TWI631308B - Parallel condenser and heat sink - Google Patents

Abstract

The present invention relates to a parallel condenser and a heat sink. The heat sink comprises a parallel condenser and an evaporation component. The parallel condenser comprises a main condensation module and at least one auxiliary condensation module connected in parallel, and the evaporation component comprises an evaporator. An input pipe and an output pipe, the two ends of the input pipe are respectively connected to the top of the evaporator and the first main base pipe of the main condensation module, and the two ends of the output pipe are respectively connected to the evaporator and the second main base pipe of the main condensation module, The parallel condenser and the evaporation component form a closed refrigerant circulation loop, and the refrigerant is filled in the closed refrigerant circulation loop. The created heat dissipation device can provide the gaseous refrigerant split cooling through the parallel main condensation module and the auxiliary condensation module. The function of liquefaction can effectively improve the efficiency of cooling and liquefaction of the heat dissipating device in the gaseous refrigerant.

Description

Parallel condenser and heat sink

This creation is a parallel condenser and heat sink, especially a parallel condenser and heat sink for providing cooling function.

When the electronic device is prone to high temperature during operation, if the electronic device continues to operate at high temperatures, there may be a risk of malfunction or damage. Therefore, a heat is dissipated through the main heat source of the electronic device. The device and the heat generated by the heat source are dissipated through the principles of heat conduction and heat convection by the heat sink to reduce the temperature of the electronic device and achieve the purpose of cooling.

The heat dissipating device comprises an evaporator, a condenser and a plurality of refrigerant tubes. The plurality of refrigerant tubes are respectively connected to the evaporator and the condenser, and form a closed circuit, and the sealed circuit is filled with a refrigerant. The evaporator is disposed at a heat source of the electronic device. When the heat source of the electronic device generates heat, it is conducted to the evaporator, and the refrigerant located in the evaporator absorbs heat and vaporizes to form a gaseous refrigerant, and the gaseous refrigerant will After entering the condenser through the refrigerant tube, and cooling and condensing into a liquid state when passing through the condenser, it is again refluxed to the evaporator to re-absorb heat, and through the heat dissipation mechanism of the refrigerant circulating in the liquid phase and the gaseous phase to provide a heat source for the electronic device. Cooling and cooling function.

However, the heat sink has only one condenser, and the condenser can provide a limited flow rate of the gaseous refrigerant, when the liquid refrigerant inside the evaporator is heated, and the amount of refrigerant vaporization is greater than that of the condenser to provide the gaseous refrigerant. When cooling and liquefying, there is a problem of poor heat dissipation performance.

The main purpose of this creation is to provide a parallel condenser and heat sink, in order to improve the current heat sink is easily limited by the flow limit of the condenser, resulting in poor heat dissipation.

In order to achieve the foregoing disclosure, the parallel condenser provided by the present invention comprises: a main condensation module comprising a first main base pipe, a second main base pipe and a main heat dissipation mechanism, the first main base pipe Arranged spaced apart from the second main base pipe, the main heat dissipating mechanism is disposed between the first main base pipe and the second main base pipe, and the upper portion of the first main base pipe of the main condensation module forms a refrigerant inlet And the lower portion of the first main base pipe and the lower portion of the second main base pipe respectively form a refrigerant outlet; at least one auxiliary condensation module is connected in parallel with the main condensation module, the auxiliary condensation The module includes a first auxiliary base pipe, a second auxiliary base pipe, a first connecting portion, a second connecting portion and an auxiliary heat dissipating mechanism, and the first auxiliary base pipe and the second auxiliary base pipe are arranged at intervals The first connecting portion is connected to the first auxiliary base pipe and the first main base pipe. The first connecting portion forms a plurality of first flow passages arranged at intervals from top to bottom, and the plurality of first flow passages respectively communicate with the first connecting portion An auxiliary base pipe and the first main base pipe, the second connecting portion And the second auxiliary base pipe and the second main base pipe, wherein the second connecting portion forms a plurality of second flow paths arranged at intervals from top to bottom, and the plurality of second flow paths respectively communicate with the second auxiliary base pipe and The second main base pipe is disposed between the first auxiliary base pipe and the second auxiliary base pipe.

In order to achieve the foregoing, the heat sink provided by the present invention comprises: a parallel condenser as described above; and an evaporation assembly comprising an evaporator, an input pipe and an output pipe, the evaporator comprising a built-in a housing of the evaporation chamber, the bottom of the housing has a heat conducting bottom plate, the two ends of the input tube are respectively connected to the top of the shell of the evaporator and the first main base tube of the main condensation module, and the two ends of the output tube Connecting the side wall of the casing of the evaporator and the second main base pipe of the main condensation module respectively, so that the parallel condenser The evaporation unit constitutes a closed refrigerant circulation circuit, and the refrigerant is filled in the closed refrigerant circulation circuit.

The parallel condenser of the present invention can be applied to a general heat dissipating device or a heat dissipating device as disclosed above, and the main condensing module and the auxiliary condensing module of the parallel condenser are provided to cool the refrigerant through the shunting manner, thereby providing For example, the heat dissipation effect of the article or the device is applied to provide cooling and cooling of the electronic device, and the evaporator can be installed on the heat source of the electronic device.

Wherein, the pressure of the refrigerant passing through the closed refrigerant circulation circuit increases as the amount of refrigerant vaporization increases, and the amount of refrigerant vaporization increases as the temperature of the heat source of the electronic device increases, and if the electronic device When the heat source generates heat to vaporize the refrigerant, and the amount of refrigerant vaporization is less than the flow rate of the main condensing module capable of providing the passage of the gaseous refrigerant, the gaseous refrigerant directly passes through the main condensing module; if the electronic device is heated When the source heat causes the refrigerant to vaporize, and the amount of refrigerant vaporization is greater than the flow rate of the main condensing module capable of providing the passage of the gaseous refrigerant, the gaseous refrigerant may enter the auxiliary condensing module due to the large pressure of the refrigerant. And through the simultaneous cooling of the split flow to improve the liquefaction efficiency of the refrigerant of the heat sink.

In addition, a cooling medium inlet is formed in an upper portion of the first main base pipe of the main condensing module of the heat dissipating device, and a lower refrigerant outlet is formed in a lower portion of the first main base pipe and a lower portion of the second main base pipe. The two ends of the input tube are respectively connected to the top of the shell of the evaporator and the refrigerant inlet of the main condensing module, and the two ends of the output tube are respectively connected to the side wall of the shell of the evaporator and the second main of the main condensing module a refrigerant outlet of the base pipe, and the evaporation assembly comprises a return pipe, the two ends of which are respectively connected to the sidewall of the casing of the evaporator and the refrigerant outlet of the first main pipe of the main condensation module, when the gaseous refrigerant When entering the first main base pipe of the main condensation module through the input pipe, the refrigerant that has been condensed into a liquid flows downward to the lower portion of the first main base pipe of the main condensation module, and directly Returning from the return pipe to the evaporator, and the remaining gaseous refrigerant is condensed into a liquid refrigerant through the main heat dissipating mechanism, and then returning from the output pipe of the second main base pipe connected to the main condensation module to the evaporator. Through multiple flows of cold The medium phase change circulation mode enables the liquid and gaseous refrigerant to be reliably shunted, thereby improving the heat dissipation effect of the heat dissipation device.

10‧‧‧Main Condensation Module

11‧‧‧ First main base pipe

12‧‧‧Second main base pipe

13‧‧‧Main heat dissipation mechanism

14‧‧‧Main heat pipe

15‧‧‧Main heat sink

16‧‧‧Refrigerant entrance

17, 18‧‧‧Refrigerant exports

20‧‧‧Auxiliary condensation module

21‧‧‧First auxiliary base pipe

22‧‧‧Second auxiliary base pipe

23‧‧‧Auxiliary heat dissipation mechanism

24‧‧‧Auxiliary heat pipe

25‧‧‧Auxiliary heat sink

26‧‧‧First runner

27‧‧‧Second runner

28‧‧‧First connection

29‧‧‧Second connection

30‧‧‧Evaporation components

31‧‧‧Evaporator

32‧‧‧Input tube

33‧‧‧Output tube

34‧‧‧Evaporation room

35‧‧‧Shell

36‧‧‧thermal base plate

37‧‧‧Return pipe

40‧‧‧heat source

50‧‧‧Refrigerant

Figure 1 is a perspective view of a preferred embodiment of a parallel condenser of the present invention.

Figure 2: Schematic plan view of the parallel condenser of the present invention.

Figure 3: Schematic diagram of a side view of the parallel condenser of the present invention.

FIG. 4 is a perspective view showing a stereoscopic appearance of a preferred embodiment of the heat sink of the present invention.

Figure 5 is a partial cross-sectional view showing the evaporator of the heat sink of the present invention disposed on a heat source.

Figure 6 is a schematic view showing the state of use of the heat sink of the present invention.

Figure 7: Schematic diagram of the flow direction when the refrigerant of the heat sink is not split.

Figure 8 is a schematic view showing the flow direction of the refrigerant dispersing of the heat sink of the present invention.

Referring to FIG. 1 to FIG. 3 , a preferred embodiment of the parallel condenser of the present invention comprises a main condensation module 10 and at least one auxiliary condensation module 20 .

As shown in FIG. 1 to FIG. 3, the main condensation module 10 includes a first main base pipe 11, a second main base pipe 12, and a main heat dissipation mechanism 13, the first main base pipe 11 and the second main The base tubes 12 are arranged at intervals. The main heat dissipation mechanism 13 is disposed between the first main base pipe 11 and the second main base pipe 12. The upper portion of the first main base pipe 11 of the main condensation module 10 forms a refrigerant. The inlet 16 and the lower portion of the first main base pipe 11 and the lower portion of the second main base pipe 12 of the main condensation module 10 respectively form a refrigerant outlet 17, 18, wherein the main heat dissipation mechanism 13 includes a plurality of main heat dissipation conduits 14 And a plurality of main heat dissipating members 15 , wherein the plurality of main heat dissipating ducts 14 are connected between the first main base pipe 11 and the second main base pipe 12 at an upper and lower intervals, the plurality of main heat dissipating members The 15 series is arranged and thermally in contact with the outer surface of the plurality of main heat dissipation ducts 14, and the main heat sink 15 of the main heat dissipation mechanism 13 is wavy.

As shown in FIG. 1 to FIG. 3 , the auxiliary condensing module 20 is connected in parallel with the main condensing module 10 , and the auxiliary condensing module 20 includes a first auxiliary base pipe 21 and a second auxiliary base pipe 22 . a first connecting portion 28, a second connecting portion 29 and an auxiliary heat dissipating mechanism 23, the first auxiliary base pipe 21 and the second auxiliary base pipe 22 are spaced apart from each other, and the first connecting portion 28 is connected to the first In the auxiliary base pipe 21 and the first main base pipe 11, a plurality of first flow passages 26 are arranged in the first connecting portion 28, and the plurality of first flow passages 26 are respectively connected to the first auxiliary base pipe 21 and The first main base pipe 11 is connected to the second auxiliary base pipe 22 and the second main base pipe 12, and the second connecting portion 29 is formed in a plurality of second and second intervals. The second flow channel 27 is connected to the second auxiliary base pipe 22 and the second main base pipe 12 respectively. The auxiliary heat dissipation mechanism 23 is disposed on the first auxiliary base pipe 21 and the second auxiliary base. Between the tubes 22, wherein the auxiliary heat dissipation mechanism 23 includes a plurality of auxiliary heat dissipation conduits 24 and a plurality of auxiliary heat dissipation members 25, the plurality of auxiliary heat dissipation units The tube 24 is connected between the first auxiliary base pipe 21 and the second auxiliary base pipe 22 at intervals, and the plurality of auxiliary heat dissipation members 25 are distributed and thermally contacted with the outer surface of the plurality of auxiliary heat dissipation conduits 24, The auxiliary heat sink 25 of the auxiliary heat dissipation mechanism 23 has a wave shape.

Referring to FIG. 4, a preferred embodiment of the heat sink of the present invention includes a heat sink and an evaporation assembly 30 as described above.

As shown in FIG. 4 and FIG. 5, the evaporation assembly 30 includes an evaporator 31, an input pipe 32 and an output pipe 33. The evaporator 31 includes a casing 35 having an evaporation chamber 34 therein. The bottom of the 35 has a heat conducting bottom plate 36. The two ends of the input tube 32 are respectively connected to the top of the casing 35 of the evaporator 31 and the first main base pipe 11 of the main condensation module 10. The two ends of the output pipe 33 are respectively a side wall of the casing 35 connecting the evaporator 31 and a second main base pipe 12 of the main condensation module 10, so that the parallel condenser and the evaporation assembly 30 form a closed refrigerant circulation circuit, and in the closed type The refrigerant circulation circuit is filled with a refrigerant 50, wherein the diameter of the input pipe 32 is larger than the diameter of the output pipe 33.

In addition, as shown in FIG. 1 and FIG. 4, the two ends of the input pipe 32 are respectively connected to the top of the casing 35 of the evaporator 31 and the refrigerant inlet 16 of the main condensation module 10. The two ends of the output pipe 33 are respectively connected. a side wall of the casing 35 of the evaporator 31 and a refrigerant outlet 18 of the second main base pipe 12 of the main condensation module 10, and the evaporation assembly 30 includes a return pipe 37, and the two ends of the return pipe 37 are respectively connected to the The side wall of the casing 35 of the evaporator 31 and the refrigerant outlet 17 of the first main base pipe 11 of the main condensation module 10. Further, the diameter of the input pipe 32 is larger than the diameter of the output pipe 33 and the return pipe 37.

As shown in FIG. 5 to FIG. 7 , the parallel condenser of the present invention can be applied to a general heat sink or a heat sink as disclosed above, and the main condensing module 10 and the auxiliary condensing module 20 of the parallel condenser are provided. Providing the refrigerant 50 to be cooled by means of a split flow, thereby providing a heat dissipation effect of the article or device, for example, for providing cooling and cooling of the electronic device, the evaporator 31 can be installed on the heat source 40 of the electronic device. When the heat source 40 of the electronic device generates heat and the temperature rises, the heat generated by the heat source 40 is thermally conducted to the refrigerant 50 in the evaporation chamber 34 through the heat conducting bottom plate 36 of the evaporator 31, and is located in the evaporation chamber 34. The refrigerant 50 vaporizes into the gaseous refrigerant 50 due to heat absorption, and flows into the input pipe 32 connected to the top of the casing 35 by using the principle that the hot gas naturally rises, and enters the main condensation module 10 along the input pipe 32. In the first main base pipe 11, the gaseous refrigerant 50 is sequentially cooled and condensed into the liquid refrigerant 50 through the main heat dissipation conduit 14 of the main heat dissipation mechanism 13, and then enters the second main base pipe 12, and From the output tube 33 It is refluxed to the evaporator 31.

As shown in FIG. 5, FIG. 6, and FIG. 8, the pressure of the refrigerant 50 passing through the inside of the closed refrigerant circulation circuit increases as the amount of vaporization of the refrigerant 50 increases, and the amount of vaporization of the refrigerant 50 follows the electrons. When the temperature of the heat source 40 of the device increases, the temperature of the heat source 40 of the electronic device rises, so that the liquid refrigerant 50 located inside the evaporation chamber 34 is rapidly vaporized into the gaseous refrigerant 50, and the amount of vaporization of the refrigerant 50 is greater than When the main condensing module 10 can provide the flow rate of the gaseous refrigerant 50, the pressure of the refrigerant 50 inside the closed refrigerant circulating circuit will rise. At this time, the gaseous refrigerant 50 will be split, and enter and pass the main condensing die respectively. Group 10 and the auxiliary condensation module 20 to achieve split cooling and liquefaction The liquefied liquid refrigerant 50 is finally collected into the second main base pipe 12 and returned from the output pipe 33 to the evaporator 31.

In addition, as shown in FIG. 6, when the gaseous refrigerant 50 enters the first main base pipe 11 through the input pipe 32, a part of the gaseous refrigerant 50 is liquefied into a liquid refrigerant 50 by being away from the heat source, and is condensed into a liquid state. After entering the first main base pipe 11, the refrigerant 50 flows downward to the lower portion of the first main base pipe 11, and is directly returned from the return pipe 37 to the evaporator 31, and the remaining gaseous refrigerant 50 is The main heat dissipation mechanism 13 and the second main base pipe 12 are returned from the output pipe 33 to the evaporator 31.

In summary, the heat dissipating device of the present invention can provide the function of cooling and liquefying the gaseous refrigerant 50 through the parallel main condensing module 10 and the auxiliary condensing module 20, and can effectively improve the cooling and liquefaction of the heat dissipating device in the gaseous refrigerant 50. In addition, the refrigerant 50 which is first condensed into a liquid state when entering the first main base pipe 11 can be directly recirculated through the return pipe 37 to the evaporator 31 to re-absorb heat, thereby providing a multi-flow refrigerant 50 phase change circulating flow mode. High performance cooling effect.

Claims (6)

A parallel condenser comprising: a main condensation module comprising a first main base pipe, a second main base pipe and a main heat dissipation mechanism, the first main base pipe being spaced apart from the second main base pipe Arranging, the main heat dissipation mechanism is disposed between the first main base pipe and the second main base pipe, and the upper portion of the first main base pipe of the main condensation module forms a refrigerant inlet, and the main condensation module is a lower portion of the main base pipe and a lower portion of the second main pipe respectively form a refrigerant outlet; and at least one auxiliary condensation module is connected in parallel with the main condensation module, the auxiliary condensation module includes a first auxiliary base a second auxiliary auxiliary pipe, a first connecting portion, a second connecting portion and an auxiliary heat dissipating mechanism, wherein the first auxiliary base pipe and the second auxiliary base pipe are arranged at intervals, and the first connecting portion is connected The first auxiliary base pipe and the first main base pipe form a plurality of first flow passages arranged at intervals from top to bottom, and the plurality of first flow passages respectively communicate with the first auxiliary base pipe and the first main pipe a base pipe, the second connecting portion is connected to the second auxiliary base pipe and the a second main pipe, wherein the second connecting portion forms a plurality of second flow paths arranged from top to bottom, and the plurality of second flow paths respectively communicate with the second auxiliary base pipe and the second main base pipe, the auxiliary heat dissipation mechanism The system is disposed between the first auxiliary base pipe and the second auxiliary base pipe. The parallel condenser according to claim 1, wherein the main heat dissipating mechanism comprises a plurality of main heat dissipating ducts and a plurality of main heat dissipating members, wherein the plurality of main heat dissipating ducts are connected to the first main base pipe and the second in a spaced manner Between the main base tubes, the plurality of main heat dissipating members are arranged and thermally in contact with the outer surface of the plurality of main heat dissipating ducts; the auxiliary heat dissipating mechanism includes a plurality of auxiliary heat dissipating ducts and a plurality of auxiliary heat dissipating members, and the plurality of auxiliary heat dissipating ducts are up and down Between the first auxiliary base pipe and the second auxiliary base pipe, the plurality of auxiliary heat dissipating members are distributed and thermally in contact with the outer surface of the plurality of auxiliary heat dissipating ducts. The parallel type condenser according to claim 2, wherein the main heat dissipating member of the main heat dissipating mechanism and the auxiliary heat dissipating member of the auxiliary heat dissipating mechanism are wave-shaped. A heat sink comprising: a parallel condenser according to any one of claims 1 to 3; and an evaporation assembly comprising an evaporator, an input tube, an output tube and a return tube, The evaporator comprises a casing having an evaporation chamber, the bottom of the casing has a heat conducting bottom plate, and the two ends of the inlet pipe are respectively connected to the top of the casing of the evaporator and the first main pipe of the main condensation module a refrigerant inlet, the two ends of the output tube are respectively connected to a sidewall of the casing of the evaporator and a refrigerant outlet of the second main base pipe of the main condensation module, and the two ends of the return pipe are respectively connected to the casing of the evaporator The side wall and the refrigerant outlet of the first main base pipe of the main condensation module form a closed refrigerant circulation circuit and the evaporation assembly, and the refrigerant is filled in the closed refrigerant circulation circuit. The heat sink of claim 4, wherein the diameter of the input tube is larger than the diameter of the output tube. The heat sink of claim 5, wherein the diameter of the input tube is larger than the diameter of the output tube and the return tube.