TWM618520U - Hard material processing device and system thereof - Google Patents

Abstract

A hard material processing device is suitable for processing a product containing a hard material. The device comprises: a heating element for performing a first heating process on the product to heat the product to a first temperature sufficient to reduce the hardness of the hard material of the product, so as to temporarily reduce the hardness of the hard material of the product during the first heating process; and at least one first processing element for simultaneously performing a first processing process on the product that temporarily reduces the hardness of the hard material of the product while the heating element performs the first heating process on the product. Therefore, the processing speed and productivity can be increased, and the wear of the processing element can also be reduced.

Description

Hard material processing device and its system

This creation is about a device and system, especially a hard material processing device and system.

In recent years, due to the continuous vigorous development of semiconductor technology, technological products have been able to make great strides. In the semiconductor manufacturing process, processing components are often used to cut, grind, or polish wafers and other materials. Semiconductor materials, such as silicon carbide (SiC), have the advantages of wide energy band gap, high hardness, high thermal conductivity, and chemical inertness. Therefore, they are more ideal materials for the preparation of high-temperature electronic components, high-frequency and high-power components. However, the high hardness of silicon carbide is not easy to perform processing procedures such as slicing, grinding or polishing, and it will also cause wear on the processing elements and other tools. Therefore, how to improve the processing efficiency and quality of high-hardness semiconductor materials is indeed one of the current important research and development topics.

In view of the above-mentioned problems of the prior art, one of the purposes of this creation is to provide a hard material processing device and its system to increase the processing speed, increase the productivity, and reduce the wear of the processing components.

In order to achieve the foregoing objective, the present creation proposes a hard material processing device, which is suitable for an object to be processed containing a hard material, and at least includes: a heating element, which performs a first heating procedure on the object to be processed, The object to be processed is heated to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, so as to temporarily reduce the hardness of the hard material of the object to be processed during the first heating process; and at least one The first processing element, when the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material .

Wherein, the first processing procedure is a cutting, grinding and/or polishing procedure.

Wherein, the first processing element performs the first processing procedure on the object to be processed in an oil-containing environment, and the oil-containing environment contains a high-temperature resistant oil that can withstand the first temperature.

Wherein, the first temperature is greater than 100 degrees Celsius.

Wherein, the hard material of the object to be processed is silicon carbide, and when the first processing element performs the first processing procedure on the object to be processed, the heating element simultaneously performs the first heating procedure on the object to be processed, The hardness of the hard material is temporarily reduced to close to the hardness of silicon.

Among them, the to-be-processed object is a silicon carbide ingot.

Wherein, the heating element heats the object to be processed in a contact type or a non-contact type in the first heating process.

Wherein, the heating element is a radio frequency heating element or a microwave heating element.

This creation also proposes a hard material processing system, which is suitable for an object to be processed containing a hard material, and at least includes: a heating element for performing a first heating process and a second heating process on the object to be processed, The object to be processed is heated to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, so as to temporarily reduce the hardness of the object to be processed during the first heating process and the second heating process The hardness of the material; at least one first processing element, when the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously reduces the hardness of the hard material to the to-be-processed The object performs a first processing procedure; and at least one second processing element. When the heating element performs the second heating procedure on the object to be processed, the second processing element simultaneously performs the first processing procedure and temporarily The object to be processed, which reduces the hardness of the hard material, undergoes a second processing procedure.

The hard material processing system of the present invention further includes at least one cleaning element. After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element performs a cleaning procedure on the object to be processed.

Wherein, the first processing procedure is a cutting procedure, and the second processing procedure is a grinding and/or polishing procedure.

Wherein, the first processing element and/or the second processing element perform the first processing procedure and/or the second processing procedure on the object to be processed in an oil-containing environment, and the oil-containing environment contains One temperature and one high-temperature oil.

Wherein, the first temperature is greater than 100 degrees Celsius.

Wherein, when the hard material of the object to be processed is silicon carbide, and the first processing element and/or the second processing element perform the first processing procedure and/or the second processing procedure on the object to be processed, the The heating element simultaneously performs the first heating process and/or the second heating process on the object to be processed, so that the hardness of the hard material is temporarily reduced to a hardness close to that of silicon.

Among them, the to-be-processed object is a silicon carbide ingot.

Wherein, the heating element heats the object to be processed in the first heating process and/or the second heating process in a contact or non-contact manner.

Wherein, the heating element is a radio frequency heating element or a microwave heating element.

In summary, the hard material processing device and system created according to the present invention can have one or more of the following advantages:

(1) By heating the object to be processed, the hardness of the hard material in the object to be processed is reduced, which is beneficial to the process of cutting, grinding and/or polishing the processing element, which can increase the processing speed, increase the production capacity, and reduce the processing Wear of components.

(2) The traditional cutting method needs to be tempered (heated) after completion to reduce stress. However, this creation does not need to be tempered again, which can reduce operating procedures and time costs.

(3) Taking the same tool as an example, the output per unit time of this creation is greater than that of traditional technology.

In order to understand the technical features, content and advantages of this creation and its achievable effects, this creation is combined with the diagrams, and detailed descriptions are given in the form of embodiments as follows, and the diagrams used therein have only To illustrate and supplement the manual, it may not be the true proportions and precise configuration after the implementation of this creation. Therefore, the proportion and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of the creation in actual implementation. In addition, in order to facilitate understanding, the same elements in the following embodiments are denoted by the same symbols.

In addition, the terms used in the entire specification and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each term used in this field, in the content disclosed here, and in the special content. Some terms used to describe this creation will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of this creation.

Regarding the use of "first", "second", "third", etc. in this article, it does not specifically refer to order or sequence, nor is it used to limit the creation. It is only used to distinguish components described in the same technical terms. Or operation only.

Secondly, if the terms "include", "include", "have", "contain", etc. are used in this article, they are all open terms, which means including but not limited to.

The hard material processing device of this creation is suitable for an object to be processed containing a hard material, and at least includes: a heating element. The heating element performs a first heating process on the object to be processed to heat the object to be processed enough to reduce the object to be processed A first temperature of the hardness of the hard material, so as to temporarily reduce the hardness of the hard material of the object to be processed during the first heating process; and at least one first processing element, in which the heating element performs the first heating process on the object to be processed At the same time, the first processing element simultaneously performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material. The hard material in this creation can be, for example, silicon carbide, and the object to be processed in this creation can be, for example, a silicon carbide ingot (SIC Ingot) 100, but it is not limited to this.

The first processing element can be, for example, a wire-saw slicing machine, a grinding machine, or a polishing machine. The first processing procedure can be, for example, a cutting, grinding and/or polishing procedure. The heating element may be, for example, a radio frequency (RF) heating element or a microwave heating element, and the frequency is, for example, 1 KHz to 10 GHz. The heating element of this creation is used to heat the object to be processed, so although this creation uses radio frequency heating elements or microwave heating elements as examples, this creation is not limited to the above examples. In other words, any heating element can be applied to this creation as long as it can heat the object to be processed. As shown in Figure 1, taking the radio frequency heating element 30 as an example, this creation uses the radio frequency heating element 30 to heat the silicon carbide ingot 100, which can reduce the hardness of the silicon carbide ingot 100. Therefore, this creation can more easily treat the silicon carbide ingot 100. For processing, for example, the silicon carbide ingot 100 is cut into silicon carbide slices 102 by the wire saw cutting machine 10 (the first processing procedure), so that the cutting procedure can be carried out more easily. Among them, the silicon carbide ingot 100 may be cylindrical, but is not limited thereto. In addition, although this creation is preferable to reduce the hardness of the silicon carbide ingot 100 to be close to that of silicon (Si), as long as the hardness of the silicon carbide ingot 100 can be reduced, it is helpful for the subsequent processing procedures. For example, when the silicon carbide ingot 100 is heated to 200 degrees Celsius, its hardness value is still about 25 GPa, but when the silicon carbide ingot 100 is heated to 350 degrees Celsius, its hardness value has dropped to about 21.5 GPa. And when the silicon carbide ingot 100 is heated to 500 degrees Celsius, its hardness value is only about 15 GPa. Similarly, if the silicon carbide ingot 100 is heated to 600 degrees Celsius, the hardness (14 Gpa) of the silicon carbide ingot 100 will be reduced to close to or the same as the hardness of silicon (14 Gpa), so the first processing element can be the same as The processing element that performs the processing procedure on the silicon ingot, whereby the silicon carbide ingot 100 is subjected to the first processing procedure.

In addition, the first processing element can also perform the first processing procedure on the object to be processed (ie, the silicon carbide ingot 100) in an oil-containing environment 200. The oil-containing environment 200 contains a high-temperature resistant oil that can withstand the first temperature, and is, for example, filling The tank body with the aforementioned high temperature oil resistant. The first temperature is greater than 100 degrees Celsius, and the first temperature is preferably between 200 degrees Celsius and 900 degrees Celsius, but is not limited thereto. As shown in Figure 2, the silicon carbide ingot 100 can be partially or completely placed in an oil-containing environment 200. Preferably, the silicon carbide ingot 100 is completely immersed in the oil-containing environment 200, and the silicon carbide ingot is heated by the radio frequency heating element 30 100, which reduces the hardness of the silicon carbide ingot 100. Among them, the radio frequency heating element 30 can be a common radio frequency heating element in the market, as long as it can heat the workpiece to be processed, it is suitable for this creation, so this creation is not limited to a specific brand or model of radio frequency heating element. Then, the wire saw cutting machine 10 is used to cut the reduced hardness of the silicon carbide ingot 100 into silicon carbide slices 102 (the first processing procedure), so that the cutting procedure can be carried out more easily. Among them, the wire saw cutting machine 10 can also be a common wire saw cutting machine in the market. As long as it can cut the workpiece to be processed, it is suitable for this creation, so this creation is not limited to a wire saw cutting machine of a specific brand or model. Moreover, since the cutting machine table for cutting the silicon carbide ingot 100 is a conventional technology and is not the technical focus of this creation, it will not be repeated here. The oil-containing environment 200 may, for example, contain fluorine-based oils, which can withstand the first heating process performed by the heating element to be processed, and have a large operating temperature range, excellent extreme high temperature resistance, chemical corrosion resistance, Broad material compatibility, extraordinary electrical insulation properties, excellent film formation, load-bearing capacity and lubricating properties are used to provide lubrication and uniform heating. The above-mentioned fluorine-containing oil is, for example, Per-Fluorinated Poly Ethers (PFPE), and its molecular structure is, for example, composed of three components: Carbon (Carbon) 21.6%, Oxygen (Oxygen) 9.4%, Fluorine (Fluorine) 69.0 %. However, although the above-mentioned fluorine-containing oil products are fluorine-based oils and the above-mentioned composition ratios are used as examples, this creation is not limited to this, as long as the oil products in the oil-containing environment 200 can withstand high temperatures, it can be applied to this creation middle.

In addition to the aforementioned cutting procedure, the first processing procedure may also be a grinding and/or polishing procedure. In other words, this creation is not limited to the cutting process first, followed by the grinding and/or polishing process. According to the actual process requirements, this creation may not perform the cutting process on the object to be processed, but only perform the grinding and/or polishing process. For the reasons mentioned above, the grinding and/or polishing procedure of this creation can also use common grinders and/or polishing machines on the market, such as chemical mechanical grinders (CMP), as long as they can grind and/or polish the processed objects. In this creation, this creation is not limited to specific brands or models of grinders and/or polishers. Moreover, since the grinding and/or polishing machine for grinding and/or polishing the silicon carbide ingot 100 is a conventional technology and is not the technical focus of this creation, it will not be repeated here. For example, as shown in FIG. 3, the silicon carbide slice 102 obtained after the cutting process of FIG. 1 can be placed on the carrier 40. The carrier 40 may be, for example, a ceramic plate with holes, so the silicon carbide slice 102 can be fixed on the carrier 40 through an air extraction device 50 (for example, an air pump) for subsequent grinding and/or polishing procedures . In addition, heating the silicon carbide slice 102 through the radio frequency heating element 30 can reduce the hardness of the silicon carbide slice 102, which is advantageous for the grinding and polishing machine 20 to perform a grinding and/or polishing process on the silicon carbide slice 102. The radio frequency heating element 30 in FIG. 3 is placed under the carrier 40 as an example, but it is not limited thereto. The radio frequency heating element 30 can also be arranged at other suitable positions, so as to heat the silicon carbide slice 102 to reduce its hardness. In addition, the lubricant 60 may also be used during grinding and/or polishing procedures. The lubricant 60 can be, for example, any fluorine-containing oil to provide lubrication and uniform heating.

In addition, as shown in FIG. 4, the present invention can also perform grinding and/or polishing procedures on the silicon carbide slice 102 in an oil-containing environment 200. The oil-containing environment 200 contains a high temperature resistant oil that can withstand the first temperature. The first temperature is greater than 100 degrees Celsius, and the first temperature is preferably between 200 degrees Celsius and 900 degrees Celsius, but is not limited thereto. For example, in this creation, part or all of the silicon carbide slices 102 can be placed in an oily environment 200. Preferably, the silicon carbide slices 102 are completely immersed in the oily environment 200, and the silicon carbide slices are heated by the radio frequency heating element 30. 102, so that the hardness of the silicon carbide slice 102 is reduced. Then, the grinding and polishing machine 20 is used to perform grinding and/or polishing processes on the silicon carbide slice 102 whose hardness has been reduced. As mentioned above, the reduction range of the hardness of the silicon carbide chip 102 is not particularly limited. However, if the hardness of the silicon carbide slice 102 is reduced to be close to or the same as the hardness of silicon, the grinding and polishing machine 20 of the present invention can be the same as the grinding and/or polishing machine that performs the grinding and/or polishing process on the silicon wafer. The radio frequency heating element 30 in FIG. 4 is placed outside the oil-containing environment 200 as an example, but it is not limited thereto. The radio frequency heating element 30 can also be arranged at other suitable positions, so as to heat the silicon carbide slice 102 to reduce its hardness.

In this creation, the heating element in the first heating process can be contact or non-contact heating of the object to be processed. For example, when the radio frequency heating element 30 heats the silicon carbide ingot 100 or the silicon carbide slice 102, it can be heated by directly contacting the silicon carbide ingot 100 or the silicon carbide slice 102, or by indirect means, such as The oily environment 200 is used to heat the silicon carbide ingot 100 or the silicon carbide chip 102. Since those with ordinary knowledge in the technical field to which this creation belongs should be able to clearly know how to place the radio frequency heating element 30 outside or inside the oil-containing environment 200, and can clearly know how to use direct contact or The silicon carbide ingot 100 or the silicon carbide slice 102 is heated in an indirect manner, so it will not be repeated here.

This creation also proposes a hard material processing system, which is composed of, for example, a plurality of the aforementioned hard material processing devices to perform a plurality of the aforementioned processing procedures, or a single aforementioned hard material processing device to perform multiple of the aforementioned processing procedures. The processing procedure. The hard material processing system of this creation is suitable for processing a to-be-processed object containing a hard material, and at least includes: a heating element. The heating element performs a first heating process and a second heating process on the to-be-processed object. Heating to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, so as to temporarily reduce the hardness of the hard material of the object to be processed during the first heating process and the second heating process; at least one first processing element, When the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material; When the processed object is subjected to the second heating procedure, the second processing element simultaneously performs a second processing procedure on the to-be-processed object that has passed the first processing procedure and temporarily reduces the hardness of the hard material. The first processing procedure can be, for example, a cutting procedure, and the cutting procedure can be performed by the wire saw cutting machine 10 as described above. The second processing procedure can be, for example, a grinding and/or polishing procedure, and the grinding and/or polishing procedure can be performed by the aforementioned grinding and polishing machine 20.

The first heating program and the second heating program can be performed by the same heating element or different heating elements. For example, the radio frequency heating element 30 can be used to perform the first heating process and the second heating process. In addition, the radio frequency heating element 30 may be placed inside or outside a fixed space (such as the aforementioned oil-containing environment 200), and in this oil-containing environment 200, a cutting process may be performed first, followed by a grinding and/or polishing process. Alternatively, the two radio frequency heating elements 30 can be placed in different positions. Therefore, one of the radio frequency heating elements 30 is heated before the cutting process is performed, and after the cutting process is completed, it can be moved to another position (it can be moved during the transfer process). Optionally perform a cleaning procedure) to use another radio frequency heating element 30 for heating. The aforementioned radio frequency heating element 30 can also be replaced with a microwave heating element according to actual needs.

In addition, the hard material processing system of this invention may further include at least one cleaning element (not shown in the figure). After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element is used for the processing of the object to be processed. A cleaning program. As shown in FIG. 5, after the cutting process S10 is performed, the cleaning element can be used to perform a cleaning process S21 on the object to be processed, followed by a grinding process S30 and a cleaning process S22, and then a polishing process S40 and a cleaning process S23. The cutting procedure S10 can be performed in the manner shown in FIG. 1 or FIG. 2, but is not limited to this. The grinding process S30 and the polishing process S40 can be performed in the manner shown in FIG. 3 or FIG. 4, and are not limited thereto. By carrying out the cleaning procedure, the substances remaining on the object to be processed in the previous procedure can be cleaned, so that the next procedure can be carried out. Among them, in the cleaning process, plasma can be used for cleaning, or a general degreasing ester organic solvent, such as acetone, can also be used for cleaning. The cleaning procedure of this creation is used to clean the processed objects, so although this creation uses plasma or organic solvents as examples, this creation is not limited to the above examples. In other words, any cleaning procedure can be applied to this creation as long as it can clean the processed objects. Moreover, those with ordinary knowledge in the technical field to which this creation belongs should be able to clearly know how to clean the processed objects based on the disclosure content of this creation, so we will not repeat them here.

In summary, the hard material processing device and system of this invention can have one or more of the following advantages: (1) By heating the object to be processed, the hardness of the hard material in the object is reduced, so It is conducive to the cutting, grinding and/or polishing of the processing components, which can increase the processing speed, increase the productivity, and reduce the wear of the processing components. (2) The traditional cutting method needs to be tempered (heated) after completion to reduce stress. However, this creation does not need to be tempered again, which can reduce operating procedures and time costs. (3) Taking the same tool as an example, the output per unit time of this creation is greater than that of traditional technology.

The above descriptions are merely illustrative and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of this creation should be included in the scope of the attached patent application.

10: Wire saw cutting machine 20: Grinding and polishing machine 30: RF heating element 40: Carrier 50: Exhaust device 60: Lubricant 100: Silicon carbide ingot 102: Silicon carbide slice 200: oily environment S10: Cutting program S21, S22, S23: cleaning program S30: Grinding procedure S40: Polishing procedure

Figure 1 is a schematic diagram of the first embodiment of the hard material processing device created.

Figure 2 is a schematic diagram of the second embodiment of the hard material processing device created.

Figure 3 is a schematic diagram of the third embodiment of the hard material processing device created.

Figure 4 is a schematic diagram of the fourth embodiment of the hard material processing device created.

Figure 5 is the processing flow chart of the hard material processing system created.

10: Wire saw cutting machine

30: RF heating element

100: Silicon carbide ingot

200: oily environment

Claims (17)

A hard material processing device, suitable for a to-be-processed object containing hard materials, at least including: A heating element that performs a first heating procedure on the object to be processed, and heats the object to be processed to a first temperature that is sufficient to reduce the hardness of the hard material of the object to be processed, thereby performing the second Temporarily reduce the hardness of the hard material of the object to be processed during a heating process; and At least one first processing element, when the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously performs a first process on the object to be processed that temporarily reduces the hardness of the hard material Processing program. The hard material processing device according to claim 1, wherein the first processing procedure is a cutting, grinding and/or polishing procedure. The hard material processing device according to claim 1, wherein the first processing element performs the first processing procedure on the object to be processed in an oil-containing environment, and the oil-containing environment contains a resistance that can withstand the first temperature. High temperature oil. The hard material processing device according to claim 1, wherein the first temperature is greater than 100 degrees Celsius. The hard material processing device of claim 1, 2, 3, or 4, wherein the hard material of the object to be processed is silicon carbide, and when the first processing element performs the first processing procedure on the object to be processed, The heating element simultaneously performs the first heating process on the object to be processed, so that the hardness of the hard material is temporarily reduced to close to the hardness of silicon. The hard material processing device according to claim 5, wherein the object to be processed is a silicon carbide ingot. The hard material processing device according to claim 1, wherein the heating element heats the object to be processed in a contact type or a non-contact type in the first heating process. The hard material processing device according to claim 1, wherein the heating element is a radio frequency heating element or a microwave heating element. A hard material processing system, suitable for a to-be-processed object containing hard materials, at least including: A heating element that performs a first heating process and a second heating process on the object to be processed, and heats the object to be processed to a first temperature that is sufficient to reduce the hardness of the hard material of the object to be processed , So as to temporarily reduce the hardness of the hard material of the object to be processed during the first heating process and the second heating process; At least one first processing element, when the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously performs a first process on the object to be processed that temporarily reduces the hardness of the hard material Processing procedures; and At least one second processing element, when the heating element performs the second heating procedure on the object to be processed, the second processing element simultaneously treats the material that has passed the first processing procedure and temporarily reduces the hardness of the hard material The object to be processed is subjected to a second processing procedure. The hard material processing system according to claim 9, further comprising at least one cleaning element. After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element performs processing on the object to be processed A cleaning program. The hard material processing system according to claim 9, wherein the first processing procedure is a cutting procedure, and the second processing procedure is a grinding and/or polishing procedure. The hard material processing system according to claim 9, wherein the first processing element and/or the second processing element perform the first processing procedure and/or the second processing on the object to be processed in an oil-containing environment Procedure, the oil-containing environment contains a high temperature resistant oil that can withstand the first temperature. The hard material processing system according to claim 9, wherein the first temperature is greater than 100 degrees Celsius. The hard material processing system according to claim 9, 10, 11, 12 or 13, wherein the hard material of the object to be processed is silicon carbide, and the first processing element and/or the second processing element are When the workpiece is subjected to the first processing procedure and/or the second processing procedure, the heating element simultaneously performs the first heating procedure and/or the second heating procedure on the workpiece to make the hardness of the hard material Temporarily reduce to the hardness of silicon. The hard material processing system according to claim 14, wherein the object to be processed is a silicon carbide ingot. The hard material processing system according to claim 9, wherein the heating element heats the object to be processed in the first heating process and/or the second heating process in a contact or non-contact manner. The hard material processing system according to claim 9, wherein the heating element is a radio frequency heating element or a microwave heating element.

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