KR102559945B1 - Light emitting module, light emitting cabinet and display device - Google Patents

Abstract

A light emitting module according to an embodiment of the present invention includes a substrate; a plurality of light emitting units disposed on the substrate; and a black matrix disposed on the substrate and surrounding each of the plurality of light emitting units, wherein the plurality of light emitting units includes a first group arranged on a first line and a second group arranged on a second line parallel to the first line, wherein the number of the plurality of light emitting units included in the first group is different from the number of the plurality of light emitting units included in the second group.

Description

Light emitting module, light emitting cabinet and display device {LIGHT EMITTING MODULE, LIGHT EMITTING CABINET AND DISPLAY DEVICE}

Embodiments relate to a light emitting module, a light emitting cabinet, and a display device.

A light emitting device is a p-n junction diode that converts electrical energy into light energy, and can be produced with compound semiconductors belonging to groups on the periodic table, and various colors can be realized by adjusting the composition ratio of compound semiconductors.

Light emitting devices (LEDs) are used in various applications such as color LED display devices, LED traffic signals, and white LEDs. A general liquid crystal display device displays an image or video with light passing through a color filter by controlling light and liquid crystal transmittance of a plurality of light emitting units in which light emitting elements are mounted. A typical liquid crystal display device includes a backlight unit including a light source module and optical sheets, and a liquid crystal display panel including a TFT array substrate, a color filter substrate, and a liquid crystal layer. A general light source module includes a plurality of light emitting device packages on which light emitting chips are mounted on a lead frame substrate, a printed circuit board on which the plurality of light emitting device packages are mounted, and a driving substrate including a driving circuit for driving the light source module and the liquid crystal display panel. It further includes.

Recently, display devices with a high resolution of HD or higher and a size of 100 inches or more are required, but liquid crystal displays and organic electric field displays having complex configurations that are mainly used in general have difficulties in implementing high-quality displays of 100 inches or more due to yield and cost.

The embodiment provides a light emitting module, a method for manufacturing a light emitting module, a light emitting cabinet, and a display device capable of improving bonding strength between substrates.

Embodiments provide a light emitting module capable of providing full color, a method for manufacturing a light emitting module, a light emitting cabinet, and a display device.

Embodiments provide a light emitting module capable of realizing uniform color and uniform luminance, a method for manufacturing a light emitting module, a light emitting cabinet, and a display device.

Embodiments provide a light emitting module, a method for manufacturing a light emitting module, a light emitting cabinet, and a display device capable of simplifying a configuration in a COB (Chip On Board) type and realizing slimness and high brightness.

Embodiments provide a low-power driving light emitting module, a method for manufacturing a light emitting module, a light emitting cabinet, and a display device.

The embodiment provides a light emitting module, a light emitting module manufacturing method, a light emitting cabinet, and a display device capable of improving productivity and yield.

The embodiment provides a display device with excellent linearity of images and videos.

The embodiment provides a display device capable of realizing a high-resolution, large-sized display device.

The embodiment provides a display device excellent in color purity and color reproduction.

A light emitting module according to an embodiment of the present invention includes a substrate including a first side surface and a second side surface opposite to the first side surface; a plurality of light emitting units disposed on the substrate; and a black matrix disposed on the substrate and surrounding each of the plurality of light emitting units, wherein the plurality of light emitting units includes a first group arranged on a first line connecting the first side surface and the second side surface of the substrate, and a second group arranged on a second line adjacent to and parallel to the first line and connecting the first side surface and the second side surface of the substrate. It differs from the number of included plural light emitting units.

In addition, the first side is a left side of the substrate, the second side is a right side of the substrate, the first line includes a first row of the upper surface of the substrate, and the second line includes a second row of the upper surface of the substrate.

In addition, the first side is an upper side of the substrate, the second side is a lower side of the substrate, the first line includes a first column of the upper surface of the substrate, and the second line includes a second column of the upper surface of the substrate.

Further, in the substrate, a distance between the first side and the second side corresponding to the first line is different from a distance between the first and second side corresponding to the second line.

In addition, the first side surface of the substrate is positioned on the same plane as each other, and the second side surface of the substrate includes a first portion positioned on the first plane and a second plane positioned on a second plane different from the first plane.

In addition, the number of light emitting units included in the first group is greater than the number of light emitting units included in the second group, and a portion of the second side surface positioned on the first line forms a protrusion protruding outward from the portion positioned on the second line of the second side surface, and a portion positioned on the second line of the second side surface forms an insertion groove recessed inward with respect to the portion positioned on the first line.

In addition, each of the plurality of light emitting units includes a first light emitting element mounted on the substrate emitting red wavelength, a second light emitting element mounted on the substrate emitting green wavelength, a third light emitting element mounted on the substrate emitting blue wavelength, and a molding part covering the first to third light emitting elements.

In addition, the molding part directly contacts the top surface of the substrate and the side surface of the black matrix.

In addition, the black matrix includes an opening corresponding to each of the plurality of light emitting units and directly contacts a side surface of each of the plurality of light emitting units.

Meanwhile, a light emitting cabinet according to an embodiment includes a first substrate including a first side surface and a second side surface opposite to the first side surface, a plurality of first light emitting units directly mounted on the first substrate, and a first light emitting module including a first black matrix surrounding each of the plurality of first light emitting units; A second light emitting module including a second substrate including a third side surface and a fourth side surface opposite to the third side surface, a plurality of second light emitting units directly mounted on the second substrate, and a second black matrix surrounding each of the plurality of second light emitting units; A support frame supporting the first light emitting module and the second light emitting module, wherein the plurality of first light emitting units includes a first group arranged on a first line connecting the first side surface and the second side surface of the first substrate, and a second group arranged on a second line adjacent to and parallel to the first line and connecting the first side surface and the second side surface of the first substrate. The number of one light emitting unit is different from the number of the plurality of first light emitting units included in the second group.

In addition, the first side is a left side of the first substrate, the second side is a right side of the first substrate, the first line includes a first row of the upper surface of the first substrate, and the second line includes a second row of the upper surface of the first substrate.

In addition, the first side surface is an upper surface of the first substrate, the second side surface is a lower surface of the first substrate, the first line includes a first column on the upper surface of the first substrate, and the second line includes a second column on the upper surface of the first substrate.

Further, in the first substrate, a distance between the first side and the second side corresponding to the first line is different from a distance between the first and second side corresponding to the second line.

The plurality of second light-emitting units may include a third group extending from the first line and arranged on a third line connecting a third side surface and the fourth side surface of the second substrate, and a fourth group extending from the second line and arranged on a fourth line connecting the third side surface and the fourth side surface of the second substrate, wherein the number of second light-emitting units included in the third group is equal to two It is different from the number of light emitting parts.

In addition, the first side of the first line and the second line of the first substrate are located on the same plane, and the second side of the first and second lines of the first substrate contacting the third side of the second substrate are located on different planes, and the third side of the third line and the fourth line of the second substrate are located on different planes and face the third side of the second substrate. and the fourth side surface of the second substrate of the third line and the fourth line is located on the same plane.

The number of first light emitting units included in the first group is different from the number of second light emitting units included in the third group, and the number of first light emitting units included in the second group is different from the number of second light emitting units included in the fourth group.

In addition, the total number of the first light emitting units included in the first group and the second light emitting units included in the third group is equal to the total number of the first light emitting units included in the second group and the total number of second light emitting units included in the fourth group.

In addition, the second side of the first substrate includes a first protrusion corresponding to the first line, a first insertion groove corresponding to the second line, and the third side of the second substrate, the second side of the second substrate, and the second protrusion corresponding to the third line, and the second protrusion corresponding to the fourth line, and the first protrusion is inserted into the second insertion groove. The second turn is inserted into the first insertion groove.

In addition, each of the plurality of first light-emitting units and the plurality of second light-emitting units includes a first light-emitting element mounted on the first substrate or the second substrate and emitting a red wavelength, a second light-emitting element mounted on the first substrate or the second substrate and emitting a green wavelength, a third light-emitting element mounted on the first substrate or the second substrate and emitting a blue wavelength, and a molding part covering the first to third light-emitting elements. .

In addition, the support frame includes a flat surface directly contacting the first light emitting module and the second light emitting module, and a plurality of openings and outer surfaces penetrating from the one surface to the other surface.

Also, on the outer surfaces, a plurality of protrusions and a plurality of grooves are formed.

According to the embodiment, bonding strength between substrates may be improved by cutting the substrate of the light emitting module in a zigzag shape.

The embodiment may implement a uniform color and uniform luminance by providing a full-color light emitting module.

The embodiment is a COB (Chip On Board) type, which can simplify the configuration of the light emitting module, and can realize slimming and high brightness.

In the embodiment, low-power driving may be implemented by simplifying the configuration of the light emitting module.

The embodiment can improve productivity and yield by simplifying the structure of the thin light module.

The display device according to the embodiment has excellent linearity of images and videos, so that high resolution can be realized on a large display device of 100 inches or more.

The display device according to the embodiment can implement a display device with excellent color purity and color reproduction by realizing images and images of the full color light emitting unit.

1 is a perspective view showing a light emitting module according to a first embodiment.
FIG. 2 is a view showing a combination example of the light emitting module shown in FIG. 1 .
3 and 4 are modified examples of the light emitting module shown in FIG. 1 .
5 is a cross-sectional view of a light emitting unit according to the first embodiment.
FIG. 6 is a cross-sectional view of the light emitting module taken along line -I' in FIG. 1 .
7 is a plan view illustrating a light emitting unit and a black matrix of the light emitting module according to the first embodiment.
8 to 12 are diagrams illustrating a method of manufacturing a light emitting module according to a first embodiment.
13 to 17 are diagrams illustrating a method of manufacturing a light emitting module according to a second embodiment.
18 to 21 are diagrams illustrating a method of manufacturing a light emitting module according to a third embodiment.
22 to 24 are diagrams illustrating a method of manufacturing a light emitting module according to a fourth embodiment.
25 to 28 are diagrams illustrating a method of manufacturing a light emitting module according to a fifth embodiment.
29 is a plan view illustrating a light emitting unit and a black matrix of a light emitting module according to a second embodiment.
30 is a plan view illustrating a light emitting unit and a black matrix of a light emitting module according to a third embodiment.
31 is a plan view illustrating a light emitting unit and a black matrix of a light emitting module according to a fourth embodiment.
32 is a perspective view showing a light emitting cabinet according to an embodiment.
33 is a perspective view showing a lower portion of a light emitting cabinet according to an embodiment.
34 is a plan view illustrating lower portions of first and second light emitting cabinets according to an embodiment.
35 is a view showing a lower corner of a light emitting cabinet according to an embodiment.
36 is a view showing a state in which first and second light emitting cabinets are coupled according to an embodiment.
37 is a perspective view illustrating fastening structures of first and second light emitting cabinets according to an embodiment.
38 is a perspective view illustrating a coupling portion of first and second light emitting cabinets according to another embodiment.
39 is a perspective view illustrating a display device according to an embodiment.

In the description of the embodiment, in the case where each layer (film), region, pattern or structure is described as being formed “on/over” or “under” the substrate, each layer (film), region, pad or pattern, “on/over” and “under” include both “directly” or “indirectly” formation through another layer. In addition, the criteria for the top/top or bottom of each layer will be described based on the drawings.

FIG. 1 is a perspective view showing a light emitting module according to a first embodiment, FIG. 2 is a view showing a combination example of the light emitting module shown in FIG. 1, FIGS. 3 and 4 are modified examples of the light emitting module shown in FIG. 1, FIG. 5 is a cross-sectional view showing a light emitting unit according to the first embodiment, FIG. .

As shown in FIGS. 1 to 7 , the light emitting module 10 of the first embodiment may include a plurality of light emitting units 100 , a black matrix BM and a substrate 120 .

The light emitting module 10 of the first embodiment can implement a simplified structure, slimming, and high brightness for realizing full-color images or images. To this end, in the light emitting module 10 of the first embodiment, the light emitting unit 100 may be directly mounted on the substrate 120 in a COB (Chip on Board) type. Although not shown in the drawings, a driving circuit (not shown) for driving the light emitting unit 100 may be mounted on a lower surface of the substrate 120 .

The substrate 120 includes an insulating part 121 , a first electrode pattern 127 , a second electrode pattern 129 and a protective layer 123 .

The insulating unit 121 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnated substrate, and may include an epoxy-based insulating resin when a polymer resin is included, or a polyimide-based resin.

The protective layer 123 is disposed on the insulating part 121 and has an opening exposing an upper surface of the insulating part 121 to be exposed. Preferably, the protective layer 123 is disposed on the upper surface of the insulating part 121 while exposing the first electrode pattern 127 and the second electrode pattern 129 .

The first electrode pattern 127 and the second electrode pattern 129 are disposed on the insulating part 121 at regular intervals.

The first electrode pattern 127 and the second electrode pattern 129 may be formed of at least one of titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P) or a selective alloy thereof, and may be formed as a single layer or multiple layers. A solder paste 130 to be described later is disposed on the first electrode pattern 127 and the second electrode pattern 129, and the first and second light emitting device electrodes 57 and 58 of the light emitting unit 100 are connected to the first electrode pattern 127 and the second electrode pattern 129, respectively, by the disposed solder paste 130.

The light emitting part 100 may include first to third light emitting devices 151 , 152 , and 153 and a molding part 170 .

The first to third light emitting devices 151, 152, and 153 may be arranged at regular intervals from each other. The first to third light emitting devices 151, 152, and 153 may be arranged side by side in one direction, but are not limited thereto. The first to third light emitting devices 151 , 152 , and 153 may be directly mounted on the substrate 120 . For example, the first to third light emitting devices 151 , 152 , and 153 may be directly mounted on the substrate 120 in a COB (Chip on Board) type. The light emitting module 10 of the first embodiment is a COB type, and the first to third light emitting devices 151, 152, and 153 are directly mounted on the substrate 120, so that the configuration can be simplified, and slimming and high brightness can be implemented. The first to third light emitting devices 151 , 152 , and 153 may be mounted on the substrate 120 by Surface Mounter Technology (SMT). The SMT is a method of mounting the first to third light emitting devices 151 , 152 , and 153 on the substrate 120 using the solder paste 130 , and the solder paste 130 may be a metal paste. For example, the solder paste 130 may include an alloy such as AuSn or NiSn, but is not limited thereto.

The first to third light emitting devices 151, 152, and 153 may emit light of different colors. For example, the first light emitting device 151 may emit light of a red wavelength, the second light emitting device 152 may emit light of a green wavelength, and the third light emitting device 153 may emit light of a blue wavelength. As another example, the first to third light emitting devices 151, 152, and 153 may include a UV light emitting layer and a fluorescent layer.

The first to third light emitting devices 151 , 152 , and 153 may include a sapphire substrate 51 , a light emitting layer 53 , and first and second light emitting device electrodes 57 and 58 . The first to third light emitting devices 151 , 152 , and 153 may have a flip chip structure in which the first and second light emitting device electrodes 57 and 58 are disposed below and directly mounted on the substrate 120 . In the light emitting module 10 of the first embodiment, the light emitted from the first to third light emitting devices 151, 152, and 153 may be mixed to implement full color. The heights of the first to third light emitting devices 151, 152, and 153 may be the same. The first to third light emitting devices 151, 152 and 153 have the same height, and the sapphire substrate 51 of the first to third light emitting devices 151, 152 and 153 may have a thickness of 100 μm or more. According to the first embodiment, light mixing may be improved and volume emission may be realized by using the sapphire substrate 51 having a thickness of 100 μm or more and the first to third light emitting devices 151, 152, and 153 having the same height.

The first to third light emitting devices 151, 152, and 153 may be disposed at intervals of 50 μm or more. Since the first to third light emitting devices 151, 152, and 153 are disposed at intervals of 50 μm or more, damage caused by friction of the first to third light emitting devices 151, 152, and 153 in a mounting process can be improved. Since the first to third light emitting devices 151, 152, and 153 are spaced apart from each other by 50 μm or more, light loss caused by interference between light from the first to third light emitting devices 151, 152, and 153 can be reduced.

The molding part 170 may be disposed on the substrate 120 . The molding part 170 may be disposed on top and side surfaces of the first to third light emitting devices 151 , 152 , and 153 . The molding part 170 may directly contact the substrate 120 and the first to third light emitting devices 151 , 152 , and 153 . The molding part 170 may have a top view square structure, but is not limited thereto. A top view shape of the molding part 170 may correspond to a pixel structure of a display device. For example, the top view of the molding part 170 may be variously changed such as a rectangle, a polygon, an ellipse, and a circle.

The molding part 170 may include a black filler 171 .

When the light emitting module 10 is not light emitting, the black pillar 171 implements the entire light emitting surface in black color, thereby improving the appearance quality. For example, when the light emitting module 10 is included in a display device, it is possible to improve the appearance quality by implementing a black display surface when driving of the display device is stopped.

The molding part 170 may have a thickness capable of protecting the first to third light emitting devices 151, 152, and 153 and reducing light loss from the first to third light emitting devices 151, 152, and 153. For example, the height between the upper surface of the molding part 170 and the upper surface of the first to third light emitting devices 151, 152 and 153 may be lower than the height of the sapphire substrate 51 of each of the first to third light emitting devices 151, 152 and 153. For example, the height of the sapphire substrate 51 may be 100 μm, and the height between the upper surface of the molding part 170 and the upper surface of the first to third light emitting devices 151, 152, and 153 may be 100 μm or less. A height between the top surface of the molding part 170 and the top surfaces of the first to third light emitting devices 151 , 152 , and 153 may be 50 μm or less. In the first embodiment, the height between the upper surface of the molding part 170 and the upper surface of the first to third light emitting devices 151, 152, and 153 is lower than the height of the sapphire substrate 51, so that mixing and straightness of light can be improved. Here, the height of the sapphire substrate 51 of 100 μm may be a height for volume emission from each of the first to third light emitting devices 151, 152, and 153, but is not limited thereto. For example, the height of the sapphire substrate 51 may be 100 μm or less.

The molding part 170 may have a constant gap between the first to third light emitting devices 151, 152, and 153 and adjacent side surfaces. The distance may be between the first to third light emitting devices 151 , 152 , and 153 and the closest side surface of the molding part 170 . The interval may be 25 μm or more. The spacing may prevent damage to the first to third light emitting devices 151 , 152 , and 153 during a sawing process of separating the unit light emitting parts 100 after forming the molding part 170 .

The black matrix BM may include a function of preventing light leakage and improving appearance quality. The black matrix BM may be an opaque organic material. For example, the black matrix BM may be black resin. The black matrix BM may include openings corresponding to the first to third light emitting devices 151 , 152 , and 153 . One opening corresponds to one pixel of the display device and can accommodate one light emitting unit 100 . A thickness of a cross section of the black matrix BM may be the same as a thickness of a cross section of the light emitting part 100 . The black matrix BM may have a matrix structure covering all outer surfaces of the plurality of light emitting units 100 . The black matrix BM blocks light interference between adjacent light emitting units 100 and provides a black screen when driving of the display device is stopped, thereby improving external quality.

The first embodiment can provide a light emitting module 10 having a simplified structure in which the first to third light emitting devices 151, 152, and 153, which can be individually driven, and the molding unit 170 are directly mounted on a substrate 120, and a black matrix (BM) of a matrix type surrounding the side surface of each light emitting unit 100 is disposed on the substrate 120. That is, the first embodiment provides the light emitting module 10 capable of realizing full color images and images, but it is possible to realize slimness and high brightness by simplifying the configuration of the light emitting module 10 .

The first embodiment can reduce power consumption by simplifying the electrical connection structure by the COB type light emitting module 10 structure.

Meanwhile, a plurality of light emitting units 100 including the first to third light emitting devices 151 , 152 , and 153 may be disposed on the substrate 120 at regular intervals.

In this case, the plurality of light emitting units 100 may be arranged on the substrate 120 in a matrix structure. For example, the plurality of light emitting units 100 may be arranged in a first direction (horizontal direction, row direction) on the substrate 120, and may be arranged in a second direction (vertical direction, column direction) on the substrate 120. Can be arranged.

At this time, the first direction and the second direction include directions orthogonal to each other.

For example, the plurality of light emitting units 100 include a first array 1a arranged in a first row on the uppermost side of the upper surface of the substrate 120, a second array 1b arranged in a second row under the first array 1a, a third array 1c arranged in a third row under the second array 1b, and a fourth array arranged in a fourth row under the third array 1c. 4 arrays 1d, a 5th array 1e arranged in a 5th row below the 4th array 1d, a 6th array 1f arranged in a 6th row below the 5th array 1e, and a 7th array 1g arranged in a 7th row below the 6th array 1f.

In this case, the number of light emitting units 100 arranged in the adjacent rows may be different from each other. In other words, the number of light emitting units 100 included in the first array 1a arranged in the first row may be different from the number of light emitting units 100 included in the second array 1b arranged in the second row. For example, the number of light emitting units 100 included in the first array 1a arranged in the first row may be less than the number of light emitting units 100 included in the second array 1b arranged in the second row.

In addition, as shown in FIG. 1 , the number of light emitting units 100 included in each array arranged in odd rows may be the same, and the number of light emitting units 100 included in each array arranged in even rows may be the same.

Also, the number of light emitting units 100 included in each array arranged in odd rows may be different from the number of light emitting units 100 included in each array arranged in even rows.

Accordingly, the horizontal width of the region on which the first array 1a is mounted on the upper surface of the substrate 120 may be smaller than the horizontal width of the region on which the second array 1b is mounted. For example, the first array 1a may include four light emitting parts 100 and the second array 1b may include six light emitting parts 100 . Accordingly, the area on which the first array 1a is mounted on the upper surface of the substrate 120 may have a width as narrow as the area where the two light emitting units 100 are to be mounted, compared to the horizontal width of the area on which the second array 1b is mounted.

Accordingly, the right side of the substrate 120 is not placed on the same vertical plane, and the right side of the region corresponding to the even rows may protrude more than the right side of the region corresponding to the odd row.

Alternatively, the right side of the region corresponding to the odd-numbered rows may be recessed to a certain depth in an inward direction based on the right side of the region corresponding to the even-numbered rows. Accordingly, the recessed portion forms an insertion groove into which a protruding surface of another light emitting module can be inserted.

The light emitting module shown in FIG. 1 may be manufactured by laser cutting a light emitting module manufactured in a rectangular or square top view shape in a zigzag shape rather than a vertical line as described above.

Referring to FIG. 2 , the first light emitting module 10a and the second light emitting module 10b having the above structure are coupled to each other based on the above protruding and recessed surfaces.

That is, the right side of the first row of the first light emitting module 10a forms a recessed surface, and the left side of the first row of the second light emitting module 10b forms a protruding surface. Accordingly, the right side of the first row of the first light emitting module 10a forms an insertion groove into which the left side of the first row of the second light emitting module 10b is inserted. Accordingly, the left region of the first row of the second light emitting module 10b is inserted into the insertion groove formed on the right side of the first row of the first light emitting module 10a.

Further, the right side of the second row of the first light emitting module 10a forms a protruding surface, and the left side of the second row of the second light emitting module 10b forms a recessed surface. Accordingly, the left side of the second row of the second light emitting module 10b forms an insertion groove into which the right side of the second row of the first light emitting module 10a is inserted. Accordingly, the right area of the second row of the first light emitting module 10a is inserted into the insertion groove formed on the left side of the second row of the second light emitting module 10b.

Further, the right side of the third row of the first light emitting module 10a forms a depressed surface, and the left side of the third row of the second light emitting module 10b forms a protruding surface. Accordingly, the right side of the third row of the first light emitting module 10a forms an insertion groove into which the left side of the third row of the second light emitting module 10b is inserted. Accordingly, the left region of the third row of the second light emitting module 10b is inserted into the insertion groove formed on the right side of the third row of the first light emitting module 10a.

In addition, the right side of the fourth row of the first light emitting module 10a forms a protruding surface, and the left side of the fourth row of the second light emitting module 10b forms a recessed surface. Accordingly, the left side of the fourth row of the second light emitting module 10b forms an insertion groove into which the right side of the fourth row of the first light emitting module 10a is inserted. Accordingly, the right area of the fourth row of the first light emitting module 10a is inserted into the insertion groove formed on the left side of the fourth row of the second light emitting module 10b.

Further, the right side of the fifth row of the first light emitting module 10a forms a recessed surface, and the left side of the fifth row of the second light emitting module 10b forms a protruding surface. Accordingly, the right side of the fifth row of the first light emitting module 10a forms an insertion groove into which the left side of the fifth row of the second light emitting module 10b is inserted. Accordingly, the left region of the fifth row of the second light emitting module 10b is inserted into the insertion groove formed on the right side of the fifth row of the first light emitting module 10a.

In addition, the right side of the sixth row of the first light emitting module 10a forms a protruding surface, and the left side of the sixth row of the second light emitting module 10b forms a recessed surface. Accordingly, the left side of the sixth row of the second light emitting module 10b forms an insertion groove into which the right side of the sixth row of the first light emitting module 10a is inserted. Accordingly, the right area of the sixth row of the first light emitting module 10a is inserted into the insertion groove formed on the left side of the sixth row of the second light emitting module 10b.

In addition, the right side of the seventh row of the first light emitting module 10a forms a recessed surface, and the left side of the seventh row of the second light emitting module 10b forms a protruding surface. Accordingly, the right side of the seventh row of the first light emitting module 10a forms an insertion groove into which the left side of the seventh row of the second light emitting module 10b is inserted. Accordingly, the left region of the seventh row of the second light emitting module 10b is inserted into the insertion groove formed on the right side of the seventh row of the first light emitting module 10a.

As described above, the first light emitting module 10a and the second light emitting module 10b according to the present invention are not coupled while their side surfaces located on a straight line contact each other as in the prior art, but protruding parts included in the side surfaces of each light emitting module are combined while being inserted into recessed parts included in the side surfaces of other light emitting modules.

Therefore, in the embodiment according to the present invention, the bonding strength between the first light emitting module 10a and the second light emitting module 10b can be improved by mutually coupling a plurality of light emitting modules having the zigzag side structure.

Meanwhile, a top view of a light emitting module finally manufactured according to the combination of the first light emitting module 10a and the second light emitting module 10b may have a rectangular or square shape.

Accordingly, the number of light emitting units arranged in the first row of the first light emitting module 10a may be different from the number of light emitting units arranged in the second row.

Also, the number of light emitting units arranged in the first row of the second light emitting module 10b may be different from the number of light emitting units arranged in the second row.

However, it is preferable that the total number of light emitting units arranged in the first row of the first light emitting module 10a and the first row of the second light emitting module 10b be the same as the total number of light emitting units arranged in the second row of the first light emitting module 10a and the second row of the second light emitting module 10b.

Meanwhile, as described above, the light emitting module may be configured so that the even-numbered rows do not include two more light-emitting units than the odd-numbered rows, but three more light-emitting units.

As described above, by increasing the difference in the number of light-emitting units between even-numbered rows and odd-numbered rows, bonding strength between a plurality of light-emitting modules may be further improved.

On the other hand, as shown in FIG. 3, although it is said that the difference in the number of light emitting units varies for each row of the light emitting module 10c, this is only an example and the difference in the number of light emitting units may vary based on a plurality of rows.

For example, the number of light emitting units included in the arrays of the second row and the third row may be the same, and the number of light emitting units included in the arrays of the fourth row and the fifth row may be the same. However, the number of light emitting units included in the arrays of the second and third rows may be different from the number of light emitting units included in the arrays of the fourth and fifth rows, respectively.

Also, referring to FIG. 4 , the protruding surface and the recessed surface may be formed not on the right or left surface of the substrate 120 constituting the light emitting module, but on the upper or lower surface.

In other words, when a plurality of light emitting modules are coupled in the left and right directions as shown in FIG. 2 , the protruding and recessed surfaces may be formed on the left and right sides of the light emitting module, respectively.

However, when the plurality of light emitting modules are coupled in a vertical direction instead of a horizontal direction, the protruding surface and the recessed surface may be respectively formed on the upper and lower surfaces of the light emitting module.

Therefore, as shown in FIG. 4 , the light emitting units 100 may be arranged in a column direction on the substrate 120,

At this time, the number of light emitting units arranged in the first column is different from the number of light emitting units arranged in the second column. That is, the number of light emitting units arranged in the first column may be greater than the number of light emitting units arranged in the second column. Accordingly, the lower surface of the first row forms a protruding surface, and the lower surface of the second row forms a recessed surface.

Meanwhile, referring to FIG. 1 again, in one light emitting module, the upper surface of the substrate 120 provides a mounting area in which each light emitting unit is mounted. In this case, the mounting area of each light emitting unit 100 may have a horizontal width of 0.8 mm and a vertical width of 0.8 mm.

Also, each light emitting unit 100 may have a horizontal width of 0.5 mm and a vertical width of 0.5 mm.

In addition, the separation distance between each light emitting unit 100 may have 0.2 mm.

Therefore, in the structure of the light emitting module as described above, a protrusion is formed on one side of a row in which a larger number of light emitting units are arranged than other rows, and a groove is formed in one side of a row in which a smaller number of light emitting units is arranged than in other rows.

In this case, the protrusion may have a width corresponding to the mounting area of the light emitting unit 100 . That is, if the number of light emitting units arranged in the area where the protrusion is formed is two more than the number of light emitting units arranged in other areas, the width of the protrusion may have a width of 1.6 mm.

In addition, the groove may have a width corresponding to the mounting area of the light emitting unit 100, and if the number of light emitting units arranged in the area where the groove is formed is less than the number of light emitting units arranged in other areas by one, the groove may have a width of 0.8 mm.

8 to 12 are diagrams illustrating a method of manufacturing a light emitting module according to a first embodiment.

Referring to FIG. 8 , in the light emitting module manufacturing method of the first embodiment, a plurality of first to third light emitting devices 151 , 152 , and 153 may be disposed on a first carrier film 101 .

The plurality of first to third light emitting devices 151, 152, and 153 may be arranged at regular intervals from each other. The first to third light emitting devices 151, 152, and 153 may emit light of different colors. For example, the first light emitting device 151 may emit light of a red wavelength, the second light emitting device 152 may emit light of a green wavelength, and the third light emitting device 153 may emit light of a blue wavelength. As another example, the first to third light emitting devices 151, 152, and 153 may include a UV light emitting layer and a fluorescent layer. The first to third light emitting devices 151 , 152 , and 153 may be flip chips in which electrodes are disposed on a lower surface in contact with the first carrier film 101 , but are not limited thereto. The heights of the first to third light emitting devices 151, 152, and 153 may be the same. The first to third light emitting devices 151, 152, and 153 may be disposed at intervals of 50 μm or more.

The first carrier film 101 may include an adhesive layer on one surface. The first carrier film 101 may be silicon-based, but is not limited thereto.

Referring to FIG. 9 , a molding layer 170a may be formed on the first carrier film 101 and the plurality of first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a light-transmissive resin material such as epoxy or silicon. The molding layer 170a may directly contact the first carrier film 101 and the first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a black filler. The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color when the light emitting module is not light emitting.

Referring to FIG. 10 , unit light emitting units 100 may be formed by a cutting process. In the cutting process, the molding part 170 may be formed by etching or physically removing the molding layer. Thereafter, an aligning step of aligning the light emitting part 100 with the second carrier film 103 may be included. The aligning step may be a step for implementing the separated light emitting units 100 in block units on the first carrier film through a cutting process.

Referring to FIG. 11 , the light emitting device block 100-1 may be manufactured by forming a black matrix (BM) on the second carrier film 103. The black matrix BM may be formed to surround outer surfaces of the first to third light emitting units 151 , 152 , and 153 . The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto. The light emitting device block 100-1 including the first to third light emitting units 151, 152, and 153 can improve yield by improving fairness in a subsequent light emitting module manufacturing process, and since the plurality of light emitting units 100 are aligned, alignment defects can be improved.

Referring to FIG. 12 , in the light emitting module of the first embodiment, the light emitting device block 100-1 may be directly mounted on the substrate 100 in a COB type. The light emitting device block 100 - 1 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

In the light emitting module manufacturing method of the first embodiment of FIGS. 8 to 12, the light emitting device block 100-1 is manufactured using the first and second carrier films 101 and 103, and the light emitting device block 100-1 is directly mounted on the substrate 120 in a COB type to improve processability and yield, and improve alignment defects of the light emitting unit 100.

In addition, when the light emitting module is manufactured as shown in FIGS. 8 to 12 , a process of cutting the substrate of the manufactured light emitting module with a laser may be additionally performed. That is, as shown in FIGS. 1 to 4, a process of cutting the substrate with a laser is additionally performed so that the number of light emitting parts arranged in each row is different from each other, so that the number of light emitting parts arranged in the first row and the number of light emitting parts arranged in the second row are different from each other.

Alternatively, a light emitting module having a different number of light emitting units arranged in the first column and a different number of light emitting units arranged in the second column may be manufactured by performing the laser cutting process.

The light emitting module of the first embodiment is a COB type and can simplify configuration, realize slimness and high luminance, and also reduce power consumption by simplifying electrical connection configuration.

13 to 17 are diagrams illustrating a method of manufacturing a light emitting module according to a second embodiment.

Referring to FIGS. 13 and 14 , the method for manufacturing a light emitting module according to the second embodiment may employ technical features of the method for manufacturing a light emitting module according to the first embodiment shown in FIGS. 8 and 9 .

Referring to FIG. 15 , unit light emitting units 100 may be formed on the first carrier film 101 by a cutting process. In the cutting process, the molding part 170 may be formed by etching or physically removing the molding layer.

Referring to FIG. 16 , the unit light emitting unit 100 may be directly mounted on the substrate 120 in a COB type. The light emitting part 100 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

Referring to FIG. 17 , the light emitting device block 100 may be manufactured by forming a black matrix BM on the substrate 120 . The black matrix BM may be formed to surround outer surfaces of the first to third light emitting units 151 , 152 , and 153 . The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto.

In the manufacturing method of the light emitting module of the second embodiment of FIGS. 13 to 17, after manufacturing the unit light emitting part 100 on the first carrier film 101, the unit light emitting part 100 is directly mounted on the substrate 120 in a COB type, and a black matrix (BM) can be formed.

The light emitting module of the second embodiment is a COB type and can simplify configuration, realize slimness and high brightness, and also reduce power consumption by simplifying electrical connection configuration.

In addition, when the light emitting module is manufactured as shown in FIGS. 13 to 17 , a process of cutting the substrate of the manufactured light emitting module with a laser may be additionally performed. That is, as shown in FIGS. 1 to 4, a process of cutting the substrate with a laser is additionally performed so that the number of light emitting parts arranged in each row is different from each other, so that the number of light emitting parts arranged in the first row and the number of light emitting parts arranged in the second row are different from each other.

Alternatively, a light emitting module having a different number of light emitting units arranged in the first column and a different number of light emitting units arranged in the second column may be manufactured by performing the laser cutting process.

18 to 21 are diagrams illustrating a method of manufacturing a light emitting module according to a third embodiment.

Referring to FIG. 18 , the plurality of first to third light emitting devices 151 , 152 , and 153 may be directly mounted on the substrate 120 in a COB type. The first to third light emitting devices 151 , 152 , and 153 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

Referring to FIG. 19 , a molding layer 170a may be formed on the substrate 120 and the plurality of first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a light-transmissive resin material such as epoxy or silicon. The molding layer 170a may directly contact the substrate 120 and the first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a black filler. The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color when the light emitting module is not light emitting.

Referring to FIG. 20 , unit light emitting units 100 may be formed on the substrate 120 by a cutting process. In the cutting process, the molding part 170 may be formed by etching or physically removing the molding layer.

Referring to FIG. 21 , a black matrix BM may be formed on the substrate 120 . The black matrix BM may be formed to surround an outer surface of the light emitting part 100 . The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto.

In the light emitting module manufacturing method of the third embodiment of FIGS. 18 to 21, the manufacturing process can be simplified by directly mounting the first to third light emitting devices 151, 152, and 153 in a COB type on a substrate 120 and forming a molding unit 170 and a black matrix BM.

The light emitting module of the third embodiment is a COB type and can simplify configuration, realize slimness and high brightness, and also reduce power consumption by simplifying electrical connection configuration.

In addition, when the light emitting module is manufactured as shown in FIGS. 18 to 21 , a process of cutting the substrate of the manufactured light emitting module with a laser may be additionally performed. That is, as shown in FIGS. 1 to 4, a process of cutting the substrate with a laser is additionally performed so that the number of light emitting parts arranged in each row is different from each other, so that the number of light emitting parts arranged in the first row and the number of light emitting parts arranged in the second row are different from each other.

Alternatively, a light emitting module having a different number of light emitting units arranged in the first column and a different number of light emitting units arranged in the second column may be manufactured by performing the laser cutting process.

22 to 24 are diagrams illustrating a method of manufacturing a light emitting module according to a fourth embodiment.

Referring to FIG. 22 , the plurality of first to third light emitting devices 151 , 152 , and 153 may be directly mounted on the substrate 120 in a COB type. The first to third light emitting devices 151 , 152 , and 153 may be mounted on the substrate 120 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

Referring to FIG. 23 , a black matrix BM may be formed on the substrate 120 . The black matrix BM may be spaced apart from the plurality of first to third light emitting devices 151, 152, and 153 at a predetermined interval. The black matrix BM may form a cavity 131 including one each of the first to third light emitting elements 151, 152, and 153. The black matrix BM may form a cavity 131 by forming barrier ribs in a matrix type. The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto.

Referring to FIG. 24 , a molding part 170 may be formed in a cavity formed by the black matrix BM. The molding unit 170 may be formed on the substrate 120 by one of transfer molding, dispensing molding, compression molding, and screen printing. The molding layer 170a may directly contact the black matrix BM, the substrate 120 and the first to third light emitting devices 151 , 152 , and 153 . The molding layer 170a may include a black filler. The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color when the light emitting module is not light emitting.

In the manufacturing method of the light emitting module according to the fourth embodiment of FIGS. 22 to 24, the first to third light emitting devices 151, 152, and 153 are directly mounted on the substrate 120 in a COB type, and the molding part 170 is formed after forming the black matrix (BM), thereby eliminating the cutting process of the method of manufacturing the light emitting module according to the third embodiment, thereby simplifying the manufacturing process.

In addition, when the light emitting module is manufactured as shown in FIGS. 22 to 24 , a process of cutting the substrate of the manufactured light emitting module with a laser may be additionally performed. That is, as shown in FIGS. 1 to 4, a process of cutting the substrate with a laser is additionally performed so that the number of light emitting parts arranged in each row is different from each other, so that the number of light emitting parts arranged in the first row and the number of light emitting parts arranged in the second row are different from each other.

Alternatively, a light emitting module having a different number of light emitting units arranged in the first column and a different number of light emitting units arranged in the second column may be manufactured by performing the laser cutting process.

The light emitting module of the fourth embodiment is a COB type and can simplify configuration, realize slimness and high luminance, and reduce power consumption by simplifying electrical connection configuration.

25 to 28 are diagrams illustrating a method of manufacturing a light emitting module according to a fifth embodiment.

Referring to FIG. 25 , a black matrix BM may be formed on the substrate 220 . The black matrices BM may be spaced apart from each other by a predetermined distance. The black matrix BM may be formed through a screen printing, dispensing, or injection process, but is not limited thereto. The black matrix BM may form barrier ribs in a matrix type.

Referring to FIG. 26 , the substrate 220 may be etched using the black matrix BM as a mask to form a cavity 231 . Although not shown in the drawing, a substrate pad (not shown) may be exposed on the bottom surface of the cavity 231 .

Referring to FIG. 27 , the plurality of first to third light emitting devices 151 , 152 , and 153 may be directly mounted on the substrate 220 on the bottom surface of the cavity 231 in a COB type. The first to third light emitting devices 151 , 152 , and 153 may be mounted on the substrate 220 by SMT. The SMT may use solder paste. The solder paste may be a metal paste. For example, the solder paste may include an alloy such as AuSn or NiSn, but is not limited thereto.

Referring to FIG. 28 , a molding part 170 may be formed in a cavity formed by the black matrix BM. The molding unit 170 may be formed on the substrate 220 by one of transfer molding, dispensing molding, compression molding, and screen printing. The molding part 170 may directly contact the black matrix BM, the substrate 220 and the first to third light emitting devices 151 , 152 , and 153 . The molding part 170 may include a black filler. The black pillar can improve the appearance quality by implementing the entire light emitting surface in black color when the light emitting module is not light emitting.

25 to 28, the manufacturing method of the light emitting module of the fifth embodiment forms a black matrix (BM) on a substrate 220, forms a cavity 231 by etching the substrate 220, mounts the first to third light emitting devices 151, 152, and 153 directly in a COB type on the substrate 220 at the bottom of the cavity 231, and forms a molding part 170 to form a third light emitting module. Since the cutting process of the light emitting module manufacturing method of the embodiment is deleted, the manufacturing process can be simplified.

In addition, when the light emitting module is manufactured as shown in FIGS. 25 to 28 , a process of cutting the substrate of the manufactured light emitting module with a laser may be additionally performed. That is, as shown in FIGS. 1 to 4, a process of cutting the substrate with a laser is additionally performed so that the number of light emitting parts arranged in each row is different from each other, so that the number of light emitting parts arranged in the first row and the number of light emitting parts arranged in the second row are different from each other.

Alternatively, a light emitting module having a different number of light emitting units arranged in the first column and a different number of light emitting units arranged in the second column may be manufactured by performing the laser cutting process.

The light emitting module of the fifth embodiment is a COB type and can simplify configuration, realize slimness and high luminance, and reduce power consumption by simplifying electrical connection configuration.

29 to 31 are plan views illustrating light emitting units and black matrices according to second to fourth embodiments.

Referring to FIG. 29 , the light emitting unit 200 of the second embodiment has technical characteristics of the light emitting unit 100 of the first embodiment of FIGS. 1 to 4 except for the first to third light emitting elements 251, 252, and 253.

The first to third light emitting devices 251, 252, and 253 may be disposed in a direction orthogonal to the first to third light emitting devices 151, 152, and 153 of the first embodiment.

Referring to FIG. 30 , the light emitting unit 300 of the third embodiment may adopt technical features of the light emitting unit 100 of the first embodiment of FIGS. 1 to 4 except for the first to third light emitting elements 351, 352, and 353.

The first to third light emitting devices 351, 352, and 353 may be displaced in one direction. For example, the first light emitting device 351 may be disposed adjacent to a first corner of the light emitting unit 300 and the second light emitting device 352 may be disposed adjacent to a second corner of the light emitting unit 300 . The first and second corners may be arranged side by side in one direction. The third light emitting element 353 may be disposed adjacent to a side of the light emitting unit 300 connecting third and fourth edges symmetrical to the first and second edges.

Referring to FIG. 31 , the light emitting unit 400 of the fourth embodiment may adopt technical features of the light emitting unit 100 of the first embodiment of FIGS. 1 to 7 except for the first to third light emitting elements 451, 452, and 453.

The first light emitting device 451 may be a vertical type in which electrodes are disposed on upper and lower portions. The first light emitting device 451 may emit light of a red wavelength. The first light emitting device 451 may be a vertical type to improve red light extraction efficiency and reliability. The first light emitting device 451 may further include a wire 451W connecting a light emitting device electrode (not shown) exposed on the top and a substrate.

29 to 31, the light emitting units 200, 300, and 400 of the second to fourth embodiments are described by limiting the shape, arrangement, and type of the light emitting elements, but are not limited thereto, and the shape and arrangement of the light emitting elements can be variously changed.

32 is a perspective view showing a light emitting cabinet according to an embodiment, FIG. 33 is a perspective view showing a lower portion of the light emitting cabinet according to an embodiment, FIG. 34 is a plan view showing a lower portion of first and second light emitting cabinets according to an embodiment, FIG. 35 is a view showing a lower corner of a light emitting cabinet according to an embodiment, FIG. It is a perspective view showing the structure.

As shown in FIGS. 32 and 33 , the light emitting cabinet 1000 according to the embodiment may include a plurality of light emitting modules. In the embodiment, a structure including two first and second light emitting modules 10a and 10b has been described, but is not limited thereto. The light emitting cabinet 1000 may be a display device of a minimum unit.

The light emitting cabinet 1000 may include first and second light emitting modules 10a and 10b and a support frame 1010 supporting lower surfaces of the first and second light emitting modules 10a and 10b. Here, upper surfaces of the first and second light emitting modules 10a and 10b may be display areas where light emitting units are disposed, and lower surfaces may be non-display areas where driving circuits are mounted.

Each of the first and second light emitting modules 10a and 10b may adopt the technical characteristics of the light emitting modules of FIGS. 1 to 31 .

The support frame 1010 supports the first and second light emitting modules 10a and 10b and may include a heat radiation function. The support frame 1010 may include a plurality of openings 1015 . The opening 1015 can reduce the weight of the support frame 1010, prevent contact with the driving circuit exposed on the lower surfaces of the first and second light emitting parts 10a and 10b, and improve heat dissipation efficiency.

The support frame 1010 includes one surface 1011 having a flat structure, and the one surface 1011 may directly contact lower surfaces of the first and second light emitting modules 10a and 10b.

The support frame 1010 includes four outer surfaces 1013, and a plurality of protrusions 1018 and a plurality of receiving grooves 1019 may be disposed on the four outer surfaces 1013. The plurality of protrusions 1018 and receiving grooves 1019 may have a function for primary fixing with an adjacent support frame.

The support frame 1010 may include a plurality of fastening parts 1017 protruding to the other surface along the edge.

For example, referring to FIG. 34 , when the first and second light emitting cabinets 1000a and 1000b are connected to each other, the plurality of protrusions 1018 of the support frame 1010 of the first light emitting cabinet 1000a may be inserted into the plurality of receiving grooves 1019 of the support frame 1010 of the second light emitting cabinet 1000b.

Referring to FIGS. 34 to 36 , the edge of the light emitting module 10 may protrude outward from the edge of the support frame 1010 . The distance (W) between the edge end of the light emitting module 10 and the edge end of the support frame 1010 may be 0.5 mm to 2.0 mm. The edge end of the light emitting module 10 protruding outward from the edge end of the support frame 1010 may include a function of improving side alignment of the first and second light emitting modules 10a and 10b adjacent to each other when the first and second light emitting cabinets 1000a and 1000b are connected to each other. That is, the light emitting module 10 protruding outward from the support frame 1010 is adjacent to the first and second light emitting modules 10a and 10b through side contact of the adjacent first and second light emitting modules 10a and 10b. Seamless (Seamless) can be implemented.

Referring to FIGS. 36 and 37 , the embodiment may include first and second coupling parts 1017a and 1017b connecting first and second light emitting cabinets 1000a and 1000b adjacent to each other. The first and second fastening parts 1017a and 1017b may adopt the technical characteristics of the fastening part 1017 of FIG. 30 .

The first and second coupling parts 1017a and 1017b may face each other.

The first and second light emitting cabinets 1000a and 1000b may be secondarily fixed by inserting the fastening members 1100 penetrating the fastening holes of the first and second fastening parts 1017a and 1017b.

38 is a perspective view illustrating a coupling portion of first and second light emitting cabinets according to another embodiment.

Referring to FIG. 38 , first and second light emitting cabinets 1000a and 1000b of another example may include slit grooves 1014 and protrusions (not shown) along outer surfaces. The slit groove 1014 and the protrusion (not shown) have a wider contact area than the plurality of accommodating grooves 1019 and the plurality of protrusions 1018 provided in the light emitting cabinet 1000 of the embodiment of FIG.

Although the light emitting cabinet 1000 of FIGS. 32 to 38 supports a plurality of light emitting modules 10a and 10b and has a limited coupling structure for stable fixation between adjacent first and second light emitting cabinets 1000a and 1000b, it is not limited thereto, and the coupling structure may be variously changed.

The light emitting cabinet 1000 according to the embodiment includes the light emitting module 10 capable of providing full color, and can realize uniform color and uniform luminance.

The light emitting cabinet 1000 of the embodiment includes the light emitting module 10 mounted on the substrate 220 to simplify the configuration, realize slimness and high brightness, and reduce power consumption by simplifying the electrical connection configuration.

The light emitting cabinet 1000 according to the embodiment includes the light emitting module 10 mounted on the substrate 220 and thus can improve productivity and yield.

The light emitting cabinet 1000 of the embodiment includes the light emitting module 10 capable of providing full color, and provides a display device with excellent linearity of images and videos.

The light emitting cabinet 1000 according to the embodiment includes the light emitting module 10 capable of providing full color and can provide images or images with excellent color purity and color reproduction.

39 is a perspective view illustrating a display device according to an embodiment.

As shown in FIGS. 32 to 39 , the display device 2000 according to the embodiment may include a plurality of light emitting cabinets 1000 . The display device 2000 according to the embodiment will be described as an example of a large display device having a size of 100 inches or more, such as an electronic display board.

The plurality of light emitting cabinets 1000 may include light emitting modules 10a and 10b in which a full color light emitting unit in which a plurality of light emitting devices is mounted on a driving substrate is disposed in an accommodating portion of a black matrix. The light emitting modules 10a and 10b may adopt the technical features of FIGS. 1 to 31 .

The display device 2000 according to the embodiment includes a light emitting module including a light emitting unit capable of providing full color, so that the structure of the display device can be simplified and slimmed down.

The display device 2000 according to the embodiment implements videos and images by including a light emitting device providing full color, and thus has excellent color purity and color reproduction.

The display device 2000 according to the embodiment includes a light emitting module mounted on a substrate 220 to simplify the configuration, realize slimness and high brightness, and reduce power consumption by simplifying the electrical connection configuration.

The display device 2000 according to the embodiment includes a light emitting module mounted on a substrate to improve productivity and yield.

The display device 2000 of the embodiment includes the light emitting modules 10a and 10b capable of providing full color, and provides a display device with excellent linearity of images and videos.

The display device 2000 according to the embodiment includes the light emitting modules 10a and 10b capable of providing full color, and thus can provide images or images with excellent color purity and color reproduction.

Since the display device 2000 according to the embodiment implements video and images using a light emitting device having excellent linearity, a clear, large-sized display device of 100 inches or more can be implemented.

The embodiment can implement a large display device of 100 inches or more with high resolution at low cost.

An image or video may be displayed, but is not limited thereto, and may be applied to a lighting unit, a backlight unit, a pointing device, a lamp, a street light, a lighting device for a vehicle, a display device for a vehicle, a smart watch, etc., but is not limited thereto.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified with respect to other embodiments by those skilled in the art in the field to which the embodiments belong. Therefore, contents related to these combinations and modifications should be construed as being included in the scope of the embodiments.

The above has been described with reference to the embodiments, but these are merely examples and are not intended to limit the embodiments, and those skilled in the art in the field to which the embodiments belong will know that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiment. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set forth in the appended claims.

Claims (22)

a substrate including a first side and a second side opposite to the first side;
a plurality of light emitting units disposed on the substrate; and
It is disposed on the substrate and includes a black matrix surrounding each of the plurality of light emitting units,
The plurality of light emitting units,
a first group arranged on a first line connecting the first side and the second side of the substrate;
a second group arranged on a second line adjacent to and parallel to the first line and connecting the first side and the second side of the substrate;
The number of light emitting units included in the first group is
It is different from the number of light emitting units included in the second group,
The part located on the first line of the second side,
Forming a protrusion protruding outward based on a portion located on the second line of the second side surface,
The part located on the second line of the second side,
Forming an insertion groove recessed in an inward direction based on a portion located on the first line
light module. According to claim 1,
The first side is a left side of the substrate,
The second side surface is the right side of the substrate,
The first line is
a first row on the top surface of the substrate;
The second line is
Comprising a second row of the upper surface of the substrate
light module. According to claim 1,
The first side is an upper side of the substrate,
The second side surface is a lower surface of the substrate,
The first line is
Including a first row of the upper surface of the substrate,
The second line is
Comprising a second row of the upper surface of the substrate
light module. According to claim 2 or 3,
the substrate,
The distance between the first side and the second side corresponding to the first line,
a distance different from the distance between the first side and the second side corresponding to the second line
light module. According to claim 1,
The first side surface of the substrate is located on the same plane as each other,
The second side of the substrate includes a first part positioned on a first plane and a second part positioned on a second plane different from the first plane.
light module. According to claim 1,
On the first line, the light emitting portion located on the protruding portion,
On the second line, a light emitting unit located on the second side surface does not overlap with each other in a horizontal or vertical direction.
light module. According to claim 1,
Each of the plurality of light emitting units,
A first light emitting element mounted on the substrate and emitting red wavelength;
A second light emitting element mounted on the substrate and emitting green wavelength;
A third light emitting element mounted on the substrate and emitting blue wavelength;
Comprising a molding portion covering the first to third light emitting elements
light module. According to claim 7,
The molding part,
directly contacting the top surface of the substrate and the side surface of the black matrix.
light module. According to claim 8,
The black matrix,
It includes an opening corresponding to each of the plurality of light emitting parts, and directly contacts the side surface of each of the plurality of light emitting parts.
light module. A first light emitting module including a first substrate including a first side surface and a second side surface opposite to the first side surface, a plurality of first light emitting units directly mounted on the first substrate, and a first black matrix surrounding each of the plurality of first light emitting units;
A second light emitting module including a second substrate including a third side surface and a fourth side surface opposite to the third side surface, a plurality of second light emitting units directly mounted on the second substrate, and a second black matrix surrounding each of the plurality of second light emitting units;
A support frame supporting the first light emitting module and the second light emitting module,
The plurality of first light emitting units,
a first group arranged on a first line connecting the first side and the second side of the first substrate;
a second group arranged on a second line adjacent to and parallel to the first line and connecting the first side surface and the second side surface of the first substrate;
The plurality of second light emitting units,
a third group extending from the first line and arranged on a third line connecting the third and fourth sides of the second substrate;
a fourth group extending from the second line, adjacent to and parallel to the first line, and arranged on a fourth line connecting the third side and the fourth side of the second substrate;
The second side surface of the first substrate includes a first protrusion corresponding to the first line;
And a first insertion groove corresponding to the second line,
The third side of the second substrate has a second insertion groove corresponding to the third line;
A light emitting cabinet comprising a second protrusion corresponding to the fourth line. According to claim 10,
The first side surface is a left side surface of the first substrate,
The second side surface is the right side of the first substrate,
The first line is
a first row of an upper surface of the first substrate;
The second line is,
Comprising a second row of the upper surface of the first substrate
luminous cabinet. According to claim 10,
The first side surface is an upper surface of the first substrate,
The second side surface is a lower surface of the first substrate,
The first line is
Including a first row of the upper surface of the first substrate,
The second line is,
Including a second row of the upper surface of the first substrate
luminous cabinet. According to claim 10,
The first substrate,
The distance between the first side and the second side corresponding to the first line,
a distance different from the distance between the first side and the second side corresponding to the second line
luminous cabinet. According to claim 10,
The plurality of second light emitting units,
The number of second light emitting units included in the third group;
The number of second light emitting units included in the fourth group is different.
luminous cabinet. According to claim 14,
The first side surfaces of the first line and the second line of the first substrate are located on the same plane as each other;
The second side surfaces of the first line and the second line of the first substrate contacting the third side surface of the second substrate are located on different planes;
The third side surfaces of the third and fourth lines of the second substrate are located on different planes;
Opposed to the third side of the second substrate, the fourth side of the second substrate having the third line and the fourth line are located on the same plane as each other.
luminous cabinet. According to claim 15,
The number of first light emitting units included in the first group is
different from the number of second light emitting units included in the third group,
The number of first light emitting units included in the second group is
different from the number of second light emitting units included in the fourth group
luminous cabinet. According to claim 16,
The total number of first light emitting units included in the first group and second light emitting units included in the third group,
The number of first light emitting units included in the second group is equal to the total number of second light emitting units included in the fourth group.
luminous cabinet. According to claim 10,
The first protrusion,
It is inserted into the second insertion groove,
The second protrusion,
inserted into the first insertion groove
luminous cabinet. According to claim 10,
Each of the plurality of first light emitting units and the plurality of second light emitting units,
A first light emitting element mounted on the first substrate or the second substrate and emitting red wavelength;
a second light emitting element mounted on the first substrate or the second substrate and emitting green wavelength;
A third light emitting element mounted on the first substrate or the second substrate and emitting blue wavelength;
Including a molding portion covering the first to third light emitting elements
luminous cabinet. According to claim 10,
The support frame,
A flat surface directly contacting the first light emitting module and the second light emitting module;
Including a plurality of openings and outer surfaces penetrating the other surface from the one surface
luminous cabinet. 21. The method of claim 20,
On the outer surfaces,
A plurality of protrusions and a plurality of grooves are formed
luminous cabinet. A plurality of light emitting cabinets according to any one of claims 10 to 21
display device.

Images