TWM603016U - Substrate sucking carrier - Google Patents

Abstract

The creative substrate adsorption carrier used to adsorb thin substrates includes a carrier body and a suction patch. The carrier body is configured with a bearing groove and a plurality of ejection holes extending from the bottom surface to the bearing groove. The suction patch is installed The bearing groove is provided with an adsorption layer capable of contacting with the thin substrate, an adhesive layer positioned in close contact with the bearing groove, and a heat-resistant layer connected to the adsorption layer and the adhesive layer, and the adsorption layer, the The adhesion layer and the heat-resistant layer are jointly constructed with a plurality of through holes aligned with the position of the ejection hole, wherein the surface of the adsorption layer has a plurality of contact patterns to form an adsorption part, and the remaining patterns on the surface of the adsorption layer are processed A rough part that destroys the adsorption effect is formed; and the contact patterns generate a uniform adsorption force on the thin substrate according to the arrangement pattern and the set total area size, so that the adsorption force received by the printed board is even on the surface, and it is more stable during use.

Description

Substrate adsorption carrier

This creation is about a carrier that is convenient for positioning and disassembling a printed circuit board (PCB), especially an adsorption carrier that can withstand high-temperature manufacturing processes and can be used repeatedly.

Printed circuit board (PCB) has matured in the current industry, and various electronic products on the market (such as mobile phones, printers, notebook computers, etc.) often use printed circuit boards. With the evolution of technology, the thickness of printed circuit boards has become thinner and thinner, which has led to the refinement of electronic products.

However, when processing and manufacturing printed circuit boards (for example: Surface Mount Technology (SMT)), the printed circuit board needs to be placed in the groove of the carrier first, and then taped to the printed circuit board The printed circuit board is fixed to the carrier for subsequent printing and production operations. However, the connection method of fixing the printed circuit board to the carrier with tape can not only accurately position the printed circuit board on the carrier, It is easier for the printed circuit board to be misaligned, which will affect the quality of the printed circuit board.

Moreover, when the printed circuit board is connected to the carrier through the tape, the tape will be exposed on the printed surface of the printed circuit board, so that the tape will cover a part of the printed circuit board, and the thickness of the tape will affect the printing during the printing production operation. The printing quality of the circuit board causes the printed surface of the printed circuit board to form a printed layer with uneven thickness.

In addition, during the printing production process, the tape may melt due to the high temperature of the operating environment to form tape liquid, and the tape liquid will flow around, so that the printed circuit board and the carrier may be stained with the tape liquid. Furthermore, the tape liquid will affect the printing quality of the printed circuit board, and even if the tape liquid is not cleaned up, the tape liquid will shorten the service life of the carrier.

Furthermore, after the printing production operation is completed, the tape must be removed from the printed circuit board and the carrier, and the tape cannot be used again after the printing production operation, which not only increases the material cost, but also consumes more human resources. To remove the tape, and because the tape is affixed to the printed circuit board and the carrier at the same time, it is difficult to remove the tape from the printed circuit board and the carrier. Once the force to remove the tape is too strong or incorrect, As a result, part of the tape remains on the surface of the printed circuit board or the carrier, and it takes extra time to clean up.

The main purpose of this creation is to provide an adsorption carrier that can be used in a high temperature environment and can repeatedly adsorb thin circuit boards, and the adsorption patch can be separated and replaced from the carrier body, which greatly improves the practicality.

The secondary purpose of this creation is that the processing carrier can be matched with an ejector base, so that the thin circuit board can be separated evenly from the suction carrier, and the thin circuit board is prevented from being damaged during the separation process.

In order to achieve the aforementioned purpose, the substrate adsorption carrier of the invention is used to adsorb a thin substrate, and the substrate adsorption carrier includes:

A carrier body, configured with a carrying groove and a plurality of ejection holes extending from the bottom surface to the carrying groove; and

An adsorption patch is installed in the carrying groove, and has an adsorption layer capable of contacting the thin substrate, an adhesive layer positioned in contact with the carrying groove, and an adhesive layer connected between the adsorption layer and the adhesive layer The heat-resistant layer, and the adsorption layer, the adhesive layer and the heat-resistant layer are jointly constructed with a plurality of through holes aligned with the position of the ejection hole.

Wherein, the surface of the adsorption layer has a plurality of contact patterns to form an adsorption part, and the remaining patterns on the surface of the adsorption layer are processed to form a rough part that destroys the adsorption effect, and the contact patterns are based on an arrangement pattern and a set The total area is used to produce a uniform adsorption force on the thin substrate.

Wherein, the carrying groove of the carrier body is provided with a taking-out groove around, and the carrying groove and the bottom of the taking-out groove are jointly provided with a recess for the user to separate the adsorption patch.

Wherein, the thickness of the suction patch is smaller than the depth of the carrying groove.

Wherein, the contact patterns include circular graphs arranged at intervals and a straight line graph connected between two circular graphs, and the diameter of the circular graph is larger than the line width of the straight line graph.

Wherein, the straight line segment connects a part of the periphery of the outer sides of the annular diagrams, and the inner side of the annular diagrams surrounds the through hole.

Wherein, a release sheet is further provided on the surface of the adsorption patch, and the release sheet is connected to the adsorption part of the adsorption layer.

Wherein, the adsorption layer, the adhesive layer and the heat-resistant layer further constitute a plurality of auxiliary through holes, and the auxiliary through holes have a larger aperture than the through holes.

In summary, the characteristic of the creative substrate adsorption carrier is that the adsorption patch has the adsorption layer, the adhesive layer and the heat-resistant layer. The adsorption patch is pasted on the substrate adsorption carrier through the adhesive layer, and then the The adsorption layer adsorbs the thin substrate, and prevents the adsorption patch from deforming due to overheating during the printing process under high-temperature contact during the printing process. Therefore, the heat-resistant layer maintains the adsorption patch to maintain its shape. The surface of the adsorption layer has a plurality of contact patterns to form the adsorption part, and the remaining patterns on the surface of the adsorption layer are processed to form the rough part that destroys the adsorption effect, and the contact patterns are based on the arrangement pattern and the set total area size. This uniform force is generated on the thin substrate, so that when the thin substrate is removed, it will not be difficult to remove because the substrate has too strong adsorption force to adsorb the carrier, and it will not be easily shifted and misaligned during printing due to insufficient adsorption force .

In order to facilitate a deeper, clear and detailed knowledge and understanding of the structure, use and characteristics of this creation, a preferred embodiment is given, and the detailed description is as follows with the drawings:

Please refer to Figures 1 and 2. The creative substrate adsorption carrier 1 is used to adsorb a thin substrate 2. The substrate adsorption carrier 1 includes a carrier body 3 and an adsorption patch 4, and the carrier body 3 is constructed with a The carrying groove 31 and a plurality of ejection holes 32 extending from the bottom surface to the carrying groove 31, the carrier body 3 is made of lead-free stone material, which can withstand high temperature, heat insulation and acid corrosion, so that When the carrier body 3 enters the printing process, it is not affected by high temperature and acid corrosion by using a lead-free stone material. The adsorption patch 4 is installed in the carrying groove 31, and the adsorption patch 4 has a capacity to interact with the The adsorption layer 41 in contact with the thin substrate 2, an adhesive layer 42 positioned in contact with the carrying groove 31, and a heat-resistant layer 43 connected between the adsorption layer 41 and the adhesive layer 42, and the adsorption layer 41, the The adhesive layer 42 and the heat-resistant layer 43 are jointly constructed with a plurality of through holes 44 aligned with the position of the ejection hole 32.

Wherein, the carrying groove 31 of the carrier body 3 is provided with a fetching groove 33 around, and the carrying groove 31 and the bottom of the fetching groove 33 are jointly provided with a convenient user to separate the adsorption patch 4 The recess 34, when the adsorption force of the adsorption patch 4 is insufficient, the number of uses reaches the upper limit, so that the adsorption patch 4 can be replaced, so that the carrier body 3 can be reused.

Please refer to Figures 3 and 4, the surface of the adsorption layer 41 has a plurality of contact patterns 411 to form an adsorption portion 412, and the remaining patterns on the surface of the adsorption layer 41 are processed to form a rough portion 413 that destroys the adsorption effect. The iso-contact pattern 411 generates a uniform adsorption force on the thin substrate 2 according to an arrangement pattern and a set total area. The spacing distances between the through holes 44 are the same. The adsorption layer 41 and the adhesive layer 42 And the heat-resistant layer 43 further constitutes a plurality of auxiliary through holes 45, the diameter of the auxiliary through holes 45 is larger than that of the through holes 44, and the auxiliary through holes 45 can be used for heat dissipation during printing.

Please refer to Figures 1 and 3, the surface of the adsorption portion 412 is further provided with a release sheet 414, which is connected to the adsorption portion 412 of the adsorption layer 41 to prevent the adsorption portion 412 from accumulating ash because it is not in use The layer makes the adsorption part 412 easy to adsorb dust, which reduces the adsorption force, which affects the stability of the thin substrate 2 during printing.

Wherein, the contact patterns 411 include ring patterns 411a arranged at intervals and a line pattern 411b connected between two ring patterns 411a. The diameter of the ring patterns 411a is larger than the line width of the linear pattern 411b. The segment 411 b is connected around a part of the outer side of the ring patterns 411 a, and the inner side of the ring patterns 411 a surrounds the through hole 44.

In a preferred embodiment, the size and shape of the release sheet 414 can be made the same as the contact pattern 411 of the suction portion 412, and the contact pattern 411 is connected by connecting the ring patterns 411a of the linear pattern 411b Furthermore, when the release sheet 414 is torn up, it is connected by a straight line diagram 411b so that the release sheet 414 can be torn up at one time.

In a preferred embodiment, the thin substrate 2 is pressed against the adsorption patch 4 in the direction of the adsorption layer 41, and the contact pattern 411 on the adsorption portion 412 is used for vacuum adsorption of the thin substrate 2. The adsorption layer 41 includes the roughness 413, so that the part that is attached to the thin substrate 2 has no adsorption force, so that the thin substrate 2 will not be attracted too tightly, which may cause difficulty in construction or force when removing Excessive damage to the thin substrate 2 is caused, and the adsorption force of the adsorption layer 41 will not be affected by the insufficient adsorption force because part of the area is the rough part 413, resulting in the thin substrate being dropped and damaged during the transportation process. The area adsorption force is evenly distributed, so that the thin base plate can be firmly adsorbed on it.

Please refer to FIG. 5, the adsorption patch 4 is sorted from top to bottom into the adsorption layer 41, the heat-resistant layer 43 and the adhesive layer 42, and the heat-resistant layer 43 is between the adsorption layer 41 and the adhesive layer 42 One side of the heat-resistant layer 43 is connected to the adsorption layer 41, and the other side is connected to the adhesive layer 42, the opposite side of the adsorption layer 41 is used to adsorb the thin substrate 2, and the adhesive layer 42 is opposite to the other The side is pasted to the carrying groove 31, the thickness of the suction patch 4 is smaller than the depth of the carrying groove 31, but the distance between the suction patch 4 and the surface of the carrier body 3 is not very different, so that the substrate can adsorb the carrier 1 Maintain light and thin, and will not accidentally fall when being too thick or too heavy.

Please refer to FIGS. 6A and 6B. In a preferred first embodiment, the substrate adsorption carrier 1 further has an ejector plate 5 for pushing out the thin substrate 2 and separating the substrate adsorption carrier 1. The ejector plate 5 has a plurality of ejector pins 51 corresponding to the positions of the ejector holes 32. The length of the ejector pins 51 is much higher than the thickness of the substrate adsorption carrier 1. After the printing process is completed, When the thin substrate 2 is separated from the substrate suction carrier 1, manually, the ejection holes 32 under the carrier body 3 are aligned with the ejection pins 51, and then the substrate suction carrier 1 Press down in a force direction A, the ejector pins 51 will sequentially enter the ejector holes 32 and the through holes 44 and then hit the thin substrate 2, and the ejector pins 51 will The substrate 2 is separated from the substrate adsorption carrier 1.

Please refer to Figures 7A and 7B. In a preferred second embodiment, there is an automatic ejector 6 that assembles the ejector plate 5 to the machine. The automatic ejector 6 is provided with an automatic ejector 6 and the carrier body 3 The fixed positioning frame 61, a start button 62 outside the automatic ejector 6, and the ejector plate 5 that can be disassembled under the automatic ejector 6, the sequence of steps is to first place the substrate adsorption carrier 1 Fix it on the positioning frame 61, and then press the start button 62, the automatic ejector 6 will cause the ejector plate 5 to move in a rising direction B, so that the ejector plate below the automatic ejector 6 5 will rise slowly, the ejector pins 51 will sequentially enter the ejector holes 32 and the through holes 44 and then hit the thin substrate 2 to separate the thin substrate 2 from the substrate adsorption carrier 1. After the thin substrate 2 is separated, press the start button 62, the automatic ejector 6 will return the ejector plate 5 to the original installation position, so as to achieve the effect of automation, thereby using the substrate to adsorb and load The design of tool 1 can achieve the effect of printing automation and easy use.

1: Substrate adsorption carrier 2: Thin substrate 3: Vehicle body 31: Carrying groove 32: ejector hole 33: Fetching groove 34: sunken 4: Adsorption patch 41: Adsorption layer 411: Contact Pattern 411a: ring chart 411b: Straight line graph 412: Adsorption part 413: Rough part 414: Release film 42: Adhesive layer 43: heat-resistant layer 44: Through hole 45: auxiliary through hole 5: eject board 51: eject needle 6: Automatic ejection machine 61: positioning box 62: Start button A: Direction of force B: Ascending direction

Figure 1 is a schematic diagram of the creative substrate adsorption carrier; Figure 2 is an exploded view of the creative substrate adsorption carrier; Figure 3 is a top view of the creative substrate adsorption carrier; 4 is a schematic diagram of the contact pattern of block B in FIG. 3; Figure 5 is a cross-sectional view of line AA of Figure 3; 6A is a schematic diagram of the state of the first embodiment; 6B is a schematic diagram of the thin substrate separation of the first embodiment; FIG. 7A is a schematic diagram of the state of the second embodiment; and FIG. 7B is a schematic diagram of the thin substrate separation of the second embodiment.

1: Substrate adsorption carrier

3: Vehicle body

31: Carrying groove

32: ejector hole

33: Fetching groove

34: sunken

4: Adsorption patch

41: Adsorption layer

411: Contact Pattern

411a: ring chart

411b: Straight line graph

412: Adsorption part

413: Rough part

42: Adhesive layer

43: heat-resistant layer

44: Through hole

45: auxiliary through hole

Claims (7)

A substrate adsorption carrier for adsorbing a thin substrate, comprising: a carrier body configured with a carrying groove and a plurality of ejection holes extending from the bottom surface to the carrying groove; and a suction patch mounted on The carrying groove has an adsorbing layer capable of contacting the thin substrate, an adhesive layer positioned in close contact with the carrying groove, and a heat-resistant layer connected between the adsorbing layer and the adhesive layer, and the adsorbing layer , The adhesive layer and the heat-resistant layer are jointly constructed with a plurality of through holes aligned with the position of the ejection hole; wherein, the surface of the adsorption layer has a plurality of contact patterns to form an adsorption part, and the remaining patterns on the surface of the adsorption layer After being processed, a rough part that destroys the adsorption effect is formed, and the contact patterns generate a uniform adsorption force on the thin substrate according to an arrangement pattern and a set total area size. According to claim 1, the substrate adsorption carrier, wherein a picking groove is provided around the carrying groove of the carrier body, and the bottom of the carrying groove and the fetching groove are both provided with a convenient The depression where the sticking patch separates. The substrate suction carrier according to claim 2, wherein the thickness of the suction patch is less than the depth of the carrying groove. The substrate adsorption carrier according to claim 1, wherein the contact patterns include circular graphs arranged spaced apart from each other and a linear graph connected between two circular graphs, the diameter of the circular graph is larger than the line of the linear graph width. According to claim 4, the substrate adsorption carrier, wherein a straight line segment connects a part of the periphery of the outer side of the ring diagrams, and the inner side of the ring diagrams surrounds the through hole. The substrate suction carrier according to claim 1, wherein a release sheet is further provided on the surface of the suction patch, and the release sheet is connected to the suction part of the suction layer. The substrate adsorption carrier according to claim 1, wherein the adsorption layer, the adhesive layer and the heat-resistant layer further constitute a plurality of auxiliary through holes, which are arranged in a staggered manner between the through holes.

Images