TWI813999B - Hard material processing device and system thereof - Google Patents

Abstract

A hard material processing device is suitable for processing a product containing a hard material. The device comprises: a heating element for performing a first heating process on the product to heat the product to a first temperature sufficient to reduce the hardness of the hard material of the product, so as to temporarily reduce the hardness of the hard material of the product during the first heating process; and at least one first processing element for simultaneously performing a first processing process on the product that temporarily reduces the hardness of the hard material of the product while the heating element performs the first heating process on the product. Therefore, the processing speed and productivity can be increased, and the wear of the processing element can also be reduced.

Description

Hard material processing device and system

The invention relates to a device and a system, in particular to a hard material processing device and a system thereof.

In recent years, due to the continuous vigorous development of semiconductor technology, technological products have made great strides. In the semiconductor manufacturing process, processing components are often used to perform cutting, grinding or polishing of materials such as wafers. Semiconductor materials, such as silicon carbide (SiC), have the advantages of wide energy band gap, high hardness, high thermal conductivity and chemical inertness. Therefore, they are more ideal materials for preparing high-temperature electronic components and high-frequency high-power components. However, the high hardness of silicon carbide makes it difficult to perform processing procedures such as slicing, grinding or polishing, and will also cause wear to cutting tools such as processing components. Therefore, how to improve the processing efficiency and quality of high-hardness semiconductor materials is one of the current important research and development topics.

In view of the above-mentioned problems in conventional techniques, one purpose of this invention is to provide a hard material processing device and its system to increase processing speed, increase productivity, and reduce wear of processing components.

In order to achieve the above purpose, this invention proposes a hard material processing device, which is suitable for an object to be processed containing hard materials, and at least includes: a heating element, which performs a first heating process on the object to be processed, and heats the object to be processed. The object to be processed is heated to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, thereby temporarily reducing the hardness of the hard material of the object to be processed while performing the first heating process; and at least one The first processing element, when the heating element performs the first heating procedure on the object to be processed, the first processing element simultaneously performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material. .

Wherein, the first processing procedure is a cutting, grinding and/or polishing procedure.

Wherein, the first processing element performs the first processing procedure on the object to be processed in an oil-containing environment, and the oil-containing environment contains high-temperature resistant oil that can withstand the first temperature.

Wherein, the first temperature is greater than 100 degrees Celsius.

Wherein, the hard material of the object to be processed is silicon carbide, and when the first processing element performs the first processing procedure on the object to be processed, the heating element simultaneously performs the first heating procedure on the object to be processed, The hardness of the hard material is temporarily reduced to the hardness close to silicon.

Wherein, the object to be processed is silicon carbide ingot.

Wherein, the heating element heats the object to be processed in a contact or non-contact manner in the first heating process.

Wherein, the heating element is a radio frequency heating element or a microwave heating element.

This invention also proposes a hard material processing system, which is suitable for an object to be processed containing hard materials, and at least includes: a heating element, which performs a first heating program and a second heating program on the object to be processed, The object to be processed is heated to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, so as to temporarily perform the first heating process and the second heating process. Temporarily reduce the hardness of the hard material of the object to be processed; at least one first processing element, when the heating element performs the first heating process on the object to be processed, the first processing element simultaneously temporarily reduces the hardness of the hard material of the object to be processed. The object to be processed with the hardness of the hard material undergoes a first processing procedure; and at least one second processing element. When the heating element performs the second heating procedure for the object to be processed, the second processing element is simultaneously A second processing procedure is performed on the object to be processed that has gone through the first processing procedure and temporarily reduced the hardness of the hard material.

The hard material processing system of the present invention further includes at least one cleaning element. After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element performs a cleaning process on the object to be processed.

Wherein, the first processing procedure is a cutting procedure, and the second processing procedure is a grinding and/or polishing procedure.

Wherein, the first processing element and/or the second processing element perform the first processing procedure and/or the second processing procedure on the object to be processed in an oil-containing environment, and the oil-containing environment contains materials that can withstand the third processing procedure. One temperature resistant oil.

Wherein, the first temperature is greater than 100 degrees Celsius.

Wherein, the hard material of the object to be processed is silicon carbide, and when the first processing element and/or the second processing element perform the first processing procedure and/or the second processing procedure on the object to be processed, the The heating element simultaneously performs the first heating process and/or the second heating process on the object to be processed, so that the hardness of the hard material is temporarily reduced to a hardness close to that of silicon.

Wherein, the object to be processed is silicon carbide ingot.

Wherein, the heating element heats the object to be processed in a contact or non-contact manner during the first heating process and/or the second heating process.

Wherein, the heating element is a radio frequency heating element or a microwave heating element.

Based on the above, the hard material processing device and its system according to the invention can have one or more of the following advantages:

(1) By heating the object to be processed, the hardness of the hard materials in the object to be processed is reduced, which is beneficial to the cutting, grinding and/or polishing of processing components, which can increase the processing speed, increase productivity, and reduce processing costs. Component wear.

(2) Traditional cutting methods require tempering (heating) after completion to reduce stress. This creation does not require tempering again, which can reduce operating procedures and time costs.

(3) Taking the same tool as an example, the output per unit time of this creation is greater than that of traditional technology.

10: Scroll saw cutting machine

20: Grinding and polishing machine

30: Radio frequency heating element

40: Bearing part

50: Air extraction device

60: Lubricant

100: Silicon carbide ingot

102: Silicon carbide slices

200: Oily environment

S10: Cutting procedure

S21, S22, S23: Cleaning procedure

S30: Grinding program

S40: Polishing procedure

Figure 1 is a schematic diagram of the first embodiment of the hard material processing device of the present invention.

Figure 2 is a schematic diagram of the second embodiment of the hard material processing device of the present invention.

Figure 3 is a schematic diagram of the third embodiment of the hard material processing device of the present invention.

Figure 4 is a schematic diagram of the fourth embodiment of the hard material processing device of the present invention.

Figure 5 is a processing flow chart of the hard material processing system of this creation.

In order to facilitate understanding of the technical features, content and advantages of this invention and the effects it can achieve, this invention is described in detail below with diagrams and in the form of expressions of embodiments. The purpose of the diagrams used is only They are for illustration and auxiliary instructions, and may not represent the actual proportions and precise configurations of this creation after implementation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited to the actual implementation of this creation. scope of rights. In addition, to facilitate understanding, the same elements in the following embodiments are labeled with the same symbols for explanation.

In addition, unless otherwise noted, the terms used throughout the specification and patent application generally have the ordinary meanings of each term used in the field, the content disclosed herein, and the specific content. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the invention.

The use of "first", "second", "third", etc. in this article does not specifically refer to the order or sequence, nor is it used to limit the present invention. It is only used to distinguish components described by the same technical terms. Or just an operation.

Secondly, if the words "include", "includes", "have", "contains", etc. are used in this article, they are all open terms, which means including but not limited to.

The hard material processing device of this invention is suitable for an object to be processed containing hard materials, and at least includes: a heating element. The heating element performs a first heating process on the object to be processed, and heats the object to be processed to a level sufficient to reduce the temperature of the object to be processed. a first temperature of the hard material of the hard material, so as to temporarily reduce the hardness of the hard material of the object to be processed when the first heating process is performed; and at least one first processing element, when the heating element performs the first heating process of the object to be processed At the same time, the first processing element performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material. The hard material in this invention can be, for example, silicon carbide, and the object to be processed in this invention can be, for example, silicon carbide ingot (SIC Ingot) 100, but it is not limited thereto.

The first processing element may be, for example, a wire-saw slicing machine, a grinding machine or a polishing machine. The first processing procedure may be, for example, cutting, grinding and/or polishing procedures. The heating element may be, for example, a Radio Frequency (RF) plus Thermal element or microwave heating element, frequency is 1KHz to 10GHz, for example. The heating element of this invention is used to heat the object to be processed. Therefore, although this invention uses radio frequency heating elements or microwave heating elements as examples, this invention is not limited to the above examples. In other words, any heating element can be suitable for this invention as long as it can heat the object to be processed. As shown in Figure 1, taking the radio frequency heating element 30 as an example, the invention uses the radio frequency heating element 30 to heat the silicon carbide ingot 100, which can reduce the hardness of the silicon carbide ingot 100. Therefore, the invention can more easily heat the silicon carbide ingot 100. Performing processing, for example, using the wire saw cutting machine 10 to cut the silicon carbide ingot 100 into silicon carbide slices 102 (first processing procedure), the cutting procedure can be performed more easily. The silicon carbide ingot 100 may be, for example, cylindrical, but is not limited thereto. In addition, although this invention preferably reduces the hardness of the silicon carbide ingot 100 to a hardness close to silicon (Si), as long as the hardness of the silicon carbide ingot 100 can be reduced, it will be helpful for subsequent processing procedures. For example, when the silicon carbide ingot 100 is heated to 200 degrees Celsius, its hardness value is still about 25 GPa, but when the silicon carbide ingot 100 is heated to 350 degrees Celsius, its hardness value has dropped to about 21.5 GPa, and When the silicon carbide ingot 100 is heated to 500 degrees Celsius, its hardness value is only about 15 GPa. Similarly, if the silicon carbide ingot 100 is heated to 600 degrees Celsius, the hardness of the silicon carbide ingot 100 (14 Gpa) is reduced to close to or the same as the hardness of silicon (14 Gpa). Therefore, the first processing element can be the same as that used for silicon. The ingot is a processing component for performing a processing procedure, thereby performing a first processing procedure on the silicon carbide ingot 100 .

In addition, the first processing element can also perform the first processing procedure on the object to be processed (i.e., the silicon carbide ingot 100) in an oil-containing environment 200. The oil-containing environment 200 contains a high-temperature resistant oil that can withstand the first temperature, and is, for example, filling. There is the aforementioned high-temperature oil tank body. The first temperature is greater than 100 degrees Celsius, and the first temperature is preferably between 200 degrees Celsius and 900 degrees Celsius, but is not limited thereto. As shown in Figure 2, part or all of the silicon carbide ingot 100 can be placed in an oil-containing environment 200. Preferably, the entire silicon carbide ingot 100 is immersed in the oil-containing environment 200, and the silicon carbide ingot is heated through the radio frequency heating element 30. 100, making the silicon carbide ingot 100 harder degree decreased. Among them, the radio frequency heating element 30 can be a common radio frequency heating element on the market. As long as it can heat the object to be processed, it is suitable for this invention. Therefore, this invention is not limited to radio frequency heating elements of a specific brand or model. Then, the silicon carbide ingot 100 with reduced hardness is cut into silicon carbide slices 102 by the wire saw cutting machine 10 (first processing procedure), thereby making the cutting procedure easier to perform. Among them, the wire saw cutting machine 10 can also be a common wire saw cutting machine on the market. As long as it can cut the object to be processed, it is suitable for this invention. Therefore, this invention is not limited to a specific brand or model of wire saw cutting machine. Moreover, since the cutting machine for cutting the silicon carbide ingot 100 is a conventional technology and is not the technical focus of this invention, it will not be described again here. The above-mentioned oil-containing environment 200 may contain, for example, fluorine-based oil, which can withstand the first heating process of the object to be processed by the above-mentioned heating element, and has a wide operating temperature range, excellent extreme high temperature resistance, and chemical corrosion resistance. Broad material compatibility, extraordinary electrical insulation properties, excellent film formation, load-bearing capacity and lubrication properties are used to provide lubrication and uniform heating. The above-mentioned fluorine-containing oil is, for example, fluorinated oil (Per-Fluorinated Poly Ethers, PFPE). Its molecular structure is composed of three components: 21.6% carbon, 9.4% oxygen, and 69.0 fluorine. %. However, although the above-mentioned fluorine-containing oil products take fluorine oil as an example and the above-mentioned component composition ratio as an example, this invention is not limited to this. As long as the oil in the oil-containing environment 200 can withstand high temperatures, it can be applied to this invention. middle.

In addition to the aforementioned cutting procedure, the first processing procedure may also be a grinding and/or polishing procedure. In other words, the present invention is not limited to performing the cutting process first, followed by the grinding and/or polishing process. According to the actual process requirements, this invention may not perform a cutting process on the object to be processed, but only perform a grinding and/or polishing process. For the reasons mentioned above, the grinding and/or polishing process of this invention can also use common grinding machines and/or polishing machines on the market, such as chemical mechanical grinders (CMP), as long as they can grind and/or polish the object to be processed. This creation is not limited to specific brands or models of grinding machines and/or polishing machines. Moreover, due to the grinding and/or polishing of the silicon carbide ingot 100 The optical machine is a common technology and is not the technical focus of this creation, so it will not be described again here. For example, as shown in FIG. 3 , the silicon carbide slices 102 obtained after the cutting process in FIG. 1 can be placed on the carrier 40 . The carrier 40 can be, for example, a ceramic plate with holes, so the silicon carbide slices 102 can be fixed on the carrier 40 through an air extraction device 50 (such as an air pump) for subsequent grinding and/or polishing procedures. . In addition, heating the silicon carbide slice 102 through the radio frequency heating element 30 can reduce the hardness of the silicon carbide slice 102, which is beneficial to the grinding and polishing machine 20 for grinding and/or polishing the silicon carbide slice 102. The radio frequency heating element 30 in FIG. 3 is placed under the carrier 40 as an example, but is not limited to this. The radio frequency heating element 30 can also be disposed at other appropriate positions to heat the silicon carbide slice 102 to reduce its hardness. In addition, lubricant 60 may also be used during grinding and/or polishing procedures. The lubricant 60 can be, for example, any fluorine-containing oil to provide lubrication and uniform heating.

In addition, as shown in FIG. 4 , in this invention, the silicon carbide slice 102 can also be ground and/or polished in an oil-containing environment 200 . Oily Environment Series 200 contains high-temperature oil that can withstand one of the first temperatures. The first temperature is greater than 100 degrees Celsius, and the first temperature is preferably between 200 degrees Celsius and 900 degrees Celsius, but is not limited thereto. For example, in this invention, part or all of the silicon carbide slices 102 can be placed in the oil-containing environment 200. It is better to immerse all the silicon carbide slices 102 in the oil-containing environment 200, and heat the silicon carbide slices through the radio frequency heating element 30. 102, causing the hardness of the silicon carbide slice 102 to decrease. Then, the silicon carbide slice 102 with reduced hardness is ground and/or polished by the grinding and polishing machine 20 . As mentioned above, the degree of reduction in hardness of the silicon carbide slice 102 is not particularly limited. However, if the hardness of the silicon carbide slice 102 is reduced to close to or the same as the hardness of silicon, the grinding and polishing machine 20 of the present invention can be a grinding and/or polishing machine that performs the same grinding and/or polishing process on the silicon wafer. The radio frequency heating element 30 in FIG. 4 is placed outside the oil-containing environment 200 as an example, but is not limited thereto. The radio frequency heating element 30 can also be disposed at other appropriate positions to heat the silicon carbide slice 102 to reduce its hardness.

In the present invention, the heating element can heat the object to be processed in a contact or non-contact manner in the first heating process. For example, when the radio frequency heating element 30 heats the silicon carbide ingot 100 or the silicon carbide slices 102, the heating can be performed by directly contacting the silicon carbide ingot 100 or the silicon carbide slices 102, or through an indirect method, such as through The oil-containing environment 200 is used to heat the silicon carbide ingot 100 or silicon carbide slices 102 . Based on the disclosure of this invention, a person with ordinary knowledge in the technical field of this invention should be able to clearly understand how to place the radio frequency heating element 30 outside or inside the oil-containing environment 200, and how to place it through direct contact or The silicon carbide ingot 100 or the silicon carbide slice 102 is heated in an indirect manner, so no details are given here.

The present invention also proposes a hard material processing system, which is, for example, composed of a plurality of the aforementioned hard material processing devices to perform a plurality of the aforementioned processing procedures respectively, or is composed of a single aforementioned hard material processing device to perform a plurality of the aforementioned processing procedures respectively. The processing procedure. The hard material processing system of this invention is suitable for processing objects to be processed that contain hard materials. It at least includes: a heating element. The heating element performs a first heating program and a second heating program on the object to be processed. Heating to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed, thereby temporarily reducing the hardness of the hard material of the object to be processed during the first heating process and the second heating process; at least one first processing element, When the heating element performs a first heating process on the object to be processed, the first processing element simultaneously performs a first processing procedure on the object to be processed that temporarily reduces the hardness of the hard material; and at least one second processing element is used when the heating element is treating the object. When the workpiece undergoes the second heating process, the second processing element simultaneously performs a second processing process on the workpiece that has undergone the first processing process and temporarily reduces the hardness of the hard material. The first processing procedure may be, for example, a cutting procedure, and the cutting procedure may be performed by the aforementioned wire saw cutting machine 10 . The second processing procedure may be, for example, a grinding and/or polishing procedure, and the grinding and/or polishing procedure may be performed by the aforementioned grinding and polishing machine 20 .

The first heating process and the second heating process can be performed by the same heating element or different heating elements. For example, the radio frequency heating element 30 can be used to perform the first heating process and the second heating process. In addition, the radio frequency heating element 30 can be placed inside or outside a fixed space (such as the aforementioned oil-containing environment 200), and the cutting process and then the grinding and/or polishing process can be performed in the oil-containing environment 200. Alternatively, the two radio frequency heating elements 30 can be placed at different positions, so that one of the radio frequency heating elements 30 is heated first during the cutting process, and after the cutting process is completed, it can be moved to another position (the moving process can be Optionally perform a cleaning procedure) to use another radio frequency heating element 30 for heating. The aforementioned radio frequency heating element 30 can also be replaced with a microwave heating element depending on actual needs.

In addition, the hard material processing system of the present invention can further include at least one cleaning element (not shown in the figure). After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element is used to clean the object to be processed. A cleaning procedure. As shown in FIG. 5 , after the cutting process S10 , the cleaning element can be used to perform the cleaning process S21 on the object to be processed, followed by the grinding process S30 and the cleaning process S22 , and then the polishing process S40 and the cleaning process S23 . The cutting procedure S10 can be performed in the manner of Figure 1 or Figure 2, but is not limited thereto. The grinding process S30 and the polishing process S40 can be performed in the manner of Figure 3 or Figure 4, and are not limited thereto. By performing the cleaning process, the substances remaining on the object to be processed from the previous process can be cleaned so that the next process can be carried out. Among them, plasma can be used for cleaning in the cleaning process, or organic solvents such as acetone that generally remove oil esters can also be used for cleaning. The cleaning process of this invention is used to clean the object to be processed. Therefore, although this invention uses plasma or organic solvent as an example, this invention is not limited to the above examples. In other words, any cleaning procedure can be applied to this creation as long as it can clean the object to be processed. Moreover, the technical field to which this creation belongs has Generally, a person with knowledge should be able to clearly understand how to clean the workpiece based on the disclosed content of this creation, so no further details will be given here.

In summary, the hard material processing device and its system of the present invention can have one or more of the following advantages: (1) By heating the object to be processed, the hardness of the hard material in the object to be processed is reduced. Therefore, It is conducive to cutting, grinding and/or polishing of processing components, which can increase processing speed, increase production capacity, and reduce wear of processing components. (2) Traditional cutting methods require tempering (heating) after completion to reduce stress. This creation does not require tempering again, which can reduce operating procedures and time costs. (3) Taking the same tool as an example, the output per unit time of this creation is greater than that of traditional technology.

The above is only illustrative and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of this creation shall be included in the appended patent application scope.

10: Scroll saw cutting machine

30: Radio frequency heating element

100: Silicon carbide ingot

200: Oily environment

Claims (17)

A hard material processing device, suitable for an object to be processed containing hard materials, at least includes: a heating element, which performs a first heating procedure on the object to be processed, and heats the object to be processed to a level sufficient to reduce the A first temperature of the hard material of the object to be processed, the first temperature being greater than or equal to 200 degrees Celsius, so as to temporarily reduce the hardness of the hard material of the object to be processed when performing the first heating process; And at least one first processing element. When the heating element performs the first heating process on the object to be processed, the first processing element simultaneously performs a first processing step on the object to be processed that temporarily reduces the hardness of the hard material. A processing procedure. The hard material processing device as claimed in claim 1, wherein the first processing procedure is a cutting, grinding and/or polishing procedure. The hard material processing device as claimed in claim 1, wherein the first processing element performs the first processing procedure on the object to be processed immersed in an oily environment, and the oily environment contains a material that can withstand the first temperature. 1. High temperature resistant oil. The hard material processing device as claimed in claim 1, wherein the hardness of the hard material of the object to be processed is temporarily reduced to 25 Gpa to be close to or the same as the hardness of silicon. The hard material processing device as described in claim 1, 2, 3 or 4, wherein the hard material of the object to be processed is silicon carbide, and when the first processing element performs the first processing procedure on the object to be processed, The heating element simultaneously performs the first heating process on the object to be processed, so that the hardness of the hard material is temporarily reduced to close to or the same as the hardness of silicon. The hard material processing device of claim 5, wherein the object to be processed is a silicon carbide ingot. The hard material processing device as claimed in claim 1, wherein the heating element heats the object to be processed in a contact or non-contact manner in the first heating procedure. The hard material processing device as claimed in claim 1, wherein the heating element is a radio frequency heating element or a microwave heating element. A hard material processing system, suitable for an object to be processed containing hard materials, at least includes: a heating element, the heating element performs a first heating program and a second heating program on the object to be processed, and the object to be processed is The object is heated to a first temperature sufficient to reduce the hardness of the hard material of the object to be processed. The first temperature is greater than or equal to 200 degrees Celsius, so as to temporarily reduce the hardness of the object to be processed during the first heating process and the second heating process. The hardness of the hard material of the object to be processed; at least one first processing element. When the heating element performs the first heating process on the object to be processed, the first processing element temporarily reduces the hard material at the same time. The object to be processed with the hardness is subjected to a first processing procedure; and at least one second processing element. When the heating element performs the second heating procedure for the object to be processed, the second processing element simultaneously processes the object that has been processed. The first processing procedure and the object to be processed that temporarily reduces the hardness of the hard material undergoes a second processing procedure. The hard material processing system of claim 9 further includes at least one cleaning element. After the object to be processed passes through the first processing procedure and/or the second processing procedure, the cleaning element performs cleaning on the object to be processed. A cleaning procedure. The hard material processing system of claim 9, wherein the first processing procedure is a cutting procedure, and the second processing procedure is a grinding and/or polishing procedure. The hard material processing system as claimed in claim 9, wherein the first processing element and/or the second processing element performs the first processing procedure and/or the third processing procedure on the object to be processed immersed in an oily environment. In the second processing procedure, the oil-containing environment contains high-temperature oil that can withstand the first temperature. The hard material processing system of claim 9, wherein the hardness of the hard material of the object to be processed is temporarily reduced to 25 Gpa to be close to or the same as the hardness of silicon. The hard material processing system as described in claim 9, 10, 11, 12 or 13, wherein the hard material of the object to be processed is silicon carbide, and the first processing element and/or the second processing element are suitable for the object to be processed. When the object to be processed undergoes the first processing program and/or the second processing program, the heating element simultaneously performs the first heating program and/or the second heating program on the object to be processed, so that the hardness of the hard material Temporarily reduced to close to or the same hardness as silicon. The hard material processing system of claim 14, wherein the object to be processed is a silicon carbide ingot. The hard material processing system of claim 9, wherein the heating element heats the object to be processed in a contact or non-contact manner during the first heating process and/or the second heating process. The hard material processing system of claim 9, wherein the heating element is a radio frequency heating element or a microwave heating element.