TWI685098B - Spliced led circuit board - Google Patents

Spliced led circuit board Download PDF

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Publication number
TWI685098B
TWI685098B TW108104126A TW108104126A TWI685098B TW I685098 B TWI685098 B TW I685098B TW 108104126 A TW108104126 A TW 108104126A TW 108104126 A TW108104126 A TW 108104126A TW I685098 B TWI685098 B TW I685098B
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Taiwan
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light
emitting diode
row
diode chips
circuit board
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TW108104126A
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Chinese (zh)
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TW202030879A (en
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李遠智
李家銘
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同泰電子科技股份有限公司
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Abstract

A spliced LED circuit board includes a first LED carrier plates having multiple parallel first and second LED chips. The first and the second substrates thereof have a first and a second splicing sides and multiple first and second protrusion portions, respectively. The first LED carrier plate further includes at least one column of first protrusion LED chips disposed on the first protrusion portion. The second LED carrier plate further includes at least one column of second protrusion LED chips disposed on the second protrusion portion. The first and the second protrusion portions are engaged with each other. The first and second protrusion LED chips are arranged on the same extension line.

Description

拼接式發光二極體電路板Spliced light-emitting diode circuit board

本發明是關於一種電路板結構，特別是一種用於發光二極體載板的拼接式電路板。The invention relates to a circuit board structure, in particular to a spliced circuit board used for a light-emitting diode carrier board.

目前，發光二極體（簡稱LED）業者發展出次毫米發光二極體（Mini LED）及微發光二極體（Micro LED）技術，與現今一般LED背光模組相比，採用Mini LED或Micro LED背光時，可以更細緻地進行調光，對比度及色彩表現度也能顯著提升。At present, light emitting diode (LED) manufacturers have developed sub-millimeter light emitting diode (Mini LED) and micro light emitting diode (Micro LED) technologies. Compared with today's general LED backlight modules, Mini LED or Micro With LED backlighting, dimming can be performed in more detail, and contrast and color expression can also be significantly improved.

另一方面，目前LED顯示器所要求的解析度越來越高，高階LED顯示器也有整體尺寸大型化的趨勢，而由於現有載板技術尚無法做出特大尺寸的LED載板，因此目前板與板之間多利用熱壓（hotbar）軟板熱壓接合來加以連接，但此製程較為複雜，使得大型LED載板製作成本較高。On the other hand, the resolution required by LED displays is getting higher and higher, and high-end LED displays are also tending to become larger in overall size. Since the existing carrier board technology is still unable to make LED carrier boards of extra large size, the current board and board Most of them are connected by hot-bar (hotbar) soft board hot-press bonding, but this process is more complicated, which makes the production cost of large LED carrier board higher.

本發明之主要目的在於提供一種容易製作為大尺寸且能維持解析度的發光二極體電路板。The main object of the present invention is to provide a light-emitting diode circuit board that can be easily manufactured to a large size and can maintain resolution.

為了達成上述及其他目的，本發明提供一種拼接式發光二極體電路板，其包括一第一發光二極體載板及一第二發光二極體載板。第一發光二極體載板包括一第一基板及多列平行設於該第一基板的第一發光二極體晶片，第一基板具有一第一拼接邊及多個自第一拼接邊朝一拼接方向延伸的第一凸出部，任兩相鄰第一凸出部之間具有一第一凹部，第一發光二極體載板更包括至少一列設於該些第一凸出部的第一凸出部發光二極體晶片；第二發光二極體載板包括一第二基板及多列平行設於第二基板的第二發光二極體晶片，第二基板具有一第二拼接邊及多個自第二拼接邊朝相反於拼接方向延伸的第二凸出部，任兩相鄰所述第二凸出部之間具有一第二凹部，第二發光二極體載板更包括至少一列設於該些第二凸出部的第二凸出部發光二極體晶片；其中，該些第一凸出部分別嵌接於該些第二凹部，該些第二凸出部分別嵌接於該些第一凹部，該至少一列第一凸出部發光二極體晶片分別與該至少一列第二凸出部發光二極體晶片在同一延伸線上排列。To achieve the above and other objects, the present invention provides a spliced light-emitting diode circuit board, which includes a first light-emitting diode carrier board and a second light-emitting diode carrier board. The first light-emitting diode carrier includes a first substrate and a plurality of rows of first light-emitting diode chips disposed in parallel on the first substrate, the first substrate has a first splicing edge and a plurality of The first protrusion extending in the splicing direction has a first recess between any two adjacent first protrusions, and the first light-emitting diode carrier further includes at least one row of first protrusions disposed on the first protrusions A projection light-emitting diode chip; the second light-emitting diode carrier includes a second substrate and a plurality of rows of second light-emitting diode chips arranged in parallel on the second substrate, the second substrate has a second splicing edge And a plurality of second protruding parts extending from the second splicing edge in the direction opposite to the splicing direction, a second concave part is provided between any two adjacent second protruding parts, and the second light-emitting diode carrier board further includes At least one row of second projection light emitting diode chips disposed on the second projections; wherein the first projections are respectively embedded in the second recesses, and the second projections are respectively Embedded in the first concave portions, the at least one row of first protrusion light-emitting diode chips and the at least one row of second protrusion light-emitting diode chips are respectively arranged on the same extension line.

藉由上述設計，本發明的發光二極體電路板能在不通過熱壓接合的方式下，將複數發光二極體載板加以連接，其製程簡易，容易製作大尺寸發光二極體電路板，同時於凸出部接合處還設有至少一列發光二極體晶片，使得本發明的拼接式設計不會導致顯示器解析度下降，進而滿足使用者的需求。With the above design, the light-emitting diode circuit board of the present invention can be connected to a plurality of light-emitting diode carrier boards without thermocompression bonding, the manufacturing process is simple, and it is easy to manufacture a large-sized light-emitting diode circuit board At the same time, there is at least one row of light-emitting diode chips at the junction of the protrusions, so that the spliced design of the present invention will not cause the resolution of the display to decrease, thereby meeting the needs of users.

請參考第1、2圖，所繪示者為本發明拼接式發光二極體電路板的第一實施例，該拼接式發光二極體電路板例如可應用於發光二極體顯示器，或可應用於液晶顯示器的背光模組。該拼接式發光二極體電路板包括一第一發光二極體載板10及一第二發光二極體載板20。Please refer to FIG. 1 and FIG. 2, which shows the first embodiment of the spliced light-emitting diode circuit board of the present invention. The spliced light-emitting diode circuit board can be applied to a light-emitting diode display, for example, or Backlight module applied to LCD. The spliced light-emitting diode circuit board includes a first light-emitting diode carrier board 10 and a second light-emitting diode carrier board 20.

第一發光二極體載板10包括一第一基板11及多列平行設於第一基板11的第一發光二極體晶片12。第一基板11具有一第一拼接邊13及多個自第一拼接邊13朝一拼接方向D延伸的第一凸出部14，任兩相鄰第一凸出部14之間具有一第一凹部15，也就是說，第一基板11在第一拼接邊13形成一連續方波狀的凹凸結構。此外，第一發光二極體載板10更包括一列設於該些第一凸出部14的第一凸出部發光二極體晶片16。The first light-emitting diode carrier 10 includes a first substrate 11 and a plurality of first light-emitting diode chips 12 arranged in parallel on the first substrate 11. The first substrate 11 has a first splicing edge 13 and a plurality of first protrusions 14 extending from the first splicing edge 13 in a splicing direction D, and there is a first recess between any two adjacent first protrusions 14 15, that is to say, the first substrate 11 forms a continuous square wave-shaped concave-convex structure on the first splicing edge 13. In addition, the first light emitting diode carrier 10 further includes a row of first protrusion light emitting diode chips 16 disposed on the first protrusions 14.

與第一發光二極體載板10類似，第二發光二極體載板20包括一第二基板21及多列平行設於第二基板21的第二發光二極體晶片22。第二基板21具有一第二拼接邊23及多個自第二拼接邊23朝相反於拼接方向D延伸的第二凸出部24，任兩相鄰第二凸出部24之間具有一第二凹部25，也就是說，第二基板21也在第二拼接邊23形成一連續方波狀的凹凸結構，且第一、第二基板的凹凸結構彼此形狀互補。第二發光二極體載板20也同樣包括一列設於該些第二凸出部24的第二凸出部發光二極體晶片26。Similar to the first light-emitting diode carrier 10, the second light-emitting diode carrier 20 includes a second substrate 21 and a plurality of rows of second light-emitting diode chips 22 arranged in parallel on the second substrate 21. The second substrate 21 has a second splicing edge 23 and a plurality of second protrusions 24 extending from the second splicing edge 23 opposite to the splicing direction D. Between any two adjacent second protrusions 24 there is a first The two concave portions 25, that is to say, the second substrate 21 also forms a continuous square wave-shaped concave-convex structure on the second splicing edge 23, and the concave-convex structures of the first and second substrates are complementary in shape. The second light-emitting diode carrier 20 also includes a row of second protrusion light-emitting diode chips 26 disposed on the second protrusions 24.

其中，第一凸出部14分別嵌接於該些第二凹部25，且第二凸出部24也分別嵌接於該些第一凹部15，使得第一、第二發光二極體載板得以形成無縫拼接，或至少幾近於無縫拼接，兩者拼接後，該列第一凸出部發光二極體晶片16與該列第二凸出部發光二極體晶片26可在同一條延伸線L上排列。本實施例中，延伸線L垂直於拼接方向D，且延伸線L平行於每一列第一發光二極體晶片12，而每一列第一發光二極體晶片12又都平行於每一列第二發光二極體晶片22。此外，任兩相鄰列第一發光二極體晶片12之間具有一第一間隙G1，任兩相鄰列第二發光二極體晶片22之間具有一第二間隙G2，該列在同一延伸線L上排列的第一、第二凸出部發光二極體晶片16、26與其相鄰的另一列第一發光二極體晶片12之間具有一第三間隙G3，該列在同一延伸線L上排列的第一、第二凸出部發光二極體晶片16、26與其相鄰的另一列第二發光二極體晶片22之間具有一第四間隙G4，且G1、G2、G3及G4彼此實質相等，也就是說，第一、第二發光二極體晶片及第一、第二凸出部發光二極體晶片可以形成一發光二極體晶片陣列，且該陣列在第一、第二發光二極體載板的拼接處不形成有斷點，從而不會犧牲發光二極體顯示器的解析度。Wherein, the first protruding portions 14 are respectively embedded in the second concave portions 25, and the second protruding portions 24 are also embedded in the first concave portions 15, respectively, so that the first and second light-emitting diode carrier plates To form a seamless splice, or at least almost seamless splice, after the two are spliced, the row of first projection light-emitting diode chips 16 and the row of second projection light-emitting diode chips 26 may be in the same An extension line L is arranged. In this embodiment, the extension line L is perpendicular to the splicing direction D, and the extension line L is parallel to each row of first light-emitting diode chips 12, and each row of first light-emitting diode chips 12 is parallel to each row of second Light-emitting diode wafer 22. In addition, there is a first gap G1 between any two adjacent rows of first light-emitting diode chips 12, and there is a second gap G2 between any two adjacent rows of second light-emitting diode chips 22, which are in the same row There is a third gap G3 between the first and second projection light-emitting diode chips 16 and 26 arranged on the extension line L and another row of the first light-emitting diode chips 12 adjacent to each other There is a fourth gap G4 between the first and second protrusion light-emitting diode chips 16, 26 arranged on the line L and another row of second light-emitting diode chips 22 adjacent thereto, and G1, G2, G3 And G4 are substantially equal to each other, that is to say, the first and second light-emitting diode chips and the first and second projection light-emitting diode chips can form a light-emitting diode chip array, and the array is in the first 2. No breakpoint is formed at the joint of the second light-emitting diode carrier board, so that the resolution of the light-emitting diode display is not sacrificed.

需說明的是，前述第一、第二基板具有至少一介電層及用以電連接於該些發光二極體晶片的電路結構，第一、第二基板表面也可設有防焊層。It should be noted that the first and second substrates have at least one dielectric layer and a circuit structure for electrically connecting to the light-emitting diode chips. The surface of the first and second substrates may also be provided with a solder mask layer.

需說明的是，前述第一、第二發光二極體晶片及第一、第二凸出部發光二極體晶片可以是水平式發光二極體晶片、垂直式發光二極體晶片或覆晶發光二極體晶片。It should be noted that the first and second light-emitting diode chips and the first and second protrusion light-emitting diode chips may be horizontal light-emitting diode chips, vertical light-emitting diode chips or flip-chips Light emitting diode chip.

請參考第3圖，所繪示者為本發明拼接式發光二極體電路板的第二實施例，其大致與第一實施例雷同，差異之處在於，其第一凸出部14上具有兩列第一凸出部發光二極體晶片16，其第二凸出部24也具有兩列第二凸出部發光二極體晶片26，每一列第一凸出部發光二極體晶片16恰與其中一列第二凸出部發光二極體晶片26在同一延伸線上排列，這兩列在同一延伸線上排列的第一、第二凸出部發光二極體晶片16、26之間具有一第五間隙G5，且G5同樣實質等於G1、G2、G3及G4，從而同樣可以形成解析度無斷點的發光二極體電路板拼接結構。在其他可能的實施方式中，第一、第二凸出部發光二極體晶片的列數可視需求調整為至少一列。Please refer to FIG. 3, which shows a second embodiment of the spliced light-emitting diode circuit board of the present invention, which is substantially the same as the first embodiment, except that the first protrusion 14 has The two rows of first protrusion light-emitting diode chips 16, the second protrusions 24 also have two rows of second protrusion light-emitting diode chips 26, each row of first protrusion light-emitting diode chips 16 It is arranged on the same extension line with one row of the second protrusion light-emitting diode chips 26. The two rows of the first and second protrusion light-emitting diode chips 16, 26 are arranged on the same extension line. The fifth gap G5, which is also substantially equal to G1, G2, G3, and G4, can also form a splicing structure of a light-emitting diode circuit board with no break point in resolution. In other possible implementation manners, the number of rows of the first and second protrusion light-emitting diode chips can be adjusted to at least one row according to requirements.

請參考第4圖，在其中一種可能的實施方式中，為了將第一發光二極體載板10與第二發光二極體載板20穩固拼接，第一拼接邊及該些第一凸出部至少其中一者可具有至少一第一金屬接點17，第二拼接邊及該些第二凸出部至少其中一者可具有至少一第二金屬接點27，該至少一第一金屬接點17分別對應於該至少一第二金屬接點27，且所述拼接式發光二極體電路板更包括至少一焊料30（例如錫）焊固於相對應的第一、第二金屬接點17、27。Please refer to FIG. 4, in one of the possible implementation manners, in order to stably join the first light-emitting diode carrier 10 and the second light-emitting diode carrier 20, the first splicing edge and the first protrusions At least one of the parts may have at least one first metal contact 17, at least one of the second splicing edge and the second protrusions may have at least one second metal contact 27, the at least one first metal contact Points 17 respectively correspond to the at least one second metal contact 27, and the spliced light-emitting diode circuit board further includes at least one solder 30 (such as tin) soldered to the corresponding first and second metal contacts 17, 27.

請參考第5圖，在其中一種可能的實施方式中，為了將第一發光二極體載板10與第二發光二極體載板20穩固拼接，第一拼接邊及該些第一凸出部至少其中一者具有至少一第一插槽18，該第一插槽18的至少一個表面具有第一金屬接點17，而第二拼接邊及該些第二凸出部至少其中一者具有至少一第一插接塊28，該第一插接塊28的至少一個表面具有第二金屬接點27，至少一個焊料30同樣可將相對應的第一、第二金屬接點17、27加以焊固。Please refer to FIG. 5, in one of the possible implementation manners, in order to firmly join the first light-emitting diode carrier 10 and the second light-emitting diode carrier 20, the first splicing edge and the first protrusions At least one of the parts has at least one first slot 18, at least one surface of the first slot 18 has a first metal contact 17, and at least one of the second splicing edge and the second protrusions has At least one first plug-in block 28, at least one surface of the first plug-in block 28 has a second metal contact 27, and at least one solder 30 can also apply the corresponding first and second metal contacts 17, 27 Welding.

在其中一種可能的實施方式中，前述焊料除了可將第一、第二發光二極體載板穩固焊接之外，也可以讓第一、第二發光二極體載板中的電路結構形成電性連接。In one of the possible implementation manners, the aforementioned solder can not only firmly solder the first and second light-emitting diode carrier plates, but also allow the circuit structures in the first and second light-emitting diode carrier plates to form electricity. Sexual connection.

10‧‧‧第一發光二極體載板10‧‧‧The first light-emitting diode carrier board

11‧‧‧第一基板11‧‧‧The first substrate

12‧‧‧第一發光二極體晶片12‧‧‧First LED chip

13‧‧‧第一拼接邊13‧‧‧First splicing edge

14‧‧‧第一凸出部14‧‧‧First protrusion

15‧‧‧第一凹部15‧‧‧First recess

16‧‧‧第一凸出部發光二極體晶片16‧‧‧First protruding light-emitting diode chip

17‧‧‧第一金屬接點17‧‧‧First metal contact

18‧‧‧第一插槽18‧‧‧First slot

20‧‧‧第二發光二極體載板20‧‧‧Second light-emitting diode carrier board

21‧‧‧第二基板21‧‧‧Second substrate

22‧‧‧第二發光二極體晶片22‧‧‧Second LED chip

23‧‧‧第二拼接邊23‧‧‧Second stitching edge

24‧‧‧第二凸出部24‧‧‧Second protrusion

25‧‧‧第二凹部25‧‧‧Second recess

26‧‧‧第二凸出部發光二極體晶片26‧‧‧Second protrusion light emitting diode chip

27‧‧‧第二金屬接點27‧‧‧Second metal contact

28‧‧‧第一插接塊28‧‧‧First plug block

30‧‧‧焊料30‧‧‧Solder

D‧‧‧拼接方向D‧‧‧Splicing direction

L‧‧‧延伸線L‧‧‧Extended line

G1、G2、G3、G4、G5‧‧‧間隙G1, G2, G3, G4, G5 ‧‧‧ gap

第1圖為本發明第一實施例的示意圖。Figure 1 is a schematic diagram of a first embodiment of the invention.

第2圖為本發明第一實施例的分解示意圖。FIG. 2 is an exploded schematic view of the first embodiment of the present invention.

第3圖為本發明第二實施例的示意圖。FIG. 3 is a schematic diagram of a second embodiment of the invention.

第4圖為本發明其中一實施例的縱剖面示意圖。FIG. 4 is a schematic longitudinal cross-sectional view of one embodiment of the present invention.

第5圖為本發明另一實施例的縱剖面示意圖。FIG. 5 is a schematic longitudinal cross-sectional view of another embodiment of the present invention.

11‧‧‧第一基板 11‧‧‧The first substrate

10‧‧‧第一發光二極體載板 10‧‧‧The first light-emitting diode carrier board

12‧‧‧第一發光二極體晶片 12‧‧‧First LED chip

13‧‧‧第一拼接邊 13‧‧‧First splicing edge

14‧‧‧第一凸出部 14‧‧‧First protrusion

15‧‧‧第一凹部 15‧‧‧First recess

16‧‧‧第一凸出部發光二極體晶片 16‧‧‧First protruding light-emitting diode chip

20‧‧‧第二發光二極體載板 20‧‧‧Second light-emitting diode carrier board

21‧‧‧第二基板 21‧‧‧Second substrate

22‧‧‧第二發光二極體晶片 22‧‧‧Second LED chip

23‧‧‧第二拼接邊 23‧‧‧Second stitching edge

24‧‧‧第二凸出部 24‧‧‧Second protrusion

25‧‧‧第二凹部 25‧‧‧Second recess

26‧‧‧第二凸出部發光二極體晶片 26‧‧‧Second protrusion light emitting diode chip

D‧‧‧拼接方向 D‧‧‧Splicing direction

L‧‧‧延伸線 L‧‧‧Extended line

G1、G2、G3、G4‧‧‧間隙 G1, G2, G3, G4 ‧‧‧ gap

Claims (5)

一種拼接式發光二極體電路板，包括：一第一發光二極體載板，包括一第一基板及多列平行設於該第一基板的第一發光二極體晶片，該第一基板具有一第一拼接邊及多個自該第一拼接邊朝一拼接方向延伸的第一凸出部，任兩相鄰所述第一凸出部之間具有一第一凹部，該第一發光二極體載板更包括至少一列設於該些第一凸出部的第一凸出部發光二極體晶片；以及一第二發光二極體載板，包括一第二基板及多列平行設於該第二基板的第二發光二極體晶片，該第二基板具有一第二拼接邊及多個自該第二拼接邊朝相反於該拼接方向延伸的第二凸出部，任兩相鄰所述第二凸出部之間具有一第二凹部，該第二發光二極體載板更包括至少一列設於該些第二凸出部的第二凸出部發光二極體晶片；其中，該些第一凸出部分別嵌接於該些第二凹部，該些第二凸出部分別嵌接於該些第一凹部，該至少一列第一凸出部發光二極體晶片分別與該至少一列第二凸出部發光二極體晶片在同一條延伸線上排列；其中，該第一拼接邊及該些第一凸出部至少其中一者具有至少一第一金屬接點，該第二拼接邊及該些第二凸出部至少其中一者具有至少一第二金屬接點，該至少一第一金屬接點分別對應於該至少一第二金屬接點；其中，該第一拼接邊及該些第一凸出部至少其中一者具有至少一第一插槽，該第一插槽的至少一個表面具有所述第一金屬接點，該第二拼接邊及該些第二凸出部至少其中一者具有至少一第一插接塊，該第一插接塊的至少一個表 面具有所述第二金屬接點，該拼接式發光二極體電路板更包括至少一焊料將相對應的第一、第二金屬接點加以焊固。 A spliced light-emitting diode circuit board, including: a first light-emitting diode carrier board, including a first substrate and a plurality of rows of first light-emitting diode chips arranged in parallel on the first substrate, the first substrate It has a first splicing edge and a plurality of first protrusions extending from the first splicing edge in a splicing direction, and there is a first concave portion between any two adjacent first protrusions, the first light emitting two The polar body carrier board further includes at least one row of first protruding portion light emitting diode chips disposed on the first protruding parts; and a second light emitting diode carrier board, including a second substrate and a plurality of rows arranged in parallel A second light-emitting diode chip on the second substrate, the second substrate has a second splicing edge and a plurality of second protrusions extending from the second splicing edge opposite to the splicing direction, any two phases There is a second concave portion adjacent to the second convex portion, and the second light-emitting diode carrier board further includes at least one row of second convex portion light-emitting diode chips disposed on the second convex portions; Wherein, the first convex portions are respectively embedded in the second concave portions, the second convex portions are respectively embedded in the first concave portions, and the at least one row of the first convex portions of the light-emitting diode chips are respectively And the at least one row of second projection light-emitting diode chips are arranged on the same extension line; wherein, at least one of the first splicing edge and the first projections has at least one first metal contact, the At least one of the second splicing edge and the second protrusions has at least one second metal contact, the at least one first metal contact corresponds to the at least one second metal contact; wherein, the first At least one of the splicing edge and the first protrusions has at least one first slot, at least one surface of the first slot has the first metal contact, the second splicing edge and the second At least one of the protrusions has at least one first plug block, and at least one surface of the first plug block The surface has the second metal contact, and the spliced light-emitting diode circuit board further includes at least one solder to solder the corresponding first and second metal contacts. 如請求項1所述的拼接式發光二極體電路板，其中每一列所述第一發光二極體晶片均平行於每一列所述第二發光二極體晶片。 The spliced light-emitting diode circuit board according to claim 1, wherein each row of the first light-emitting diode chips is parallel to each row of the second light-emitting diode chips. 如請求項1或2所述的拼接式發光二極體電路板，其中該延伸線平行於每一列所述第一發光二極體晶片。 The spliced light-emitting diode circuit board according to claim 1 or 2, wherein the extension line is parallel to each row of the first light-emitting diode chips. 如請求項1所述的拼接式發光二極體電路板，其中該延伸線垂直於該拼接方向。 The spliced light-emitting diode circuit board according to claim 1, wherein the extension line is perpendicular to the splicing direction. 如請求項1所述的拼接式發光二極體電路板，其中任兩相鄰列第一發光二極體晶片之間的間隙等於任兩相鄰列第二發光二極體晶片之間的間隙，且每一列在同一延伸線上排列的所述第一、第二凸出部發光二極體晶片與其相鄰的另一列在同一延伸線上排列的所述第一、第二凸出部發光二極體晶片、其相鄰的另一列第一發光二極體晶片、或其相鄰的另一列第二發光二極體晶片之間的間隙等於任兩相鄰列第一發光二極體晶片之間的間隙。 The spliced light-emitting diode circuit board according to claim 1, wherein the gap between any two adjacent rows of first light-emitting diode chips is equal to the gap between any two adjacent rows of second light-emitting diode chips , And each row of the first and second protrusion light-emitting diode chips arranged on the same extension line and another adjacent row of the first and second protrusion light-emitting diodes arranged on the same extension line The gap between the bulk chip, another row of first light-emitting diode chips adjacent to it, or another row of second light-emitting diode chips adjacent to it is equal to that between any two adjacent rows of first light-emitting diode chips Clearance.
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