JP3234377U - Hard material processing equipment and its system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hard material processing apparatus and a system thereof capable of increasing a processing speed, increasing a production capacity, and reducing wear of a processed member. SOLUTION: This is a hard material processing apparatus for processing a work piece 100 to be processed including a hard material, and a first heating step is performed on the work piece to be processed to harden the hard material contained in the work piece to be processed. By heating the work piece to be processed to a first temperature at which it is possible to reduce the hardness, the hardness of the hard material contained in the work piece to be treated is temporarily increased during the first heating step. When the lowering heating member 30 and the heating member perform the first heating step on the work piece to be processed, the hardness of the hard material is temporarily lowered on the work piece to be processed. At least one first processing member 10 that performs the processing step of the above is provided. [Selection diagram] Fig. 2

Description

The present invention relates to equipment and systems, in particular to hard material processing equipment and its systems.

In recent years, the continuous and active development of semiconductor technology has made great progress in technological products. In the semiconductor manufacturing process, machining equipment such as cutting, grinding, and polishing is performed on a material such as a wafer. Silicon carbide (SiC), which is a semiconductor material, has the advantages of a wide energy band gap, high hardness, high thermal conductivity, and chemical inactivity, so that it is suitable for high-temperature electronic components and high-frequency / high-power components. It is the best material for manufacturing. However, since silicon carbide has a high hardness, it is not easy to perform processing steps such as slicing, grinding, and polishing, and the cutter, which is a processing member, is easily worn. For this reason, methods for improving the processing efficiency and quality of high-hardness semiconductor materials are currently one of the most important research and development topics.

A main object of the present invention is to provide a hard material processing apparatus and a system thereof capable of increasing the processing speed, increasing the production capacity, and reducing the wear of the processed member.

The hard material processing apparatus according to the present invention is a hard material processing apparatus that processes a work schedule to be processed containing a hard material, and performs the first heating step on the work schedule to be processed to perform the work schedule to be processed. When the first heating step is performed by heating the work to be processed to a first temperature at which the hardness of the hard material contained in the object can be lowered, the work to be treated is to be processed. When the heating member that temporarily lowers the hardness of the hard material contained in the above and the heating member performs the first heating step on the work piece to be processed, the hardness of the hard material becomes It is characterized in that at least one first processing member that performs the first processing step is provided at the same time with respect to the work to be processed that temporarily descends.

The hard material processing apparatus according to the present invention is characterized in that the first processing step is a cutting, grinding and / or polishing step.

In the hard material processing apparatus according to the present invention, the first processing member performs the first processing step on the work piece to be processed in an oil-containing environment, and the oil-containing environment is the first. It is characterized by containing high temperature resistant oil capable of withstanding temperature.

The hard material processing apparatus according to the present invention is characterized in that the first temperature is higher than 100 degrees Celsius.

In the hard material processing apparatus according to the present invention, the hard material of the work to be processed is silicon carbide, and the first processing member performs the first processing step on the work to be processed. Occasionally, the heating member performs the first heating step at the same time on the work piece to be processed, so that the hardness of the hard material temporarily decreases to be close to the hardness of silicon. It is characterized by doing.

The hard material processing apparatus according to the present invention is characterized in that the processed product to be processed is a silicon carbide ingot.

The hard material processing apparatus according to the present invention is characterized in that the heating member heats the work piece to be processed by a contact method or a non-contact method in the first heating step.

The hard material processing apparatus according to the present invention is characterized in that the heating member is a high frequency heating member or a microwave heating member.

The hard material processing system according to the present invention is a hard material processing system for processing a work piece to be processed containing a hard material, and has a first heating step and a second heating step for the work piece to be processed. By heating the work piece to be processed to a first temperature at which the hardness of the hard material of the work piece to be treated can be lowered, the first heating step and the second heating step are performed. When the heating step of the above is performed, the heating member that temporarily lowers the hardness of the hard material of the work to be processed, and the first heating step of the heating member with respect to the work to be treated. At the same time, the first processing member performs at least one first processing step on the work to be processed in which the hardness of the hard material is temporarily lowered. When the processing member and the heating member perform the second heating step on the work piece to be processed, the second processing member is subjected to the first processing step, and the hard material is said to have the first processing step. It is characterized in that at least one second processing member that performs a second processing step is provided at the same time with respect to the work to be processed whose hardness is temporarily lowered.

The hard material processing system according to the present invention further includes at least one cleaning member, and the cleaning member performs the first processing step and / or the second processing step on the work piece to be processed. After that, a cleaning step is performed on the work piece to be processed.

The hard material processing system according to the present invention is characterized in that the first processing step is a cutting step and the second processing step is a grinding and / or polishing step.

In the hard material processing system according to the present invention, the first processing member and / or the second processing member may be subjected to the first processing step and / or the processing with respect to the work to be processed in an oil-containing environment. A second processing step is performed, and the oil-containing environment is characterized by containing high temperature resistant oil capable of withstanding the first temperature.

The rigid material processing system according to the present invention is characterized in that the first temperature is higher than 100 degrees Celsius.

In the hard material processing system according to the present invention, the hard material of the work to be processed is silicon carbide, and the first processing member and / or the second processing member is to the work to be processed. When the first processing step and / or the second processing step is performed, the heating member simultaneously performs the first heating step and / or the second heating step with respect to the work to be processed. The hardness of the hard material is temporarily lowered so as to be close to the hardness of silicon.

The hard material processing system according to the present invention is characterized in that the processed product to be processed is a silicon carbide ingot.

In the hard material processing system according to the present invention, the heating member heats the work piece to be processed by a contact method or a non-contact method in the first heating step and / or the second heating step. It is a feature.

The hard material processing system according to the present invention is characterized in that the heating member is a high frequency heating member or a microwave heating member.

The hard material processing apparatus and its system according to the present invention have the following effects.
(1) By heating the work piece to be processed, the hardness of the hard material in the work piece to be processed is lowered, so that the processed member can easily perform processes such as cutting, grinding and / or polishing. , The processing speed can be increased. As a result, the production capacity can be increased and the wear of the processed member can be reduced.
(2) In the conventional cutting method, it is necessary to perform tempering (heating) in order to reduce stress after completion, whereas according to the present invention, tempering can be performed. Since it is not necessary, the operation man-hours can be reduced.
(3) Taking the same cutter as an example, according to the present invention, the production amount per unit time is larger than the production amount by the conventional technique.

It is a schematic diagram which shows the 1st Embodiment of the hard material processing apparatus which concerns on this invention. It is a schematic diagram which shows the 2nd Embodiment of the hard material processing apparatus which concerns on this invention. It is a schematic diagram which shows the 3rd Embodiment of the hard material processing apparatus which concerns on this invention. It is a schematic diagram which shows the 4th Embodiment of the hard material processing apparatus which concerns on this invention. It is a flowchart which shows the processing process of the hard material processing system which concerns on this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The proportions of the members in the drawings of the embodiments of the present invention are shown for easy understanding of the description and are not actual proportions. Further, the dimensional ratio of the assembly shown in the figure is for explaining each part and its structure, and of course, the present invention is not limited to this. On the other hand, for convenience of understanding, the same parts in the following embodiments will be described with the same reference numerals.

In addition, terms used throughout the specification and in the utility model claims are generally used in this field, the content disclosed herein, and each term used in a special context, unless otherwise stated. Has the meaning of. Some terms used to describe the present invention will be described below or elsewhere herein to provide those skilled in the art with additional guidance regarding the description of the present invention.

Terms such as "first", "second", and "third" used in the entire specification and in the claims for utility model registration do not specifically indicate the order or sequence, and limit the present invention. Not also used to. It is used only to distinguish between components or operations described in the same jargon.

When terms such as "include", "prepare", "have", and "contain" are used throughout the specification and in the utility model claims, they are all open terms. This means that they include, but are not limited to.

The hard material processing apparatus according to the present invention is a hard material processing apparatus for processing a workpiece to be processed containing a hard material, and is a workpiece to be processed by performing a first heating step on the workpiece to be processed. By heating the workpiece to be processed to a first temperature at which the hardness of the hard material to be processed can be lowered, the hardness of the hard material of the workpiece to be processed is temporarily increased when the first heating step is performed. When the heating member and the heating member perform the first heating step on the work piece to be processed, the first processing member is subjected to the processing scheduled processing in which the hardness of the hard material is temporarily lowered. At least one first processing member that performs the first processing step on the object is provided at the same time.
The hard material according to the present invention is, for example, silicon carbide, and the processed product to be processed in the present invention is, for example, silicon carbide ingot (SiC Ingot) 100, but the present invention is not limited thereto.

The first processing member is, for example, a wire saw cutting machine (Wire-Saw Sliding Machine), a grinding machine (Grinding Machine), or a polishing machine (Polishing Machine). The first processing step is, for example, a cutting, grinding and / or polishing step.
The heating member is, for example, a radio frequency (Radio Frequency, RF) heating member or a microwave heating member, and the frequency is, for example, 1 KHz to 10 GHz. Since the heating member according to the present invention is for heating the work to be processed, the present invention has described the high frequency heating member or the microwave heating member as an example, but the present invention is not limited to this. In other words, as the heating member, any one may be adopted as long as the work to be processed can be heated.
As shown in FIG. 1, taking the high-frequency heating member 30 as an example, in the present invention, the silicon carbide ingot 100 can be heated by the high-frequency heating member 30 to reduce the hardness of the silicon carbide ingot 100. Therefore, the processing of the silicon carbide ingot 100 can be easily performed. For example, the silicon carbide ingot 100 is cut into silicon carbide slices 102 (first processing step) by the wire saw cutting machine 10, and the cutting step is performed. Becomes even easier. Further, the silicon carbide ingot 100 exhibits, for example, a columnar shape, but is not limited thereto. Further, in the present invention, it is preferable to reduce the hardness of the silicon carbide ingot 100 so as to be close to the hardness of silicon (Si), but if the hardness of the silicon carbide ingot 100 can be reduced, the following The processing process becomes easy.
For example, when the silicon carbide ingot 100 is heated to 200 degrees Celsius, its hardness is about 25 GPa, but when the silicon carbide ingot 100 is heated to 350 degrees Celsius, its hardness drops to about 21.5 GPa and carbonized. When the silicon ingot 100 is heated to 500 degrees Celsius, its hardness is only about 15 GPa. Similarly, when the silicon carbide ingot 100 is heated to 600 degrees Celsius, the hardness (14 GPa) of the silicon carbide ingot 100 drops and is close to or the same as the hardness of silicon (14 GPa). As the processing member, the same processing member as that for performing the processing process on the silicon ingot can be adopted, and the first processing step can be performed on the silicon carbide ingot 100.

Further, the first processed member may perform the first processing step on the processed product to be processed (that is, the silicon carbide ingot 100) in the oil-containing environment 200. The oil-containing environment 200 includes a high temperature resistant oil capable of withstanding a first temperature. The oil-containing environment 200 is, for example, a tank filled with the above-mentioned high-temperature resistant oil. The first temperature is preferably, but not limited to, above 100 degrees Celsius and between 200 and 900 degrees Celsius.
As shown in FIG. 2, a part or all of the silicon carbide ingot 100 may be placed in the oil-containing environment 200. It is preferable that the entire silicon carbide ingot 100 is immersed in the oil-containing environment 200, and the silicon carbide ingot 100 is heated by the high-frequency heating member 30. As a result, the hardness of the silicon carbide ingot 100 can be lowered. Of these, as the high-frequency heating member 30, a commercially available high-frequency heating member may be adopted. The present invention is not limited to the high-frequency heating member of a specific brand or model number, because it is sufficient to adopt a material capable of heating the work to be processed. Next, the cutting step is further facilitated by cutting the silicon carbide ingot 100 whose hardness has been lowered into the silicon carbide slice 102 (first processing step) by the wire saw cutting machine 10. Among them, as the wire saw cutting machine 10, a commercially available wire saw cutting machine may be similarly adopted. Anything that can cut the work to be processed will do. Therefore, the present invention is not limited to the wire saw cutting machine of a specific brand or model number. Here, since the cutting device for cutting the silicon carbide ingot 100 is a well-known technique and is not the focus of the technique of the present invention, the description thereof will be omitted.
The oil-containing environment 200 may contain, for example, a fluorine-based oil. It can withstand the first heating step performed on the work piece to be processed of the above heating members, and has a wide operating temperature range, excellent extreme temperature resistance, chemical resistance, wide material compatibility, and extraordinary. It has characteristics such as electrical insulation performance, excellent film formation, load resistance, and lubrication performance, and provides lubricity and heating uniformity. The above-mentioned oil containing fluorine is, for example, fluorine oil (Per-Fluorina Ted Poly Ethers, PFPE), and its molecular structure is composed of, for example, three kinds of components, which are carbon (Carbon) 21.6%. , Oxygen (9.4%), Fluorine (Fluorine) 69.0%. Here, as the above-mentioned oil containing a fluorine-based oil, fluorine oil has been mentioned as an example, but the proportion of the above composition is merely an example, and the present invention is not limited to this. Any oil that can withstand high temperatures in an oil-containing environment 200 may be used.

The first processing step may be the above-mentioned cutting step, or may be a grinding and / or polishing step. In other words, the present invention is not limited to performing a grinding and / or polishing step after performing a cutting step. Depending on the needs of the actual manufacturing process, the workpiece to be processed may not be subjected to the cutting step, but only the grinding and / or polishing step may be performed. For the same reason, a commercially available grinding machine and / or polishing machine may be adopted for the grinding and / or polishing process according to the present invention. This may employ, for example, a chemical mechanical grinder (CMP). It suffices if the workpiece to be processed can be ground and / or polished. Therefore, the present invention is not limited to a grinding machine and / or a grinding machine of a specific brand or model number. Since the grinding and / or polishing device for grinding and / or polishing the silicon carbide ingot 100 is a conventional technique and is not the focus of the technique of the present invention, the description thereof has been omitted.
For example, as shown in FIG. 3, the silicon carbide slice 102 obtained by performing the cutting step of FIG. 1 may be placed on the receiving member 40. Since the receiving member 40 is, for example, a ceramic plate having holes, the silicon carbide slice 102 is fixed to the receiving member 40 by an air extraction device 50 (for example, an air extraction pump), and the next grinding and / or polishing step is performed. It can be carried out. Then, since the hardness of the silicon carbide slice 102 can be lowered by heating the silicon carbide slice 102 by the high-frequency heating member 30, the grinding and polishing machine 20 can grind and / or grind the silicon carbide slice 102. Alternatively, the polishing process becomes easy.
In FIG. 3, the high frequency heating member 30 is placed below the receiving member 40, but is not limited thereto. The high frequency heating member 30 may be placed at another suitable position. As a result, the silicon carbide slice 102 can be heated to reduce its hardness. Further, when performing the grinding and / or polishing step, the lubricant 60 may be used. The lubricant 60 is, for example, any fluorine-based oil that can provide the effects of lubrication and heating uniformity.

Further, as shown in FIG. 4, in the present invention, the silicon carbide slice 102 may be subjected to a grinding and / or polishing step in the oil-containing environment 200. The oil-containing environment 200 includes a high temperature resistant oil capable of withstanding a first temperature. The first temperature is preferably, but not limited to, above 100 degrees Celsius and between 200 and 900 degrees Celsius. For example, in the present invention, a part or all of the silicon carbide slice 102 may be placed in the oil-containing environment 200. It is preferable that the hardness of the silicon carbide slice 102 is lowered by immersing the entire silicon carbide slice 102 in the oil-containing environment 200 and heating the silicon carbide slice 102 by the high-frequency heating member 30.
Next, the grinding and polishing machine 20 performs a grinding and / or polishing step on the silicon carbide slice 102 whose hardness has decreased. Similarly, the degree of decrease in hardness of the silicon carbide slice 102 is not limited. However, when the hardness of the silicon carbide slice 102 is close to the hardness of silicon or drops so as to be the same as the hardness of silicon, the grinding machine 20 according to the present invention grinds and / or grinds the silicon slice. Alternatively, the same grinding and / or polishing machine that performs the polishing step may be adopted. The high-frequency heating member 30 in FIG. 4 is placed outside the oil-containing environment 200, but the present invention is not limited thereto. The high frequency heating member 30 may be placed in another suitable position, whereby the silicon carbide slice 102 can be heated to reduce its hardness.

In the present invention, the heating member heats the work piece to be processed by a contact method or a non-contact method in the first heating step. For example, when heating the silicon carbide ingot 100 or the silicon carbide slice 102 by the high-frequency heating member 30, the silicon carbide ingot 100 or the silicon carbide slice 102 may be directly contacted and heated, or indirectly. For example, the silicon carbide ingot 100 or the silicon carbide slice 102 may be heated depending on the oil-containing environment 200. A person having general knowledge of the technical field to which the present invention belongs, how to place the high frequency heating member 30 outside or inside the oil-containing environment 200 based on the contents disclosed in the present invention, and Since it should be possible to clearly know how the silicon carbide ingot 100 or the silicon carbide slice 102 is heated by the direct contact method or the indirect contact method, the description thereof will be omitted.

The present invention separately proposes a hard material processing system. It is composed of, for example, a plurality of the above-mentioned hard material processing devices and performs a plurality of the above-mentioned processing steps, respectively, or is composed of one and the above-mentioned hard material processing devices and performs a plurality of the above-mentioned processing steps.
The hard material processing system according to the present invention is a hard material processing system for processing a work piece to be processed containing a hard material, and a first heating step and a second heating step are performed on the work piece to be processed. When the first heating step and the second heating step are performed by heating the work piece to be processed to a first temperature at which the hardness of the hard material of the work piece to be treated can be lowered. In addition, the heating member that temporarily lowers the hardness of the hard material of the work piece to be processed, and the first processing member are hard when the heating member performs the first heating step on the work piece to be processed. For the work piece to be processed in which the hardness of the material is temporarily lowered, at least one first processing member that performs the first processing step and the heating member are second to the work piece to be processed. When the heating step is performed, the second processing member performs the first processing step, and at least the second processing step is performed on the work piece to be processed in which the hardness of the hard material is temporarily lowered. It is provided with one second processed member and at least. Among them, the first processing step is, for example, a cutting step, and the cutting step can be performed by the wire saw cutting machine 10 as described above. The second processing step is, for example, a grinding and / or polishing step, and the grinding and / or polishing step can be performed by the grinding and polishing machine 20 as described above.

The first heating step and the second heating step may be performed by the same heating member or may be performed by different heating members. For example, the high frequency heating member 30 may perform the first heating step and the second heating step. Further, the high-frequency heating member 30 is placed inside or outside a fixed space (for example, the oil-containing environment 200 described above), and in the oil-containing environment 200, a cutting step is first performed, and then a grinding and / or polishing step is performed. You may. Alternatively, when two high-frequency heating members 30 are placed at different positions and the cutting process is performed, first, one of the high-frequency heating members 30 is used to heat the members, the cutting process is performed, and then the cutting process is performed. It may be transported (the cleaning step may be selectively performed during the transport process), and heating may be performed by another high-frequency heating member 30. If necessary, a microwave heating member may be adopted instead of the high frequency heating member 30 described above.

Further, the hard material processing system according to the present invention may further include at least one cleaning member (not shown). The work piece to be processed may undergo a cleaning step by a cleaning member after undergoing the first processing step and / or the second processing step.
As shown in FIG. 5, after performing the cutting step S10, the cleaning member performs the cleaning step S21 on the workpiece to be processed, then performs the grinding step S30 and the cleaning step S22, and then polishes. Step S40 and cleaning step S23 may be performed. The cutting step S10 may be performed by the method of FIG. 1 or 2, but is not limited thereto. The grinding step S30 and the polishing step S40 may be performed by the method shown in FIG. 3 or 4, but are not limited thereto. By performing the cleaning step and cleaning the substance remaining in the work piece to be processed in the previous step, the next step can be conveniently performed. Among them, in the cleaning step, the cleaning step may be performed by plasma, or the cleaning step may be performed by an organic solvent (for example, acetone) for removing fats and oils. The cleaning process according to the present invention has been described by taking plasma or an organic solvent as an example when cleaning the work to be processed, but the present invention is not limited to this. In other words, the cleaning step only needs to be able to perform cleaning on the work piece to be processed. A person who has general knowledge of the technical field to which the present invention belongs can understand well how to clean the workpiece to be processed based on the contents of the present invention, so the explanation is omitted. do.

The hard material processing apparatus and its system according to the present invention have the following effects.
(1) By heating the work piece to be processed, the hardness of the hard material in the work piece to be processed is lowered, so that the processed member can easily perform processes such as cutting, grinding and / or polishing. , The processing speed can be increased. As a result, the production capacity can be increased and the wear of the processed member can be reduced.
(2) According to the conventional cutting method, it is necessary to perform tempering (heating) in order to reduce stress after completion. On the other hand, according to the present invention, since it is not necessary to perform the tempering process, the operation man-hours can be reduced.
(3) Taking the same cutter as an example, the production amount per unit time according to the present invention is larger than the production amount according to the conventional technique.

The above description is merely an example and is not limited. Any modification or modification of the equivalent effect made to it that does not deviate from the spirit and scope of the present invention is included in the appended claims.

10 Wire saw cutting machine 20 Grinding and polishing machine 30 High-frequency heating member 40 Receiving member 50 Air extraction device 60 Lubricant 100 Silicon carbide ingot 102 Silicon carbide slice 200 Oil-containing environment S10 Cutting process S21, S22, S23 Cleaning process S30 Grinding process S40 Polishing Process

Claims (17)

It is a hard material processing device that processes processed products including hard materials.
A first heating step is performed on the work to be processed to heat the work to be treated to a first temperature at which the hardness of the hard material contained in the work to be treated can be lowered. As a result, when the first heating step is being performed, the heating member that temporarily lowers the hardness of the hard material contained in the work to be processed, and the heating member.
When the heating member performs the first heating step on the work to be processed, the hardness of the hard material temporarily drops, and at the same time, the first work is to be processed. It is characterized by including at least one first processing member that performs a processing process.
Hard material processing equipment. The hard material processing apparatus according to claim 1, wherein the first processing step is a cutting, grinding and / or polishing step. The first processing member performs the first processing step on the work piece to be processed in an oil-containing environment, and the oil-containing environment is a high-temperature resistant oil capable of withstanding the first temperature. The hard material processing apparatus according to claim 1, wherein the hard material processing apparatus comprises. The hard material processing apparatus according to claim 1, wherein the first temperature is higher than 100 degrees Celsius. The hard material of the work scheduled to be processed is silicon carbide, and when the first processing member performs the first processing step on the work to be processed, the heating member is scheduled to be treated. A first aspect of the present invention, wherein the hardness of the hard material is temporarily lowered so as to be close to the hardness of silicon by simultaneously performing the first heating step on the work piece. The hard material processing apparatus according to any one of 4. The hard material processing apparatus according to claim 5, wherein the processed product to be processed is a silicon carbide ingot. The hard material processing apparatus according to claim 1, wherein the heating member heats the work to be processed by a contact method or a non-contact method in the first heating step. The hard material processing apparatus according to claim 1, wherein the heating member is a high-frequency heating member or a microwave heating member. A hard material processing system that processes processed products containing hard materials.
By performing the first heating step and the second heating step on the work to be processed, the hardness of the hard material of the work to be treated can be lowered to a first temperature. A heating member that heats the work piece to be processed,
When the heating member performs the first heating step on the work piece to be processed, the hardness of the hard material is temporarily lowered, and at the same time, the first work piece is subjected to the first process. With at least one first processing member that performs the processing process,
When the heating member performs the second heating step on the work to be processed, the hardness of the hard material is temporarily lowered, and at the same time, the second heat is applied to the work to be processed. It is characterized by including at least one second processing member that performs a processing process.
Hard material processing system. The cleaning member includes at least one cleaning member, and the cleaning member performs the first processing step and / or the second processing step on the work to be processed, and then cleans the work to be processed. The hard material processing system according to claim 9, wherein the process is performed. The hard material processing system according to claim 9, wherein the first processing step is a cutting step, and the second processing step is a grinding and / or polishing step. The first processing member and / or the second processing member performs the first processing step and / or the second processing step on the work piece to be processed in an oil-containing environment, and the oil. The hard material processing system according to claim 9, wherein the content environment includes a high temperature resistant oil capable of withstanding the first temperature. The hard material processing system according to claim 9, wherein the first temperature is higher than 100 degrees Celsius. The hard material of the work to be processed is silicon carbide, and the first processing member and / or the second processing member has the first processing step and / or the said to the work to be processed. When the second processing step is performed, the heating member simultaneously performs the first heating step and / or the second heating step on the work piece to be processed, so that the hardness of the hard material is hardened. The hard material processing system according to any one of claims 9 to 13, wherein the heat is temporarily lowered so as to be close to the hardness of silicon. The hard material processing system according to claim 14, wherein the processed product to be processed is a silicon carbide ingot. The ninth aspect of the present invention, wherein the heating member heats the work to be processed by a contact method or a non-contact method in the first heating step and / or the second heating step. Hard material processing system. The hard material processing system according to claim 9, wherein the heating member is a high-frequency heating member or a microwave heating member.

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