CN107623993A - A kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method - Google Patents

A kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method Download PDF

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Publication number
CN107623993A
CN107623993A CN201711043017.5A CN201711043017A CN107623993A CN 107623993 A CN107623993 A CN 107623993A CN 201711043017 A CN201711043017 A CN 201711043017A CN 107623993 A CN107623993 A CN 107623993A
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CN
China
Prior art keywords
mainboard
scoreboard
circuit board
layout
splicing pad
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Granted
Application number
CN201711043017.5A
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Chinese (zh)
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CN107623993B (en
Inventor
范艳辉
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201711043017.5A priority Critical patent/CN107623993B/en
Publication of CN107623993A publication Critical patent/CN107623993A/en
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Publication of CN107623993B publication Critical patent/CN107623993B/en
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Abstract

The present invention is applied to technical field of electronic equipment, there is provided a kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method.The circuit board of the present embodiment, it is spliced by mainboard and scoreboard, so, in the layout design of circuit board making, in the case of equal area, the layout quantity of the design after improvement is original twice, so FPC production cost can be reduced into one times.Meanwhile when to circuit board paster, because most of space of layout is fully utilized, so, more electronic components can be sticked in area identical layout, and disposable stove excessively can be unified, improve paster efficiency.The electronic equipment of the present embodiment, positioning convex column is provided with its center, in assembling process, positioning convex column can be penetrated in mainboard to be spliced and the positioning hole of scoreboard, so as to the splicing pad on mainboard and the splicing pad in scoreboard can easily, be accurately performed contraposition work.

Description

A kind of circuit board, circuit board manufacturing method, electronic equipment and its assembly method
Technical field
The invention belongs to technical field of electronic equipment, more particularly to a kind of circuit board, circuit board manufacturing method, electronic equipment And its assembly method.
Background technology
FPC (flexible PCB, Flexible Printed Circuit) when production is carried out by layout, Paster is needed by a whole set of flow.Being in the existing main FPC of project can be two parts board design to together, such as raises one's voice Together with the circuit board of device and the board design of antenna part, the space that such lower part takes is more, and FPC layout utilizes Rate is low, because useless plate part is also to need to calculate unit price in production, so, the production cost that result in FPC is higher.
In addition, paster is carried out in layout, due to not being designed with FPC in some regions in layout, so, also lead Cause paster less efficient.
After each piece of FPC of layout completes paster, in assembling, there can be electrical connection to close by separately respective independent plate Two pieces of circuit boards of system need to be stitched together by welding.At present, FPC easily produces off normal when welding and aligning and causes to give birth to Produce bad.
The content of the invention
Embodiments of the invention can save the production cost of circuit board, improve paster efficiency and improve the spelling of circuit board Aligning accuracy when connecing.
A kind of circuit board, including mainboard and scoreboard are present embodiments provided, stitching section is equipped with mainboard and scoreboard, Splicing pad, the stitching section of scoreboard and the stitching section of mainboard is provided with the stitching section mutually to weld by both splicing pads It is connected together.
Further, the mainboard is one piece of main circuit board, and the scoreboard is one block of speaker circuit plate.
Further, the speaker circuit plate and main circuit board collectively form T-shaped, wherein, the main circuit board It is L-shaped.
Further, the mainboard and scoreboard are flexible PCB.
Further, the stitching section of the mainboard and scoreboard is upper and lower stacked.
The present invention is in order to solve the above technical problems, additionally provide a kind of electronic equipment, including center and circuit board, mutually Offer the first positioning hole and the second positioning hole on the mainboard of splicing and the stitching section of scoreboard respectively, the mainboard and scoreboard Stitching section is stacked up and down, first positioning hole and the second positioning hole consistency from top to bottom, is provided with positioning convex column on the center, institute Positioning convex column is stated to be arranged in first positioning hole and the second positioning.
The present invention is including following in order to solve the above technical problems, additionally provide a kind of assembly method of above-mentioned electronic equipment The step of:
First mainboard is installed on the center of the electronic equipment, and the positioning convex column on the center is passed into the master First positioning hole of plate;
The positioning convex column is passed through the second positioning hole in the scoreboard again;
The splicing pad in main scoreboard is alignd with the splicing pad in scoreboard, complete the welding contraposition work of circuit board;
Splicing pad on the mainboard is welded with the splicing pad in scoreboard.
The present invention additionally provides a kind of preparation method of circuit board to solve above-mentioned technical problem, comprises the following steps:
One circuit board is divided into mainboard and scoreboard, makes the mainboard that there is larger end and small end, also, in institute The stitching portion for stating mainboard and scoreboard separately designs splicing pad;
By at least two pieces of motherboard layouts in one big layout, also, in adjacent two pieces of mainboards, the larger end of a mainboard The small end of corresponding another mainboard, scoreboard is in the layout of in a small layout;
In sticking electronic component in the big layout and small layout, stove is then crossed;
All mainboards in the big layout are cut down, likewise, all scoreboards in the small layout are cut Get off;
By the splicing pad solder of the matched mainboard of the splicing pad of the scoreboard together, that is, described in completing The making of circuit board.
The present invention also provides a kind of preparation method of circuit board again to solve above-mentioned technical problem, comprises the following steps:
One circuit board is divided into mainboard and scoreboard, makes the mainboard that there is larger end and small end, also, in institute The stitching portion for stating mainboard and scoreboard separately designs splicing pad;
By at least two pieces of motherboard layouts in a layout, also, in adjacent two pieces of mainboards, the larger end pair of a mainboard Answer the small end of another mainboard, scoreboard be in the layout of in same layout, also, the position of scoreboard layout positioned at two pieces of mainboards it Between space in;
In sticking electronic component in the layout, stove is then crossed;
All mainboards in the layout and scoreboard are cut down;
By the splicing pad solder of the matched mainboard of the splicing pad of the scoreboard together, that is, described in completing The making of circuit board.
Further, it is further comprising the steps of before circuit board is divided:
The circuit board shape is analyzed, the part for protruding circuit board intermediate region side is defined as scoreboard, will The common plate body that the intermediate region of circuit board and the part of protrusion intermediate region opposite side are formed is defined as mainboard.
Compared with prior art, beneficial effect is the present embodiment:The circuit board of the present embodiment, it is spelled by mainboard and scoreboard Connect and form, so, in the layout design of circuit board making, in the case of equal area, the layout number of the design after improvement Measure as original twice, so FPC production cost can be reduced by one times.Meanwhile when to circuit board paster, because of layout Most of space is fully utilized, so, more electronic components can be sticked in area identical layout, and can unification one Secondary property crosses stove, improves paster efficiency.The electronic equipment of the present embodiment, positioning convex column is provided with its center, in assembling process In, positioning convex column can be penetrated in mainboard to be spliced and the positioning hole of scoreboard, so as on the splicing pad and scoreboard on mainboard Splicing pad can easily, be accurately performed contraposition work.
Brief description of the drawings
One or more embodiments are illustrative by the picture in corresponding accompanying drawing, these exemplary theorys The bright restriction not formed to embodiment, the element for having same reference numbers label in accompanying drawing are expressed as similar element, removed Non- have a special statement, and composition does not limit the figure in accompanying drawing.
Fig. 1 is the schematic diagram before a kind of circuit board splicing that the embodiment of the present invention one provides;
Fig. 2 is the spliced schematic diagram of circuit board shown in Fig. 1;
Fig. 3 a are the embodiment of the present invention one in the schematic diagram that mainboard is laid out in big layout;
Fig. 3 b are the embodiment of the present invention one in the schematic diagram that scoreboard is laid out in small layout;
Fig. 4 is the dimensional structure diagram for a kind of electronic equipment that the embodiment of the present invention one provides;
Fig. 5 a are the schematic diagrames before the board application positioning convex column contraposition of the embodiment of the present invention one;
Fig. 5 b are the schematic diagrames after the board application positioning convex column contraposition of the embodiment of the present invention one;
Fig. 6 is the schematic diagram being in the layout of scoreboard in the embodiment of the present invention two in the space between two pieces of mainboards;
Fig. 7 a are the schematic diagrames that a circuit board is divided into one piece of mainboard and two blocks of side plates in the embodiment of the present invention three;
Fig. 7 b are the schematic diagrames being in the layout of side plate in the embodiment of the present invention three in the space between two pieces of mainboards.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only To explain the present invention, it is not intended to limit the present invention.
Embodiment one:
Refer to Fig. 1 and Fig. 2, present embodiments provide a kind of circuit board, it includes mainboard 1 and scoreboard 2, mainboard 1 with And stitching section is equipped with scoreboard 2, splicing pad 11, splicing pad 21, the spelling of scoreboard 2 are respectively arranged with both stitching sections Together with socket part and the stitching section of mainboard 1 are welded to each other by splicing pad 11 with splicing pad 21.
Specifically, mainboard 1 is one piece of main circuit board, and scoreboard 2 is one block of speaker circuit plate.In the present embodiment, Suo Youzhu Plate 1 and scoreboard 2 are flexible PCB;The speaker circuit plate and main circuit board collectively form it is T-shaped, wherein, institute It is L-shaped to state main circuit board.Mainboard 1 and the stitching section of scoreboard 2 are upper and lower stacked, splicing pad 11 and the splicing consistency from top to bottom of pad 21, And it is welded and fixed by tin cream.
The preparation method that the present embodiment additionally provides foregoing circuit plate, its step are as follows:
S10, a circuit board is divided into mainboard 1 and scoreboard 2, makes the mainboard 1 that there is larger end and small end, and And separately design splicing pad 11, splicing pad 12 in the stitching portion of the mainboard 1 and scoreboard 2;
S11, Fig. 3 a are referred to, at least two pieces of mainboards 1 are in the layout of in one big layout 100, also, adjacent two pieces of masters In plate 1, the larger end of a mainboard 1 corresponds to the small end of another mainboard 1, refers to Fig. 3 b, and scoreboard 2 is in the layout of into a small layout On 200;
S12, in sticking electronic component in the big layout 100 and small layout 200, then cross stove;
S13, all mainboards 1 in the big layout 100 are cut down, likewise, by the institute in the small layout 200 There is scoreboard 2 to cut down;
S14, the splicing pad 11 of the matched mainboard 1 of the splicing pad 21 of the scoreboard 2 welded together, Complete the making of the circuit board.
Fig. 4 is referred to, the present embodiment additionally provides a kind of electronic equipment 300, including center 30 and foregoing circuit plate, please Referring to Fig. 5 a and Fig. 5 b, the mainboard 1 that the circuit board mutually splices with offering the first positioning hole 12 respectively on the stitching section of scoreboard 2 And second positioning hole 22, the mainboard 1 and the stitching section of scoreboard 2 are stacked up and down, the positioning of the first positioning hole 12 and second The consistency from top to bottom of hole 22, positioning convex column 31 is provided with the center 30, the positioning convex column 31 is arranged in first positioning hole 12 and second positioning 22 in.
The present embodiment additionally provides the assembly method of above-mentioned electronic equipment, and its step is as follows:
S20, first mainboard 1 is installed on the center 30 of the electronic equipment 300, and by the convex on the center 30 Post 31 passes the first positioning hole 12 of the mainboard 1;
S21, the positioning convex column 31 is passed through the second positioning hole 22 in the scoreboard 2 again;
S22, the splicing pad 11 on mainboard 1 is alignd with the splicing pad 21 in scoreboard 2, complete the welding pair of circuit board Position work;
S23, the splicing pad 11 on the mainboard 1 welded with the splicing pad 21 in scoreboard 2.
The circuit board of the present embodiment, it is spliced by mainboard 1 and scoreboard 2, so, designed in the layout of circuit board making When, in the case of equal area, the layout quantity of the design after improvement is original twice, so can be by FPC production Cost reduces by one times.Meanwhile because most of space of layout is fully utilized, so, when to circuit board paster, area is identical Layout on can stick more electronic components, and can unify it is disposable cross stove, improve paster efficiency.The present embodiment Electronic equipment, positioning convex column 31 is provided with its center 30, in assembling process, positioning convex column 31 can penetrate mainboard to be spliced 1 with the positioning hole of scoreboard 2, so as to the splicing pad 11 on mainboard 1 and the splicing pad 21 in scoreboard 2 and can be very square Just, it is accurately performed contraposition work.
Embodiment two:
The present embodiment provides another preparation method for the circuit board in embodiment one, comprises the following steps:
S30, the circuit board shape is analyzed, the part for protruding circuit board intermediate region side is defined as scoreboard 2, the common plate body that the part of the intermediate region of circuit board and protrusion intermediate region opposite side is formed is defined as mainboard 1.
S31, a circuit board is divided into mainboard 1 and scoreboard 2, makes the mainboard 1 that there is larger end and small end, and And separately design splicing pad 11, splicing pad 12 in the stitching portion of the mainboard 1 and scoreboard 2;
S32, Fig. 6 is referred to, at least two pieces of mainboards 1 will be in the layout of in a layout 400, also, adjacent two pieces of mainboards 1 In, the larger end of a mainboard 1 corresponds to the small end of another mainboard 1, and scoreboard 2 is in the layout of in same layout 400, also, point The position that plate 2 is laid out is in the space between two pieces of mainboards 1;
S33, in sticking electronic component in the layout 400, then cross stove;
S34, all mainboards 1 in the layout 400 and scoreboard 2 are cut down;
S35, the splicing pad 11 of the matched mainboard 1 of the splicing pad 21 of the scoreboard 2 welded together, Complete the making of the circuit board.
Most of space of the layout 400 of the present embodiment is fully utilized, so, when to circuit board paster, area phase More electronic components can be sticked in same layout 400, drop the production cost for the road plate that is supplied with electric power, and disposable mistake can be unified Stove, improve paster efficiency.
Embodiment three:
The preparation method for present embodiments providing another circuit board, comprises the following steps:
S40, Fig. 7 a are referred to, a circuit board is divided into one piece of mainboard 1 and two blocks of side plates 5, makes the two of the mainboard 1 End width is more than intermediate width, and the area of two blocks of side plates 5 is less than the area of mainboard 1,
S41, in the stitching portion of the mainboard 1 and side plate 5 separately design splicing pad;
S42, Fig. 7 b are referred to, at least two pieces of mainboards 1 will be in the layout of in a layout 500, also, adjacent two pieces of mainboards In 1, the end positions of mainboard 1 correspond to the end positions of another mainboard 1 respectively, and side plate 5 is in the layout of in same layout 500, Also, the position that side plate 5 is laid out is in the space between two pieces of mainboards 1;
S43, in sticking electronic component in the layout 500, then cross stove;
S44, all mainboards 1 in the layout 500 and side plate 5 are cut down;
S45, by the splicing pad solder of the matched mainboard 1 of splicing pad of the side plate 5 together, i.e., it is complete Into the making of the circuit board.
Most of space of the layout 500 of the present embodiment is fully utilized, so, when to circuit board paster, area phase More electronic components can be sticked in same layout 500, drop the production cost for the road plate that is supplied with electric power, and disposable mistake can be unified Stove, improve paster efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.

Claims (10)

  1. A kind of 1. circuit board, it is characterised in that including mainboard and scoreboard, stitching section is equipped with mainboard and scoreboard, it is described Splicing pad, the stitching section of scoreboard and the stitching section of mainboard is provided with stitching section to be welded to each other by both splicing pads Together.
  2. 2. circuit board as claimed in claim 1, it is characterised in that the mainboard is one piece of main circuit board, and the scoreboard is one Block speaker circuit plate.
  3. 3. circuit board as claimed in claim 2, it is characterised in that the speaker circuit plate and main circuit board collectively form It is T-shaped, wherein, the main circuit board is L-shaped.
  4. 4. the circuit board as described in any one in claims 1 to 3, it is characterised in that the mainboard and scoreboard are soft Property circuit board.
  5. 5. the circuit board as described in any one in claims 1 to 3, it is characterised in that the stitching section of the mainboard and scoreboard It is upper and lower stacked.
  6. 6. a kind of electronic equipment, including center, it is characterised in that the electronic equipment is also included as any in claim 1 to 5 Circuit board described in one, the first positioning hole and second fixed is offered on the mainboard mutually spliced and the stitching section of scoreboard respectively The stitching section of position hole, the mainboard and scoreboard is stacked up and down, first positioning hole and the second positioning hole consistency from top to bottom, in described Positioning convex column is provided with frame, the positioning convex column is arranged in first positioning hole and the second positioning.
  7. 7. a kind of assembly method of electronic equipment as claimed in claim 6, it is characterised in that comprise the following steps:
    First mainboard is installed on the center of the electronic equipment, and the positioning convex column on the center is passed into the mainboard First positioning hole;
    The positioning convex column is passed through the second positioning hole in the scoreboard again;
    The splicing pad in main scoreboard is alignd with the splicing pad in scoreboard, complete the welding contraposition work of circuit board;
    Splicing pad on the mainboard is welded with the splicing pad in scoreboard.
  8. 8. a kind of preparation method of circuit board, it is characterised in that comprise the following steps:
    One circuit board is divided into mainboard and scoreboard, makes the mainboard that there is larger end and small end, also, in the master The stitching portion of plate and scoreboard separately designs splicing pad;
    By at least two pieces of motherboard layouts in one big layout, also, in adjacent two pieces of mainboards, the larger end of a mainboard is corresponding The small end of another mainboard, scoreboard is in the layout of in a small layout;
    In sticking electronic component in the big layout and small layout, stove is then crossed;
    All mainboards in the big layout are cut down, likewise, all scoreboards in the small layout are cut down;
    By the splicing pad solder of the matched mainboard of the splicing pad of the scoreboard together, that is, the circuit is completed The making of plate.
  9. 9. a kind of preparation method of circuit board, it is characterised in that comprise the following steps:
    One circuit board is divided into mainboard and scoreboard, makes the mainboard that there is larger end and small end, also, in the master The stitching portion of plate and scoreboard separately designs splicing pad;
    By at least two pieces of motherboard layouts in a layout, also, in adjacent two pieces of mainboards, the larger end of a mainboard corresponds to another The small end of one mainboard, scoreboard is in the layout of in same layout, also, the position of scoreboard layout is between two pieces of mainboards In space;
    In sticking electronic component in the layout, stove is then crossed;
    All mainboards in the layout and scoreboard are cut down;
    By the splicing pad solder of the matched mainboard of the splicing pad of the scoreboard together, that is, the circuit is completed The making of plate.
  10. 10. the preparation method of circuit board as claimed in claim 9, it is characterised in that before circuit board is divided, in addition to it is following Step:
    The circuit board shape is analyzed, the part for protruding circuit board intermediate region side is defined as scoreboard, by circuit The common plate body that the intermediate region of plate and the part of protrusion intermediate region opposite side are formed is defined as mainboard.
CN201711043017.5A 2017-10-31 2017-10-31 Circuit board, circuit board manufacturing method, electronic equipment and assembly method thereof Active CN107623993B (en)

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CN201711043017.5A CN107623993B (en) 2017-10-31 2017-10-31 Circuit board, circuit board manufacturing method, electronic equipment and assembly method thereof

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CN201711043017.5A CN107623993B (en) 2017-10-31 2017-10-31 Circuit board, circuit board manufacturing method, electronic equipment and assembly method thereof

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CN107623993B CN107623993B (en) 2020-06-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873751A (en) * 2020-06-30 2021-12-31 广东美的厨房电器制造有限公司 Circuit board structure and household appliance

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917970A (en) * 1972-04-06 1974-02-16
CN1705425A (en) * 2004-05-28 2005-12-07 Tcl王牌电子(深圳)有限公司 Quick jointable printed circuit board and making method thereof
CN103687295A (en) * 2013-12-03 2014-03-26 广州杰赛科技股份有限公司 Large flexible printed circuit board produced by butt jointing process
CN203632967U (en) * 2013-12-17 2014-06-04 江西合力泰科技股份有限公司 Splicing-type large-piece FPC

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917970A (en) * 1972-04-06 1974-02-16
CN1705425A (en) * 2004-05-28 2005-12-07 Tcl王牌电子(深圳)有限公司 Quick jointable printed circuit board and making method thereof
CN103687295A (en) * 2013-12-03 2014-03-26 广州杰赛科技股份有限公司 Large flexible printed circuit board produced by butt jointing process
CN203632967U (en) * 2013-12-17 2014-06-04 江西合力泰科技股份有限公司 Splicing-type large-piece FPC

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873751A (en) * 2020-06-30 2021-12-31 广东美的厨房电器制造有限公司 Circuit board structure and household appliance

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