TWM579433U - Splice type LED circuit board - Google Patents

Abstract

A spliced light-emitting diode circuit board, wherein the first and second light-emitting diode carrier plates respectively have a plurality of parallel first and second light-emitting diode chips, and the first and second substrates of the two are respectively The first light emitting diode carrier plate further includes at least one first protruding portion light emitting light disposed on the first protruding portions. The second light emitting diode carrier further includes at least one second protruding light emitting diode chip disposed on the second protruding portions; wherein the first and second protruding portions are mutually The at least one column of the first protruding portion LED chips are respectively arranged on the same extension line as the at least one column of the second protruding portion LED chips.

Description

Spliced LED circuit board

The present invention relates to a circuit board structure, and more particularly to a spliced circuit board for a light emitting diode carrier.

At present, LEDs have developed sub-millimeter LEDs and micro-LEDs, which are compared with today's general LED backlight modules, using Mini LEDs or Micros. When the LED is backlit, the dimming can be performed in more detail, and the contrast and color expression can be significantly improved.

On the other hand, the resolution required for LED displays is getting higher and higher, and the high-order LED displays also have a tendency to increase in size as a whole. However, due to the inability to make extra large-sized LED carriers, the current boards and boards are not available. The hot bar soft plate is often used for thermocompression bonding, but the process is complicated, which makes the large LED carrier plate costly.

The main object of the present invention is to provide a light-emitting diode circuit board which can be easily fabricated into a large size and can maintain resolution.

In order to achieve the above and other objects, the present invention provides a spliced light-emitting diode circuit board comprising a first light-emitting diode carrier and a second light-emitting diode carrier. The first LED substrate includes a first substrate and a plurality of first LEDs disposed parallel to the first substrate. The first substrate has a first splicing edge and a plurality of first splicing edges a first protruding portion extending in the splicing direction, and a first concave portion between the two adjacent first protruding portions, the first light emitting diode carrier further comprising at least one column disposed on the first protruding portions a second LED substrate includes a second substrate and a plurality of second LEDs disposed parallel to the second substrate, the second substrate having a second splicing edge And a plurality of second protrusions extending from the second splicing edge opposite to the splicing direction, and a second recess between the two adjacent second protrusions, the second LED carrier further comprising And at least one of the second protruding portions of the second and second protruding portions; wherein the first protruding portions are respectively engaged with the second concave portions, and the second protruding portions are respectively respectively Engaging in the first recesses, the at least one column of the first protruding portion of the LED chip and the at least Column of the second projecting portion extending emitting diode chip arranged in the same line.

With the above design, the light-emitting diode circuit board of the present invention can connect the plurality of light-emitting diode carrier plates without hot-press bonding, and the manufacturing process is simple, and the large-sized light-emitting diode circuit board can be easily fabricated. At the same time, at least one column of the LED chip is disposed at the junction of the protrusion, so that the splicing design of the novel does not cause the resolution of the display to decrease, thereby satisfying the needs of the user.

Please refer to FIG. 1 and FIG. 2 , which are the first embodiment of the novel spliced LED circuit board. The spliced LED circuit board can be applied to, for example, a light-emitting diode display. A backlight module applied to a liquid crystal display. The spliced LED board includes a first LED carrier 10 and a second LED carrier 20 .

The first light emitting diode carrier 10 includes a first substrate 11 and a plurality of first light emitting diode chips 12 disposed in parallel with the first substrate 11. The first substrate 11 has a first splicing edge 13 and a plurality of first protrusions 14 extending from the first splicing edge 13 toward a splicing direction D. A first recess is formed between any two adjacent first protrusions 14 . 15. That is, the first substrate 11 forms a continuous square wave-like uneven structure on the first splicing edge 13. In addition, the first LED carrier 10 further includes a first protrusion LED array 16 disposed on the first protrusions 14 .

Similar to the first LED carrier 10, the second LED carrier 20 includes a second substrate 21 and a plurality of second LED chips 22 disposed in parallel with the second substrate 21. The second substrate 21 has a second splicing edge 23 and a plurality of second protrusions 24 extending from the second splicing edge 23 opposite to the splicing direction D, and any two adjacent second protrusions 24 have a first The two recesses 25, that is, the second substrate 21 also form a continuous square wave-like uneven structure on the second splice side 23, and the concavo-convex structures of the first and second substrates are complementary in shape to each other. The second LED carrier 20 also includes a second protrusion LED array 26 disposed on the second protrusions 24.

The first protrusions 14 are respectively engaged with the second recesses 25, and the second protrusions 24 are also respectively engaged with the first recesses 15 so that the first and second LEDs are loaded. The seamless splicing is formed, or at least close to the seamless splicing, after the splicing, the column of the first protruding light emitting diode chip 16 and the column of the second protruding light emitting diode chip 26 can be the same Arranged on an extension line L. In this embodiment, the extension line L is perpendicular to the splicing direction D, and the extension line L is parallel to each column of the first illuminating diode chip 12, and each column of the first illuminating diode chip 12 is parallel to each column second. Light-emitting diode wafer 22. In addition, any two adjacent columns of the first LED chips 12 have a first gap G1 therebetween, and any two adjacent columns of the second LED chips 22 have a second gap G2 between the columns. A first gap G3 is formed between the first and second protruding portion LED chips 16 and 26 arranged on the extension line L and another column of the first LED array 12 adjacent thereto, and the column is extended in the same direction. A first gap G4 is formed between the first and second protruding portion LED chips 16 and 26 arranged on the line L and another adjacent second LED chip 22 adjacent thereto, and G1, G2, G3 And the G4 are substantially equal to each other, that is, the first and second LED chips and the first and second protrusion LED chips can form an LED array, and the array is in the first The splicing portion of the second illuminating diode carrier plate is not formed with a break point, so that the resolution of the illuminating diode display is not sacrificed.

It should be noted that the first and second substrates have at least one dielectric layer and a circuit structure for electrically connecting to the light-emitting diode wafers, and the first and second substrate surfaces may also be provided with a solder resist layer.

It should be noted that the first and second LED chips and the first and second protruding LED chips may be a horizontal LED, a vertical LED, or a flip chip. Light-emitting diode wafer.

Please refer to FIG. 3 , which is a second embodiment of the novel spliced LED circuit board, which is substantially the same as the first embodiment, except that the first protrusion 14 has Two rows of first protruding light emitting diode chips 16 having a second protruding portion 24 also having two rows of second protruding light emitting diode chips 26, each column of first protruding light emitting diode chips 16 Just one of the second protruding portion LED chips 26 is arranged on the same extension line, and the two columns have a first and second protruding portion LEDs 16 and 26 arranged on the same extension line. The fifth gap G5, and G5 is also substantially equal to G1, G2, G3, and G4, so that the splicing structure of the light-emitting diode circuit board with the resolution without breakpoint can be formed. In other possible implementation manners, the number of columns of the first and second protruding portion LED chips can be adjusted to at least one column according to the visual requirement.

Referring to FIG. 4, in one possible implementation manner, in order to stably splicing the first LED carrier 10 and the second LED carrier 20, the first splicing edge and the first bulging At least one of the at least one of the first metal contacts 17 and the at least one of the second spliced sides and the second protruding portions may have at least one second metal contact 27, the at least one first metal connection The point 17 corresponds to the at least one second metal contact 27, and the spliced LED circuit board further includes at least one solder 30 (for example, tin) soldered to the corresponding first and second metal contacts. 17, 27.

Referring to FIG. 5, in a possible implementation manner, in order to stably splicing the first LED carrier 10 and the second LED carrier 20, the first splicing edge and the first bulging At least one of the at least one portion has at least one first slot 18, at least one surface of the first slot 18 has a first metal contact 17, and at least one of the second splice edge and the second projection has at least one of At least one first plug block 28, at least one surface of the first plug block 28 has a second metal contact 27, and at least one solder 30 can also have corresponding first and second metal contacts 17, 27 Welding solid.

In one of the possible implementation manners, in addition to stably soldering the first and second LED packages, the solder may also form a circuit structure in the first and second LED carriers. Sexual connection.

10‧‧‧First LED Transistor Carrier

11‧‧‧First substrate

12‧‧‧First LED Diode Wafer

13‧‧‧First stitching edge

14‧‧‧First bulge

15‧‧‧First recess

16‧‧‧First protruding light emitting diode chip

17‧‧‧First metal joint

18‧‧‧First slot

20‧‧‧Second light-emitting diode carrier

21‧‧‧second substrate

22‧‧‧Second light-emitting diode chip

23‧‧‧Second stitching edge

24‧‧‧second bulge

25‧‧‧Second recess

26‧‧‧Second bulging LED chip

27‧‧‧Second metal joint

28‧‧‧First plug block

30‧‧‧ solder

D‧‧‧Splicing direction

L‧‧‧ Extension line

G1, G2, G3, G4, G5‧‧ ‧ gap

Figure 1 is a schematic view of a first embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the first embodiment of the present invention.

Figure 3 is a schematic view of a second embodiment of the present invention.

Figure 4 is a schematic longitudinal cross-sectional view showing one embodiment of the present invention.

Fig. 5 is a schematic longitudinal sectional view showing another embodiment of the present invention.

Claims (6)

A spliced LED substrate includes: a first LED substrate, a first substrate and a plurality of first LEDs disposed in parallel with the first substrate, the first substrate Having a first splicing edge and a plurality of first protrusions extending from the first splicing edge toward a splicing direction, and having a first recess between the two adjacent first protrusions, the first illuminating second The pole carrier board further includes at least one first protruding portion LED chip disposed on the first protrusions; and a second LED carrier board including a second substrate and a plurality of columns of parallel a second LED substrate of the second substrate, the second substrate has a second splicing edge and a plurality of second protrusions extending from the second splicing edge opposite to the splicing direction, and two phases a second concave portion is disposed between the second protruding portions, and the second light emitting diode carrier further includes at least one second protruding light emitting diode wafer disposed on the second protruding portions; The first protruding portions respectively engage the second concave portions, and the second protruding portions To the plurality of first engagement recess portion, the at least one first protruding portions respectively emitting diode chip and the at least one second projecting portion emitting diode chips arranged in a line extending the same. The spliced LED substrate of claim 1, wherein each of the first illuminating diode wafers is parallel to each of the second illuminating diode wafers. The spliced light-emitting diode circuit board of claim 1 or 2, wherein the extension line is parallel to each of the first light-emitting diode wafers. The spliced LED circuit board of claim 1, wherein the extension line is perpendicular to the splicing direction. The spliced LED circuit board of claim 1, wherein at least one of the first splicing edge and the first protrusions has at least one first metal contact, the second splicing edge and the At least one of the second protruding portions has at least one second metal contact, the at least one first metal contact respectively corresponding to the at least one second metal contact, and the spliced LED circuit board further comprises At least one solder welds the corresponding first and second metal contacts. The spliced LED circuit board of claim 1, wherein a gap between any two adjacent columns of the first LED chips is equal to a gap between any two adjacent columns of the second LED chips And the first and second protruding portion light emitting diodes of the first and second protruding portion LED arrays arranged on the same extension line and the adjacent ones of the other columns arranged on the same extension line The gap between the body wafer, another adjacent one of the first light emitting diode chips, or another adjacent one of the second light emitting diode chips is equal to between any two adjacent columns of the first light emitting diode wafer Clearance.