TWI775366B - Package carrier and the manufacture method - Google Patents

Abstract

The present invention relates to a package carrier and the manufacture method, the package carrier is used in the IC packaging process and will be adsorbed and separated from a circuit boards through atmospheric pressure in the conditions of non-exhausted and heat-resistant. The package carrier comprises a carrier body and a vacuum lamination that set in a groove of the carrier body. The vacuum lamination is made by the heat-resisting material, comprises: an adhesive layer, an absorbing layer set on the surface of package carrier, and a separating layer which will be removed when using, covered on the absorbing layer. The absorbing layer comprises a plurality of exhausting groove that spacing arranged. One end of the venting groove is formed as a closing end that being spaced from the edge of the vacuum lamination. The other end of the venting groove is formed as an opening end that communicating from the edge of the vacuum lamination. Therefore, the absorbing layer will be divided into an absorbing area that touches the circuit board and a plurality of venting area that locates inside the venting groove. A plurality of cutting traces that corresponding with the position of the venting groove is formed in the separating layer.

Description

Packaging carrier and method of making the same

The present invention relates to a carrier suitable for use in IC or chip packaging process and a manufacturing method thereof, in particular to a carrier used in the packaging process to fix an IC carrier board or an IC carrier through the principle of vacuum adsorption without air extraction in the packaging process. The wafer is produced by processes such as printing/placement (smt or diebond)/wirebond/washing/Molding/dispensing/curing to prevent the IC board from shifting during the production process, thermal expansion and deformation, precision printing, dislocation, air welding, wirebond Parts displacement and disconnection, washing process, the carrier used in the one-stop full-process production.

IC substrates have matured in the current industry. With the increasing miniaturization and thinning of packaging technology, the packaging technology commonly used in various IC products has improved, making the thickness of the carrier board thinner and thinner, and the multi-material characteristics of materials are complex, which requires Developed IC substrate thinning full-process packaging technology or automated processes to respond.

For the processing flow of the packaging process, from fixing the carrier board/printing/printing/reflow/diebond/water washing/wirebond/dispensing/curing/bonding, one of the known IC substrate fixing methods is to use tape to fix the IC substrate first. On the carrier, but when the IC substrate is fixed to the carrier with tape, the tape will cover the IC substrate, so during production operations, the thickness of the tape will cause the printed surface of the IC substrate to form a printed layer with uneven thickness , which in turn affects the overall yield of IC packaging.

In addition, during the processing, the tape may be melted due to the high temperature of the operating environment to form tape liquid that flows around, and may be affected by sticking to the IC substrate and the carrier. affect the printing quality; if the tape liquid is not cleaned up, the tape liquid is more likely to shorten the life of the carrier.

In addition, when the tape needs to be removed after processing, once the force to remove the tape is too large or incorrect, part of the tape will remain on the surface of the IC substrate or carrier, and it will take extra time to remove the tape. In addition, the tapes that are torn off after completing the relevant production operations cannot be reused, which not only increases the material cost, but also requires additional labor to remove the cost.

In other ways, the conventional method of using a magnetic cover plate also needs to repeatedly manufacture different carriers because of the multiple contents of the carrier plate, which increases the cost and management problems, and because the cover plate increases the thickness of the fixing device, it cannot meet the Full process requirements from start to finish.

In addition, although there are also carriers for fixing IC substrates through vacuum evacuation instead of using adhesive tapes, such carriers require additional vacuum evacuation equipment, which is inconvenient to use.

The main purpose of the present invention is to provide a carrier for packaging operation, which adopts heat-resistant material to fix the IC substrate by vacuum adsorption to avoid the use of adhesive tape or magnetic suction top cover, and the exhaust is passed through the carrier on the carrier. The provided exhaust channel exhausts the air between the carrier and the IC substrate without the need for additional air extraction equipment, so that the carrier can be vacuum adsorbed on the carrier for high temperature and other process production.

A secondary object of the present invention is to provide a carrier for processing an IC substrate, wherein the carrier is provided with a protective layer to prevent contamination and needs to be removed during use, and the protective layer is formed with processing The cut marks generated during the exhaust passage on the carrier, through the design of the cut marks, can allow the user to remove the entire protective layer on the surface of the carrier when tearing the protective layer from any place.

In order to achieve the above object, the packaging carrier of the present invention can repeatedly adsorb and separate a circuit substrate comprising: a carrier body and a vacuum patch.

The vacuum patch is made of heat-resistant material and is disposed on the carrier body, including: an adhesive layer, an adsorption layer and a release layer; the adhesive layer is adhered to the carrier body; the adsorption layer is away from the adhesive layer One side of the layer has a plurality of spaced exhaust grooves, and one end of each of the exhaust grooves is formed with a closed end spaced from the edge of the vacuum patch, and the other end forms a closed end connected to the edge of the vacuum patch. At the open end, the adsorption layer is divided into an adsorption area that can contact the circuit substrate and a plurality of exhaust areas located in the exhaust grooves through the exhaust grooves; and the release layer is connected to the adsorption area layer, with a plurality of incisions corresponding to the positions of the vent grooves.

The heat-resistant material in the preceding paragraph is a high-temperature-resistant material that can withstand packaging processing.

In one type of embodiment, an accommodating groove is formed on the surface of the carrier body, and the accommodating groove has a bottom and at least one wall portion, the wall portion is disposed on the edge of at least one side of the bottom, and the vacuum paste The sheet is arranged in the accommodating groove; and the suction layer of the vacuum patch is formed with all suction surfaces aligned with the surface of the carrier body; this structure can withstand the pressing of the Molding mold and protect the product.

In one embodiment, the vacuum patch includes a first side and a second side opposite to the first side, and the exhaust grooves include a plurality of the exhaust sections adjacent to each other The first section of the first side and the plurality of exhaust sections are adjacent to the second section of the second side, and the first section and the second section are spaced apart from each other, so that the vacuum The surface of the patch forms an adsorption area in an S-shaped arrangement.

In a preferred embodiment, the exhaust groove includes a first section extending toward the extension direction of the exhaust groove and a second section different from the extension direction of the exhaust groove; and the exhaust The groove includes a plurality of the first sections and a plurality of the second sections, and the first sections and the second sections are arranged at intervals from each other.

In one embodiment, the suction layer of the vacuum patch is formed with all suction surfaces aligned with the surface of the carrier body.

In one embodiment, a heat-resistant layer is disposed between the adhesive layer and the adsorption layer, the heat-resistant layer has two connection interface layers; the adsorption layer has a first interface layer connected with the connection interface layer; the adhesive layer has A second interface layer connected with the connection interface layer, the second interface layer and the first interface layer are respectively located on opposite sides of the heat-resistant layer.

The present invention also provides another packaging carrier, which can repeatedly adsorb and separate a circuit substrate. The difference from the aforementioned packaging carrier is that it does not have the release layer, so it will not be repeated here.

The present invention also provides a manufacturing method for manufacturing the aforementioned packaging carrier, comprising: a first forming step: processing a substrate into a carrier body, the carrier body including a bottom plate; a second forming step: manufacturing a vacuum A patch, the vacuum patch is made of heat-resistant material, and includes an adhesive layer, an adsorption layer and a release layer in sequence; a combining step: pasting the vacuum patch on the bottom plate through the adhesive layer; a The third forming step: the vacuum patch is processed, so that the adsorption layer forms a plurality of spaced exhaust grooves on the side away from the adhesive layer, and one end of each exhaust groove is formed with the wall The other end forms an open end connected to the wall, and is divided into an adsorption area that can be in contact with the circuit substrate through the exhaust grooves and a plurality of suction areas located in the exhaust grooves. The exhaust area, and then a plurality of incisions corresponding to the positions of the exhaust grooves are generated on the release layer.

In a preferred embodiment, in the body forming step, at least one thickening piece is connected to the edge of at least one side of the bottom plate, and a accommodating groove is formed in the center of the carrier body, and The total thickness of the adhesive layer and the adsorption layer is equal to the depth of the accommodating groove; in different embodiments, the thickening member may be a frame surrounding the edge of the bottom plate, or located on two opposite sides of the bottom plate Edge strips.

As can be seen from the above description, the feature of the present invention is that the vacuum patch made of heat-resistant material has an exhaust groove for exhausting on its adsorption layer, which can be fixed by applying the principle of vacuum adsorption and the principle of air convection during the manufacturing process. IC substrate, and in order to have both the convenience of exhausting and removing the release layer, the shape of the exhaust groove is designed, and one end of the exhaust groove is formed with an edge (a groove when it is installed on the carrier body) that is connected to the vacuum patch. The other end forms an open end connected to the wall, so that the user can tear up the release layer as a protective layer from any place. To remove the mold layer, through the thinning of the carrier and the design of the vacuum patch, it can be easily placed first, and then pressed by the roller during the process without the use of metal upper cover, heat-resistant tape, magnet suction plate, etc. Production is ready.

10: Packaging the carrier

2: Vehicle body

21: Bottom plate

22a: Frame

22b: Edges

23: accommodating groove

231: Bottom

232: Wall

3: Vacuum patch

3a: first side

3b: Second side

3c: extension direction

31: Adhesive layer

31a: Adhesive side

31b: Second interface layer

32: Heat-resistant layer

32a: Connection interface layer

33: Adsorption layer

33a: adsorption surface

33b: The first interface layer

34: release layer

341: Cuts

4: Exhaust groove

4a: closed end

4b: Open end

41: The first section

42: Second Section

5: Adsorption area

6: Exhaust area

7: Substrate

71: Assembly surface

72: Printing side

8: Datum plane

9: Bubbles

S1: First forming step

S2: Second forming step

S3: Combination step

S4: Third forming step

1 is an exploded schematic view of the packaging carrier of the present invention in a preferred embodiment; FIG. 2 is a schematic front view of FIG. 1 ; FIG. 3 is a schematic cross-sectional view of FIG. 1 ; Schematic diagrams of the manufacturing of the carrier; FIGS. 5A to 5D are schematic diagrams of the embodiment of FIG. 1 when in use; FIGS. 6A to 6F are schematic diagrams of the packaging carrier of the present invention in other embodiments.

For the convenience of further understanding and understanding of the structure, use and features of the present invention, a preferred embodiment is given, and the detailed description is as follows: please refer to Fig. 1~Fig. The packaging carrier 10 of the invention is used to fix a substrate 7 to be used as an IC substrate material in the process of processing the circuit substrate, and can repeatedly adsorb and separate the substrate 7, In one embodiment, the packaging carrier 10 includes a carrier body 2 and a vacuum patch 3 ; wherein the substrate 7 may be a flexible thin circuit substrate.

As shown in the figure, in this embodiment, the carrier body 2 is composed of a bottom plate 21 and a frame body 22a, and is in the shape of a sheet, and the center of the surface is formed through the thickness of the frame body 22a to accommodate the vacuum The accommodating groove 23 of the patch 3; the accommodating groove 23 has a bottom 231 on the bottom plate 21 and a wall 232 formed through the frame body 22a, surrounding the edge of the bottom 231, and the accommodating groove 23 The dimensions are the same as vacuum patch 3. Among them, the main purpose of the frame body 22a is to withstand the downward pressure of the Molding mold, as a thickening member to protect the product during manufacture.

Supplementary description, the square appearance of the vacuum patch 3 in the figure is only for convenience of description. In other embodiments, the appearance of the vacuum patch 3 can be set as a circle, a trapezoid, an ellipse, a triangle or other shapes. The shape of the accommodating groove 23 is changed according to the shape of the vacuum patch 3; in addition, the present invention does not specifically limit the carrier body 2 or the shape, and the combination of the bottom plate 21 and the frame body 22a in the foregoing description can be adopted. In other embodiments, other methods can be used, for example, the perimeter of a plate body is folded toward the center of the plate body, or the plate body is deformed by stamping, and then a accommodating recess is formed on the plate body. Manufactured by way of groove 23.

In terms of material, the vacuum patch 3 is made of a high temperature resistant material that can withstand packaging processing, and is disposed in the accommodating groove 23; in terms of structure, in this embodiment, the vacuum patch 3 sequentially includes: an adhesive layer 31 , a heat-resistant layer 32 , an adsorption layer 33 and a release layer 34 .

As shown in the figure, one side of the heat-resistant layer 32 is connected to the adsorption layer 33, and the opposite side is connected to the adhesive layer 31, wherein the adsorption layer 33 forms an adsorption surface 33a on the side away from the heat-resistant layer 32, and the adhesive layer 31 is located on the side of the heat-resistant layer 32. A sticking surface 31a with the same contour as the adsorption surface 33a is formed on the side away from the heat-resistant layer 32; as shown in the figure, when the vacuum sticking surface is located in the accommodating groove 23, the sticking surface 31a is pasted on the bottom surface of the accommodating groove 23 , so that the adsorption The layer 33 and the adhesive layer 31 are located on the upper and lower halves of the accommodating groove 23, respectively, so that the adsorption surface 33a is aligned with a reference plane 8 of the carrier body 2 (same as the surface of the frame body 22a).

The heat-resistant layer 32 is made of a flexible material and can be bent, and has a connecting interface layer 32a on both sides of the heat-resistant layer 32. The heat-resistant layer 32 can be made of glass fiber cloth and epoxy resin.

The adsorption layer 33 has a first interface layer 33b with the same material as the connection interface layer 32a. The first interface layer 33b is connected to the connection interface layer 32a. In this embodiment, the adsorption layer 33 is made of silicone glue, hardener, color glue and adhesive made of the agent.

In order to prevent the adsorption layer 33 from being exposed to contamination in the air after the packaging carrier 10 is produced and not in use, and to allow the adsorption layer 33 to attach contaminants that can affect the adsorption function, the release layer 34 is removed before the product is used. Covering the surface of the adsorption layer 33 away from the heat-resistant layer 32 to isolate external contamination.

The adhesive layer 31 has a second interface layer 31b with the same material as the aforementioned connection interface layer 32a, and an adhesive surface layer connected to the second interface layer 31b for connecting with the carrier body 2. The adhesive surface 31a is formed on the adhesive surface layer. In one embodiment, the materials of the adhesive layer 31 and the adsorption layer 33 may be the same.

In this embodiment, since the adsorption layer 33 is adhered to the heat-resistant layer 32 through the connection interface layer 32a and the first interface layer 33b, and is subjected to high temperature and high pressure treatment to closely adhere to the heat-resistant layer 32, and thus presents a flat and smooth state, Therefore, when the circuit board is adhered to the adsorption surface 33a of the adsorption layer 33, the air between the circuit board and the adsorption surface 33a is expelled, and the circuit board is combined with the adsorption surface 33a through atmospheric pressure.

Among them, in order to prevent air remaining between the circuit substrate and the adsorption layer 33 to affect the fixing ability of the packaging carrier 10 , the adsorption layer 33 has a plurality of spaced exhaust grooves 4 on the side away from the adhesive layer 31 , and each One end of an exhaust groove 4 is formed with a closed end 4a spaced from the edge of the vacuum patch 3 (also the wall 232 of the carrier body 1 in this embodiment), and the other end is formed with a connection to the vacuum patch 3 The open end 4b of the edge (also the wall 232 of the carrier body 1 in this embodiment), the adsorption layer 33 passes through the isometric row The air groove 4 is divided into an adsorption area 5 that can be in contact with the circuit substrate and a plurality of exhaust sections 6 located in the iso-exhaust groove 4 .

Among them, it can be seen from FIGS. 2 and 3 that the width of the exhaust grooves 4 is smaller than the distance between the exhaust grooves 4. The present invention does not limit the width of the exhaust grooves 4. It is the exhaust demand to be adjusted. In addition, as can be seen from the figure, through the shape arrangement of the exhaust grooves 4, the adsorption layer 33 of the vacuum patch 3 only forms a single continuous adsorption area 5, which enables the user to remove the release layer 34. Any part of the sheet 3 is torn up and the entire release layer 34 is removed; even when it is torn from a specific corner, a continuous S-shaped residue can be formed; in addition, in terms of depth, it can be seen from FIG. In this embodiment, it is only located on the adsorption layer 33 and does not contact the heat-resistant layer 32 .

In the detailed state of the exhaust groove 4, in this embodiment, the vacuum patch 3 includes a first side 3a and a second side 3b located on the opposite side of the first side 3a, etc. The exhaust groove 4 includes a plurality of first sections 41 adjacent to the first side 3a and a plurality of second sections 42 adjacent to the second side 3b, and the first sections 41 and the second sections 42 are spaced apart from each other Arranged so that the surface of the vacuum patch 3 forms an S-shaped adsorption area 5, and wherein the exhaust groove 4 includes a plurality of first sections 41 extending toward the extension direction 3c of the exhaust groove 4 and a plurality of A second section 42 is different from the extending direction 3c of the exhaust groove 4 , and the first section 41 and the second section 42 are arranged at intervals from each other, and then a square wave is formed on the surface of the vacuum patch 3 . zigzag pattern.

3 , in this embodiment, the first sections 41 and the second sections 42 of all the exhaust grooves 4 are parallel to each other along the arrangement direction of the exhaust grooves 4 , and the entire exhaust grooves 4 are parallel to each other. The surface of the vacuum veneer has the same spacing distance, and then the entire surface of the vacuum veneer 3 is divided into a plurality of adsorption areas 5 composed of squares and used to connect between the two adsorption areas 5. The width is equal to the adsorption area 5 connection area.

Regarding the manufacturing method of the aforementioned packaging carrier, please refer to FIG. 4A to FIG. 4D : first, in a first forming step S1 : a substrate (not shown) is processed into the bottom plate 21 , and the frame body 22 a is connected to the bottom plate The edge of 21 forms the carrier body 2 with the accommodating groove 23 in the center; then, a second forming step S2: using the aforementioned heat-resistant material to manufacture the vacuum patch 3, the vacuum patch 3 includes the adhesive layer 31, The adsorption layer 33 and the release layer 34, wherein the total thickness of the adhesive layer 31 and the adsorption layer 33 is equal to the depth of the accommodating groove 23; wherein, since the components as finished products are independent of each other, the present invention does not limit the first forming step The sequence between S1 and the second forming step S2; wherein, the present invention does not limit the method of processing the bottom plate 21, and can be performed by conventional cutting or punching methods.

Then, in a combining step S3, the vacuum patch 3 is pasted into the accommodating groove 23 through the adhesive layer 31 (it can be pressed with a roller); finally, in a third forming step S4, the vacuum patch 3 is processed, The aforementioned exhaust groove 4 is formed on the side of the adsorption layer 33 away from the adhesive layer 31 . Since the release layer 34 has not been separated from the adsorption layer 33 , when the exhaust channel is processed, a plurality of exhaust channels will be generated in the release layer 34 . The notch 341 corresponds to the position of the exhaust groove 4; in addition, the present invention does not limit the method of processing the exhaust groove 4, as long as the performance of the vacuum veneer is not affected.

Please refer to FIG. 5A , when the packaging carrier 10 is used in a specific application, first, the release layer 34 is removed, and then a substrate 7 whose area size is smaller than the area of the accommodating groove 23 (or the vacuum veneer 3 ) is disposed At the central position of the vacuum patch 3 from which the release layer 34 has been removed, one side of the substrate 7 has an assembly surface 71 that is smooth and flat, and a side opposite to the assembly surface 71 is formed to be processed. Printing side 72.

As shown in FIG. 5B , when the assembly surface 71 of the substrate 7 is attached to the suction surface 33 a of the vacuum patch 3 , the air can be exhausted by being gradually combined with the vacuum patch 3 from one side to the other side, resulting in Being fixed and sucked by the vacuum patch 3 , the relative movement between the substrate 7 and the carrier body 2 does not occur.

Please refer to FIG. 5C and FIG. 5D . During the process, if air bubbles 9 are generated by accidental air remaining on the adsorption surface 33 a and the assembly surface 71 during the bonding process, the IC substrate 7 can be pressed toward the exhaust groove 4 by pressing the IC substrate 7 . , let the gas in the bubble 9 pass through the part of the two ends (or at least one end) of the exhaust groove 4 that is not covered by the substrate 7 to discharge the gas, so that the substrate 7 is firmly attached to the vacuum patch 3; wherein, in some embodiments In addition, the gas can be squeezed into the exhaust groove 4 for exhausting by means of pressurization by the printing surface 72.

Referring to FIGS. 6A to 6D , the present invention does not limit the pattern of the exhaust groove 4 . As in the foregoing embodiment, a zigzag-like shape can be formed by a plurality of squares, or as shown in FIG. 6B , Set the exhaust groove 4 as a plurality of straight lines, and set the exhaust section on the same side of the vacuum patch 3; or as shown in FIG. 6B, set the exhaust groove 4 as a wave shape, and make two adjacent The difference in spacing at any point on the exhaust grooves 4 is reduced (referring to the state in FIG. 2 ), or the relative positions of different sections of two adjacent exhaust grooves 4 are changed (as shown in FIG. 6C by different exhausts The pattern formed by the grooves 4 differs by half a cycle), or as shown in FIG. 6D , the area of the exhaust grooves 4 is increased through a plurality of branches.

Please refer to FIG. 6E , the shape of the carrier body 2 and the square appearance of the vacuum patch 3 in the figure are only for convenience of description. The body 2 may only have a bottom plate 21, and the area of the vacuum patch 3 is the same as the area of the bottom plate 21; or, as shown in FIG. An accommodating groove 23 (not shown in FIG. 6F ) for arranging the vacuum patch 3 is formed between 22b.

The above-mentioned embodiments are only for the convenience of illustrating the present invention and are not intended to limit it. Without departing from the spirit and scope of the present invention, various simple deformations and modifications made by those skilled in the industry according to the scope of the patent application of the present invention and the description of the invention should still be used. Included in the following claims.

10: Packaging the carrier

2: Vehicle body

3: Vacuum patch

3a: first side

3b: Second side

3c: extension direction

4: Exhaust groove

4a: closed end

4b: open end

41: The first section

42: Second Section

5: Adsorption area

6: Exhaust area

Claims (9)

A package carrier, capable of repeatedly adsorbing and separating a circuit substrate, comprises: a carrier body; a vacuum patch, made of heat-resistant material, disposed on the carrier body, and comprising: an adhesive layer attached to the carrier body A carrier body; an adsorption layer with a plurality of spaced exhaust grooves on the side away from the adhesive layer, and one end of each of the exhaust grooves is formed with a closed end spaced from the edge of the vacuum patch , the other end forms an open end connected to the edge of the vacuum patch, the adsorption layer is divided into an adsorption area that can contact the circuit substrate through the exhaust grooves and a plurality of suction areas located in the exhaust grooves The exhaust area; a release layer, connected to the adsorption layer, has a plurality of incisions corresponding to the positions of the exhaust grooves. The packaging carrier according to claim 1, wherein an accommodating groove is formed on the surface of the carrier body, and the accommodating groove has a bottom and at least one wall, and the wall is disposed on at least one of the bottoms. the edge of the side, the vacuum patch is arranged in the accommodating groove. The packaging carrier of claim 2, wherein the adsorption layer of the vacuum patch is formed with adsorption surfaces that are all aligned with the surface of the carrier body. The packaging carrier of claim 1, wherein the vacuum patch includes a first side and a second side located on an opposite side of the first side, and the exhaust grooves include A plurality of first sections adjacent to the first side and a plurality of second exhaust sections adjacent to the second side and the first sections and the second sections are spaced apart from each other, so that the vacuum The surface of the sheet forms an adsorption area showing an S-shaped arrangement. The packaging carrier of claim 1, wherein the exhaust groove includes a first section extending toward the extending direction of the exhaust groove and a second area different from the extending direction of the exhaust groove part. The packaging carrier of claim 5, wherein the exhaust groove includes a plurality of the first sections and a plurality of the second sections, and the first sections and the second sections are spaced apart from each other Arrangement. The packaging carrier according to claim 1, wherein a heat-resistant layer is disposed between the adhesive layer and the adsorption layer, the heat-resistant layer has two connection interface layers; the adsorption layer has a first connection interface layer connected to the connection interface layer. an interface layer; the adhesive layer has a second interface layer connected with the connection interface layer, the second interface layer and the first interface layer are respectively located on opposite sides of the heat-resistant layer. A manufacturing method of a package carrier, the package carrier can repeatedly adsorb and separate a circuit substrate, comprising: a first forming step: processing a substrate into a carrier body, the carrier body including a bottom plate; a The second forming step: using a heat-resistant material to manufacture a vacuum patch, the vacuum patch sequentially includes an adhesive layer, an adsorption layer and a release layer; a bonding step: pasting the vacuum patch on the adhesive layer through the adhesive layer on the bottom plate; a third forming step: processing the vacuum patch, so that the adsorption layer forms a plurality of spaced exhaust grooves on the side away from the adhesive layer, and one end of each exhaust groove is A closed end spaced from the wall is formed, and an open end connected to the wall is formed at the other end, and is divided into an adsorption area that can be in contact with the circuit substrate through the exhaust grooves and a plurality of areas located in the rows The exhaust area in the air groove, and then a plurality of incisions corresponding to the position of the exhaust groove are generated on the release layer. The method for manufacturing a packaging carrier according to claim 8, wherein, in the first forming step, at least one thickening member is connected to the edge of at least one side of the bottom plate, and is connected to the edge of the carrier body. An accommodating groove is formed in the center, and the total thickness of the adhesive layer and the adsorption layer is equal to the depth of the accommodating groove.

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