CN108271314A - A kind of production method and backboard of oversize backboard - Google Patents
A kind of production method and backboard of oversize backboard Download PDFInfo
- Publication number
- CN108271314A CN108271314A CN201810050103.7A CN201810050103A CN108271314A CN 108271314 A CN108271314 A CN 108271314A CN 201810050103 A CN201810050103 A CN 201810050103A CN 108271314 A CN108271314 A CN 108271314A
- Authority
- CN
- China
- Prior art keywords
- backboard
- small size
- oversize
- via hole
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1447—External wirings; Wiring ducts; Laying cables
- H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The present invention provides a kind of production methods and backboard of oversize backboard, at least one large-sized backboard is resolved into several small size backboards, and via hole is reserved according to cabling, after being processed into small size backboard, multiple several small size backboards are connected by the reserved via hole using connector and cable lines, large scale backboard is formed, the present invention solves the technical issues of oversize backboard can not be processed.
Description
Technical field
The present invention relates to the technical fields of circuit, and in particular to a kind of production method and backboard of oversize backboard.
Background technology
In the prior art, printed wiring board industry backboard is used as the motherboard of connection, and corresponding snap-gauge can pass through
Connector is inserted on this motherboard to realize the conducting of signal.Such backboard number of plies is all very high, it might even be possible to reach 60 layers, thickness
Substantially all in more than 3mm.And as the industries such as communication are frequently necessary to the backboard of oversize for communication base station, if backboard size
The working ability that excessively big then circuit board plant is limited by equipment can not process.The prior art for certain high end plate factories also only
Can processing dimension be less than the backboard of 1100mm*600mm, most general plate factory processing dimensions of process capability then smaller, so needing
Solve the technical barrier of oversize backboard processing.
Invention content
Based on the above problem, the present invention proposes a kind of production method and backboard of oversize backboard, large-sized
Backboard resolves into the backboard of several small sizes at devoid of risk signal, then connects conducting with cable lines by connector,
Solves the technical issues of oversize backboard can not be processed.
The present invention provides following technical solution：
On the one hand, the present invention provides a kind of production method of oversize backboard, including：
At least one large-sized backboard is resolved into N number of small size backboard, and reserve via hole according to cabling, is processed into
After small size backboard, M small size backboard is connected by the reserved via hole using connector and cable lines, shape
Into large scale backboard.
Wherein, N is the natural number more than or equal to 2, and M is the natural number more than or equal to N.
Wherein, it is described that at least one large-sized backboard is resolved into N number of small size backboard to be punished in devoid of risk signal
Solution is into N number of small size backboard.
In addition, the present invention also provides a kind of oversize backboard, the backboard includes M small size backboard, via hole
With connector and cable lines；
The M small size backboard is connected by reserved via hole using connector and cable lines, forms large scale
Backboard.
Wherein, N is the natural number more than or equal to 2, and M is the natural number more than or equal to N.
Wherein, the M small size backboard by least one large scale backboard resolve into N number of small size backboard be processed into it is small
Size backplanes obtain.
The present invention provides a kind of production method and backboard of oversize backboard, by least one large-sized backboard point
Solution reserves via hole into several small size backboards according to cabling, and after being processed into small size backboard, multiple several small sizes are carried on the back
Plate is connected by the reserved via hole using connector and cable lines, forms large scale backboard, the present invention solves super
The technical issues of large scale backboard can not be processed.
Description of the drawings
Fig. 1 is the oversize backboard of the present invention；
Fig. 2 is the backboard of the prior art.
Specific embodiment
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Based on above-mentioned, on the one hand, embodiments of the present invention provide a kind of production method of oversize backboard, attached drawing
1 is the oversize backboard of the present invention, and attached drawing 2 is the oversize backboard of the present invention, the method includes：
At least one large-sized backboard is resolved into N number of small size backboard, and reserve via hole according to cabling, is processed into
After small size backboard, M small size backboard is connected by the reserved via hole using connector and cable lines, shape
Into large scale backboard.
One or more large-sized backboards are resolved into the back of the body of several small sizes when designing first at devoid of risk signal
Plate, and via hole is reserved according to cabling, after Dai Ban factories process the backboard of small size, by the backboard of small size by reserving
Via hole connector and cable lines connect, thus produce large-sized wiring board, as shown in Figure 1.It is logical
It crosses and is solved using the connection of cable lines because backboard is very thick very heavy, directly have connection reliability and misalignment with connector connection
The problem of (2 two backboards of attached drawing are directly connected with connector, it is this design because A＆B backboards it is very thick very heavy, have connector company
Connect reliability and misalignment problem).
The present invention provides a kind of production method and backboard of oversize backboard, by least one large-sized backboard point
Solution reserves via hole into several small size backboards according to cabling, and after being processed into small size backboard, multiple several small sizes are carried on the back
Plate is connected by the reserved via hole using connector and cable lines, forms large scale backboard, the present invention solves super
The technical issues of large scale backboard can not be processed can be applied to the industry of the demands oversize backboard such as communication base station, and having can
Realisation and very high economic value.
On the other hand, embodiments of the present invention provide a kind of oversize backboard, and attached drawing 1 is the super large ruler of the present invention
Very little backboard, attached drawing 2 are the oversize backboards of the present invention；The backboard include M small size backboard, via hole with connector with
And cable lines；
One or more large-sized backboards resolve into the backboard of several small sizes at devoid of risk signal, and according to walking
Line reserves via hole, and after Dai Ban factories process the backboard of small size, the backboard of small size is used by the via hole reserved
Connector and cable lines connect, and thus produce large-sized wiring board, as shown in Figure 1.By using
The connection of cable lines is solved because backboard is very thick very heavy, directly connects the problem of having connection reliability and misalignment with connector
(2 two backboards of attached drawing are directly connected with connector, and it is reliable to have connector connection because A＆B backboards are very thick very heavy for this design
Property and misalignment problem).
The present invention provides a kind of production method and backboard of oversize backboard, by least one large-sized backboard point
Solution reserves via hole into several small size backboards according to cabling, and after being processed into small size backboard, multiple several small sizes are carried on the back
Plate is connected by the reserved via hole using connector and cable lines, forms large scale backboard, the present invention solves super
The technical issues of large scale backboard can not be processed can be applied to the industry of the demands oversize backboard such as communication base station, and having can
Realisation and very high economic value.
The foregoing description of the disclosed embodiments enables those skilled in the art to realize or use the present invention.To this
A variety of modifications of a little embodiments will be apparent for a person skilled in the art, and the general principles defined herein can
Without departing from the spirit or scope of the present invention, to realize in other embodiments.
Therefore, the present invention is not intended to be limited to the embodiments shown herein, but meet with it is disclosed herein
Principle and the consistent most wide range of features of novelty.
Claims (6)
1. a kind of production method of oversize backboard, it is characterised in that：
At least one large-sized backboard is resolved into N number of small size backboard, and reserve via hole according to cabling, is processed into small ruler
After very little backboard, M small size backboard by the reserved via hole using connector and cable lines is connected, is formed big
Size backplanes.
2. according to the method described in claim 1, it is characterized in that：N is natural number more than or equal to 2, M be more than or equal to
The natural number of N.
3. according to the method described in claim 1, it is characterized in that：It is described at least one large-sized backboard is resolved into it is N number of
Small size backboard is resolves into N number of small size backboard at devoid of risk signal.
4. a kind of oversize backboard, it is characterised in that：
The backboard includes M small size backboard, and via hole is with connector and cable lines；The M small size backboard passes through
Reserved via hole is connected using connector and cable lines, forms large scale backboard.
5. backboard according to claim 4, it is characterised in that：N is natural number more than or equal to 2, M be more than or equal to
The natural number of N.
6. backboard according to claim 4, it is characterised in that：The M small size backboard is carried on the back by least one large scale
Plate resolves into N number of small size backboard and is processed into the acquisition of small size backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050103.7A CN108271314A (en) | 2018-01-18 | 2018-01-18 | A kind of production method and backboard of oversize backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810050103.7A CN108271314A (en) | 2018-01-18 | 2018-01-18 | A kind of production method and backboard of oversize backboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108271314A true CN108271314A (en) | 2018-07-10 |
Family
ID=62776132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810050103.7A Pending CN108271314A (en) | 2018-01-18 | 2018-01-18 | A kind of production method and backboard of oversize backboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108271314A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119293A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
| CN101027950A (en) * | 2004-09-27 | 2007-08-29 | 英特尔公司 | Flexible cable for high-speed interconnect |
| CN102246606A (en) * | 2008-12-09 | 2011-11-16 | 皇家飞利浦电子股份有限公司 | Flexible modular assembly |
| CN203301859U (en) * | 2013-04-17 | 2013-11-20 | 茅永夫 | Assembled circuit board |
| CN203608454U (en) * | 2013-12-03 | 2014-05-21 | 广州杰赛科技股份有限公司 | Large-size butt joint production flexible printed circuit board |
-
2018
- 2018-01-18 CN CN201810050103.7A patent/CN108271314A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119293A (en) * | 1986-11-07 | 1988-05-23 | 日本電気株式会社 | Multilayer interconnection board |
| CN101027950A (en) * | 2004-09-27 | 2007-08-29 | 英特尔公司 | Flexible cable for high-speed interconnect |
| CN102246606A (en) * | 2008-12-09 | 2011-11-16 | 皇家飞利浦电子股份有限公司 | Flexible modular assembly |
| CN203301859U (en) * | 2013-04-17 | 2013-11-20 | 茅永夫 | Assembled circuit board |
| CN203608454U (en) * | 2013-12-03 | 2014-05-21 | 广州杰赛科技股份有限公司 | Large-size butt joint production flexible printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180710 |
|
| RJ01 | Rejection of invention patent application after publication |