WO2024101953A1

WO2024101953A1 - Display device and manufacturing method therefor

Info

Publication number: WO2024101953A1
Application number: PCT/KR2023/018073
Authority: WO
Inventors: 김나리; 박홍기; 김현종; 이지훈; 최정식
Original assignee: 엘지전자 주식회사
Priority date: 2022-11-11
Filing date: 2023-11-10
Publication date: 2024-05-16

Abstract

The present invention is applicable to the technical field related to display devices, and relates to a display device using, for example, light-emitting diodes (LED), and a manufacturing method therefor. This invention may comprise: a wiring board; an electrode pad that is partitioned on the wiring board to constitute a plurality of unit pixels; a light-emitting diode that is connected to the electrode pad; an encapsulation layer that is formed on the wiring board so as to cover the light emitting diode; a black coating layer that is located on a side of the encapsulation layer and contains a black pigment in a resin-based base coating agent; and an optical film that is located on the encapsulation layer.

Description

Display device and method of manufacturing the same

The present invention is applicable to display device-related technical fields and, for example, relates to a display device using LED (Light Emitting Diode) and a method of manufacturing the same.

As the information society develops, the demand for display devices in various forms is increasing, and in response to this, in recent years, LCD (Liquid Crystal Display Device), PDP (Plasma Display Panel), ELD (Electro luminescent display), and VFD (Vacuum Fluorescent) have been developed. Various display devices such as display, OLED (Organic Light Emitting Diode), and micro LED (Micro Light Emitting Diode) are being researched and used.

Digital Signage is a communication tool that can induce marketing, advertising, training effects, and customer experience for companies, as well as general TV, in public places such as airports, hotels, hospitals, and subway stations. It is a display device that provides not only broadcast programs but also specific information.

Digital signage uses LCD (Liquid Crystal Display), PDP (Plasma Display Panel), OLED (Organic Light Emitting Diode), Micro LED (Light Emitting Diode), etc. on devices such as outdoor locations or street furniture. It is a medium that displays various contents and commercial advertisements by installing display panels. It can be installed not only in homes but also in the public movement lines such as apartment elevators, subway stations, subways, buses, universities, banks, convenience stores, discount stores, and shopping malls. there is.

Recently, as digital signage has become larger and larger, much research has been conducted to improve the image quality of display panels.

Such digital signage is implemented as a modular display device composed of several display modules combined. These module displays can use light emitting elements (LEDs) as pixels.

Figure 1 schematically shows an example of a modular display device configured by combining several general display modules.

Referring to FIG. 1, a modular display device 1 is shown in which a plurality of display modules 2 are combined to form a large area.

However, in this display device 1, a phenomenon in which bright lines A and B are visible may occur at the side joint of the module 2 due to the multiplication of the LED, which is a light source.

For example, when small-sized display modules 2 are connected to each other to form a large display device 1, a phenomenon may occur where the joint area of the display module 2 appears as a bright line compared to other surfaces. This phenomenon may hinder visibility when the small-sized display modules 2 combined together appear to be connected as a single display.

Therefore, a solution to these problems is emerging.

According to an embodiment of the present invention, when a plurality of unit display devices are combined with each other in a planar direction to form a larger display device, the phenomenon in which the joint area of the unit display devices appears as a bright line compared to other surfaces is prevented. The object is to provide a display device capable of producing the same and its manufacturing method.

In addition, when a plurality of unit display devices are combined together in a planar direction to form a larger display device, the multiple unit display devices combined with each other appear connected as a single display, but the display device and the manufacture of the same allow visibility to be unobstructed. We would like to provide a method.

As a first aspect of the present invention for achieving the above-described object, the present invention includes a wiring board; electrode pads partitioned on the wiring board to form a plurality of unit pixels; a light emitting element connected to the electrode pad; an encapsulation layer formed on the wiring board to cover the light emitting device; A black coating layer located on a side of the encapsulation layer and containing a black pigment in a resin-based base coating agent; And it may include an optical film positioned on the encapsulation layer.

As an exemplary embodiment, the base coating agent may include acrylic, silicone, or acrylic resin.

As an exemplary embodiment, the black pigment in the black coating layer may have a content of 0.01 to 5 wt%.

As an exemplary embodiment, individual particles of the black pigment may have a size of 20 nm to 3 μm.

As an exemplary embodiment, the height of the black coating layer may match the thickness of the encapsulation layer.

As an exemplary embodiment, the thickness of the black coating layer may be 10 to 30 ㎛.

As an exemplary embodiment, the ratio of the thickness of the black coating layer to the thickness of the encapsulation layer may be 2 to 21%.

As an exemplary embodiment, it may include a light scattering agent distributed in at least one of the encapsulation layer and the optical layer.

As an exemplary embodiment, the light scattering agent may include at least one of Zr, Si, Ti, Zn, BaS, and oxides thereof.

As an exemplary embodiment, the optical layer includes: a transparent adhesive layer; And it may include AG (Anti Glare) and AF (Anti Fingerprint) functional coatings located on the transparent adhesive layer.

As a second aspect of the present invention for achieving the above-described object, the present invention includes a wiring board, an electrode pad partitioned on the wiring board and forming a plurality of unit pixels, a light emitting element connected to the electrode pad, and the providing an assembly including an encapsulation layer formed on the wiring board to cover a light emitting device; And it may include forming a black coating layer by stamping a coating ink containing a black pigment in a resin-based base coating agent on the side of the encapsulation layer.

As an exemplary embodiment, the coating ink may include a terminal functional group to improve adhesion to the encapsulation layer.

As an exemplary embodiment, the terminal functional group may have an amount of 0.001 to 10 wt% based on the entire black coating layer.

According to an exemplary embodiment of the present invention, the following effects are achieved.

First, when multiple unit display devices are combined with each other in a planar direction to form a larger display device, a phenomenon in which the joint area of the unit display devices appears as a bright line compared to other surfaces can be prevented.

Accordingly, a plurality of display devices combined with each other appear connected as a single display, but visibility may not be disturbed.

Figure 2 is a cross-sectional schematic diagram showing a display device according to a first embodiment of the present invention.

3 and 4 are cross-sectional schematic diagrams showing the manufacturing process of the display device according to the first embodiment of the present invention.

Figure 5 is a cross-sectional schematic diagram showing a display device according to a second embodiment of the present invention.

Figure 6 is an enlarged view of the black coating layer of Figure 5.

Figure 7 is a photograph showing examples of black coating layers formed by a stamping process.

Figure 8 is a cross-sectional view showing a display device according to a second embodiment of the present invention.

Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. However, identical or similar components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted. The suffixes “module” and “part” for components used in the following description are given or used interchangeably only for the ease of preparing the specification, and do not have distinct meanings or roles in themselves.

In addition, in describing the embodiments disclosed in this specification, to the extent that it is judged that a detailed description of related known technologies may obscure the gist of the embodiments disclosed in this specification, the embodiments disclosed in this specification will be described in detail with reference to the attached drawings. In the description, identical or similar components will be given the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted.

The suffixes “module” and “part” for components used in the following description are given or used interchangeably only for the ease of preparing the specification, and do not have distinct meanings or roles in themselves. Additionally, in describing the embodiments disclosed in this specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in this specification, the detailed descriptions will be omitted. In addition, it should be noted that the attached drawings are only for easy understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical idea disclosed in this specification by the attached drawings.

Furthermore, although each drawing is described for convenience of explanation, it is within the scope of the present invention for a person skilled in the art to implement another embodiment by combining at least two or more drawings.

Additionally, when an element such as a layer, region or substrate is referred to as being “on” another component, it is to be understood that it may be present directly on the other element or that there may be intermediate elements in between. There will be.

The display device described in this specification is a concept that includes all display devices that display information using a unit pixel or a set of unit pixels. Therefore, it is not limited to finished products but can also be applied to parts. For example, a panel corresponding to a part of a digital TV also independently corresponds to a display device in this specification. Finished products include mobile phones, smart phones, laptop computers, digital broadcasting terminals, PDAs (personal digital assistants), PMPs (portable multimedia players), navigation, Slate PCs, Tablet PCs, and Ultra This may include books, digital TVs, desktop computers, etc.

However, those skilled in the art will easily understand that the configuration according to the embodiments described in this specification may be applied to a device capable of displaying, even if it is a new product type that is developed in the future.

In addition, the semiconductor light emitting device mentioned in this specification includes LED, mini LED, micro LED, etc., and may be used interchangeably.

As shown in FIG. 2, the display device 10 may largely include a display panel 200 and an optical layer 100 located on the display panel 200.

The display panel 200 may include light emitting elements 220 arranged on a wiring board 210 to form a unit subpixel or pixel. A display image can be implemented by arranging the light emitting elements 220 forming such a unit subpixel or pixel.

Although FIG. 2 shows one light-emitting device 220, multiple light-emitting devices 220 forming a unit subpixel or pixel may be provided (see FIG. 8).

In this way, a unit subpixel may be formed by an individual light emitting device 220. For example, the light emitting device 220 forming a unit subpixel may include a red light emitting device, a green light emitting device, and a blue light emitting device.

These individual light emitting devices 220 may be electrically connected to the unit electrode pad 230 located on the wiring board 210 using an electrical bonding agent such as solder 231. That is, the two electrodes 221 of the light emitting device 220 may each be electrically connected to a pair of unit electrode pads 230.

Meanwhile, the light emitting device 220 may include a stacked light emitting device (LED) in which red, green, and blue colors are formed into a single chip structure. This stacked light emitting device 220 can implement a unit pixel.

In FIG. 2 , a component located at the bottom of the wiring board 210 may be a driver IC for driving the light emitting device 220 . The explanation for this is omitted.

An encapsulation layer 250 may be located on the light emitting device 220. The encapsulation layer 250 may be disposed on the wiring board 210 provided with the electrode pad 230. The encapsulation layer 250 is made of an insulating and flexible material such as polyimide (PI), PET, PEN, or silicone, and can be integrated with the wiring board 210 to form one board. . In this way, the wiring board 210 provided with the electrode pad 230 may include a wiring electrode (not shown) connected to the electrode pad 230. A detailed description of this will be omitted.

For example, a thin film transistor (TFT) is connected to the wiring electrode to implement an active matrix (AM) type display device. For example, the wiring board 210 may be a TFT board. As another example, the substrate 210 may be a passive matrix (PM) type substrate.

The encapsulation layer 250 may include filler 270. This filler 270 may have optical properties that refract or scatter light emitted from the light emitting device 220.

Light emitted from the light emitting device 220 may be refracted or scattered by the pillar 270. Light scattered from the filler 270 may be emitted to the outside of the encapsulation layer 250.

After cured, the encapsulation layer 250 may be transparent. For example, the cured encapsulation layer 250 containing silicon may have a refractive index of 1.4 to 1.6. Accordingly, light may be totally reflected inside the encapsulation layer 250. The filler 270 may refract or scatter light that is totally reflected inside the encapsulation layer 250.

That is, the filler 270 may act as a light scattering agent. Accordingly, the filler 270 may be referred to as a light scattering agent. In the following description, the filler and the light scattering agent may refer to the same entity.

The filler 270 may include at least one of Zr, Si, Ti, Zn, BaS, and oxides thereof. For example, the filler 270 may be spherical or amorphous.

The diameter or size of the filler 270 may be 10 nanometers (nm) to 10 micrometers (㎛). The content (weight ratio) of the filler 270 may be 0.01% to 30% of the encapsulation layer 250. For example, the filler 270 may include at least one of Zr oxide and Si oxide.

Although not shown separately, a modular display device that implements a larger display area can be implemented by combining a plurality of display devices 10. For example, the display device 10 may be one display module that forms a modular display device. In this way, a plurality of display devices 10 can be combined in parallel to form a modular display device. A detailed description of this will be omitted.

An optical layer 100 may be located on the display panel 200. This optical layer 100 may constitute a composite optical film. In this way, the optical layer 100 can be attached to the display panel 200. The display panel 200 to which the optical layer 100 is attached may be referred to as a display device 10.

Here, the optical layer 100 may include an optically transparent adhesive layer (OCA) 110 attached to the display panel 200 as an exemplary embodiment.

In addition, on the transparent adhesive layer 110, a transparent polyimide (colorless polyimide; CPI) film 120, a black dye layer 130, an anti-glare (AG) coating layer 140, and an anti-fingerprint (AF) coating layer 150 are formed on the transparent adhesive layer 110. At least one more may be provided.

For example, a composite optical film composed of a transparent polyimide film 120, a black coating layer 130, an anti-glare (AG) coating layer 140, and an anti-fingerprint (AF) coating layer 150 is formed by forming a transparent adhesive layer (110). It can be attached to the encapsulation layer 250 by .

A black coating layer 260 containing a black pigment in a resin-based base coating may be located on the side of the encapsulation layer 250. Here, the base coating agent may include acrylic, silicone, or acrylic resin. The transmittance of this black coating layer 260 may be 25 to 60%.

As an exemplary embodiment, the black pigment in the black coating layer 260 may have a content of 0.01 to 5 wt% (weight percent). For example, the black coating layer 260 may be formed by applying a base coating agent containing black pigment. This black coating layer 260 may be formed by a stamping method. This will be described in detail later.

After the base coating containing the black pigment is cured, the black pigment in the black coating layer 260 may have a content of 0.01 to 5 wt%. As an exemplary embodiment, individual particles of black pigment in black coating layer 260 may have a size of 20 nm to 3 μm.

The hardness of the base coating agent may be A30 to D60 based on the Shore durometer. In the Shore hardness scale, the larger the number, the greater the hardness, and D has greater hardness than A.

In this example, performance can be maintained when the surface friction test (rubbing test, 30 times at 1 kgf) is performed 100 times at A30 or higher. Meanwhile, it can be confirmed that surface damage occurs in materials below A30 in surface friction tests.

As an exemplary embodiment, the height (H) of the black coating layer 260 may match the thickness of the encapsulation layer 250. Substantially, the side of the encapsulation layer 250 where the light emitting device 220 is located may be coated with the black coating layer 260. As an exemplary embodiment, the thickness (W) of the black coating layer 260 may be 10 to 30 ㎛.

In the case where the black coating layer 260 is provided with at least one of the height (H) and thickness (W), the display device 10 is combined with each other in the plane direction to form a larger display device. This can prevent the phenomenon where the joint area of the device 10 appears as a bright line compared to other surfaces. Accordingly, the multiple display devices 10 coupled to each other appear connected as one display, but visibility may not be disturbed.

For example, if the height (H) of the black coating layer 260 is lower than the thickness of the encapsulation layer 250, the effect of reducing bright lines may not occur. Additionally, when the height H of the black coating layer 260 is greater than the thickness of the encapsulation layer 250, the space between the plurality of display devices 10 coupled to each other may be viewed as a darker line (dark line).

For example, if the thickness (W) of the black coating layer 260 is less than 10 ㎛, the effect of reducing bright lines may not occur. Additionally, when the thickness (W) of the black coating layer 260 is greater than 30 ㎛, the space between the plurality of display devices 10 coupled to each other may be viewed as a darker line (dark line).

As an exemplary embodiment, Table 1 below shows the ratio of the thickness of the black coating layer 260 to the thickness of the encapsulation layer 250 where the light emitting device 220, which exhibits the above effect, is located. As such, the ratio of the thickness of the black coating layer 260 to the thickness of the encapsulation layer 250 may be 2 to 21%. That is, if the ratio of the thickness of the black coating layer 260 to the thickness of the encapsulation layer 250 is less than 2%, the bright line may not be reduced, and the thickness of the black coating layer 260 relative to the thickness of the encapsulation layer 250 may not be reduced. If the ratio is more than 21%, it may actually be recognized as a dark line.

Table 2 below shows the thickness (W) of the applied black coating layer 260 and the light emission by the light emitting element 220, which are related to the phenomenon in which the joint area of the display device 10 appears as a bright line (bright line) compared to the other side. It shows the relationship with luminance.

When the thickness (W) of the black coating layer 260 is 10 ㎛ (um), the luminance by the light emitting device 220 may be 650 nit, and the thickness (W) of the black coating layer 260 is 20 ㎛ (um). In this case, the luminance by the light-emitting device 220 may be 580 nit. Additionally, when the thickness (W) of the black coating layer 260 is 30 μm (um), the luminance by the light-emitting device 220 may be 460 nit. It can be. In this way, it can be seen that luminance decreases as the thickness (W) of the black coating layer 260 increases. In the case of this embodiment, for example, when the thickness (W) of the black coating layer 260 increases by 1 ㎛, the luminance may decrease by 15 to 65 nits.

Hereinafter, the manufacturing process of the display device 10 according to the first embodiment will be described with reference to FIGS. 3 and 4.

As mentioned above, the black coating layer 260 may be formed by applying a base coating agent containing a black pigment. This black coating layer 260 may be formed by a stamping method.

For example, an electrode pad 230 divided on a wiring board 210 as shown in FIG. 4 and constituting a plurality of unit pixels, a light emitting element 220 connected to the electrode pad 230, and a light emitting element ( In a state in which an assembly including an encapsulation layer 250 formed on the wiring board 210 to cover the wiring board 220 is manufactured, a base coating agent containing a black pigment is stamped on the side of the encapsulation layer 250 to form a black coating layer ( 260) can be formed.

First, as shown in FIG. 3, the coating ink 310 filled in the ink jig 300 may be temporarily applied to the end side of the stamp 400. Here, the coating ink 310 may include a black pigment in a resin-based base coating agent.

The base coating agent may have a viscosity of 1000 to 6000 cps (centi poise). If the viscosity of the base coating agent is 1000 cps or less, the coating ink 310 may flow after stamping. Meanwhile, if the viscosity of the base coating agent is 6000 cps or more, the uniformity of the coating ink 310 may be reduced.

Thereafter, as shown in FIG. 4, the black coating layer 260 can be formed by stamping the side of the encapsulation layer 250 using a stamp 400 on which the coating ink 310 is temporarily applied. In this way, the applied coating ink 310 may be cured and/or dried to form a black coating layer 260.

As an exemplary embodiment, the coating ink 310 may include a terminal functional group to improve adhesion to the encapsulation layer 250. For example, after the black coating layer 260 is cured, the terminal functional group may have a content of 0.001 to 10 wt% based on the entire black coating layer 260.

In this way, in order to reduce the variation of the black coating layer 260 and improve uniformity, the adhesion of the coating ink 310 can be increased to prevent damage to the black coating layer 260 due to external force.

As described above, the content of the terminal functional group (for example, -OH group) that can improve adhesion within the black coating layer 260 may be at least 0.001 wt% and at most 10%. The critical meaning may correspond to the content (0.001 wt%) for developing minimum adhesive force and the maximum value (10 wt%) for maintaining the physical properties (hardness, transmittance) of the black coating layer 260 itself.

This black coating layer 260 may have the physical properties described above. Therefore, overlapping descriptions are omitted.

Figure 5 is a cross-sectional schematic diagram showing a display device according to a second embodiment of the present invention. Figure 6 is an enlarged view of the black coating layer of Figure 5.

As shown in FIG. 5, the display device 10 may largely include a display panel 200 and an optical layer 100 located on the display panel 200.

An encapsulation layer 250 may be located on the light emitting device 220. The encapsulation layer 250 may be disposed on the wiring board 210 provided with the electrode pad 230.

Since this display panel 200 may be the same as that of the first embodiment described above, redundant description will be omitted.

Additionally, a composite optical layer 131 including an anti-glare (AG) coating layer and an anti-fingerprint (AF) coating layer may be provided on the transparent adhesive layer 110.

For example, the composite optical layer 131 including an anti-glare (AG) coating layer and an anti-fingerprint (AF) coating layer may be attached to the encapsulation layer 250 by the transparent adhesive layer 110.

For example, the transparent adhesive layer 110 may include filler 270. This filler 270 may have optical properties that refract or scatter light emitted from the light emitting device 220.

Light emitted from the light emitting device 220 may be refracted or scattered by the pillar 270. Light scattered from the filler 270 may be emitted to the outside of the transparent adhesive layer 110.

The filler 270 may refract or scatter light that is totally reflected inside the encapsulation layer 250. That is, the filler 270 may act as a light scattering agent. Accordingly, the filler 270 may be referred to as a light scattering agent. Redundant description of the filler 270 will be omitted.

A black coating layer 260 containing a black pigment in a resin-based base coating may be located on the side of the encapsulation layer 250. Here, the base coating agent may include acrylic, silicone, or acrylic resin.

As an exemplary embodiment, the black pigment in the black coating layer 260 may have a content of 0.01 to 5 wt%. For example, the black coating layer 260 may be formed by applying a base coating agent containing black pigment.

After the base coating containing the black pigment is cured, the black pigment in the black coating layer 260 may have a content of 0.01 to 5 wt%.

Figure 6 shows the black coating layer 260 schematically enlarged. As an exemplary embodiment, individual particles 271 of black pigment within the black coating layer 260 may have a size of 20 nm to 3 μm.

Figure 7 is a photograph showing examples of a black coating layer formed by a stamping process.

Referring to FIG. 7, the shape of the black coating layer 260 for each coating ink formed by the stamping method is shown. That is, differences may occur in the shape of the black coating layer 260 formed depending on the type of ink used.

In this way, the black coating layer 260 can be formed using various inks. In this example, in cases (a) and (c), it can be used as a black coating layer 260 having the characteristics described above.

Referring to FIG. 8, the display device 11 described with reference to FIG. 5 shows a unit module display device 12 in which a plurality of light emitting elements 220 are formed into pixels or subpixels.

Although FIG. 8 shows a state in which three light-emitting devices 220 are provided, it goes without saying that a greater number of light-emitting devices 220 can be provided in the unit display device 12.

At this time, an encapsulation layer 250 may be provided to cover the plurality of light emitting devices 220. Additionally, the black coating layer 260 may be located on the end side of the encapsulation layer 250.

In this way, when the unit display devices 12 having the black coating layer 260 on the end sides are combined to form a larger display device, the joint portion of the display device 12 has a bright line (bright line) compared to the other side. The visible phenomenon can be prevented. Accordingly, the multiple display devices 12 coupled to each other appear connected as one display, but visibility may not be disturbed.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the above description has been made focusing on the examples, this is only an example and does not limit the present invention, and those skilled in the art will understand the above examples without departing from the essential characteristics of the present embodiment. You will be able to see that various modifications and applications are possible. For example, each component specifically shown in the examples can be modified and implemented. And these variations and differences related to application should be construed as being included in the scope of the present invention as defined in the appended claims.

According to the present invention, a display device using an LED (Light Emitting Diode) and a method of manufacturing the same can be provided.

Claims

wiring board;

electrode pads partitioned on the wiring board to form a plurality of unit pixels;

a light emitting element connected to the electrode pad;

an encapsulation layer formed on the wiring board to cover the light emitting device;

A black coating layer located on a side of the encapsulation layer and containing a black pigment in a resin-based base coating agent; and

A display device comprising an optical film positioned on the encapsulation layer.
The display device of claim 1, wherein the base coating agent includes acrylic, silicone, or acrylic resin.
The display device according to claim 1, wherein the black pigment in the black coating layer has a content of 0.01 to 5 wt%.
The display device according to claim 1, wherein individual particles of the black pigment have a size of 20 nm to 3 ㎛.
The display device of claim 1, wherein the height of the black coating layer matches the thickness of the encapsulation layer.
The display device according to claim 1, wherein the black coating layer has a thickness of 10 to 30 ㎛.
The display device according to claim 6, wherein a ratio of the thickness of the black coating layer to the thickness of the encapsulation layer is 2 to 21%.
The display device according to claim 1, comprising a light scattering agent distributed in at least one of the encapsulation layer and the optical layer.
The display device according to claim 8, wherein the light scattering agent includes at least one of Zr, Si, Ti, Zn, BaS, and oxides thereof.
According to paragraph 1,

The optical layer is,

transparent adhesive layer; and

A display device comprising AG (Anti Glare) and AF (Anti Fingerprint) functional coatings located on the transparent adhesive layer.
A wiring board, electrode pads partitioned on the wiring board and constituting a plurality of unit pixels, a light emitting element connected to the electrode pad, and an encapsulation layer formed on the wiring board to cover the plurality of light emitting elements. providing an assembly; and

A method of manufacturing a display device, comprising the step of forming a black coating layer on a side of the encapsulation layer by stamping a coating ink containing a black pigment in a resin-based base coating agent.
The method of manufacturing a display device according to claim 11, wherein the coating ink includes a terminal functional group to improve adhesion to the encapsulation layer.
The method of claim 12, wherein the terminal functional group has a content of 0.001 to 10 wt% based on the entire black coating layer.
The method of manufacturing a display device according to claim 11, wherein the black pigment in the black coating layer has a content of 0.01 to 5 wt%.
The method of manufacturing a display device according to claim 11, wherein the individual particles of the black pigment have a size of 20 nm to 3 ㎛.