CN209946451U - Optical fiber circuit board and optical transmission device - Google Patents

Abstract

The application discloses fiber circuit board and optical transmission device, this fiber circuit board includes: a first substrate; the first bonding layer is arranged on one side of the first substrate; a first optical fiber at least partially disposed in the first adhesive layer; the second substrate is arranged on one side, far away from the first substrate, of the first bonding layer. Through the mode, the reliability of the optical fiber circuit board can be improved.

Description

Optical fiber circuit board and optical transmission device

Technical Field

The present application relates to the field of circuit board technology, and in particular, to an optical fiber circuit board and an optical transmission device.

Background

Electrical interconnection refers to the use of metal lines (usually copper) to connect signals between circuit boards and chips. Optical interconnection refers to the use of light-conducting media (optical fibers, optical waveguides, etc.) to realize signal connection between circuit boards and chips.

The traditional electrical interconnection faces the problems of signal delay, signal crosstalk, power consumption surge and the like at high frequency and high speed, and the optical interconnection can realize data transmission with low power consumption, high speed and complete signals between boards/in boards by using the unique advantages of the optical interconnection. The optical fiber circuit board is a method for realizing optical interconnection, combines mature optical fiber technology and printed circuit board technology to manufacture a light, thin and low-loss optical fiber board which can be used for optical connection in boards, between boards and between frames.

The optical fiber circuit board commonly used in the industry at present fixes the optical fiber on the surface of the optical fiber circuit board or the substrate through an adhesive, and the position of the optical fiber of the circuit board is often not firm, so the reliability of the circuit board is poor.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides an optical fiber circuit board and optical transmission device, can improve optical fiber circuit board's reliability.

The technical scheme adopted by the application is as follows: provided is a fiber optic circuit board comprising: a first substrate; the first bonding layer is arranged on one side of the first substrate; a first optical fiber at least partially disposed in the first adhesive layer; the second substrate is arranged on one side, far away from the first substrate, of the first bonding layer.

The first adhesive layer comprises two sub adhesive layers which are arranged in a stacked mode, and the at least part of the first optical fiber is arranged between the two sub adhesive layers.

The number of the first optical fibers is at least two, and the at least two first optical fibers are arranged side by side.

And the gap between two adjacent first optical fibers is filled up by the first adhesive layer.

Wherein, the optical fiber circuit board further comprises: the second bonding layer is arranged on one side of the second substrate, which is far away from the first bonding layer; a second optical fiber at least partially disposed in the second adhesive layer; and the third substrate is arranged on one side, far away from the second substrate, of the second bonding layer.

And at least one side surface of the first substrate and/or the second substrate and/or the third substrate is provided with a conductive layer.

The optical fiber circuit board comprises at least two conducting layers, communicated via holes are formed between at least two of the conducting layers, and conducting materials are arranged in the via holes so as to realize the electrical interconnection between the conducting layers through which the via holes pass.

Another technical scheme adopted by the application is as follows: an optical transmission device is provided, which includes the optical fiber circuit board and an optical connector connected to the first optical fiber, where the optical connector is used to connect to an optical docking device to realize optical signal transmission between the first optical fiber and the optical docking device.

Wherein the optical connector is provided on the optical fiber circuit board and connected to the first optical fiber embedded in the optical fiber circuit board.

The optical fiber circuit board is provided with a groove, the optical connector is arranged in the groove, and one end of the first optical fiber extends to the groove and is connected with the optical connector.

The first optical fiber comprises one end extending outwards from the inside of the optical fiber circuit board and exposed outside the optical fiber circuit board, and the optical connector is connected with one end of the first optical fiber exposed outside the optical fiber circuit board.

The periphery of the part, exposed outside the optical fiber circuit board, of the first optical fiber is sleeved with a protective layer.

The optical fiber circuit board in this application sets up the first bonding layer between first base plate and second base plate with at least part of first optic fibre, can guarantee the rigidity of first optic fibre, and then guarantees optical fiber circuit board's reliability.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of an embodiment of an optical fiber circuit board according to the present application;

FIG. 2 is a schematic structural diagram of another embodiment of an optical fiber circuit board according to the present application;

FIG. 3 is a schematic diagram of the fiber circuit board of FIG. 2 in an application scenario;

FIG. 4 is a schematic diagram of the fiber circuit board of FIG. 3 in a specific application scenario;

FIG. 5 is a schematic structural diagram of the fiber circuit board of FIG. 3 in another specific application scenario;

FIG. 6 is a schematic structural diagram of an embodiment of an optical transmission apparatus according to the present application;

FIG. 7 is a schematic diagram of the optical transmission apparatus of FIG. 6 in an application scenario;

FIG. 8 is a schematic diagram of a portion of the optical transmission apparatus of FIG. 6 in an application scenario;

FIG. 9 is a schematic diagram of a portion of the optical transmission apparatus of FIG. 6 in an application scenario;

FIG. 10 is a schematic diagram of the optical transmission apparatus of FIG. 6 in an application scenario;

FIG. 11 is a schematic flow chart diagram illustrating an embodiment of a method for manufacturing an optical fiber circuit board according to the present invention;

FIG. 12 is a schematic diagram of a structure corresponding to the method of FIG. 11;

fig. 13 is a schematic diagram of the manufacturing method of the optical fiber circuit board in an actual fiber distribution process.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an optical fiber circuit board according to the present application, and in this embodiment, the optical fiber circuit board may be a circuit board that transmits only optical signals, or may be a circuit board that transmits mixed signals including optical signals. The optical fiber wiring board includes 100: a first substrate 110, a first adhesive layer 120, a first optical fiber 130, and a second substrate 140.

The first adhesive layer 120 is disposed on one side of the first substrate 110, the first optical fibers 130 are at least partially disposed in the first adhesive layer 120, and the second substrate 140 is disposed on one side of the first adhesive layer 120 away from the first substrate 110, that is, the first substrate 110, the first adhesive layer 120, and the second substrate 140 are sequentially stacked, and at least a portion of the first optical fibers 130 is disposed in the first adhesive layer 120.

Specifically, the first substrate 110 and the second substrate 140 serve as main support layers of the optical fiber circuit board 100, and are used to ensure the strength of the optical fiber circuit board 100, wherein the material of the first substrate 110 and the second substrate 140 may be any material that can serve as a substrate of the circuit board, which may be an insulating material or a conductive material, or which may be a flexible material or a rigid material. It should be noted that, by providing the material of the first substrate 110 and the second substrate 140 as a flexible material (e.g., polyimide or liquid crystal polymer, etc.), the optical fiber circuit board 100 can be made flexible and bendable, so that the optical fiber circuit board 100 can be placed in a narrow and irregular space (e.g., a cabinet, a chassis, etc.). Meanwhile, in different application scenarios, the materials of the first substrate 110 and the second substrate 140 may be the same material, or may not be the same material, which is not limited herein.

The first optical fiber 130 may be a high temperature optical fiber or a general optical fiber. The high temperature optical fiber is different from the general optical fiber in that: the material of high temperature optical fiber surface coating is high temperature resistant material, makes high temperature optical fiber can satisfy the application under the adverse circumstances of high temperature, and ordinary optical fiber is also equipped with the coating in the surface, but ordinary optical fiber surface's coating can lose the effect of protection optic fibre under high temperature, and then optic fibre is impaired easily. Wherein the designer can select the first optical fiber 130 to be a high temperature optical fiber or a common optical fiber according to the application environment of the optical fiber circuit board 100. For example: when the optical fiber circuit board 100 is required to be capable of operating at a high temperature of 100 ℃ or higher and to be repeatedly bent, the first optical fiber 130 may be selected as a high-temperature optical fiber. It should be noted that, the first optical fiber 130 is a high-temperature optical fiber, which not only can broaden the working temperature of the optical fiber circuit board 100, but also can make the optical fiber circuit board 100 adopt a lamination processing mode in the processing process, thereby broadening the processing mode of the optical fiber circuit board 100.

The first adhesive layer 120 is used to adhere the first substrate 110 and the second substrate 140 together, and the material of the first adhesive layer is adhesive, for example, epoxy resin, prepreg, or the like.

The at least part of the first optical fiber 130 disposed in the first adhesive layer 120 means: the first optical fibers 130 may be disposed entirely within the first adhesive layer 120 or partially within the first adhesive layer 120. Because the material of the first adhesive layer 120 has adhesiveness, at least a portion of the first optical fiber 130 is disposed in the first adhesive layer 120, so that the position of the first optical fiber 130 can be ensured to be fixed, and when an external force is applied, the first optical fiber 130 is not easy to deviate from the original position, thereby improving the reliability of the optical fiber circuit board 100.

The number of the first optical fibers 130 may be one or at least two, and when the number of the first optical fibers 130 is at least two, the at least two first optical fibers 130 are arranged side by side. The at least two first optical fibers 130 may be arranged side by side in a manner that: the at least two first optical fibers 130 may be arranged side by side in the same layer (as shown in fig. 1), or the at least two first optical fibers 130 may be arranged side by side in multiple layers in a stacked manner.

In order to further ensure the fixed position of the first optical fibers 130, when the number of the first optical fibers 130 is at least two, the gap between two adjacent first optical fibers 130 is filled with the first adhesive layer 120 (as shown in fig. 1).

In order to ensure that the first optical fiber 130 is not easily deviated from the pre-arranged position in the process of manufacturing the optical fiber circuit board 100, as shown in fig. 1, the first adhesive layer 120 includes two sub adhesive layers 121 stacked one on another, and at least a portion of the first optical fiber 130 is disposed between the two sub adhesive layers 121. The sub-adhesive layer 121 between the first optical fiber 130 and the first substrate 110 is defined as a first sub-adhesive layer 122, and the sub-adhesive layer 121 between the first optical fiber 130 and the second substrate 140 is defined as a second sub-adhesive layer 123.

Specifically, during manufacturing, a first sub-adhesive layer 122 is formed on the first substrate 110, then the first optical fiber 130 is disposed on the first sub-adhesive layer 122, at this time, the first sub-adhesive layer 122 pre-fixes the first optical fiber 130, then a second sub-adhesive layer 123 is formed on the side of the first optical fiber 130 away from the first sub-adhesive layer 122, at this time, the second sub-adhesive layer 123 further fixes the first optical fiber 130, so as to prevent the first optical fiber 130 from deviating from the original position, and such a layout can further ensure that the first optical fiber 130 is firmly located between the first substrate 110 and the second substrate 140, and further improve the reliability of the optical fiber circuit board 100.

In an application scenario, the material of the first sub-adhesive layer 122 may be liquid and viscous when the material is at a predetermined temperature (e.g., 45-150 ℃) exceeding the normal temperature (25 ℃), and is solid when the temperature returns to the normal temperature, and is still solid when the material is subsequently at the predetermined temperature exceeding the normal temperature (25 ℃). In another application scenario, the material of the second sub-adhesive layer 123 may be liquid at a high temperature (e.g., above 100 degrees celsius, 120 degrees celsius, or 130 degrees celsius, etc.), and has viscosity, and is solid after the temperature returns to below the high temperature, and is still solid at a high temperature. For example, the material of the second sub adhesive layer 123 may be epoxy, prepreg, or the like. Meanwhile, the material of the first sub-adhesive layer 122 and the material of the second sub-adhesive layer 123 may be different or the same, and are selected according to the practical application.

Referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of the optical fiber circuit board of the present application. Unlike the above embodiments, in the present embodiment, the optical fiber circuit board 200 further includes a second adhesive layer 250, a second optical fiber 260, and a third substrate 270 in addition to the first substrate 210, the first adhesive layer 220, the first optical fiber 230, and the second substrate 240. The first substrate 210, the first adhesive layer 220, the first optical fiber 230, and the second substrate 240 are the same as the first substrate 110, the first adhesive layer 120, the first optical fiber 130, and the second substrate 140 in the above embodiments, and are not described herein again.

The second adhesive layer 250 is disposed on a side of the second substrate 240 away from the first adhesive layer 220, the second optical fiber 260 is at least partially disposed in the second adhesive layer 250, and the third substrate 270 is disposed on a side of the second adhesive layer 250 away from the second substrate 240.

The relative position relationship among the second adhesive layer 250, the second optical fibers 260 and the third substrate 270 is the same as the relative position relationship among the first adhesive layer 220, the first optical fibers 230 and the second substrate 240. Meanwhile, the second adhesive layer 250 has the same structure as the first adhesive layer 220, the second optical fibers 260 have the same structure as the first optical fibers 230, and the third substrate 270 has the same structure as the first substrate 210/the second substrate 240.

Specifically, in the present embodiment, the second optical fibers 260 are continuously provided on the optical fiber circuit board 200 on the side of the second substrate 240 away from the first adhesive layer 220 in accordance with the arrangement method of the above-described embodiment, and the function and the use of the optical fiber circuit board 200 can be further expanded, thereby expanding the range of use of the optical fiber circuit board 200.

It should be noted that in other embodiments, more optical fibers may be disposed in the optical fiber circuit board 200 on the side of the first substrate 210 away from the first adhesive layer 220 and/or on the side of the third substrate 270 away from the second adhesive layer 250 according to the above-mentioned manner, which is not described herein again.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the optical fiber circuit board of fig. 2 in an application scenario. In this application scenario, at least one side surface of the first substrate 210, the second substrate 240, and/or the third substrate 270 is provided with the conductive layer 280, that is, a part or all of the surfaces of the first substrate 210, the second substrate 240, and the third substrate 270 are provided with the conductive layer 280, wherein fig. 3 illustrates that the surfaces of the first substrate 210, the second substrate 240, and the third substrate 270 are provided with the conductive layer 280.

The conductive layer 280 may be made of a conductive material such as copper or gold, and specifically, an electrical signal layer may be formed on the conductive layer 280, so that the optical fiber circuit board 200 may transmit both optical signals and electrical signals.

When the conductive layer 280 is at least two layers, in order to realize electrical interconnection between the conductive layers 280, as shown in fig. 4 and 5, at least two layers of the at least two conductive layers 280 are provided with a through via 281, and a conductive material (not shown) is provided in the through via 281 to realize electrical interconnection between the conductive layers 280 through which the through via 281 passes.

Specifically, vias 281 may be disposed between any of the conductive layers 280, wherein the placement of the vias 281 is required to avoid the optical fibers in the fiber circuit board 200. The number of the vias 281 may be one (as shown in fig. 5) or more than one (as shown in fig. 4).

The hole wall of the via 281 is provided with a conductive coating to electrically connect the conductive layer 280 through which the via 281 passes, or a conductive pillar is disposed in the via 281 to electrically connect the conductive layer 280 through which the via 281 passes, and how to achieve electrical interconnection between the conductive layers 280 through which the via 281 passes is not limited herein.

Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the optical transmission device of the present application. The optical transmission device 300 includes a fiber-optic circuit board 310 and an optical connector 320.

The optical fiber circuit board 310 has the same structure as the optical fiber circuit board in any of the above embodiments, and reference to the above embodiments can be made for details, which are not described herein again.

The optical connector 320 is connected to the first optical fiber 311 in the optical fiber circuit board 310, and is used for connecting with the optical docking device 400 to realize optical signal transmission between the first optical fiber 311 and the optical docking device 400. It should be noted that when the optical fiber circuit board 310 further includes more optical fibers such as a second optical fiber, the optical connector 320 may also be connected to more optical fibers such as a second optical fiber, or when the number of optical fibers in the optical fiber circuit board 310 is multiple, the optical connector 320 may be one or multiple, and when the number of optical connectors 320 is multiple, different optical connectors 320 are connected to different optical fibers.

The optical docking apparatus 400 is an apparatus capable of receiving an optical signal or transmitting an optical signal, and when the optical fiber circuit board 310 is connected to the optical docking apparatus 400 through the optical connector 320, the optical signal is transmitted between the first optical fiber 311 and the optical docking apparatus 400.

In an application scenario, the optical connector 320 is disposed on the optical fiber board 310 and connected to the first optical fiber 311 embedded inside the optical fiber board 310. That is, the first optical fibers 311 are all disposed in the fiber-optic wiring board 310 at this time.

In a specific application scenario, as shown in fig. 7, the optical fiber circuit board 310 is provided with a groove 312, the optical connector 320 is disposed in the groove 312, and one end of the first optical fiber 311 extends to the groove 312 to connect with the optical connector 320. Optionally, the number of the grooves 312 is two, the number of the optical connectors 320 is set in each of the two grooves 312, and both ends of the first optical fiber 311 are connected to the two optical connectors 320 respectively. Optionally, all of the optical connectors 320 are disposed in the grooves 312. Meanwhile, the optical connector 320 is provided with an inner cavity, a positioning structure is arranged in the inner cavity, and the first optical fiber 311 extends into the inner cavity of the optical connector 320 and is connected with the optical connector 320 through the positioning structure.

In other specific application scenarios, the optical fiber circuit board 310 may also connect the first optical fiber 311 embedded inside the optical fiber circuit board 310 with the optical connector 320 without providing the groove 312, for example, as shown in fig. 8 and 9, at least a portion of an end portion of the optical fiber circuit board 310 enters an inner cavity of the optical connector 320, so that the first optical fiber 311 embedded in the optical fiber circuit board 310 also enters the optical connector 320 to be connected with the optical connector 320, and at this time, the first optical fiber 311 is not exposed to the outside, so that the first optical fiber 311 can be effectively prevented from being damaged. The difference between the structures of fig. 8 and 9 is that: in fig. 8, the end of the fiber board 310 is fully inserted into the optical connector 320, and in fig. 9, the end of the fiber board 310 is partially inserted into the optical connector 320. in the manufacturing of the structure of fig. 9, the end of the fiber board 310 may be cut so that the width of at least a portion of the end of the fiber board 310 is reduced and at least a portion of the end of the fiber board 310 is inserted into the optical connector 320.

In another application scenario, as shown in fig. 10, the first optical fiber 311 includes an end 3111 extending outward from the optical fiber circuit board 310 to be exposed outside the optical fiber circuit board 310, and the optical connector 320 is connected to the end 3111 of the first optical fiber 311 exposed outside the optical fiber circuit board 310. That is, at least a portion of the first optical fiber 311 is exposed outside the optical fiber circuit board 310 and connected to the optical connector 320, and the optical connector 320 may or may not be fixedly disposed on the surface of the optical fiber circuit board 310 (as shown in fig. 10).

In order to protect the exposed portion of the first optical fiber 311 outside the optical fiber circuit board 310, a protective layer 3112 is sleeved on the outer circumference of the exposed portion of the first optical fiber 311 outside the optical fiber circuit board 310 to protect the first optical fiber 311. The protective layer 3112 may be a hard material or a soft material, and when the protective layer 3112 is a hard material, the protective layer 3112 may also support or position the first optical fiber 311. The material of the protective layer 3112 can be selected according to different applications.

Referring to fig. 11, fig. 11 is a schematic flow chart of an embodiment of a method for manufacturing an optical fiber circuit board according to the present application, which can manufacture the optical fiber circuit board, and the detailed description of the related contents refers to the above-mentioned section, which is not described herein again. With reference to fig. 12, the method includes:

s510: a first substrate 1 and a second substrate 2 are provided.

S520: a first adhesive layer 3 is formed by coating an adhesive material on one side of a first substrate 1 and performing a semi-curing process.

The coating method includes but is not limited to: screen printing, spray coating, roller coating, laminating, and the like. Methods of semi-curing include, but are not limited to: air moisture curing, laminating, baking and semi-curing.

S530: the first adhesive layer 3 is heated and at least part of the first optical fiber 4 is disposed therein.

In an application scenario, when the first adhesive layer 3 includes two sub adhesive layers 31, a sub adhesive layer 31 is formed on the first substrate 1, and then referring to fig. 13, the sub adhesive layer 31 is heated by the heating stages (including the top heating stage 5a and the bottom heating stage 5b), and then the first optical fiber 4 is arranged on the sub adhesive layer 31 by the fiber arrangement device 6, and then the sub adhesive layer 31 is continuously formed. In other embodiments, the heating stage may be heated only by the bottom heating stage 5 b.

S540: the second substrate 2 is disposed on a side of the first adhesive layer 3 away from the first substrate 1.

S550: and performing lamination treatment to form the optical fiber circuit board.

Optionally, after the lamination treatment, the reliability of the optical fiber circuit board can be further ensured through baking treatment.

In summary, unlike the prior art, the optical fiber circuit board in the present application has at least a portion of the first optical fiber disposed in the first adhesive layer between the first substrate and the second substrate, so as to ensure the position of the first optical fiber is fixed and ensure the reliability of the optical fiber circuit board.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (12)

1. A fiber optic circuit board, comprising:

a first substrate;

the first bonding layer is arranged on one side of the first substrate;

a first optical fiber at least partially disposed in the first adhesive layer;

the second substrate is arranged on one side, far away from the first substrate, of the first bonding layer.

2. The fiber optic circuit board of claim 1, wherein the first adhesive layer comprises two sub-adhesive layers arranged in a stack, the at least a portion of the first optical fiber being disposed between the two sub-adhesive layers.

3. The fiber optic cord of claim 1, wherein the number of the first optical fibers is at least two, and at least two of the first optical fibers are disposed side-by-side.

4. The fiber optic circuit board of claim 3,

the gap between two adjacent first optical fibers is filled up by the first adhesive layer.

5. The fiber optic cord board of claim 1, further comprising:

the second bonding layer is arranged on one side of the second substrate, which is far away from the first bonding layer;

a second optical fiber at least partially disposed in the second adhesive layer;

and the third substrate is arranged on one side, far away from the second substrate, of the second bonding layer.

6. The fiber optic circuit board of claim 5,

and at least one side surface of the first substrate and/or the second substrate and/or the third substrate is provided with a conductive layer.

7. The fiber optic circuit board of claim 6, wherein the fiber optic circuit board comprises at least two of the conductive layers, and a via hole is disposed between at least two of the at least two conductive layers, and a conductive material is disposed in the via hole to electrically interconnect the conductive layers through which the via hole passes.

8. An optical transmission device, comprising the optical fiber circuit board according to any one of claims 1 to 7, and an optical connector connected to the first optical fiber, wherein the optical connector is used for connecting to an optical interface device to realize optical signal transmission between the first optical fiber and the optical interface device.

9. The optical transmission apparatus according to claim 8,

the optical connector is provided on the optical fiber circuit board and connected to the first optical fiber embedded in the optical fiber circuit board.

10. The optical transmission apparatus according to claim 9,

the optical fiber circuit board is provided with a groove, the optical connector is arranged in the groove, and one end of the first optical fiber extends to the groove and is connected with the optical connector.

11. The optical transmission apparatus according to claim 8,

the first optical fiber comprises one end which extends outwards from the inside of the optical fiber circuit board and is exposed outside the optical fiber circuit board, and the optical connector is connected with one end of the first optical fiber, which is exposed outside the optical fiber circuit board.

12. The optical transmission apparatus according to claim 11,

the periphery of the part, exposed outside the optical fiber circuit board, of the first optical fiber is sleeved with a protective layer.

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