CN203608454U - Large-size butt joint production flexible printed circuit board - Google Patents
Large-size butt joint production flexible printed circuit board Download PDFInfo
- Publication number
- CN203608454U CN203608454U CN201320780895.6U CN201320780895U CN203608454U CN 203608454 U CN203608454 U CN 203608454U CN 201320780895 U CN201320780895 U CN 201320780895U CN 203608454 U CN203608454 U CN 203608454U
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- China
- Prior art keywords
- circuit board
- flexible printed
- printed circuit
- board unit
- board units
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 210000001503 joint Anatomy 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 238000003032 molecular docking Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract 4
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a large-size butt joint production flexible printed circuit board comprising a plurality of flexible printed circuit board units, which are spliced together sequentially. A protective film is disposed on a spliced part between every two flexible printed circuit board units, and the surface of the protective film is provided with conductive materials used for the line conduction in a bonded, welded, or coated manner. One spliced side of the spliced part between every two flexible printed circuit board units is provided with a groove used for a butt joint, and the other spliced side is provided with a boss cooperated with a corresponding groove. The flexible printed circuit board units provided by the utility model are connected together by the protective films, and the line conduction can be realized by the conductive materials on the protective films, and therefore the connectors are not required for the connection, and the signal loss can be reduced to the greatest extent. The flexible printed circuit board units are provided with grooves and bosses used for the butt joint, and therefore the butt joint of the flexible printed circuit board units can be more accurate. The conductive parameters of the conductive materials are the same as the conductive parameters of the flexible printed circuit board units, and therefore the transmission loss of the signals can be basically prevented.
Description
Technical field
The utility model relates to printed board and manufactures field, more specifically, relates to a kind of large scale butt-joint process flexible printed-circuit board.
Background technology
Flexible printed-circuit board (Flexible Printed Circuit, FPC; Rear abbreviation flex plate), claim again flex circuit application, flexible circuit board, Flexible Printed Circuit or soft board, be a kind of special printed circuit board, there is light, thin, soft, bent characteristic.Be limited by the restriction of raw material process equipment, circuit exposure film process equipment and processing technology, the common finished product length of flex plate is all in 0.5 meter.In the communications industry, some specific features need to use length and exceed 1 meter, even the overlength flex plate of 2 meters.Due to raw material process equipment and wiring board exposure film manufacturing equipment, special flexible copper-clad substrate length is less than 1 meter, and the length of exposure film is less than 1.5 meters conventionally, is therefore difficult to adopt conventional Printed Circuit Board to produce this type of overlength flex plate.
Conventional flex plate is limited by the reasons such as raw material size, circuit exposure film size and production technology, general finished size can not be oversize, in the occasion of some specific needs overlength size flex plate, must be by the short size flex plate of polylith, plate and plate couple together the flex plate of formation overlength by third party's interface unit.The overlength flex plate coupling together through third party's interface unit, has the larger loss of signal in junction, make it above product that cannot be applied in high-frequency signal, high-speed transfer signal, merit sub-signal.
Utility model content
In order to overcome the deficiencies in the prior art, the utility model proposes a kind of large scale butt-joint process flexible printed-circuit board.The length of flexible printed-circuit board of the present utility model is not subject to the restriction of common process, and this circuit board can be realized the substantially harmless conducting of circuit.
To achieve these goals, the technical solution of the utility model is:
The flexible printed-circuit board that a kind of large scale docking is produced; comprise the flexible printed-circuit board unit that several are stitched together in order; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, bonding on described diaphragm surface, weld or be coated with the electric conducting material for line conduction.
In flexible printed-circuit board of the present utility model, flexible printed-circuit board unit is to connect by diaphragm, and carries out the conducting of circuit by the electric conducting material on diaphragm, without adopting connector to connect, can farthest reduce the loss of signal.
In the preferred scheme of one, described flexible printed-circuit board unit be respectively the first flexible printed-circuit board unit, the second flexible printed-circuit board unit ..., N flexible printed-circuit board unit, N >=2;
I flexible printed-circuit board unit and j flexible printed-circuit board unit spliced; I, j=1,2 ..., N and i ≠ j; I flexible printed-circuit board unit spliced side offers the groove for contraposition, on j flexible printed-circuit board unit with the splicing side of i flexible printed-circuit board unit spliced be provided with for the boss of groove fit.
Be provided with in flexible printed-circuit board unit and flexible printed-circuit board unit spliced side groove and the boss that contraposition is used, make the contraposition of flexible printed-circuit board unit more accurate.
In the preferred scheme of one, described diaphragm is bent insulating material.
In the preferred scheme of one, the width of described electric conducting material is greater than, is equal to or less than the width of flexible printed-circuit board unit.
In the preferred scheme of one, the conductive parameters of described electric conducting material is identical with the conductive parameters of flexible printed-circuit board unit, therefore the basic free of losses transmission of signal.
In the preferred scheme of one, the groove that described contraposition is used and boss adopt the method for machinery or laser to cut out.
Compared with prior art; the beneficial effects of the utility model are: in flexible printed-circuit board of the present utility model, flexible printed-circuit board unit is to connect by diaphragm; and carry out the conducting of circuit by the electric conducting material on diaphragm; without adopting connector to connect, can farthest reduce the loss of signal.Flexible printed-circuit board unit is provided with groove and the boss that contraposition is used, and can make the contraposition of flexible printed-circuit board unit more accurate.The conductive parameters of electric conducting material is identical with the conductive parameters of flexible printed-circuit board unit, therefore the basic free of losses transmission of signal.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that in embodiment 1, large plate A is cut into platelet a.
Fig. 2 is the schematic diagram that in embodiment 1, large plate B is cut into platelet b.
Fig. 3 is the schematic diagram of contraposition interface contraposition in platelet a in embodiment 1, b splicing.
Fig. 4 is the bonding schematic diagram of the rear diaphragm of platelet a, b splicing in embodiment 1.
Fig. 5 is platelet a and the spliced conspectus of platelet b.
Fig. 6 is the enlarged drawing of circuit stitching portion.
Fig. 7 is the schematic diagram after platelet a and the bonding electric conducting material of platelet b.
Fig. 8 is electric conducting material place enlarged diagram.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described, but execution mode of the present utility model is not limited to this.
The flexible printed-circuit board that a kind of large scale docking is produced; comprise the flexible printed-circuit board unit that several are stitched together in order; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, bonding on diaphragm surface, weld or be coated with the electric conducting material for line conduction.
As Fig. 1,2, according to the scheme of design, large plate A and large plate B are cut into platelet a, b.As Fig. 3, platelet a and platelet b are stitched together, the splicing side of platelet a offers the groove that two contrapositions are used, platelet b is provided with the splicing side of platelet a splicing two boss that mate with groove, the groove of coupling and boss form contraposition interface M, and groove and boss adopt the method for machinery or laser to cut out; The groove of coupling and boss make splicing more accurate.
As Fig. 4; after platelet a, b contraposition; carry out chemical microetch at platelet a, b on respectively, paste dry film, figure shifts and obtains flexible printed-circuit board unit; two flexible printed-circuit board unit are adhesively fixed into a plate by logicalnot circuit picture surface pressing (HTHP) or the bonding layer protecting film 1 of adhesive in flexible printed-circuit board unit, and diaphragm 1 is material bent, insulation.
As Fig. 5 to 8, circuit splicing 2 connects conductings: use that electric conducting material 3 is bonding, on the twolink surface of welding or be coated in flexible printed-circuit board unit spliced and splicing seam crossing, make the connection conducting that disconnects because of splicing, as shown in Fig. 5 to 8.
Said protection film 1 is bonding by HTHP pressing or adhesive, and two flexible printed-circuit board unit are adhesively fixed.The conductive parameters of electric conducting material 3 is identical with the conductive parameters of flexible printed-circuit board unit, therefore reach the basic free of losses transmission of signal.
Above-described execution mode of the present utility model, does not form the restriction to the utility model protection range.Any modification of having done within spiritual principles of the present utility model, be equal to and replace and improvement etc., within all should being included in claim protection range of the present utility model.
Claims (4)
1. the flexible printed-circuit board that large scale docking is produced; comprise the flexible printed-circuit board unit that several are stitched together in order; it is characterized in that; stitching portion between two flexible printed-circuit board unit is provided with diaphragm, is useful on the electric conducting material of line conduction on described diaphragm surface.
2. the flexible printed-circuit board that large scale docking according to claim 1 is produced, it is characterized in that, described flexible printed-circuit board unit be respectively the first flexible printed-circuit board unit, the second flexible printed-circuit board unit ..., N flexible printed-circuit board unit, N >=2;
I flexible printed-circuit board unit and j flexible printed-circuit board unit spliced; I, j=1,2 ..., N and i ≠ j; I flexible printed-circuit board unit spliced side offers the groove for contraposition, on j flexible printed-circuit board unit with the splicing side of i flexible printed-circuit board unit spliced be provided with for the boss of groove fit.
3. the flexible printed-circuit board that large scale docking according to claim 2 is produced, is characterized in that, described diaphragm is bent insulating material.
4. the flexible printed-circuit board that large scale docking according to claim 1 is produced, is characterized in that, the width of described electric conducting material is greater than, is equal to or less than the width of flexible printed-circuit board unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320780895.6U CN203608454U (en) | 2013-12-03 | 2013-12-03 | Large-size butt joint production flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320780895.6U CN203608454U (en) | 2013-12-03 | 2013-12-03 | Large-size butt joint production flexible printed circuit board |
Publications (1)
Publication Number | Publication Date |
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CN203608454U true CN203608454U (en) | 2014-05-21 |
Family
ID=50721107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320780895.6U Expired - Lifetime CN203608454U (en) | 2013-12-03 | 2013-12-03 | Large-size butt joint production flexible printed circuit board |
Country Status (1)
Country | Link |
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CN (1) | CN203608454U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687295A (en) * | 2013-12-03 | 2014-03-26 | 广州杰赛科技股份有限公司 | Large flexible printed circuit board produced by butt jointing process |
CN108271314A (en) * | 2018-01-18 | 2018-07-10 | 郑州云海信息技术有限公司 | A kind of production method and backboard of oversize backboard |
CN113141706A (en) * | 2020-01-17 | 2021-07-20 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
-
2013
- 2013-12-03 CN CN201320780895.6U patent/CN203608454U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687295A (en) * | 2013-12-03 | 2014-03-26 | 广州杰赛科技股份有限公司 | Large flexible printed circuit board produced by butt jointing process |
CN108271314A (en) * | 2018-01-18 | 2018-07-10 | 郑州云海信息技术有限公司 | A kind of production method and backboard of oversize backboard |
CN113141706A (en) * | 2020-01-17 | 2021-07-20 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160126 Address after: 519170, No. three, No. 1, Toyama Industrial Park, dry town, Doumen District, Guangdong, Zhuhai, Toyama Patentee after: ZHUHAI GCI SCIENCE & TECHNOLOGY Co.,Ltd. Address before: 510310 No. 381 middle Xingang Road, Guangdong, Guangzhou Patentee before: GCI SCIENCE & TECHNOLOGY Co.,Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20140521 |
|
CX01 | Expiry of patent term |