TWM603016U - Substrate sucking carrier - Google Patents
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- TWM603016U TWM603016U TW109208625U TW109208625U TWM603016U TW M603016 U TWM603016 U TW M603016U TW 109208625 U TW109208625 U TW 109208625U TW 109208625 U TW109208625 U TW 109208625U TW M603016 U TWM603016 U TW M603016U
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Abstract
本創作基板吸附載具用以吸附薄型基板包含載具本體以及吸附貼片,該載具本體構造有承載凹槽以及複數個由底面延伸至該承載凹槽的頂出孔,該吸附貼片裝設於該承載凹槽,具有能與該薄型基板接觸的吸附層、與該承載凹槽貼合定位的黏貼層以及連接於該吸附層與該黏貼層之前的耐熱層,且該吸附層、該黏貼層以及該耐熱層三者共同構造有複數個對齊該頂出孔位置的貫穿孔,其中,該吸附層表面具有複數個接觸圖案共同構成吸附部,而該吸附層比面的剩餘圖案受到加工形成破壞吸附作用的粗糙部;又該等接觸圖案依據排列樣式以及設定的總面積大小來對該薄型基板產生一均勻吸附力,使印刷板受到的吸附力平均於表面,在使用時更加穩固。The creative substrate adsorption carrier used to adsorb thin substrates includes a carrier body and a suction patch. The carrier body is configured with a bearing groove and a plurality of ejection holes extending from the bottom surface to the bearing groove. The suction patch is installed The bearing groove is provided with an adsorption layer capable of contacting with the thin substrate, an adhesive layer positioned in close contact with the bearing groove, and a heat-resistant layer connected to the adsorption layer and the adhesive layer, and the adsorption layer, the The adhesion layer and the heat-resistant layer are jointly constructed with a plurality of through holes aligned with the position of the ejection hole, wherein the surface of the adsorption layer has a plurality of contact patterns to form an adsorption part, and the remaining patterns on the surface of the adsorption layer are processed A rough part that destroys the adsorption effect is formed; and the contact patterns generate a uniform adsorption force on the thin substrate according to the arrangement pattern and the set total area size, so that the adsorption force received by the printed board is even on the surface, and it is more stable during use.
Description
本創作有關於一種便於對電路基板(Printed circuit board,PCB)進行定位與拆卸的載具,特別是指一種能耐高溫製程且能重複性使用的吸附式載具。This creation is about a carrier that is convenient for positioning and disassembling a printed circuit board (PCB), especially an adsorption carrier that can withstand high-temperature manufacturing processes and can be used repeatedly.
印刷電路基板(Printed circuit board,PCB)在目前產業界已發展成熟,進而目前市面上的各種電子產品(如:行動電話、印表機、筆記型電腦等)常使用印刷電路板,並且,隨著科技的演變使得印刷電路基板的厚度越來越薄,進而導致的電子產品走向精緻化。Printed circuit board (PCB) has matured in the current industry, and various electronic products on the market (such as mobile phones, printers, notebook computers, etc.) often use printed circuit boards. With the evolution of technology, the thickness of printed circuit boards has become thinner and thinner, which has led to the refinement of electronic products.
然而,目前針對印刷電路板進行加工製作時(例如:表面黏著技術(Surface Mount Technology, SMT)),需先將印刷電路板放置在載具的凹槽內部,並再使用膠帶黏貼於印刷電路板的四周,使得印刷電路板固定於載具以能進行後續的印刷生產作業,但是,以膠帶將印刷電路板貼合固定於載具的連接方式不但無法將印刷電路板準確定位於載具上,更容易讓印刷電路板發生錯位的狀況,相對就會影響印刷電路板的品質。However, when processing and manufacturing printed circuit boards (for example: Surface Mount Technology (SMT)), the printed circuit board needs to be placed in the groove of the carrier first, and then taped to the printed circuit board The printed circuit board is fixed to the carrier for subsequent printing and production operations. However, the connection method of fixing the printed circuit board to the carrier with tape can not only accurately position the printed circuit board on the carrier, It is easier for the printed circuit board to be misaligned, which will affect the quality of the printed circuit board.
並且,當印刷電路板透過膠帶連接於載具時,膠帶會外露於印刷電路板的印刷表面,使得膠帶會覆蓋於印刷電路板的一部分,進而在進行印刷生產作業時,膠帶的厚度會影響印刷電路板的印刷品質,致使印刷電路板的印刷表面會形成厚度不均的印刷層。Moreover, when the printed circuit board is connected to the carrier through the tape, the tape will be exposed on the printed surface of the printed circuit board, so that the tape will cover a part of the printed circuit board, and the thickness of the tape will affect the printing during the printing production operation. The printing quality of the circuit board causes the printed surface of the printed circuit board to form a printed layer with uneven thickness.
此外,進行印刷生產作業的過程中,膠帶可能會因為作業環境的溫度過高而導致融化以形成膠帶液體,而膠帶液體會四處流串,讓印刷電路板與載具都可能沾有膠帶液體,進而膠帶液體會影響印刷電路板的印刷品質,甚至沒有將膠帶液體清理乾淨,則膠帶液體會縮短載具的使用壽命。In addition, during the printing production process, the tape may melt due to the high temperature of the operating environment to form tape liquid, and the tape liquid will flow around, so that the printed circuit board and the carrier may be stained with the tape liquid. Furthermore, the tape liquid will affect the printing quality of the printed circuit board, and even if the tape liquid is not cleaned up, the tape liquid will shorten the service life of the carrier.
再者,完成印刷生產作業之後,膠帶必須從印刷電路板與載具上撕除,而膠帶經過印刷生產作業之後就無法再二次使用,進而不但提高材料成本,更需要耗費較多的人力資源來將膠帶進行清除作業,並且,因膠帶是整面同時黏貼於印刷電路板與載具,使得膠帶較難以從印刷電路板與載具上撕除,一旦撕除膠帶的力量過大或不正確,則會導致部分的膠帶殘留於印刷電路板或載具的表面上,進而就需要花費額外多餘的時間來進行清除作業。Furthermore, after the printing production operation is completed, the tape must be removed from the printed circuit board and the carrier, and the tape cannot be used again after the printing production operation, which not only increases the material cost, but also consumes more human resources. To remove the tape, and because the tape is affixed to the printed circuit board and the carrier at the same time, it is difficult to remove the tape from the printed circuit board and the carrier. Once the force to remove the tape is too strong or incorrect, As a result, part of the tape remains on the surface of the printed circuit board or the carrier, and it takes extra time to clean up.
本創作的主要目的在於提供一種可使用於高溫環境並能重複性吸附薄型電路板的吸附載具,且吸附貼片能夠與載具本體分離更換,大幅提升了實用性。The main purpose of this creation is to provide an adsorption carrier that can be used in a high temperature environment and can repeatedly adsorb thin circuit boards, and the adsorption patch can be separated and replaced from the carrier body, which greatly improves the practicality.
本創作的次要目的在於加工載具能夠配合一頂出基台,讓薄型電路板能夠平整地分離該吸附載具,避免薄型電路板在分離過程中受損。The secondary purpose of this creation is that the processing carrier can be matched with an ejector base, so that the thin circuit board can be separated evenly from the suction carrier, and the thin circuit board is prevented from being damaged during the separation process.
為實現前述目的,本創作基板吸附載具用以吸附一薄型基板,該基板吸附載具包含:In order to achieve the aforementioned purpose, the substrate adsorption carrier of the invention is used to adsorb a thin substrate, and the substrate adsorption carrier includes:
一載具本體,構造有一承載凹槽以及複數個由底面延伸至該承載凹槽的頂出孔;以及A carrier body, configured with a carrying groove and a plurality of ejection holes extending from the bottom surface to the carrying groove; and
一吸附貼片,裝設於該承載凹槽,具有一能與該薄型基板接觸的吸附層、一與該承載凹槽貼合定位的黏貼層以及一連接於該吸附層與該黏貼層之間的耐熱層,且該吸附層、該黏貼層以及該耐熱層三者共同構造有複數個對齊該頂出孔位置的貫穿孔。An adsorption patch is installed in the carrying groove, and has an adsorption layer capable of contacting the thin substrate, an adhesive layer positioned in contact with the carrying groove, and an adhesive layer connected between the adsorption layer and the adhesive layer The heat-resistant layer, and the adsorption layer, the adhesive layer and the heat-resistant layer are jointly constructed with a plurality of through holes aligned with the position of the ejection hole.
其中,該吸附層表面具有複數個接觸圖案共同構成一吸附部,而該吸附層比表面的剩餘圖案受到加工形成一破壞吸附作用的粗糙部,又該等接觸圖案依據一排列樣式以及一設定的總面積大小來對該薄型基板產生一均勻吸附力。Wherein, the surface of the adsorption layer has a plurality of contact patterns to form an adsorption part, and the remaining patterns on the surface of the adsorption layer are processed to form a rough part that destroys the adsorption effect, and the contact patterns are based on an arrangement pattern and a set The total area is used to produce a uniform adsorption force on the thin substrate.
其中,該載具本體的承載凹槽周圍設有一取物凹槽,且該承載凹槽與該取物凹槽的底部共同設有一方便使用者將該吸附貼片分離的凹陷。Wherein, the carrying groove of the carrier body is provided with a taking-out groove around, and the carrying groove and the bottom of the taking-out groove are jointly provided with a recess for the user to separate the adsorption patch.
其中,該吸附貼片的厚度小於該承載凹槽的深度。Wherein, the thickness of the suction patch is smaller than the depth of the carrying groove.
其中,該等接觸圖案包含有彼此間隔排設的環形圖以及連接於兩兩環形圖之間的直線圖,該環形圖的直徑大於該直線圖的線寬。Wherein, the contact patterns include circular graphs arranged at intervals and a straight line graph connected between two circular graphs, and the diameter of the circular graph is larger than the line width of the straight line graph.
其中,該直線段連接該等環形圖外側的一部分周圍,該等環形圖的內側圍繞在該貫穿孔周圍。Wherein, the straight line segment connects a part of the periphery of the outer sides of the annular diagrams, and the inner side of the annular diagrams surrounds the through hole.
其中,該吸附貼片表面進一步設有一離型片,該離型片連接於該吸附層的該吸附部。Wherein, a release sheet is further provided on the surface of the adsorption patch, and the release sheet is connected to the adsorption part of the adsorption layer.
其中,該吸附層、該黏貼層以及該耐熱層三者進一步構造出複數個輔助貫穿孔,該輔助貫穿孔的孔徑大於貫穿孔的孔徑。Wherein, the adsorption layer, the adhesive layer and the heat-resistant layer further constitute a plurality of auxiliary through holes, and the auxiliary through holes have a larger aperture than the through holes.
綜合上述,本創作基板吸附載具的特點在於該吸附貼片具有該吸附層、黏貼層以及耐熱層,藉由該黏貼層將該吸附貼片黏貼在該基板吸附載具上,再來利用該吸附層將該薄型基板吸附住,在印刷過程中有高溫的接觸下,避免在印刷過程中該吸附貼片因過熱而變形,所以藉由該耐熱層維持該吸附貼片維持形狀,其中,該吸附層表面具有複數個接觸圖案共同構成該吸附部,而該吸附層表面的剩餘圖案受到加工形成該破壞吸附作用的粗糙部,又該等接觸圖案依據該排列樣式以及該設定的總面積大小來對該薄型基板產生該均勻受力,使該薄型基板在拆除時,不會因為該基板吸附載具的吸附力太強而導致拆除不易,也不會因為吸附力不足導致容易印刷時偏移錯位。In summary, the characteristic of the creative substrate adsorption carrier is that the adsorption patch has the adsorption layer, the adhesive layer and the heat-resistant layer. The adsorption patch is pasted on the substrate adsorption carrier through the adhesive layer, and then the The adsorption layer adsorbs the thin substrate, and prevents the adsorption patch from deforming due to overheating during the printing process under high-temperature contact during the printing process. Therefore, the heat-resistant layer maintains the adsorption patch to maintain its shape. The surface of the adsorption layer has a plurality of contact patterns to form the adsorption part, and the remaining patterns on the surface of the adsorption layer are processed to form the rough part that destroys the adsorption effect, and the contact patterns are based on the arrangement pattern and the set total area size. This uniform force is generated on the thin substrate, so that when the thin substrate is removed, it will not be difficult to remove because the substrate has too strong adsorption force to adsorb the carrier, and it will not be easily shifted and misaligned during printing due to insufficient adsorption force .
茲為便於更進一步對本創作之構造、使用及其特徵有更深一層明確、詳實的認識與瞭解,爰舉出較佳實施例,配合圖式詳細說明如下:In order to facilitate a deeper, clear and detailed knowledge and understanding of the structure, use and characteristics of this creation, a preferred embodiment is given, and the detailed description is as follows with the drawings:
請參閱圖1、2所示,本創作基板吸附載具1用以吸附一薄型基板2,該基板吸附載具1包含一載具本體3以及一吸附貼片4,該載具本體3構造有一承載凹槽31以及複數個由底面延伸至該承載凹槽31的頂出孔32,該載具本體3使用石無鉛材質所製成,石無鉛材質可以耐高溫、隔熱以及抗酸蝕,使該載具本體3在進入印刷的過程中,藉由石無鉛材質能夠不受高溫以及酸蝕影響,該吸附貼片4裝設於該承載凹槽31,該吸附貼片4具有一能與該薄型基板2接觸的吸附層41、一與該承載凹槽31貼合定位的黏貼層42以及一連接於該吸附層41與該黏貼層42之間的耐熱層43,且該吸附層41、該黏貼層42以及該耐熱層43三者共同構造有複數個對齊該頂出孔32位置的貫穿孔44。Please refer to Figures 1 and 2. The creative
其中,該載具本體3的承載凹槽31周圍設有一取物凹槽33,且該承載凹槽31與該取物凹槽33的底部共同設有一方便使用者將該吸附貼片4分離的凹陷34,當該吸附貼片4吸附力不夠使用次數到達上限,可以使該吸附貼片4可進行更換,讓該載具本體3可以再利用。Wherein, the carrying
請參閱圖3、4所示,該吸附層41表面具有複數個接觸圖案411共同構成一吸附部412,而該吸附層41表面的剩餘圖案受到加工形成一破壞吸附作用的粗糙部413,又該等接觸圖案411依據一排列樣式以及一設定的總面積大小來對該薄型基板2產生一均勻吸附力,該等貫穿孔44之間的間隔距離相同,其中,該吸附層41、該黏貼層42以及該耐熱層43三者進一步構造出複數個輔助貫穿孔45,該輔助貫穿孔45的孔徑大於貫穿孔44的孔徑,印刷過程中可以利用該輔助貫穿孔45進行散熱。Please refer to Figures 3 and 4, the surface of the
請參閱圖1、3所示,該吸附部412表面進一步設有一離型片414,該離型片414連接於該吸附層41的該吸附部412,防止該吸附部412因為沒有使用而堆積灰層,使吸附部412容易吸附灰塵導致吸附力下降,影響到印刷時該薄型基板2的穩定度。Please refer to Figures 1 and 3, the surface of the
其中,該等接觸圖案411包含有彼此間隔排設的環形圖411a以及連接於兩兩環形圖411a之間的直線圖411b,該等環形圖411a的直徑大於該直線圖411b的線寬,該直線段411b連接於該等環形圖411a外側的一部份周圍,該等環形圖411a的內側圍繞在該貫穿孔44周圍。Wherein, the
於一較佳實施例中,該離型片414的大小形狀可做成與該吸附部412的接觸圖案411相同,藉由該直線圖411b的連接該等環形圖411a,讓該接觸圖案411相連再一起,該離型片414在撕起時,藉由直線圖411b相連使該離型片414能夠一次性地將它撕起。In a preferred embodiment, the size and shape of the
於一較佳實施例中,該薄型基板2對著該吸附貼片4往在該吸附層41方向壓緊,利用該吸附部412上的該接觸圖案411對該薄型基板2進行真空吸附作用,在該吸附層41上有包含了該粗糙部413,使部分與該薄型基板2貼合的部分沒有吸附力,所以讓該薄型基板2不會吸附過緊,而導致拆除時,施工困難或用力過度導致該薄型基板2損毀,且該吸附層41的吸附力也不會因為部分區塊為該粗糙部413而影響到吸附力不足,導致該薄型基版運送過程掉落損毀,將每一部的面積吸附力都均勻的分布,使該薄型基版都能穩固的吸附在上面。In a preferred embodiment, the
請參閱圖5所示,該吸附貼片4由上至下排序為該吸附層41、該耐熱層43以及該黏貼層42,該耐熱層43介於該吸附層41以及該黏貼層42之間,該耐熱層43的一側連接該吸附層41,則另一側連接於該黏貼層42,該吸附層41的相對另一側用於吸附該薄型基板2,該黏貼層42的相對另一側黏貼於該承載凹槽31,該吸附貼片4的厚度小於該承載凹槽31的深度,但該吸附貼片4與該載具本體3表面距離不會相差甚遠,使該基板吸附載具1維持輕薄,在拿取時不會因為太厚或太重導致意外掉落。Please refer to FIG. 5, the
請參閱圖6A、6B所示,於一較佳第一實施例中,該基板吸附載具1進一步具有一配合將該薄型基板2頂出分離該基板吸附載具1的頂出板5,該頂出板5具有複數個對應該等頂出孔32位置的頂出針51,該等頂出針51的長度高於該基板吸附載具1的厚度許多,在進行完印刷過程後,要將該薄型基板2分離於該基板吸附載具1時,使用手動的方式,將該載具本體3下方的該等頂出孔32對齊該等頂出針51,再將該基板吸附載具1往下壓於一施力方向A,該等頂出針51會依序進入該等頂出孔32以及該等貫穿孔44後碰到該薄型基板2,該等頂出針51就會將該薄型基板2分離於該基板吸附載具1。Please refer to FIGS. 6A and 6B. In a preferred first embodiment, the
請參閱圖7A、7B所示,於一較佳第二實施例中,有一將頂出板5組裝於機器的自動頂出機6,該自動頂出機6設有一與該載具本體3能固定放置的定位框61、一在自動頂出機6外部的啟動鈕62以及該在自動頂出機6內部下方可以拆裝的頂出板5,步驟順序為先將該基板吸附載具1放置於在該定位框61上並固定,再按下該啟動鈕62,該自動頂出機6會使該頂出板5做一上升方向B,使該自動頂出機6下方的該頂出板5就會緩緩升起,該等頂出針51會依序進入該等頂出孔32以及該等貫穿孔44後碰到該薄型基板2,將該薄型基板2分離於該基板吸附載具1,該薄型基板2分離以後,再按下啟動鈕62,該自動頂出機6就會將該頂出板5回到原本裝設位置,使達到自動化的效果,藉此利用該基板吸附載具1的設計可以達到印刷自動化並且簡易使用的效果。Please refer to Figures 7A and 7B. In a preferred second embodiment, there is an
1:基板吸附載具
2:薄型基板
3:載具本體
31:承載凹槽
32:頂出孔
33:取物凹槽
34:凹陷
4:吸附貼片
41:吸附層
411:接觸圖案
411a:環形圖
411b:直線圖
412:吸附部
413:粗糙部
414:離型片
42:黏貼層
43:耐熱層
44:貫穿孔
45:輔助貫穿孔
5:頂出板
51:頂出針
6:自動頂出機
61:定位框
62:啟動鈕
A:施力方向
B:上升方向
1: Substrate adsorption carrier
2: Thin substrate
3: Vehicle body
31: Carrying groove
32: ejector hole
33: Fetching groove
34: sunken
4: Adsorption patch
41: Adsorption layer
411:
圖1為本創作基板吸附載具的示意圖; 圖2為本創作基板吸附載具的分解圖; 圖3為本創作基板吸附載具的俯視圖; 圖4為圖3的B區塊該接觸圖案示意圖; 圖5為圖3的AA線段剖面圖; 圖6A為第一實施例的狀態示意圖; 圖6B為第一實施例的該薄型基板分離示意圖; 圖7A為第二實施例的狀態示意圖;以及 圖7B為第二實施例的該薄型基板分離示意圖。 Figure 1 is a schematic diagram of the creative substrate adsorption carrier; Figure 2 is an exploded view of the creative substrate adsorption carrier; Figure 3 is a top view of the creative substrate adsorption carrier; 4 is a schematic diagram of the contact pattern of block B in FIG. 3; Figure 5 is a cross-sectional view of line AA of Figure 3; 6A is a schematic diagram of the state of the first embodiment; 6B is a schematic diagram of the thin substrate separation of the first embodiment; FIG. 7A is a schematic diagram of the state of the second embodiment; and FIG. 7B is a schematic diagram of the thin substrate separation of the second embodiment.
1:基板吸附載具 1: Substrate adsorption carrier
3:載具本體 3: Vehicle body
31:承載凹槽 31: Carrying groove
32:頂出孔 32: ejector hole
33:取物凹槽 33: Fetching groove
34:凹陷 34: sunken
4:吸附貼片 4: Adsorption patch
41:吸附層 41: Adsorption layer
411:接觸圖案 411: Contact Pattern
411a:環形圖 411a: ring chart
411b:直線圖 411b: Straight line graph
412:吸附部 412: Adsorption part
413:粗糙部 413: Rough part
42:黏貼層 42: Adhesive layer
43:耐熱層 43: heat-resistant layer
44:貫穿孔 44: Through hole
45:輔助貫穿孔 45: auxiliary through hole
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109208625U TWM603016U (en) | 2020-07-07 | 2020-07-07 | Substrate sucking carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109208625U TWM603016U (en) | 2020-07-07 | 2020-07-07 | Substrate sucking carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM603016U true TWM603016U (en) | 2020-10-21 |
Family
ID=74095448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109208625U TWM603016U (en) | 2020-07-07 | 2020-07-07 | Substrate sucking carrier |
Country Status (1)
Country | Link |
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TW (1) | TWM603016U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775366B (en) * | 2021-03-25 | 2022-08-21 | 程陽有限公司 | Package carrier and the manufacture method |
TWI786848B (en) * | 2021-09-24 | 2022-12-11 | 陽程科技股份有限公司 | Sheet separating device and sheet separating method |
-
2020
- 2020-07-07 TW TW109208625U patent/TWM603016U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI775366B (en) * | 2021-03-25 | 2022-08-21 | 程陽有限公司 | Package carrier and the manufacture method |
TWI786848B (en) * | 2021-09-24 | 2022-12-11 | 陽程科技股份有限公司 | Sheet separating device and sheet separating method |
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