JP2018087928A - LED display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to provide an LED display device that reduces a fraction defective during manufacture.SOLUTION: An LED display device comprises an LED substrate 10 and a control board 110. The LED substrate 10 includes a display part 20 that is formed of a plurality of LED elements provided on a first principal surface of the LED substrate 10, data lines and a power line that are connected to the LED elements, and connectors 90 at which the ends of the data lines and the power line are arranged. The control board 110 includes sockets 190 that correspond to the connectors 90, and control parts 180 that are connected to the data lines and the power line through the sockets 190 and the connectors 90.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED display device.

  Many display devices such as LED (Light Emitting Diode) display devices are installed on the street. These display devices display various videos related to advertisements, such as still images and moving images, and provide information to passersby.

  For example, in Patent Document 1, when a large LED display is observed at a short distance, a natural image is obtained without making the light of each LED element feel as a point. An LED display device that can prevent the above is disclosed. Specifically, in an LED display device that displays a predetermined image by arranging a plurality of LED elements corresponding to a plurality of pixels in a predetermined pattern, the function of diffusing light from each LED element while maintaining a certain distance is provided. A plate-like or film-like optical member is disposed, and an optical member having light permeability that is in contact with both the LED element and the optical member is disposed between the LED element and the optical member.

  Patent Document 2 discloses a thin and light panel type display module. Specifically, it is a panel type display module, in which a plurality of LED lamps are mounted on the surface of a rectangular printed wiring board in a straight line at a pitch a in the vertical direction, and the first to third color LED lamp arrays. A total of three rows are arranged in parallel at a pitch b equal to or less than the pitch a to form a three-primary-color LED lamp row set, and a plurality of three-primary-color LED lamp row sets are arranged in parallel at predetermined intervals. A non-lamp strip-shaped area having a width d of at least twice the pitch b between the matching three primary color LED lamp train sets is provided, and one or more integrated circuits are mounted in each of the non-lamp strip-shaped areas, and the right and left LED lamp rows The total dimension of the distances p and q between the right end and the left end of the wiring board is made smaller than the width d of the non-lamp belt-like area, and the connector or LED lamp mounted on the end of the wiring board is connected to the integrated circuit. Emissions are patterned.

JP 2014-202816 A JP 2012-27484 A

  In the LED display device disclosed in Patent Document 1, the overall configuration of the device becomes large. For this reason, much labor is required for the installation work of the LED display device. On the other hand, since the panel type display module of Patent Document 2 is thin and light, labor required for installation work is reduced. Therefore, it is conceivable to install such a panel type display module in various places such as a building wall and a window glass. When the LED display device is installed on the window glass, a passerby who walks outside can view various images displayed on the LED display device. On the other hand, the person in the office is blocked by the LED display device and cannot see the scenery outside the window.

  In order to avoid such a situation, for example, a substrate made of a transparent material is used for the LED display device.

  However, in the LED display device, components such as an LED element, a control unit that controls the LED element, and various wirings are arranged on the same substrate. As described above, in the LED display device, since the number of components per device is large, the defect rate at the time of manufacture increases.

  Then, an object of this invention is to provide the LED display apparatus which reduced the defect rate at the time of manufacture.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  An LED display device according to an exemplary embodiment of the present invention includes an LED board and a control board, and the LED board includes a display unit including a plurality of LED elements, and a data line connected to the LED elements. A power line connected to the LED element, and a connector protruding from the display unit and provided with an end of the data line and the power line, and the control board includes a socket corresponding to the connector, and the socket and the connector. And a control unit connected to the data line and the power supply line via

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, according to the typical embodiment of the present invention, an LED display device having a reduced defective rate during manufacturing is provided.

It is a top view which shows an example of a structure of the LED display apparatus which concerns on Embodiment 1 of this invention. It is a top view which expands and shows an example of a structure of the display part which concerns on Embodiment 1 of this invention. It is sectional drawing which expands and shows an example of a structure of the display part which concerns on Embodiment 1 of this invention. It is an enlarged view which shows an example of a structure of the connector which concerns on Embodiment 1 of this invention. It is a figure which shows an example of a structure of the control board which concerns on Embodiment 1 of this invention. It is a top view which shows an example of a structure of the LED display apparatus which concerns on Embodiment 2 of this invention.

(Embodiment 1)
<Configuration of LED display device>
[Configuration of LED board]
FIG. 1 is a plan view showing an example of the configuration of the LED display device according to Embodiment 1 of the present invention. FIG. 2 is an enlarged plan view showing an example of the configuration of the display unit according to Embodiment 1 of the present invention. FIG. 3 is an enlarged cross-sectional view showing an example of the configuration of the display unit according to Embodiment 1 of the present invention. FIG. 4 is an enlarged view showing an example of the configuration of the connector according to Embodiment 1 of the present invention. In FIG. 2, a part of the display unit 20 of the LED display device 200 is shown. In FIG. 1, the data line 40 and the power supply line 50 are omitted.

  Moreover, in FIG. 2, the power supply line 50 provided in the 1st main surface 10a in which the LED element 30 is arrange | positioned is shown as a continuous line, and is provided in the 2nd main surface 10b different from the 1st main surface 10a. The data line 40 is indicated by a dotted line. In FIG. 3, some LED elements 30 and the cross-sectional shape of the circumference | surroundings are typically shown. FIG. 4 shows an enlarged view of some connectors. 4A shows a plan view and FIG. 4B shows a cross-sectional view.

  For example, as shown in FIG. 1, the LED display device 200 includes an LED substrate 10 and a control substrate 110. For example, as shown in FIGS. 1 to 3, the LED substrate 10 includes a display unit 20, a data line 40, a power supply line 50, a connector 90, an LED protective layer 60, an adhesive layer 70, a protective layer 80, and the like. .

  The LED board 10 is, for example, a flat board. The shape of the LED substrate 10 in plan view is, for example, a rectangle, a circle, an ellipse, etc., but is not limited to these shapes. For example, the LED substrate 10 is configured in an arbitrary shape considering the installation location of the LED display device 200 and the like.

  The LED substrate 10 is made of a material having high heat resistance. In this specification, “having high heat resistance” means that even when the temperature of the LED substrate 10 reaches, for example, 160 ° C., the LED substrate 10 does not change in quality and the LED display device 200 operates normally. Say. Moreover, it is preferable that the LED board 10 has flexibility. Thereby, the LED board 10 is comprised so that it can deform | transform into arbitrary shapes according to the installation place of the LED display apparatus 200. FIG.

  The LED substrate 10 may be made of a transparent material. Thereby, the first main surface 10a side can be seen through the LED substrate 10 from the second main surface 10b side opposite to the first main surface 10a on which the image is displayed.

  The LED substrate 10 is made of, for example, a resin such as PCB (Poly Chlorinated Biphenyl), PET (Poly Ethylene Terephthalate), or PI (Polyimide) as a material that satisfies these characteristics. Yes.

  On the first main surface (main surface) 10a of the LED substrate 10, for example, a display unit 20, a power line 50, and the like are provided. As shown in FIG. 1, the display unit 20 includes a plurality of pixels 25 arranged in a matrix along each of the X-axis direction and the Y-axis direction. Each pixel 25 includes a plurality of LED elements 30 that emit different colors, for example. Therefore, the display unit 20 includes a plurality of LED elements 30.

  Each pixel 25 includes a plurality of LED elements 30 that emit different colors, for example. Specifically, for example, as illustrated in FIG. 2, the pixel 25 includes a red LED element 30 </ b> R, a green LED element 30 </ b> G, a blue LED element 30 </ b> B, and an LED element 30 </ b> X. Here, the LED element 30X may be an LED element that emits a color different from these colors, or may be an LED element that emits the same color as any of these colors.

  In one pixel 25, as shown in FIG. 2, the LED elements 30R and 30G are arranged adjacently along the X-axis direction, and the LED elements 30X and 30B are arranged adjacently along the X-axis direction. Has been. Further, the LED elements 30R and 30X are disposed adjacently along the Y-axis direction, and the LED elements 30G and 30B are disposed adjacently along the Y-axis direction. In FIG. 2, an example of the color arrangement of the LED elements 30 is shown, but the color arrangement of the LED elements 30 in the pixel 25 is not limited to this. Further, the color arrangement of the LED elements 30 may be changed for each pixel 25.

  A lead wire 45 is provided for each LED element 30 on the first main surface 10 a of the LED substrate 10. As shown in FIG. 3, each LED element 30 is connected to a lead wire 45 and a power supply line 50 via wires 46 and 56, respectively. For example, gold is used as the material of the wire 46.

  For example, as shown in FIG. 3, the power supply line 50 is formed on the first main surface 10 a of the LED substrate 10. For example, as shown in FIGS. 1 and 2, the power supply line 50 is provided in common to the plurality of LED elements 30. The power supply line 50 extends along, for example, the X-axis direction in FIG. 2 and is provided in common to the pixels 25 for one row arranged in the X-axis direction. Specifically, the power supply line 50 is provided for each of the row where the LED elements 30R and 30G shown in FIG. 2 are arranged and the row where the LED elements 30X and 30B are arranged. Thus, the power supply line 50 is provided with two power supply lines 50 in parallel for one pixel 25, for example.

  The power supply line 50 also extends toward the connector 90 described later. The end of the power supply line 50 is disposed on the connector 90.

  For example, as shown in FIG. 3, the LED substrate 10 is formed with a through hole 15 that penetrates the first main surface 10 a and the second main surface 10 b. The through hole 15 is provided for each LED element 30. For example, the through hole 15 is formed so that an opening is provided in the wiring region of the lead wire 45 connected to the corresponding LED element 30.

  A plurality of data lines 40 are provided on the second main surface 10 b opposite to the first main surface 10 a of the LED substrate 10. For example, the data line 40 is provided for each LED element 30. For example, as shown in FIG. 2, the data line 40 extends so as to intersect with the plurality of LED elements 30 in a plan view. For example, as shown in FIGS. 1 and 2, the data line 40 intersects the LED element 30 in a plan view and extends in the Y-axis direction. Specifically, the data lines 40 (40R, 40X) extend along the column in which the LED elements 30R, 30X shown in FIG. 2 are arranged. Further, the data line 40 connected to the other LED elements 30 arranged in this column also extends across the LED elements 30R and 30X in a plan view.

  Further, the data lines 40 (40G, 40B) extend along the columns where the LED elements 30G, 30B shown in FIG. 2 are arranged. Further, the data lines 40 connected to the other LED elements 30 arranged in this column also extend across the LED elements 30G and 30B in a plan view. As described above, in each LED element 30, the same number of data lines 40 as the number of the LED elements 30 arranged in the same column intersect and extend in plan view.

  The data line 40 is connected to the LED element 30 through the through hole 15. Specifically, as shown in FIG. 3, the data line 40 is connected to the LED element 30 through the through hole 15, the lead wire 45, and the wire 46.

  Further, the data line 40 also extends toward the connector 90 described later. For example, as shown in FIG. 4A, the end of the data line 40 is disposed in the connector 90.

  The metal layers (not shown) of the data lines 40, the power supply lines 50, the lead wires 45, and the through holes 15 are made of, for example, copper as a main component. Here, “copper is the main component” means that these wirings and the like are mostly made of copper, but impurities may be mixed therein.

  The data lines 40 (40R, 40G, 40B, 40X) and the power supply line 50 are connected to a control unit (controller) 180 described later. A predetermined signal (for example, a potential) is output from the control unit 180 to the data line 40 (40R, 40G, 40B, 40X) and the power supply line 50. Each LED element 30 is switched on and off based on a signal (potential) supplied from the data line 40 (40R, 40G, 40B, 40X) and the power line 50. By switching the on / off state of each LED element 30, a still image or a moving image is displayed on the display unit 20.

  In the above description, the case where the data line 40 is provided on the second main surface 10b of the LED substrate 10 and the power supply line 50 is provided on the first main surface 10a of the LED substrate has been described. It is not limited. For example, the data line 40 may be provided on the first main surface 10a of the LED substrate 10, or the power line 50 may be provided on the second main surface 10b. Moreover, both the data line 40 and the power supply line 50 may be provided in each main surface 10a, 10b. Further, the data line 40 and the power supply line 50 may be provided in parallel in a plan view.

  A connector 90 is provided on the LED substrate 10. The connector 90 is provided so as to protrude from the LED substrate 10 along the first main surface 10a (second main surface 10b) of the LED substrate 10, for example, as shown in FIGS. Further, the LED substrate 10 may be provided with a plurality of connectors 90 as shown in FIG. Specifically, as shown in FIG. 1, the LED substrate 10 is configured in a rectangular shape in plan view, and a plurality of connectors 90 are provided on the one end 10 </ b> L side of the LED substrate 10. The connector 90 is configured to correspond to a socket provided on the control board 110 described later.

  As described above, the connector 90 is provided with the ends of the data line 40 and the power supply line 50. The ends of the data line 40 and the power supply line 50 may be provided on both the first main surface 90a and the second main surface 90b of the connector 90, as shown in FIG. 4B, for example. May be provided on either one of the main surfaces 90a, 90b.

  The connector 90 may be made of the same material (for example, PCB) as the LED substrate 10. Further, the connector 90 may be configured to be connected to the LED substrate 10 or may be configured integrally with the LED substrate 10, for example.

  Although FIG. 1 shows the case where the connector 90 is provided at one end 10L of the LED substrate 10 on the −X axis side, the present invention is not limited to such a configuration. For example, the connector 90 may be provided at one end of the LED substrate 10 on the + X axis side, or may be provided at one end of the LED substrate 10 on the −Y axis side and the + Y axis side.

  Below, the outline of the process of forming the through-hole 15, the data line 40, the lead wire 45, and the power supply line 50 is demonstrated. First, the through hole 15 is formed by irradiating the LED substrate 10 with, for example, a laser. The through hole 15 is formed at a predetermined position determined in consideration of the position where the LED element 30 is disposed and the position where the lead wire 45 is formed.

  Next, a metal layer mainly composed of, for example, copper is formed on the side wall of the through hole 15 by, for example, a plating process. In the plating step, the metal layer may be formed so that not only the side wall but also the entire through hole 15 is filled.

  Next, the lead wire 45 and the power supply line 50 are formed on the first main surface 10a. For example, a metal layer containing, for example, copper as a main component is formed on the first main surface 10a by a film forming process such as sputtering. Then, the lead wire 45 and the power supply line 50 are formed by patterning the metal layer based on a predetermined wiring pattern.

  Next, the data line 40 is formed with respect to the 2nd main surface 10b. Since the data line 40 is performed in the same process as that performed on the first main surface 10a, detailed description thereof is omitted. In addition, after performing the process of producing | generating the data line 40 with respect to the 2nd main surface 10b, you may perform the process of forming the lead wire 45 and the power supply line 50 with respect to the 1st main surface 10a. Further, these steps may be performed simultaneously on the connector 90.

  An LED protective layer 60 that covers the LED element 30 is provided on the first main surface 10 a side of the LED substrate 10. For example, the LED protective layer 60 is provided so as to cover the LED element 30 and the wires 46 and 56 as shown in FIG. The LED protective layer 60 is made of a material having transparency, insulation, and ductility (for example, silicon epoxy resin).

  For example, the LED protective layer 60 may be provided for each pixel 25 or may be provided for each LED element 30. Alternatively, the LED protective film 60 may be provided over the plurality of pixels 25.

  An adhesive layer 70 is provided on the first main surface 10 a side of the LED substrate 10. For example, as illustrated in FIG. 3, the adhesive layer 70 is provided so as to fill a space between adjacent LED protective layers 60. The LED protective layer 60 and the adhesive layer 70 are configured to have the same height from the first main surface 10 a of the LED substrate 10. It is preferable that the adhesive layer 70 is also made of a material having transparency and ductility.

  As shown in FIG. 3, a protective layer 80 is provided on the second main surface 10 b side of the LED substrate 10. The protective layer 80 is provided to protect the data line 40 and the LED substrate 10. The protective layer 80 is preferably made of a material having transparency and ductility, for example.

  In the present embodiment, wiring boards for various wirings such as the data lines 40 and the power supply lines 50 may be sequentially stacked on the second main surface 10b side of the LED board 10. Even in such a configuration, it is only necessary that the end portions of the data line and the power supply line 50 are arranged in the connector 90.

[Configuration on the control board]
FIG. 5 is a diagram showing an example of the configuration of the control board according to Embodiment 1 of the present invention. FIG. 5 shows an enlarged part of the control board. 5A shows a plan view and FIG. 5B shows a cross-sectional view. For example, as shown in FIGS. 1 and 5, the control board 110 is provided with a socket 190, a wiring pattern 193, a control unit 180, and the like.

  The control board 110 is, for example, a flat board. The control board 110 is configured based on, for example, the position of the connector 90, the shape of the LED board 10, and the like. Specifically, as shown in FIG. 1, the LED board 10 is configured in a rectangular shape in plan view, and the control board 110 is provided to extend along one end 10 </ b> L of the LED board 10. At this time, the control board 110 is configured in an elongated rectangular shape in a plan view, for example. The control board 110 may be made of the same material as the LED board 10 (for example, PCB).

  A socket 190 is provided on the first main surface 110 a of the control board 110. The socket 190 is provided corresponding to the connector 90. If a plurality of connectors 90 are provided on the LED board 10, the control board 110 is provided with a plurality of sockets 190 corresponding to the plurality of connectors 90 as shown in FIG.

  For example, as shown in FIG. 5B, the socket 190 is provided with a connector insertion portion 191. On the first surface 191a and the second surface 191b opposite to the first surface 191a of the connector insertion portion 191, a wiring pattern 192a corresponding to the ends of the data line 40 and the power supply line 50 arranged in the connector 90 is provided. , 192b are provided.

  When the connector 90 is inserted into the connector insertion portion 191 of the socket 190, the ends of the data line 40 and the power supply line 50 of the connector 90 are connected to the wirings constituting the wiring patterns 192a and 192b, respectively. Thus, the connector 90 is connected to the socket 190. The connector 90 can be removed from the socket 190, and the LED display device 200 is configured by combining an arbitrary LED board 10 and control board 110.

  A wiring pattern 193 is provided on the first main surface 110a of the control board 110, for example, as shown in FIG. The wiring pattern 193 is configured to correspond to each wiring of the wiring patterns 192a and 192b of the socket 190, for example. That is, each wiring of the wiring patterns 192a and 192b is connected to each wiring of the wiring pattern 193. The wiring pattern 193 may be provided on the second main surface 110b of the control board 110.

  Note that the wiring patterns 192a, 192b, and 193 are made of, for example, copper as a main component. Here, “copper is the main component” means that these wirings and the like are mostly made of copper, but impurities may be mixed therein.

  On the first main surface 110a of the control board 110, for example, as shown in FIG. 5B, a control unit 180 is provided. The control unit 180 includes control device components such as a drive IC (Integrated Circuit), for example. The control unit 180 is connected to the wirings of the wiring patterns 192a and 192b through the wiring pattern 193, respectively. As described above, the control unit 180 is connected to the data line 40 and the power supply line 50 through the socket 190 and the connector 90.

  The control unit 180 is mounted on the control board 110 by, for example, a surface mounting technology (SMT: Surface Mount Technology). Further, for example, as shown in FIG. 1, the control unit 180 may be provided separately for each socket 190 (connector 90), or may be provided in common by a plurality of sockets 190 (connector 90). Further, for example, as shown in FIGS. 1 and 5A, a plurality of control units 180 may be provided per socket 190 (connector 90), or only one control unit 180 may be provided. Moreover, the control part 180 may be provided in the 2nd main surface 110b, and may be provided in both surfaces of the 1st main surface 110a and the 2nd main surface 110b.

  A protective layer 185 is provided on the first main surface 110 a of the control substrate 110. For example, as shown in FIG. 5B, the protective layer 185 is provided so as to cover the wiring pattern 193. In addition, when a wiring pattern is provided on the second main surface 110b of the control board 110, a protective layer is provided so as to cover the wiring pattern on the second main surface 110b. Since the protective layer 185 has the same configuration as the protective layer 80 described above, detailed description thereof is omitted here.

<Effects of this embodiment>
According to the present embodiment, the LED board 10 and the control board 110 are provided, and the control unit 180 provided on the control board 110 includes the data line 40 and the data line 40 provided on the LED board 10 via the socket 190 and the connector 90. The power supply line 50 is connected.

  According to this configuration, the LED display device 200 is manufactured by combining the separately manufactured LED substrate 10 and the control substrate 110. For this reason, if a problem occurs, only the defective part is replaced, and the LED display device 200 without a problem is manufactured. Thereby, the LED display device 200 in which the defect rate at the time of manufacture is reduced is provided.

  In addition, even if a problem occurs during use, the LED display device 200 can be used if the defective part is replaced. Therefore, the LED display device 200 with improved reliability during use is provided. This also provides the LED display device 200 that facilitates product management.

  In addition, the design per substrate becomes easy, and the manufacturing process per substrate is shortened. Thereby, the load of the board | substrate at the time of manufacture is reduced, and a defect rate is further reduced.

  Moreover, according to this structure, since the control part 180 is provided in the control board 110 different from the LED board 10, the structure of the LED board 10 is simplified. Thereby, the thickness of the LED display device on the LED substrate 10 side is reduced, and handling and installation work of the LED display device 200 is facilitated.

  Further, according to the present embodiment, the connector 90 is provided so as to protrude from the LED board 10 along the first main surface 10 a of the LED board 10.

  According to this configuration, since the control board 110 and the display unit 20 do not overlap in a plan view, the LED display device 200 that does not impair the visibility of the video displayed on the display unit 20 is provided.

  Further, according to the present embodiment, the LED board 10 has a plurality of connectors 90, and the control board 110 has a plurality of sockets 190 corresponding to the plurality of connectors 90, respectively.

  According to this configuration, since the data line 40 and the power supply line 50 can be distributed to different connectors 90 according to the position of the LED element 30 (pixel 25) in the display unit 20, the LED display device can easily handle the wiring. 200 is provided. Further, according to this configuration, since the LED board 10 is connected to the control board 110 by the plurality of connectors 90, a physical load applied to each connector 90 is reduced. Thereby, the occurrence of problems such as disconnection is suppressed, and the LED display device 200 with improved reliability is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised by the rectangular shape in planar view, and the several connector is provided in the one end 10L side of the LED board 10. FIG. The control board 110 is provided to extend along the one end 10 </ b> L of the LED board 10, and includes a plurality of sockets 190 corresponding to the plurality of connectors 90.

  According to this configuration, since the distance between the LED board 10 and the control board 110 is kept constant, the physical load applied to each connector 90 is equalized. Thereby, the occurrence of problems such as disconnection is further suppressed, and the LED display device 200 with improved reliability is provided.

  Further, according to the present embodiment, the data line 40, the lead wire 45, the power supply line 50, and the wiring patterns 192a, 192b, and 193 are configured with copper as a main component. According to this configuration, since an inexpensive material is used for these wirings, the manufacturing cost is reduced.

  Moreover, according to this Embodiment, the LED board 10 is comprised with the material which has high heat resistance. According to this configuration, since the LED substrate 10 does not deteriorate even when the LED element 30 is in a high temperature state, the LED display device 100 with improved operation performance is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised with the material which has flexibility. According to this configuration, the LED display device 200 can be arbitrarily deformed according to the installation location, so that the LED display device 200 with improved flexibility in the installation location is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised with the transparent material.

  According to this configuration, when the LED display device 200 is installed on, for example, a window glass or the like, the scenery outside the window can be viewed from the surface opposite to the surface on which the image is displayed via the LED display device 200. . Thereby, the LED display device 200 which provides both video display and scenery visibility is provided.

  Moreover, according to this Embodiment, the LED board 10 is comprised by PCB. According to this configuration, the LED display device 200 can be arbitrarily deformed according to the installation location, so that the LED display device 200 with improved flexibility in the installation location is provided.

  Moreover, according to this Embodiment, the pixel 25 is comprised by the several LED element 30 which emits a different color.

  According to this configuration, it is possible to display various colors on each pixel 25, so that the LED display device 200 with improved display quality is provided.

  Moreover, according to this Embodiment, the LED protective layer 60 which covers the LED element 30 and the wires 46 and 56 is provided on the first main surface 10a side of the LED substrate 10.

  According to this configuration, since the impact on the LED element 30 and the wires 46 and 56 is mitigated, the occurrence of disconnection is suppressed, and the LED display device 200 with improved reliability is provided.

  Further, according to the present embodiment, the adhesive layer 70 is provided in the space between the adjacent LED protective layers 60.

  According to this configuration, since the LED display device 200 is fixed at an arbitrary location, the LED display device 200 with improved flexibility in installation location is provided.

  Moreover, according to this Embodiment, the LED protective layer 60 and the contact bonding layer 70 are provided so that it may become the same height from the 1st main surface 10a of the LED board 10. FIG.

  According to this configuration, since the LED display device 100 can be closely attached to the installation location, the LED display device 100 that is stably fixed to the installation location is provided.

(Embodiment 2)
Next, a second embodiment will be described. FIG. 6 is a plan view showing an example of the configuration of the LED display device according to Embodiment 2 of the present invention.

  For example, as shown in FIG. 6, the LED display device 300 according to the present embodiment includes a plurality of LED display devices 200, and these LED display devices 200 are combined. That is, in this embodiment, a large-scale LED display device 300 is configured by combining a plurality of small-scale LED display devices 200.

  In the LED display device 300, for example, as illustrated in FIG. 6, the display units 20 are adjacently disposed between the adjacent LED display devices 200 in a plan view. Thus, in the LED display device 300, the large-scale display unit 220 is configured by combining a plurality of small-scale display units 20.

  Each control board 110 is provided so as to surround the display unit 220. For example, as shown in FIG. 6, in the illustrated LED display device 200 on the left side (−X axis side) of the display unit 220, the control board 110 is provided to be disposed on the left side of the display unit 220. In the right side (+ X axis side) LED display device 200 in the figure, the control board 110 is provided so as to be arranged on the right side of the display unit 220. These control boards 110 are arranged linearly in the Y-axis direction.

  According to the present embodiment, the following effects can be obtained in addition to the effects of the first embodiment. According to the present embodiment, a plurality of LED display devices 200 are provided, and the respective display units 20 are disposed adjacent to each other between adjacent LED display devices 200 in plan view.

  According to this configuration, since the display unit 220 that combines the plurality of display units 20 is not blocked by the control board 110, the LED display device 300 that does not impair the visibility of the video displayed on the display unit 220 is provided. .

  Moreover, according to this structure, the large-scale LED display apparatus 300 is provided at low cost. Moreover, according to this structure, since the small-scale LED display apparatus 200 is combined and the large-scale LED display apparatus 300 is comprised, the load required for installation work is reduced significantly.

  DESCRIPTION OF SYMBOLS 10 ... LED board, 10a ... 1st main surface, 10b ... 2nd main surface, 15 ... Through-hole, 20 ... Display part, 25 ... Pixel, 30, 30R, 30G, 30B, 30X ... LED element, 40, 40R, 40G, 40B, 40X ... data line, 50 ... power supply line, 60 ... LED protective layer, 70 ... adhesive layer, 80 ... protective layer, 90 ... connector, 110 ... control board, 110a ... first main surface, 110b ... Second main surface, 190 ... Socket, 191 ... Connector insertion portion, 192a, 192b, 193 ... Wiring pattern, 200 ... LED display device, 220 ... Display portion, 300 ... LED display device

Claims (9)

An LED substrate;
A control board;
With
The LED substrate is
A display unit composed of a plurality of LED elements provided on the main surface of the LED substrate;
A data line and a power line connected to the LED element;
Ends of the data line and the power line are arranged, and a connector provided so as to protrude from the LED board along the main surface of the LED board;
Have
The control board is
A socket corresponding to the connector;
A control unit connected to the data line and the power line via the socket and the connector;
Having
LED display device. The LED display device according to claim 1,
The LED substrate has a plurality of the connectors,
The control board has a plurality of sockets corresponding to the plurality of connectors,
LED display device. The LED display device according to claim 1,
The LED substrate is configured in a rectangular shape in plan view,
A plurality of the connectors are provided on one end side of the LED substrate,
The control board is provided to extend along the one end of the LED board,
A plurality of sockets corresponding to each of the plurality of connectors;
LED display device. The LED display device according to claim 3.
A plurality of the LED display devices;
In the plan view, between the LED display devices adjacent to each other, the display units are arranged adjacent to each other.
LED display device. The LED display device according to claim 1,
The connector is configured integrally with the LED substrate,
LED display device. The LED display device according to claim 1,
The LED substrate is made of a material having high heat resistance,
LED display device. The LED display device according to claim 1,
The LED board and the control board are made of a flexible material,
LED display device. The LED display device according to claim 1,
The LED substrate is made of a transparent material,
LED display device. The LED display device according to claim 1,
The LED substrate is made of PCB,
LED display device.

Images