CN111526662A

CN111526662A - Spliced light-emitting diode circuit board

Info

Publication number: CN111526662A
Application number: CN201910108562.0A
Authority: CN
Inventors: 李远智; 李家铭
Original assignee: Uniflex Technology Inc
Current assignee: Uniflex Technology Inc
Priority date: 2019-02-03
Filing date: 2019-02-03
Publication date: 2020-08-11

Abstract

The invention provides a spliced light-emitting diode circuit board, wherein a first light-emitting diode carrier plate and a second light-emitting diode carrier plate are respectively provided with a plurality of rows of parallel first light-emitting diode chips and second light-emitting diode chips, a first substrate and a second substrate of the first light-emitting diode carrier plate and the second light-emitting diode carrier plate are respectively provided with a first splicing edge, a second splicing edge, a plurality of first bulges and a plurality of second bulges, the first light-emitting diode carrier plate further comprises at least one row of first bulge light-emitting diode chips arranged on the first bulges, and the second light-emitting diode carrier plate further comprises at least one row of second bulge light-emitting diode chips arranged on the second bulges; the first and second convex parts are embedded with each other, and the at least one row of first convex part light-emitting diode chips and the at least one row of second convex part light-emitting diode chips are arranged in a same extending line.

Description

Spliced light-emitting diode circuit board

Technical Field

The invention relates to a circuit board structure, in particular to a spliced circuit board for a light-emitting diode carrier plate.

Background

At present, Light Emitting Diode (LED) manufacturers develop sub-millimeter light emitting diode (Mini LED) and Micro light emitting diode (Micro LED) technologies, and compared with the current general LED backlight modules, when the Mini LED or the Micro LED is used for backlight, the dimming can be performed more finely, and the contrast and the color rendering can be significantly improved.

On the other hand, the resolution required by the current LED display is higher and higher, and the high-order LED display also tends to be large in overall size, and because the current carrier technology cannot be used to manufacture LED carrier boards with extra large size, the boards are often connected by using hot-press bonding (hotbar) flexible boards, but the manufacturing process is complicated, so that the manufacturing cost of the large LED carrier board is high.

Disclosure of Invention

In view of the above, the present invention provides a light emitting diode circuit board that can be easily manufactured in a large size and maintain resolution.

In order to achieve the above and other objects, the present invention provides a spliced light emitting diode circuit board, which includes a first light emitting diode carrier and a second light emitting diode carrier. The first LED carrier plate comprises a first substrate and a plurality of rows of first LED chips arranged on the first substrate in parallel, the first substrate is provided with a first splicing edge and a plurality of first protruding parts extending from the first splicing edge towards a splicing direction, a first concave part is arranged between any two adjacent first protruding parts, and the first LED carrier plate further comprises at least one row of first protruding part LED chips arranged on the first protruding parts; the second LED carrier plate comprises a second substrate and a plurality of rows of second LED chips arranged on the second substrate in parallel, the second substrate is provided with a second splicing edge and a plurality of second protruding parts extending from the second splicing edge towards the direction opposite to the splicing direction, a second concave part is arranged between any two adjacent second protruding parts, and the second LED carrier plate further comprises at least one row of second protruding part LED chips arranged on the second protruding parts; the first convex parts are respectively embedded in the second concave parts, the second convex parts are respectively embedded in the first concave parts, and the at least one row of first convex part light-emitting diode chips and the at least one row of second convex part light-emitting diode chips are arranged in a same extending line.

Through the design, the LED circuit board can connect a plurality of LED carrier plates without hot pressing, has simple manufacturing process, is easy to manufacture a large-size LED circuit board, and is also provided with at least one row of LED chips at the joint of the convex part, so that the spliced design of the LED circuit board can not cause the resolution reduction of a display, thereby meeting the requirements of users.

Other effects and embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic view of a first embodiment of the present invention;

FIG. 2 is an exploded view of the first embodiment of the present invention;

FIG. 3 is a schematic view of a second embodiment of the present invention;

FIG. 4 is a schematic longitudinal cross-sectional view of one embodiment of the present invention;

FIG. 5 is a schematic longitudinal section of another embodiment of the present invention.

Description of the symbols

10 first light emitting diode carrier 11 first substrate

12 first LED chip 13 first splicing edge

14 first projection 15 first recess

16 first projection led chip

17 first metal contact 18 first slot

20 second led carrier 21 second substrate

22 second led chip 23 second bonding edge

24 second projection 25 second recess

26 second projection light emitting diode chip

27 second metal contact 28 first plug block

30 solder D splice direction

Gaps between L-extension lines G1, G2, G3, G4 and G5

Detailed Description

The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of a preferred embodiment, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

Referring to fig. 1 and fig. 2, a tiled led circuit board according to a first embodiment of the invention is shown, which can be applied to an led display or a backlight module of an lcd, for example. The spliced light emitting diode circuit board comprises a first light emitting diode carrier plate 10 and a second light emitting diode carrier plate 20.

The first led carrier 10 includes a first substrate 11 and a plurality of rows of first led chips 12 disposed in parallel on the first substrate 11. The first substrate 11 has a first splicing edge 13 and a plurality of first protrusions 14 extending from the first splicing edge 13 toward a splicing direction D, and a first concave portion 15 is formed between any two adjacent first protrusions 14, that is, the first substrate 11 forms a continuous square wave-shaped concave-convex structure on the first splicing edge 13. In addition, the first led carrier 10 further includes a row of first protruding led chips 16 disposed on the first protruding portions 14.

Similar to the first led carrier 10, the second led carrier 20 includes a second substrate 21 and a plurality of rows of second led chips 22 disposed in parallel on the second substrate 21. The second substrate 21 has a second joint edge 23 and a plurality of second protrusions 24 extending from the second joint edge 23 in a direction opposite to the joint direction D, and a second recess 25 is formed between any two adjacent second protrusions 24, that is, the second substrate 21 also forms a continuous square wave-shaped concave-convex structure on the second joint edge 23, and the concave-convex structures of the first and second substrates are complementary to each other. The second led carrier 20 also includes a row of second protruding led chips 26 disposed on the second protruding portions 24.

The first protrusions 14 are respectively embedded in the second recesses 25, and the second protrusions 24 are also respectively embedded in the first recesses 15, so that the first and second led carriers can be seamlessly spliced, or at least nearly seamlessly spliced, and after the first and second led carriers are spliced, the row of first protrusion led chips 16 and the row of second protrusion led chips 26 can be arranged on the same extension line L. In this embodiment, the extension line L is perpendicular to the splicing direction D, and the extension line L is parallel to each row of the first led chips 12, and each row of the first led chips 12 is parallel to each row of the second led chips 22. In addition, a first gap G1 is formed between any two adjacent rows of the first led chips 12, a second gap G2 is formed between any two adjacent rows of the second led chips 22, a third gap G3 is formed between the first and second protruding led

chips

16 and 26 arranged on the same extension line L and the adjacent other row of the first led chips 12, a fourth gap G4 is formed between the first and second protruding

led chips

16 and 26 arranged on the same extension line L and the adjacent other row of the second led chips 22, and G1, G2, G3 and G4 are substantially equal to each other, that is, the first and second led chips and the first and second protruding led chips can form an led chip array, and the array does not form a break point at the joint of the first and second led carriers, so that the resolution of the led display is not sacrificed.

It should be noted that the first and second substrates have at least one dielectric layer and a circuit structure for electrically connecting the led chips, and the surfaces of the first and second substrates may also be provided with solder masks.

It should be noted that the first and second led chips and the first and second protruding led chips may be horizontal led chips, vertical led chips or flip-chip led chips.

Referring to fig. 3, a second embodiment of the tiled led circuit board of the present invention is illustrated, which is substantially the same as the first embodiment, and the difference is that the first protrusion 14 has two rows of first protrusion led chips 16, the second protrusion 24 also has two rows of second protrusion led chips 26, each row of first protrusion led chips 16 is arranged in the same extension line as one row of second protrusion led chips 26, the two rows have a fifth gap G5 between the first and second protrusion led

chips

16, 26 arranged in the same extension line, and G5 is substantially equal to G1, G2, G3 and G4, so that a split structure of the tiled led circuit board with resolution and no break point can be formed. In other possible embodiments, the number of the rows of the first and second protruding portion led chips may be adjusted to at least one row as required.

Referring to fig. 4, in one possible embodiment, in order to stably splice the first led carrier 10 and the second led carrier 20, at least one of the first splicing edge and the first protruding portions may have at least one first metal contact 17, at least one of the second splicing edge and the second protruding portions may have at least one second metal contact 27, the at least one first metal contact 17 corresponds to the at least one second metal contact 27, and the spliced led circuit board further includes at least one solder 30 (e.g., tin) soldered to the corresponding first and

second metal contacts

17, 27.

Referring to fig. 5, in one possible embodiment, in order to stably splice the first led carrier 10 and the second led carrier 20, at least one of the first splicing edge and the first protruding portion has at least one first slot 18, at least one surface of the first slot 18 has a first metal contact 17, at least one of the second splicing edge and the second protruding portion has at least one first plugging block 28, at least one surface of the first plugging block 28 has a second metal contact 27, and at least one solder 30 can also solder the corresponding first and

second metal contacts

17, 27.

In one possible embodiment, the solder not only can firmly solder the first and second led carrier boards, but also can electrically connect the circuit structures in the first and second led carrier boards.

The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art can make many modifications or changes without departing from the scope of the technology disclosed in the present disclosure, but should be construed as technology or implementations that are substantially the same as the present technology.

Claims

1. A tiled LED circuit board, comprising:

a first LED carrier plate, including a first substrate and a plurality of rows of first LED chips arranged on the first substrate in parallel, wherein the first substrate has a first splicing edge and a plurality of first protrusions extending from the first splicing edge towards a splicing direction, a first concave part is arranged between any two adjacent first protrusions, and the first LED carrier plate further includes at least one row of first protrusion LED chips arranged on the first protrusions; and

a second LED carrier plate, including a second substrate and a plurality of rows of second LED chips arranged on the second substrate in parallel, wherein the second substrate has a second splicing edge and a plurality of second protrusions extending from the second splicing edge toward the direction opposite to the splicing direction, a second concave part is arranged between any two adjacent second protrusions, and the second LED carrier plate further includes at least one row of second protrusion LED chips arranged on the second protrusions;

the first convex parts are respectively embedded in the second concave parts, the second convex parts are respectively embedded in the first concave parts, and the at least one row of first convex part light-emitting diode chips and the at least one row of second convex part light-emitting diode chips are arranged in a same extending line.

2. The tiled led circuit board of claim 1, wherein each column of the first led chips is parallel to each column of the second led chips.

3. The tiled led circuit board of claim 1 or 2, wherein the extension line is parallel to each row of the first led chips.

4. The tiled led circuit board of claim 1, wherein the extension line is perpendicular to the tiling direction.

5. The tiled LED circuit board of claim 1, wherein at least one of the first mating edge and the first protrusions has at least one first metal contact, at least one of the second mating edge and the second protrusions has at least one second metal contact, the at least one first metal contact corresponds to the at least one second metal contact, and the tiled LED circuit board further comprises at least one solder for soldering the corresponding first and second metal contacts.

6. The tiled led circuit board of claim 1, wherein the spacing between the first led chips in any two adjacent rows is equal to the spacing between the second led chips in any two adjacent rows, and the spacing between the first and second bump led chips in each row in the same extended in-line arrangement and the adjacent second led chip in the same extended in-line arrangement is equal to the spacing between the first and second bump led chips in any two adjacent rows, the adjacent first led chip in the other row, or the adjacent second led chip in the other row.