CN103687295A - Large flexible printed circuit board produced by butt jointing process - Google Patents
Large flexible printed circuit board produced by butt jointing process Download PDFInfo
- Publication number
- CN103687295A CN103687295A CN201310635237.2A CN201310635237A CN103687295A CN 103687295 A CN103687295 A CN 103687295A CN 201310635237 A CN201310635237 A CN 201310635237A CN 103687295 A CN103687295 A CN 103687295A
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- flexible printed
- circuit board
- board unit
- printed circuit
- large scale
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 238000003032 molecular docking Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract 4
- 210000002105 tongue Anatomy 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a large flexible printed circuit board produced by a butt jointing process. The large flexible printed circuit board comprises multiple flexible printed circuit board units which are jointed in sequence. A protective film is arranged at the joint of every two flexible printed circuit board units, and a conductive material for closing circuits is adhered, welded or coated on the surface of the protective film. Besides, grooves for alignment are formed on one jointing side of the joint of every two flexible printed circuit boards, and tongues matched with the grooves are arranged on the other jointing side. The flexible printed circuit boards are connected by the protective films, the circuits are closed by the conductive materials on the protective films, connectors for connection are omitted, and loss of signals can be reduced to the utmost extent. Since the flexible printed circuit boards are provided with grooves and tongues for alignment, the flexible printed circuit board units can be aligned one another more accurately. In addition, conductive parameters of the conductive materials are the same with those of the flexible printed circuit boards, and loss-less transmission of the signals is realized basically.
Description
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Technical field
The present invention relates to printed board and manufacture field, more specifically, relate to a kind of large scale butt-joint process flexible printed-circuit board.
Background technology
Flexible printed-circuit board (Flexible Printed Circuit, FPC; Rear abbreviation flex plate), claiming again flex circuit application, flexible circuit board, Flexible Printed Circuit or soft board, is a kind of special printed circuit board, has light, thin, soft, bent characteristic.Be limited by the restriction of raw material process equipment, circuit exposure film process equipment and processing technology, the common finished product length of flex plate is all in 0.5 meter.In the communications industry, some specific features need to use length and surpass 1 meter, even the overlength flex plate of 2 meters.Due to raw material process equipment and wiring board exposure film manufacturing equipment, special flexible copper-clad substrate length is less than 1 meter, and the length of exposure film is less than 1.5 meters conventionally, is therefore difficult to adopt conventional Printed Circuit Board to produce this type of overlength flex plate.
Conventional flex plate is limited by the reasons such as raw material size, circuit exposure film size and production technology, general finished size can not be oversize, occasion at some specific needs overlength size flex plate, must be by the short size flex plate of polylith, plate and plate couple together the flex plate of formation overlength by third party's interface unit.The overlength flex plate coupling together through third party's interface unit, has the larger loss of signal in junction, make it above product that cannot be applied in high-frequency signal, high-speed transfer signal, merit sub-signal.
Summary of the invention
In order to overcome the deficiencies in the prior art, the present invention proposes a kind of large scale butt-joint process flexible printed-circuit board.The length of flexible printed-circuit board of the present invention is not subject to the restriction of common process, and this circuit board can be realized the substantially harmless conducting of circuit.
To achieve these goals, technical scheme of the present invention is:
The flexible printed-circuit board that a kind of large scale docking is produced; comprise the flexible printed-circuit board unit that several are stitched together in order; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, bonding on described diaphragm surface, weld or be coated with the electric conducting material for line conduction.
In flexible printed-circuit board of the present invention, flexible printed-circuit board unit is to connect by diaphragm, and by the electric conducting material on diaphragm, carries out the conducting of circuit, without adopting connector to connect, can farthest reduce the loss of signal.
In a kind of preferred scheme, described flexible printed-circuit board unit be respectively the first flexible printed-circuit board unit, the second flexible printed-circuit board unit ..., N flexible printed-circuit board unit, N >=2;
I flexible printed-circuit board unit and j flexible printed-circuit board unit spliced; I, j=1,2 ..., N and i ≠ j; I flexible printed-circuit board unit spliced side offers the groove for contraposition, on j flexible printed-circuit board unit, is provided with for the boss with groove fit with the splicing side of i flexible printed-circuit board unit spliced.
In flexible printed-circuit board unit and flexible printed-circuit board unit spliced side, be provided with groove and the boss that contraposition is used, make the contraposition of flexible printed-circuit board unit more accurate.
In a kind of preferred scheme, described diaphragm is bent insulating material.
In a kind of preferred scheme, the width of described electric conducting material is greater than, is equal to or less than the width of flexible printed-circuit board unit.
In a kind of preferred scheme, the conductive parameters of described electric conducting material is identical with the conductive parameters of flexible printed-circuit board unit, therefore the basic free of losses transmission of signal.
In a kind of preferred scheme, the groove that described contraposition is used and boss adopt the method for machinery or laser to cut out.
Compared with prior art; beneficial effect of the present invention is: in flexible printed-circuit board of the present invention, flexible printed-circuit board unit is to connect by diaphragm; and by the electric conducting material on diaphragm, carry out the conducting of circuit; without adopting connector to connect, can farthest reduce the loss of signal.Flexible printed-circuit board unit is provided with groove and the boss that contraposition is used, and can make the contraposition of flexible printed-circuit board unit more accurate.The conductive parameters of electric conducting material is identical with the conductive parameters of flexible printed-circuit board unit, therefore the basic free of losses transmission of signal.
Accompanying drawing explanation
Fig. 1 in embodiment 1 cuts into large plate A the schematic diagram of platelet a.
Fig. 2 in embodiment 1 cuts into large plate B the schematic diagram of platelet b.
Fig. 3 is the schematic diagram of contraposition interface contraposition in platelet a in embodiment 1, b splicing.
Fig. 4 is the bonding schematic diagram of the rear diaphragm of platelet a, b splicing in embodiment 1.
Fig. 5 is platelet a and the spliced conspectus of platelet b.
Fig. 6 is the enlarged drawing of circuit stitching portion.
Fig. 7 is the schematic diagram after platelet a and the bonding electric conducting material of platelet b.
Fig. 8 is electric conducting material place enlarged diagram.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, but embodiments of the present invention are not limited to this.
The flexible printed-circuit board that a kind of large scale docking is produced; comprise the flexible printed-circuit board unit that several are stitched together in order; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, bonding on diaphragm surface, weld or be coated with the electric conducting material for line conduction.
As Fig. 1,2, according to the scheme of design, large plate A and large plate B are cut into platelet a, b.As Fig. 3, platelet a and platelet b are stitched together, the splicing side of platelet a offers the groove that two contrapositions are used, platelet b is provided with the splicing side of platelet a splicing two boss that mate with groove, the groove of coupling and boss form contraposition interface M, and groove and boss adopt the method for machinery or laser to cut out; The groove of coupling and boss make splicing more accurate.
As Fig. 4; after platelet a, b contraposition; at platelet a, b, carry out chemical microetch on respectively, paste dry film, figure shifts and obtains flexible printed-circuit board unit; logicalnot circuit picture surface pressing (HTHP) or the bonding layer protecting film 1 of adhesive in flexible printed-circuit board unit are adhesively fixed into a plate by two flexible printed-circuit board unit, and diaphragm 1 is material bent, insulation.
As Fig. 5 to 8, circuit splicing 2 connects conductings: use that electric conducting material 3 is bonding, on the twolink surface of welding or be coated in flexible printed-circuit board unit spliced and splicing seam crossing, make the connection conducting that disconnects because of splicing, as shown in Fig. 5 to 8.
Said protection film 1 is bonding by HTHP pressing or adhesive, and two flexible printed-circuit board unit are adhesively fixed.The conductive parameters of electric conducting material 3 is identical with the conductive parameters of flexible printed-circuit board unit, therefore reach the basic free of losses transmission of signal.
Above-described embodiments of the present invention, do not form limiting the scope of the present invention.Any modification of having done within spiritual principles of the present invention, be equal to and replace and improvement etc., within all should being included in claim protection range of the present invention.
Claims (6)
1. a large scale is docked the flexible printed-circuit board of producing; comprise the flexible printed-circuit board unit that several are stitched together in order; it is characterized in that; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, bonding on described diaphragm surface, weld or be coated with the electric conducting material for line conduction.
2. the flexible printed-circuit board that large scale docking according to claim 1 is produced, it is characterized in that, described flexible printed-circuit board unit be respectively the first flexible printed-circuit board unit, the second flexible printed-circuit board unit ..., N flexible printed-circuit board unit, N >=2;
I flexible printed-circuit board unit and j flexible printed-circuit board unit spliced; I, j=1,2 ..., N and i ≠ j; I flexible printed-circuit board unit spliced side offers the groove for contraposition, on j flexible printed-circuit board unit, is provided with for the boss with groove fit with the splicing side of i flexible printed-circuit board unit spliced.
3. the flexible printed-circuit board that large scale docking according to claim 2 is produced, is characterized in that, described diaphragm is bent insulating material.
4. the flexible printed-circuit board that large scale docking according to claim 1 is produced, is characterized in that, the width of described electric conducting material is greater than, is equal to or less than the width of flexible printed-circuit board unit.
5. the flexible printed-circuit board that large scale docking according to claim 1 is produced, is characterized in that, the conductive parameters of described electric conducting material is identical with the conductive parameters of flexible printed-circuit board unit.
6. the flexible printed-circuit board that large scale docking according to claim 2 is produced, is characterized in that, the groove that described contraposition is used and boss adopt the method for machinery or laser to cut out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310635237.2A CN103687295B (en) | 2013-12-03 | 2013-12-03 | Large flexible printed circuit board produced by butt jointing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310635237.2A CN103687295B (en) | 2013-12-03 | 2013-12-03 | Large flexible printed circuit board produced by butt jointing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687295A true CN103687295A (en) | 2014-03-26 |
| CN103687295B CN103687295B (en) | 2017-05-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310635237.2A Expired - Fee Related CN103687295B (en) | 2013-12-03 | 2013-12-03 | Large flexible printed circuit board produced by butt jointing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103687295B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623993A (en) * | 2017-10-31 | 2018-01-23 | 广东欧珀移动通信有限公司 | A kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method |
| CN111526662A (en) * | 2019-02-03 | 2020-08-11 | 同泰电子科技股份有限公司 | Spliced light-emitting diode circuit board |
| CN113873751A (en) * | 2020-06-30 | 2021-12-31 | 广东美的厨房电器制造有限公司 | Circuit board structure and household appliance |
| CN115003009A (en) * | 2022-06-09 | 2022-09-02 | 博敏电子股份有限公司 | Method for improving board dividing burrs of flexible printed board and flexible printed board structure thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590749A (en) * | 1991-09-30 | 1993-04-09 | Canon Inc | Method for connecting printed-circuit boards |
| CN201349360Y (en) * | 2008-12-19 | 2009-11-18 | 东莞市奕东电子有限公司 | Punching-resistant flexible printed circuit board |
| CN1984528B (en) * | 2005-12-15 | 2010-12-29 | 日东电工株式会社 | Flexible wired circuit board |
| CN102686027A (en) * | 2012-04-28 | 2012-09-19 | 华为终端有限公司 | Flexible circuit board and manufacturing method thereof |
| CN203608454U (en) * | 2013-12-03 | 2014-05-21 | 广州杰赛科技股份有限公司 | Large-size butt joint production flexible printed circuit board |
-
2013
- 2013-12-03 CN CN201310635237.2A patent/CN103687295B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590749A (en) * | 1991-09-30 | 1993-04-09 | Canon Inc | Method for connecting printed-circuit boards |
| CN1984528B (en) * | 2005-12-15 | 2010-12-29 | 日东电工株式会社 | Flexible wired circuit board |
| CN201349360Y (en) * | 2008-12-19 | 2009-11-18 | 东莞市奕东电子有限公司 | Punching-resistant flexible printed circuit board |
| CN102686027A (en) * | 2012-04-28 | 2012-09-19 | 华为终端有限公司 | Flexible circuit board and manufacturing method thereof |
| CN203608454U (en) * | 2013-12-03 | 2014-05-21 | 广州杰赛科技股份有限公司 | Large-size butt joint production flexible printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623993A (en) * | 2017-10-31 | 2018-01-23 | 广东欧珀移动通信有限公司 | A kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method |
| CN107623993B (en) * | 2017-10-31 | 2020-06-23 | Oppo广东移动通信有限公司 | Circuit board, circuit board manufacturing method, electronic equipment and assembly method thereof |
| CN111526662A (en) * | 2019-02-03 | 2020-08-11 | 同泰电子科技股份有限公司 | Spliced light-emitting diode circuit board |
| CN113873751A (en) * | 2020-06-30 | 2021-12-31 | 广东美的厨房电器制造有限公司 | Circuit board structure and household appliance |
| CN115003009A (en) * | 2022-06-09 | 2022-09-02 | 博敏电子股份有限公司 | Method for improving board dividing burrs of flexible printed board and flexible printed board structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103687295B (en) | 2017-05-17 |
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Granted publication date: 20170517 |
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