,同時還能依據空間製作出最大的變化效果。 A second object of the present invention is to provide a two-phase change circulating water-cooling module, in which a piping design between the heat collecting body and the heat dissipating body is used to change the volume of the heat when the two-phase change is performed. At the same time, the biggest change effect can be made according to the space.

為達上述目的,本發明之雙相變化循環式水冷模組,安裝於一發熱元件以驅散熱量,其包括:一集熱體,其內部係設有一第一氣液共存區,且該第一氣液共存區於該集熱體表面係形成有至少一出氣口及至少一入液口;一散熱體,其高度係高於等於該集熱體,該散熱體係設有一第二氣液共存區,且該第二氣液共存區於該散熱體上形成有至少一入氣口及至少一出液口;至少一導氣管,其一端係接設於該出氣口,另一端接設於該入氣口,而利用該導氣管形成該集熱體及該散熱體之間的一氣體通道;至少一導液管,其一端係接設於該出液口,另一端接設於該入液口,而利用該導液管形成該集熱體及該散熱體之間的一液體通道;及一散熱介質,係呈液態而以一設定量填充設於該第一氣液共存區及/或該第二氣液共存區內,該散熱介質於該集熱體受熱後而汽化成氣態,通過該氣體通道而進入該散熱體內,並於該散熱體內降溫而重新變成液態,該散熱介質受到相變化之體積變化及重力等之推動,再 通過該液體通道重新回到該集熱體內。其中,該散熱介質於常溫常壓下之汽化點係介於30℃~68℃。 In order to achieve the above object, the two-phase change circulating water-cooling module of the present invention is mounted on a heating element to dissipate heat, and includes: a heat collecting body having a first gas-liquid coexistence zone therein, and the first The gas-liquid coexistence zone is formed with at least one gas outlet and at least one liquid inlet on the surface of the heat collector; a heat sink having a height higher than or equal to the heat collector, and the heat dissipation system is provided with a second gas-liquid coexistence zone And the second gas-liquid coexistence zone is formed with at least one air inlet and at least one liquid outlet on the heat dissipating body; at least one air guiding pipe is connected at one end to the air outlet, and the other end is connected to the air inlet And using the air guiding tube to form a gas passage between the heat collecting body and the heat dissipating body; at least one liquid guiding tube has one end connected to the liquid outlet and the other end connected to the liquid inlet; Using the liquid guiding tube to form a liquid passage between the heat collecting body and the heat dissipating body; and a heat dissipating medium which is in a liquid state and is filled in the first gas-liquid coexistence zone and/or the second in a set amount In the gas-liquid coexistence zone, the heat dissipating medium is vaporized after the heat collector is heated The gaseous state enters the heat dissipating body through the gas passage, and is cooled in the heat dissipating body to become liquid again. The heat dissipating medium is driven by the volume change of the phase change and gravity, etc. Returning to the heat collector through the liquid passage. Wherein, the vaporization point of the heat dissipation medium at normal temperature and pressure is between 30 ° C and 68 ° C.

其中,該散熱體係為一散熱水箱,且包含該第二氣液共存區及複數個散熱鰭片,該等散熱鰭片係包覆於該散熱體外部。 The heat dissipation system is a heat dissipation water tank, and includes the second gas-liquid coexistence zone and a plurality of heat dissipation fins, and the heat dissipation fins are wrapped around the heat dissipation body.

於一實施例中,本發明之該雙相變化循環式水冷模組,更具有至少一散熱風扇,設於該散熱體上,而能以強制進氣的方式加速驅散該散熱體上所匯集之熱量。 In one embodiment, the two-phase change circulating water-cooling module of the present invention further has at least one heat-dissipating fan disposed on the heat-dissipating body, and can accelerate the dispersal of the heat-dissipating body by means of forced air intake. Heat.

於一實施例中,該導氣管之管徑係大於等於該導液管之管徑,而能有助於該散熱介質回復成液態時重新流回該集熱體之順暢性。 In an embodiment, the diameter of the air guiding tube is greater than or equal to the diameter of the liquid guiding tube, which can facilitate the smooth return of the heat dissipating medium to the liquid collector when it returns to a liquid state.

為了因應不同的使用狀況,本發明之該雙相變化循環式水冷模組亦有相對應之結構設計。其中,當該發熱元件係為一中央處理器時,該散熱體係設於該集熱體的上方,且該導氣管及該導液管係分設於該散熱體及該集熱體之二側。或是當該發熱元件係為一中央處理器時,該散熱體係設於該集熱體之一側且與之相同高度,該導氣管及該導液管係分設於該散熱體及該集熱體之二側。抑或是當該發熱元件係為一圖形處理器時,該散熱體係設於該集熱體之一側且高於該集熱體的位置,該導氣管及該導液管係分設於該散熱體及該集熱體之二側。以上各種實施例係依據空間製作出最大的變化效果,對於散 熱效率亦能發揮其助益。 In order to meet different usage conditions, the two-phase change circulating water cooling module of the present invention also has a corresponding structural design. Wherein, when the heating element is a central processing unit, the heat dissipation system is disposed above the heat collecting body, and the air guiding tube and the liquid guiding tube are disposed on the heat dissipating body and the heat collecting body . Or when the heat generating component is a central processing unit, the heat dissipating system is disposed on one side of the heat collecting body and at the same height, and the air guiding pipe and the liquid guiding pipe are respectively disposed on the heat dissipating body and the set The two sides of the hot body. Or when the heat generating component is a graphic processor, the heat dissipating system is disposed on one side of the heat collecting body and higher than the position of the heat collecting body, and the air guiding pipe and the liquid guiding pipe are respectively disposed in the heat dissipation The body and the two sides of the collector. The above various embodiments are based on the space to produce the largest change effect, for the scattered Thermal efficiency can also help.

本發明之再一目的,旨在提供一種雙相變化循環式水冷模組之使用方法,俾能提高其使用時的散熱效率。 Still another object of the present invention is to provide a method for using a two-phase change circulating water cooling module, which can improve the heat dissipation efficiency when used.

為達上述目的,該雙相變化循環式水冷模組的使用方法係包括:提供該雙相變化循環式水冷模組;設置該集熱體於該發熱元件之表面;利用該集熱體內之該散熱介質吸收該發熱元件所發出之熱量而汽化成氣態,並通過該導液管而進入該散熱體;使用該散熱體進行散熱,使該散熱介質降溫至該汽化點溫度以下而成為液態;及利用該散熱介質相變化之體積變化及重力等之推動,而通過該導液管重新回到該集熱體,形成一穩定之散熱循環。 In order to achieve the above object, the method for using the two-phase change circulating water-cooling module comprises: providing the two-phase change circulating water-cooling module; and providing the heat collector on a surface of the heat-generating component; The heat dissipating medium absorbs the heat generated by the heat generating component and vaporizes into a gaseous state, and enters the heat dissipating body through the liquid guiding tube; the heat dissipating body is used to dissipate heat, and the heat dissipating medium is cooled to a temperature below the vaporization point to become a liquid; By using the volume change of the phase change of the heat-dissipating medium and the pushing of gravity, etc., the liquid-collecting tube is returned to the heat-collecting body to form a stable heat-dissipating cycle.

於一實施例中,為提昇其散熱效率,係於該「使用該散熱體進行散熱,使該散熱介質降溫至該汽化點溫度以下而成為液態」之步驟中,更使用一強制冷卻手段,以使該散熱體更快將熱量驅散,且該該強制冷卻手段係使用至少一散熱風扇,而吹送該散熱體進行強制降溫。 In an embodiment, in order to improve the heat dissipation efficiency, in the step of using the heat sink to dissipate heat, and the heat dissipation medium is cooled to a temperature below the vaporization point to become a liquid state, a forced cooling method is further used. The heat sink is dissipated more quickly, and the forced cooling means uses at least one heat dissipating fan to blow the heat sink for forced cooling.

為使 貴審查委員能清楚了解本發明之內容,僅以下列說明搭配圖式,敬請參閱。 In order for your review board to have a clear understanding of the contents of the present invention, please refer to the following description.

第一實施例First embodiment

請參閱第1、2、3、4圖,係為本發明第一實施 例的結構示意圖及安裝示意圖,以及其使用時的狀態示意圖與步驟流程圖。如圖中所示,本發明之雙相變化循環式水冷模組1係用來安裝於一發熱元件2以驅散熱量,於第一實施例中,該發熱元件2係為一中央處理器,而本發明之該雙相變化循環式水冷模組1係包括一集熱體11、一散熱體12、一對導氣管13、一導液管14及一散熱介質15。 Please refer to Figures 1, 2, 3 and 4 for the first embodiment of the present invention. The structural diagram and installation diagram of the example, as well as the state diagram and step flow chart of the use. As shown in the figure, the two-phase change circulating water-cooling module 1 of the present invention is used for mounting a heat-generating component 2 to dissipate heat. In the first embodiment, the heat-generating component 2 is a central processing unit. The two-phase change circulating water-cooling module 1 of the present invention comprises a heat collecting body 11, a heat radiating body 12, a pair of air guiding tubes 13, a liquid guiding tube 14, and a heat dissipating medium 15.

其中該集熱體11係矩形塊狀結構體,於該集熱體11之內部係設有一第一氣液共存區111,且該第一氣液共存區111於該集熱體11表面係形成有一對出氣口1111及一入液口1112,該對出氣口1111係設於該集熱體11之頂面,該入液口1112係設於該集熱體11之一側面。再者,該集熱體11之四個角落分別設有一固定孔112,供以分別固設一固定元件113於該發熱元件2上,使該集熱體11與該發熱元件2完全緊密地貼合成一體。 The heat collector 11 is a rectangular block structure, and a first gas-liquid coexistence zone 111 is disposed inside the heat collector 11 , and the first gas-liquid coexistence zone 111 is formed on the surface of the heat collector 11 . There is a pair of air outlets 1111 and a liquid inlet port 1112. The pair of air outlets 1111 are provided on the top surface of the heat collector 11, and the liquid inlet 1112 is disposed on one side of the heat collector 11. Further, a fixing hole 112 is defined in each of the four corners of the heat collecting body 11 to fix a fixing component 113 on the heating element 2, so that the heat collecting body 11 and the heat generating component 2 are completely closely attached. Synthetic.

該散熱體12同樣為矩形塊體結構體,且垂直設於該集熱體11的上方,該散熱體12之內部係設有一第二氣液共存區121,且該第二氣液共存區121於該散熱體12上形成有一對入氣口1211及一出液口1212。如圖中所示,其中,該散熱體12係為一散熱水箱,且包含該第二氣液共存區121及複數個散熱鰭片122,且該等散熱鰭片122係包覆於該第二氣液共存區121之外部,該等散熱鰭片122係間 隔且平行於該集熱體11之設置。應注意的是,於該散熱體12之一側面上係設有一散熱風扇123,使該散熱風扇123之氣流可通過該等散熱鰭片122,而將其熱量側向吹出。 The heat dissipating body 12 is also a rectangular block structure body, and is disposed vertically above the heat collecting body 11. The second heat and liquid coexistence area 121 is disposed inside the heat dissipating body 12, and the second gas-liquid coexistence area 121 is provided. A pair of air inlets 1211 and a liquid outlet 1212 are formed on the heat sink 12. As shown in the figure, the heat dissipating body 12 is a heat dissipating water tank, and includes the second gas-liquid coexistence area 121 and a plurality of heat dissipating fins 122, and the heat dissipating fins 122 are coated on the second Outside the gas-liquid coexistence zone 121, the fins 122 are intersystem It is spaced apart from and parallel to the arrangement of the heat collector 11. It should be noted that a heat dissipating fan 123 is disposed on one side of the heat dissipating body 12 so that the airflow of the heat dissipating fan 123 can pass through the heat dissipating fins 122 to blow the heat laterally.

該每一導氣管13之一端係接設於該每一出氣口1111,另一端接設於該每一入氣口1211,使該每一導氣管13係垂直立設於該集熱體11,並接設於該散熱體12之底面,且透過該對導氣管13而形成該集熱體11及該散熱體12之間的一氣體通道131。 One end of each of the air guiding tubes 13 is connected to each of the air outlets 1111, and the other end is connected to each of the air inlets 1211, so that each of the air guiding tubes 13 is vertically erected on the heat collecting body 11, and The gas channel 131 is formed on the bottom surface of the heat sink 12 and penetrates the air guiding tube 13 to form a gas passage 131 between the heat collecting body 11 and the heat sink 12 .

該導液管14之一端係接設於該出液口1212,另一端接設於該入液口1112,使該導液管14之一端接設於該集熱體11之側面,另一端接設於該散熱體12之頂面,形成該集熱體11及該散熱體12之間的一液體通道141。 One end of the liquid guiding tube 14 is connected to the liquid outlet 1212, and the other end is connected to the liquid inlet 1112, so that one end of the liquid guiding tube 14 is connected to the side of the heat collecting body 11 and the other end is connected. A liquid passage 141 is formed between the heat collector 11 and the heat sink 12 on the top surface of the heat sink 12 .

該散熱介質15於常溫常壓下之汽化點係介於30℃~68℃之液態物質,因此,於室溫下係呈液態,且以一設定量而填充設於該第一氣液共存區111及/或該第二氣液共存區121內。應注意的是,由於該散熱介質15產生相變化時會有體積變化,故該導氣管13之管徑係大於等於該對導液管14之管徑。 The vaporization point of the heat dissipating medium 15 is a liquid substance having a vaporization point of 30 ° C to 68 ° C at normal temperature and pressure, and therefore is liquid at room temperature and is filled in the first gas-liquid coexistence area at a set amount. 111 and/or the second gas-liquid coexistence zone 121. It should be noted that the diameter of the air guiding tube 13 is greater than or equal to the diameter of the pair of liquid guiding tubes 14 due to the volume change of the heat dissipating medium 15 when the phase change occurs.

使用時,再請一併參閱第3、4圖所示,該雙相變化循環式水冷模組1的使用方法,其步驟係包括: When using, please refer to the methods of using the two-phase change circulating water-cooling module 1 as shown in Figures 3 and 4, the steps of which include:

S1:提供該雙相變化循環式水冷模組1。 S1: Providing the two-phase change circulating water cooling module 1.

S2:設置該集熱體11於該發熱元件2之表面。 使該發熱元件2所產生之熱量,直接傳導至該集熱體11內。 S2: The heat collector 11 is disposed on the surface of the heat generating component 2. The heat generated by the heat generating element 2 is directly conducted into the heat collector 11.

S3:利用該集熱體11內之該散熱介質15吸收該發熱元件2所發出之熱量而汽化成氣態,並通過該導液管13而進入該散熱體12。使該散熱介質15於該集熱體11之該第一氣液共存區內受熱後而汽化成氣態,呈氣態之該散熱介質15再通過該氣體通道131而進入該散熱體12之該第二氣液共存區121內。 S3: The heat dissipating medium 15 in the heat collecting body 11 absorbs heat generated by the heat generating component 2 to be vaporized into a gaseous state, and enters the heat sink 12 through the liquid guiding tube 13. The heat dissipating medium 15 is heated in the first gas-liquid coexistence region of the heat collector 11 to be vaporized into a gaseous state, and the heat dissipating medium 15 in the gaseous state passes through the gas passage 131 to enter the second portion of the heat dissipating body 12 . The gas-liquid coexistence zone 121 is inside.

S4:使用該散熱體12進行散熱,使該散熱介質15降溫至該汽化點溫度以下而成為液態。受到該散熱鰭片122增加散熱面積,而使該散熱介質15的溫度下降至汽化點以下,則該散熱介質15可重新變成液態。 S4: The heat dissipating body 12 is used to dissipate heat, and the heat dissipating medium 15 is cooled to a temperature below the vaporization point to become a liquid. The heat dissipating fins 15 can be re-turned into a liquid state by the heat dissipating fins 122 increasing the heat dissipating area and lowering the temperature of the heat dissipating medium 15 below the vaporization point.

S5:使用強制冷卻手段,以使該散熱體更快將熱量驅散。該強制冷卻手段係使用該散熱風扇123強制送風後,可更快速使該散熱體12內之該散熱介質15的溫度下降至汽化點以下,則該散熱介質15可重新變成液態。 S5: Use forced cooling to make the heat sink dissipate heat more quickly. The forced cooling means can quickly reduce the temperature of the heat dissipating medium 15 in the heat sink 12 to below the vaporization point after the air is forcedly blown by the heat radiating fan 123, and the heat dissipating medium 15 can be changed to a liquid state again.

S6:利用該散熱介質15相變化之體積變化及重力等之推動,而通過該導液管14重新回到該集熱體12,形成一穩定之散熱循環。因此,呈液態之該散熱介質15受到相變化時之體積變化及重力等之推動下,通過該液體通道141重新回到該集熱體11 內,以形成一封閉的散熱循環行程。 S6: using the volume change of the phase change of the heat dissipating medium 15 and the pushing of gravity, etc., and returning to the heat collecting body 12 through the liquid guiding tube 14 to form a stable heat dissipation cycle. Therefore, the heat dissipating medium 15 in a liquid state is returned to the heat collecting body 11 through the liquid passage 141 under the influence of volume change and gravity or the like when the phase changes. Inside to form a closed heat-dissipating cycle.

第二實施例Second embodiment

再者,請參閱第5、6、7圖,係為本發明第二實施例的結構示意圖及安裝示意圖,以及其使用時的狀態示意圖。如圖中所示,本發明第二實施例之該雙相變化循環式水冷模組3係同樣包括一集熱體31、一散熱體32、一對導氣管33、一導液管34及一散熱介質35,且該發熱元件4同樣為一中央處理器,而使用於一體成型電腦主機(ALL IN ONE)內時,該集熱體31係以與前一實施例相同的方式而固設於該發熱元件4上,而該散熱體32係設於該集熱體31之一側且與之相同高度,該對導氣管33及該導液管34則分別設於該散熱體32及該集熱體31之二側,該散熱介質35係填充設於該集熱體31及/或該散熱體32內。 Furthermore, please refer to Figures 5, 6, and 7 for a schematic view of the structure and installation of the second embodiment of the present invention, and a schematic diagram of the state of use thereof. As shown in the figure, the two-phase variable circulation water-cooling module 3 of the second embodiment of the present invention also includes a heat collecting body 31, a heat radiating body 32, a pair of air guiding tubes 33, a liquid guiding tube 34 and a The heat dissipating medium 35 is also a central processing unit. When used in an integrally formed computer main unit (ALL IN ONE), the heat collecting body 31 is fixed in the same manner as in the previous embodiment. The heat generating element 4 is disposed on one side of the heat collecting body 31 and at the same height, and the pair of air guiding tubes 33 and the liquid guiding tube 34 are respectively disposed on the heat radiating body 32 and the set. On the two sides of the heat body 31, the heat dissipation medium 35 is filled in the heat collector 31 and/or the heat sink 32.

應注意的是,該散熱體32係同樣為一散熱水箱,且可利用該對導氣管33及該導液管34而延伸至一機殼(圖中未顯示)外部,該散熱體32係內部係具有一第二氣液共存區321及複數個散熱鰭片322,該等散熱鰭片322係夾設於該第二氣液共存區321內部。據而,利用與該第一實施例同樣之使用方式,對該發熱元件4進行散熱故於此不再贅述。或可增加一散熱風扇進行強制散熱,圖中未標示。 It should be noted that the heat dissipating body 32 is also a heat dissipating water tank, and can be extended to the outside of a casing (not shown) by the pair of air guiding tubes 33 and the liquid guiding tube 34, and the heat dissipating body 32 is internally The second gas-liquid coexistence zone 321 and the plurality of heat dissipation fins 322 are disposed inside the second gas-liquid coexistence zone 321 . Accordingly, the heat generating element 4 is dissipated by the same manner as the first embodiment, and thus will not be described again. Or a cooling fan can be added for forced cooling, which is not shown in the figure.

第三實施例Third embodiment

再者,請參閱第8、9、10圖,係為本發明第三二實施例的結構示意圖及安裝示意圖,以及其使用時的狀態示意圖。如圖中所示,本發明第三實施例之雙相變化循環式水冷模組5亦同樣包括一集熱體51、一散熱體52、一導氣管53、一導液管54及一散熱介質55,且該發熱元件6係為一圖形處理器時,該散熱體52係設於該集熱體51之一側而形成水平疊置之態樣,且該散熱體52之位置係高於該集熱體51的位置,該導氣管53及該導液管54係分設於該散熱體52及該集熱體51之二側,該散熱介質55係填充設於該集熱體51及/或該散熱體52內。其使用方法與前二實施例相同,故於此不再贅述,並可增加一散熱風扇56於該散熱體52之一側,以對該散熱體52進行強制散熱,進一步提昇其散熱效率。 Furthermore, please refer to Figures 8, 9, and 10 for a schematic view of the structure and installation of the third embodiment of the present invention, and a schematic diagram of the state of use thereof. As shown in the figure, the dual-phase change circulating water-cooling module 5 of the third embodiment of the present invention also includes a heat collecting body 51, a heat radiating body 52, an air guiding tube 53, a liquid guiding tube 54, and a heat dissipating medium. 55, and the heat generating component 6 is a GPU, the heat sink 52 is disposed on one side of the heat collecting body 51 to form a horizontally stacked state, and the position of the heat sink 52 is higher than the In the position of the heat collecting body 51, the air guiding tube 53 and the liquid guiding tube 54 are disposed on the heat dissipating body 52 and the heat collecting body 51, and the heat dissipating medium 55 is filled in the heat collecting body 51 and/or Or in the heat sink 52. The method of use is the same as that of the first embodiment. Therefore, a heat dissipation fan 56 is added to one side of the heat sink 52 to forcibly dissipate the heat sink 52 to further improve the heat dissipation efficiency.

以上所述者,僅為本發明之較佳實施例而已,並非用以限定本發明實施之範圍,其他如該所屬領域中具有通常知識者,或是熟習此技藝所作出等效或輕易的變化者,在不脫離本發明之精神與範圍下所作之均等變化與修飾,皆應涵蓋於本發明之專利範圍內。而,本發明之雙相變化循環式水冷模組具有發明專利之創作要件以及對產業的利用價值;申請人爰依專利法之規定,向 鈞局提起發明專利之申請。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the practice of the present invention, and other embodiments of the present invention, or equivalent or easy changes in the art. Equivalent changes and modifications made without departing from the spirit and scope of the invention are intended to be included within the scope of the invention. However, the two-phase variable circulation water-cooling module of the present invention has the creative requirements of the invention patent and the use value of the industry; the applicant applies for the invention patent to the bureau in accordance with the provisions of the patent law.

【第一實施例】 [First Embodiment]

1‧‧‧雙相變化循環式水冷模組 1‧‧‧Two-phase change circulating water cooling module

11‧‧‧集熱體 11‧‧‧Heads

111‧‧‧第一氣液共存區 111‧‧‧First gas-liquid coexistence zone

1111‧‧‧出氣口 1111‧‧‧ gas outlet

1112‧‧‧入液口 1112‧‧‧Inlet

112‧‧‧固定孔 112‧‧‧Fixed holes

113‧‧‧固定元件 113‧‧‧Fixed components

12‧‧‧散熱體 12‧‧‧ Heat sink

121‧‧‧第二氣液共存區 121‧‧‧Second gas-liquid coexistence zone

1211‧‧‧入氣口 1211‧‧‧ inlet

1212‧‧‧出液口 1212‧‧‧ liquid outlet

122‧‧‧散熱鰭片 122‧‧‧Heat fins

123‧‧‧散熱風扇 123‧‧‧ cooling fan

13‧‧‧導氣管 13‧‧‧ air duct

131‧‧‧氣體通道 131‧‧‧ gas passage

14‧‧‧導液管 14‧‧‧ catheter

141‧‧‧液體通道 141‧‧‧Liquid channel

15‧‧‧散熱介質 15‧‧‧heating medium

2‧‧‧發熱元件 2‧‧‧heating components

S1~S6‧‧‧步驟 S1~S6‧‧‧Steps

【第二實施例】 [Second embodiment]

3‧‧‧雙相變化循環式水冷模組 3‧‧‧Two-phase change circulating water cooling module

31‧‧‧集熱體 31‧‧‧ Collector

32‧‧‧散熱體 32‧‧‧ Heat sink

321‧‧‧第二氣液共存區 321‧‧‧Second gas-liquid coexistence zone

322‧‧‧散熱鰭片 322‧‧‧heat fins

33‧‧‧導氣管 33‧‧‧ air duct

34‧‧‧導液管 34‧‧‧ catheter

35‧‧‧散熱介質 35‧‧‧Heat dissipating medium

4‧‧‧發熱元件 4‧‧‧heating components

【第三實施例】 [Third embodiment]

5‧‧‧雙相變化循環式水冷模組 5‧‧‧Two-phase change circulating water cooling module

51‧‧‧集熱體 51‧‧‧Heads

52‧‧‧散熱體 52‧‧‧ Heat sink

521‧‧‧第二氣液共存區 521‧‧‧Second gas-liquid coexistence zone

522‧‧‧散熱鰭片 522‧‧‧Heat fins

53‧‧‧導氣管 53‧‧‧ air duct

54‧‧‧導液管 54‧‧‧ catheter

55‧‧‧散熱介質 55‧‧‧Dissipating medium

56‧‧‧散熱風扇 56‧‧‧ cooling fan

6‧‧‧發熱元件 6‧‧‧heating components

第1圖,為本發明第一實施例的結構示意圖。 Fig. 1 is a schematic view showing the structure of a first embodiment of the present invention.

第2圖,為本發明第一實施例的安裝示意圖。 Fig. 2 is a schematic view showing the mounting of the first embodiment of the present invention.

第3圖,為本發明第一實施例使用時的狀態示意圖。 Fig. 3 is a view showing the state of the first embodiment of the present invention when it is used.

第4圖,為本發明第一實施例使用方法的步驟流程圖。 Figure 4 is a flow chart showing the steps of the method of use in the first embodiment of the present invention.

第5圖,為本發明第二實施例的結構示意圖。 Figure 5 is a schematic view showing the structure of a second embodiment of the present invention.

第6圖,為本發明第二實施例的安裝示意圖。 Figure 6 is a schematic view showing the installation of the second embodiment of the present invention.

第7圖,為本發明第二實施例使用時的狀態示意圖。 Fig. 7 is a view showing the state of the second embodiment of the present invention when it is used.

第8圖,為本發明第三實施例的結構示意圖。 Figure 8 is a schematic view showing the structure of a third embodiment of the present invention.

第9圖,為本發明第三實施例的安裝示意圖。 Figure 9 is a schematic view showing the mounting of the third embodiment of the present invention.

第10圖,為本發明第三實施例使用時的狀態示意圖。 Fig. 10 is a view showing the state of the third embodiment of the present invention when it is used.

1‧‧‧雙相變化循環式水冷模組 1‧‧‧Two-phase change circulating water cooling module

11‧‧‧集熱體 11‧‧‧Heads

111‧‧‧第一氣液共存區 111‧‧‧First gas-liquid coexistence zone

1111‧‧‧出氣口 1111‧‧‧ gas outlet

1112‧‧‧入液口 1112‧‧‧Inlet

112‧‧‧固定孔 112‧‧‧Fixed holes

113‧‧‧固定元件 113‧‧‧Fixed components

12‧‧‧散熱體 12‧‧‧ Heat sink

1211‧‧‧入氣口 1211‧‧‧ inlet

1212‧‧‧出液口 1212‧‧‧ liquid outlet

122‧‧‧散熱鰭片 122‧‧‧Heat fins

123‧‧‧散熱風扇 123‧‧‧ cooling fan

13‧‧‧導氣管 13‧‧‧ air duct

131‧‧‧氣體通道 131‧‧‧ gas passage

14‧‧‧導液管 14‧‧‧ catheter

141‧‧‧液體通道 141‧‧‧Liquid channel

2‧‧‧發熱元件 2‧‧‧heating components

Claims (11)

一種雙相變化循環式水冷模組,安裝於一發熱元件以驅散熱量,其包括:一集熱體,其內部係設有一第一氣液共存區,且該第一氣液共存區於該集熱體表面係形成有至少一出氣口及至少一入液口;一散熱體,其高度係高於等於該集熱體,該散熱體係設有一第二氣液共存區,且該第二氣液共存區於該散熱體上形成有至少一入氣口及至少一出液口;至少一導氣管,其一端係接設於該出氣口,另一端接設於該入氣口,而利用該導氣管形成該集熱體及該散熱體之間的一氣體通道;至少一導液管,其一端係接設於該出液口,另一端接設於該入液口,而利用該導液管形成該集熱體及該散熱體之間的一液體通道;及一散熱介質,係呈液態而以一設定量填充設於該第一氣液共存區及/或該第二氣液共存區內,該散熱介質於該集熱體受熱後而汽化成氣態,通過該氣體通道而進入該散熱體內,並於該散熱體內降溫而重新變成液態,該散熱介質受到相變化之體積變化及重力等之推動,再通過該液體通道重新回到該集熱體內。 A two-phase change circulating water-cooling module is installed in a heating element to dissipate heat, comprising: a heat collecting body, wherein a first gas-liquid coexistence zone is disposed inside, and the first gas-liquid coexistence zone is in the set The heat body surface is formed with at least one air outlet and at least one liquid inlet; a heat sink having a height higher than or equal to the heat collector, the heat dissipation system is provided with a second gas-liquid coexistence zone, and the second gas liquid The coexistence zone has at least one air inlet and at least one liquid outlet formed on the heat dissipating body; at least one air guiding pipe is connected at one end to the air outlet, and the other end is connected to the air inlet, and the air guiding tube is formed by using the air guiding tube. a gas passage between the heat collecting body and the heat dissipating body; at least one liquid guiding tube, one end of which is connected to the liquid outlet, and the other end of which is connected to the liquid inlet, and the liquid guiding tube is used to form the a liquid passage between the heat collector and the heat sink; and a heat dissipating medium which is in a liquid state and is filled in the first gas-liquid coexistence zone and/or the second gas-liquid coexistence zone by a set amount, The heat dissipating medium vaporizes into a gaseous state after the heat collector is heated, and passes through the gas passage The channel enters the heat dissipating body, and is cooled in the heat dissipating body to become liquid again. The heat dissipating medium is pushed by the volume change of the phase change, gravity, etc., and then returns to the heat collecting body through the liquid channel. 如申請專利範圍第1項所述之雙相變化循環式水 冷模組,其中,該散熱體係為一散熱水箱,且包含該第二氣液共存區及複數個散熱鰭片,該等散熱鰭片係包覆於該散熱體外部。 Bi-phase change circulating water as described in claim 1 The cooling module, wherein the heat dissipation system is a heat dissipation water tank, and includes the second gas-liquid coexistence zone and a plurality of heat dissipation fins, the heat dissipation fins being wrapped around the heat dissipation body. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,其中,該散熱介質於常溫常壓下之汽化點係介於30℃~68℃。 The two-phase change circulating water-cooling module according to claim 1, wherein the heat-dissipating medium has a vaporization point of 30 ° C to 68 ° C under normal temperature and normal pressure. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,更具有至少一散熱風扇,設於該散熱體上,供以加速驅散該散熱體之熱量。 The two-phase change circulating water-cooling module according to claim 1, further comprising at least one heat dissipating fan disposed on the heat dissipating body for accelerating the dissipating heat of the heat dissipating body. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,其中,該導氣管之管徑係大於等於該導液管之管徑。 The two-phase change circulating water-cooling module according to claim 1, wherein the air pipe has a pipe diameter greater than or equal to a pipe diameter of the pipe. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,當該發熱元件係為一中央處理器時,該散熱體係設於該集熱體的上方,且該導氣管及該導液管係分設於該散熱體及該集熱體之二側。 The two-phase change circulating water cooling module according to claim 1, wherein when the heating element is a central processing unit, the heat dissipation system is disposed above the heat collecting body, and the air guiding tube and the guiding unit The liquid pipe system is disposed on the heat dissipating body and the two sides of the heat collecting body. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,當該發熱元件係為一中央處理器時,該散熱體係設於該集熱體之一側且與之相同高度,該導氣管及該導液管係分設於該散熱體及該集熱體之二側。 The two-phase change circulating water-cooling module according to claim 1, wherein when the heat-generating component is a central processing unit, the heat dissipation system is disposed on one side of the heat collector and at the same height, The air guiding tube and the liquid guiding tube are disposed on two sides of the heat dissipating body and the heat collecting body. 如申請專利範圍第1項所述之雙相變化循環式水冷模組,當該發熱元件係為一圖形處理器時,該散熱體係設於該集熱體之一側且高於該集熱體 的位置,該導氣管及該導液管係分設於該散熱體及該集熱體之二側。 The two-phase change circulating water-cooling module according to claim 1, wherein when the heating element is a graphic processor, the heat dissipation system is disposed on one side of the heat collector and higher than the heat collector. The air guiding tube and the liquid guiding tube are disposed on two sides of the heat dissipating body and the heat collecting body. 一種使用如申請專利範圍第1項所述之雙相變化循環式水冷模組的方法,包括:提供該雙相變化循環式水冷模組;設置該集熱體於該發熱元件之表面;利用該集熱體內之該散熱介質吸收該發熱元件所發出之熱量而汽化成氣態,並通過該導液管而進入該散熱體;使用該散熱體進行散熱,使該散熱介質降溫至該汽化點溫度以下而成為液態;及利用該散熱介質相變化之體積變化及重力等之推動,而通過該導液管重新回到該集熱體,形成一穩定之散熱循環。 A method for using the two-phase change circulating water-cooling module according to claim 1, comprising: providing the two-phase change circulating water-cooling module; and providing the heat collector on a surface of the heat-generating component; The heat dissipating medium in the heat collecting body absorbs the heat generated by the heat generating component to be vaporized into a gaseous state, and enters the heat dissipating body through the liquid guiding tube; the heat dissipating body is used to dissipate heat, and the heat dissipating medium is cooled to below the vaporization point temperature. And becoming a liquid; and using the volume change of the phase change of the heat dissipating medium and the pushing of gravity, etc., and returning to the heat collector through the liquid guiding tube to form a stable heat dissipation cycle. 如申請專利範圍第9項所述之使用方法,於該「使用該散熱體進行散熱,使該散熱介質降溫至該汽化點溫度以下而成為液態」之步驟中,更使用一強制冷卻手段,以使該散熱體更快將熱量驅散。 In the method of using the heat dissipation method, the heat dissipation medium is used to cool the heat dissipation medium to a temperature below the vaporization point to become a liquid state, a forced cooling method is further used to Allow the heat sink to dissipate heat more quickly. 如申請專利範圍第10項所述之使用方法,其中,該強制冷卻手段係使用至少一散熱風扇,而吹送該散熱體進行降溫。 The method of using the method of claim 10, wherein the forced cooling means uses at least one heat dissipating fan to blow the heat sink to cool down.
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RU2731439C2 (en) * 2018-08-14 2020-09-02 Константин Викторович Котельник Cooling system of electronic system
CN113835495B (en) * 2020-06-23 2024-02-20 聊城市德通交通器材制造有限公司 Water-cooling radiator with good circulation effect and radiating method

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TW200638849A (en) * 2005-04-21 2006-11-01 Man Zai Ind Co Ltd Phase-change water-cooling type heat sink used for computers
TWM320294U (en) * 2007-04-18 2007-10-01 Cooler Master Co Ltd Heat radiator structure
WO2011040129A1 (en) * 2009-09-29 2011-04-07 日本電気株式会社 Heat conveying structure for electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2731439C2 (en) * 2018-08-14 2020-09-02 Константин Викторович Котельник Cooling system of electronic system
CN113835495B (en) * 2020-06-23 2024-02-20 聊城市德通交通器材制造有限公司 Water-cooling radiator with good circulation effect and radiating method

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