KR102480108B1 - Display device - Google Patents

Abstract

The present invention relates to a display device, and relates to a substrate in which a non-display area including a display area and a backlight area is defined, a first pad and a second pad disposed in the backlight area, and a first pad and a second pad disposed in the backlight area. It includes an LED electrically connected to the pad. Therefore, the bezel area can be minimized by folding the support member on which the LEDs are disposed twice.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a display device in which a narrow bezel is implemented using a light emitting diode (LED) mounted on a substrate as a backlight.

Currently, various display devices are being developed and marketed. For example, a liquid crystal display device (LCD), a field emission display device (FED), an electrophoretic display device (EPD), an electro-wetting display device There are display devices such as a display device (EWD), an organic light emitting display device (OLED), and a quantum dot display device (QD).

Since the liquid crystal display device is a display device that displays an image by controlling the amount of light coming from the outside of the liquid crystal display panel, a separate light source, that is, a back light unit, for irradiating light to the liquid crystal display panel is absolutely necessary. . The liquid crystal display device may display an image by selectively transmitting light emitted from a backlight unit through a liquid crystal layer.

However, as backlight units other than the liquid crystal display panel are additionally disposed, a mechanism for fixing and fastening the backlight unit is being used. At this time, there is a limit to reducing a bezel area visually recognized by a user on a flat surface due to a space for disposing a backlight unit and equipment disposed under the liquid crystal display panel.

An object to be solved by the present invention is to provide a display device that does not include a separate backlight unit by using LEDs disposed on a substrate as a backlight.

Another problem to be solved by the present invention is to provide a display device capable of implementing a narrow bezel by removing a backlight unit and removing a mechanism for fastening the backlight unit.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, a display device according to an exemplary embodiment of the present invention includes a substrate defining a non-display area including a display area and a backlight area, a first pad and a second pad disposed in the backlight area, and a backlight. and an LED disposed in the region and electrically connected to the first pad and the second pad. Accordingly, a narrow bezel may be implemented using the LED disposed on the substrate as a backlight.

Other embodiment specifics are included in the detailed description and drawings.

According to the present invention, a separate backlight unit can be omitted by folding the backlight area where the LED is disposed and using the LED as a backlight.

According to the present invention, since a separate backlight unit is removed and an area occupied by a backlight unit and a fixture for fastening the backlight unit is also removed, a narrow bezel display device can be realized.

Effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a plan view of a display device according to an exemplary embodiment of the present invention.
FIG. 2 is a cross-sectional view along line II-II′ of FIG. 1 .
3A to 3C are schematic process diagrams for explaining a method of manufacturing a display device according to an exemplary embodiment of the present invention.
4 and 5 are cross-sectional views of a display device according to another exemplary embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative, so the present invention is not limited to the details shown. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

When an element or layer is referred to as (on) another element or layer, it includes all cases where another element or layer is directly above another element or another layer or other element is interposed therebetween.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numbers designate like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated components.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and as those skilled in the art can fully understand, various interlocking and driving operations are possible, and each embodiment can be implemented independently of each other. It may be possible to implement together in an association relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a display device according to an exemplary embodiment of the present invention. 1 illustrates a substrate 110, a data driver 180, a pixel PX, a connector CNT, a plurality of pads P1 and P2, and a plurality of power supplies among various components of the display device 100 for convenience of description. Only the supply wirings VLS1 and VS2 are shown.

The substrate 110 is a substrate for supporting and protecting various components of the display device 100 . The substrate 110 may be made of glass or a plastic material having flexibility. When the substrate 110 is made of a plastic material, it may be made of, for example, polyimide (PI). However, it is not limited thereto.

A display area AA and a non-display area NA surrounding the display area AA may be defined on the substrate 110 .

The display area AA is an area where an image is actually displayed on the display device 100 . A display unit, various driving elements for driving the display unit, and a plurality of signal lines may be disposed in the display area AA. For example, the display unit may be a liquid crystal display unit that drives liquid crystal by an electric field generated by a voltage applied to the pixel electrode 131 and the common electrode 132 . In addition, various driving elements such as a transistor 120 and a capacitor for driving the display unit may be disposed in the display area AA. In this specification, the display device 100 has been described as the liquid crystal display device 100, but is not limited thereto.

A plurality of pixels PX are defined in the display area AA of the substrate 110 . Each of the plurality of pixels PX is an individual unit emitting light, and the plurality of pixels PX may include a red pixel PX, a green pixel PX, and a blue pixel PX, but are not limited thereto. no. A transistor 120 is formed in each of the plurality of pixels PX. For a more detailed description of the display area AA, it will be described later with reference to FIG. 2 .

The non-display area NA is an area in which an image is not displayed and is an area surrounding the display area AA. Various components for driving the plurality of pixels PX disposed in the display area AA may be disposed in the non-display area NA. For example, as shown in FIG. 1 , the data driver 180, the pad P, and the power supply wires VL1 and VL2 connected to the pad P may be disposed.

The non-display area NA includes a module bonding area MBA extending from one side of the display area AA and a backlight area BLA extending from the other side of the display area AA.

The module bonding area MBA is an area where modules for driving a plurality of pixels PX are bonded. For example, as shown in FIG. 1 , the data driver 180 is disposed in the module bonding area MBA. The data driver 180 is a component for processing data for displaying an image and a driving signal for processing the data, and is a component for supplying signals to the plurality of pixels PX of the display area AA. The data driver 180 supplies data signals to the plurality of pixels PX of the display area AA through various wires disposed in the non-display area NA. In FIG. 1 , one data driver 180 is illustrated, but the data driver 180 is not limited thereto and a plurality of data driver 180 may be disposed on the substrate 110 .

Referring to FIG. 1 , the data driver 180 includes a base film 182 and a driver IC 181 . The base film 182 is a film supporting the data driver 180 . The base film 182 may be made of an insulating material, for example, may be made of an insulating material having flexibility. The driving IC 181 is a component that processes a data voltage for displaying an image and a driving signal for processing the data voltage. The driving IC 181 may be disposed on the substrate 110 of the display device 100 in a manner such as COG (Chip On Glass), COF (Chip On Film), TCP (Tape Carrier Package), or the like. there is. In FIG. 1 , for convenience of description, the data driver 180 is illustrated as a COF method mounted on the base film 182 , but is not limited thereto.

The backlight area BLA of the non-display area NA is a plurality of components for driving LEDs, and as shown in FIG. 1 , a plurality of first power supply lines VL1 and second power supply lines VL2 , a plurality of first pads P1, a plurality of second pads P2, and a connector CNT are disposed.

Hereinafter, FIG. 2 will also be referred to for a more detailed description of the pixel area PX and the backlight area BLA of the non-display area NA.

FIG. 2 is a cross-sectional view along line II-II′ of FIG. 1 . In FIG. 2 , for convenience of description, the upper configuration of the pixel electrode 131 and the common electrode 132 in the display area AA is omitted.

First, the display area AA will be described in detail. The transistor 120 is disposed on the substrate 110 in the display area AA. The transistor 120 includes a gate electrode 121 , an active layer 122 disposed on the gate electrode 121 , and a source electrode 123 and a drain electrode 124 disposed on the active layer 122 .

Referring to FIG. 2 , a gate electrode 121 is formed on the substrate 110 in the display area AA. A gate insulating layer 111 is formed on the gate electrode 121 , and an active layer 122 in which a channel of the transistor 120 is formed is formed on the gate insulating layer 111 . The gate insulating layer 111 may electrically insulate the active layer 122 and the gate electrode 121 . The gate insulating layer 111 is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be a single layer or a plurality of layers thereof, but is not limited thereto.

A source electrode 123 and a drain electrode 124 of the transistor 120 may be formed on the active layer 122 . The transistor 120 may be a bottom gate type transistor as shown in FIG. 2 , but the stacked structure of the transistor 120 is not limited thereto and may be a top gate type transistor. .

A passivation layer 112 is disposed on the transistor 120 . The passivation layer 112 is an insulating layer for protecting the plurality of transistors 120 . The passivation layer 112 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). However, it is not limited thereto, and the passivation layer 112 may be omitted according to design.

A planarization layer 113 is disposed on the passivation layer 112 . The planarization layer 113 is an insulating layer for planarizing the transistor 120 and may be made of an organic material. A contact hole for exposing the drain electrode 124 of the transistor 120 is formed in the planarization layer 113 .

A pixel electrode 131 is disposed on the planarization layer 113 . The pixel electrode 131 is an electrode for forming an electric field in the liquid crystal layer. The pixel electrode 131 is connected to the drain electrode 124 of the transistor 120 through a contact hole formed in the planarization layer 113 . The transistor 120 may apply a voltage to the pixel electrode 131 . The pixel electrode 131 may be made of a transparent conductive material such as indium tin oxide (ITO), but is not limited thereto.

A common electrode 132 is disposed on the planarization layer 113 . The common electrode 132 is an electrode for forming an electric field in the liquid crystal layer together with the pixel (PX) electrode 131 . That is, the pixel electrode 131 and the common electrode 132 can form an electric field, and the liquid crystal layer can be driven by the electric field. The common electrode 132 may be made of the same material as the pixel electrode 131, and may be made of, for example, a transparent conductive material such as indium tin oxide (ITO), but is not limited thereto.

2 shows that the pixel electrode 131 and the common electrode 132 are disposed on the same layer on the planarization layer 113, but is not limited thereto, and the pixel electrode 131 and the common electrode 132 are on different layers. can be placed. For example, a pixel electrode 131 may be disposed on the planarization layer 113 and an insulating layer may be disposed on the pixel electrode 131 . Also, a common electrode 132 may be disposed on the insulating layer.

Meanwhile, although omitted for convenience of illustration in FIG. 2 , a liquid crystal layer may be disposed on the pixel electrode 131 and the common electrode 132 .

Next, a detailed description of the backlight area BLA of the non-display area NA includes a plurality of first pads P1 and a plurality of second pads P2 on the substrate 110 in the backlight area BLA. A plurality of pads (P) are disposed. The plurality of first pads P1 and the plurality of second pads P2 are connected to the plurality of first power supply lines VL1 and the plurality of second power supply lines VL2, respectively, to drive the LED 140. It is a configuration that conveys

The first pad P1 and the second pad P2 may be disposed on the same layer as the gate electrode 121 and made of the same material as the gate electrode 121 . However, it is not limited thereto, and the first pad P1 and the second pad P2 may be disposed on the same layer as the source electrode 123 and the drain electrode 124, and the source electrode 123 and the drain It may be made of the same material as the electrode 124 .

Referring to FIG. 2 , a connector CNT is disposed between the display area AA and the LED 140 . Specifically, between the LED 140 disposed on the passivation layer 112 in the backlight area BLA and the pixel electrode 131 and the common electrode 132 disposed on the passivation layer 112 in the display area AA. A connector (CNT) is disposed on.

Specifically, the connector CNT is a component for supplying a driving voltage for driving the LED 140 . Specifically, the connector CNT is disposed on the board 110 in the backlight area BLA to transmit a driving voltage supplied from a power supply unit POWER disposed outside the board 110 through a plurality of power supply wires to the LEDs ( 140) is supplied. As shown in FIG. 1 , the connector CNT is disposed between the display area AA and the LED 140, and the connector CNT and the plurality of first pads P1 and the plurality of second pads P2 It is connected to a plurality of first power supply wires VL1 and a plurality of second power supply wires VL2 connecting the .

The plurality of first power supply lines VL1 and second power supply lines VL2 are configured to connect the driving voltage supplied from the connector CNT to the plurality of pads P. Specifically, the plurality of first power supply lines VL1 and the plurality of second power supply lines VL2 are disposed on the substrate 110 in the backlight area BLA to form a plurality of first pads P1 and a plurality of second power supply lines VL2. Each is connected to the second pad P2.

A first connection electrode 151 and a second connection electrode 152 are disposed on the planarization layer 113 in the backlight area BLA. The first connection electrode 151 connects to the first pad P1 through contact holes formed in the gate insulating layer 111, the passivation layer 112, and the planarization layer 113 exposing a portion of the first pad P1. electrically connected Accordingly, the first connection electrode 151 may receive the driving voltage transmitted through the first pad P1 and supply it to the LED 140 .

The second connection electrode 152 is spaced apart from the first connection electrode 151 on the same plane. The second connection electrode 152 connects to the second pad P2 through a contact hole formed in the gate insulating layer 111, the passivation layer 112, and the planarization layer 113 exposing a portion of the second pad P2. electrically connected Accordingly, the second connection electrode 152 may receive the driving voltage transmitted through the second pad P2 and supply the driving voltage to the LED 140 .

An LED 140 is disposed on the first connection electrode 151 and the second connection electrode 152 . The LED 140 includes an LED base member 141, an n-type layer 142, an active layer 143, a p-type layer 144, an n-electrode 145, and a p-electrode 146. The LED 140 of the display device 100 according to an embodiment of the present invention has a flip-chip structure in which an n-electrode 145 and a p-electrode 146 are formed on one surface.

The LED base member 141 may be made of a material capable of emitting light, and may be made of, for example, sapphire.

Looking at the process of forming the LED 140, the n-type layer 142 is disposed on the LED base member 141. The n-type layer 142 may be formed by implanting n-type impurities into gallium nitride (GaN) having excellent crystallinity. An active layer 143 is disposed on the n-type layer 142 . The active layer 143 is a light emitting layer that emits light from the LED 140 and may be formed of a nitride semiconductor, for example, indium gallium nitride (InGaN). A p-type layer 144 is disposed on the active layer 143 . The p-type layer 144 may be formed by implanting p-type impurities into gallium nitride (GaN).

As described above, the LED 140 according to an embodiment of the present invention, after sequentially stacking the n-type layer 142, the active layer 143 and the p-type layer 144 on the LED base member 141 , After etching a predetermined portion, it is manufactured by forming an n-electrode and a p-electrode. At this time, a predetermined portion is a space for separating the n-electrode and the p-electrode, and the predetermined portion is etched to expose a portion of the n-type layer 142 . In other words, the surfaces of the LED 140 on which the n-electrode 145 and the p-electrode 146 are disposed may have different height levels rather than being flattened.

In this way, the n-electrode 145 is disposed on the etched region, that is, on the n-type layer 142 exposed through the etching process. The n-electrode 145 may be made of a conductive material. Meanwhile, a p-electrode 146 is disposed on an unetched region, that is, on the p-type layer 144 . The p-electrode 146 may also be made of a conductive material, for example, may be made of the same material as the n-electrode 145 .

As described above, in the state where the n-type layer 142, the active layer 143, the p-type layer 144, the n-electrode 145, and the p-electrode 146 are formed on the LED base member 141, the n-electrode 145 ) and the p-electrode 146 face the first connection electrode 151 and the second connection electrode 152 , respectively, the LED 140 is disposed in the backlight area BLA on the substrate 110 .

The n-electrode 145 of the LED 140 is electrically connected to the second connection electrode 152 through the adhesive layer 114, and the p-electrode 146 is electrically connected to the first connection electrode 151 through the adhesive layer 114. electrically connected However, the present invention is not limited thereto, and the first connection electrode 151 may be electrically connected to the n-electrode 145, and the second connection electrode 152 may be electrically connected to the p-electrode 146. At this time, the adhesive layer 114 is an adhesive containing conductive particles, and conducts a current through which conductive balls are dispersed, and is cured by heat and/or pressure to maintain adhesive strength.

Hereinafter, a manufacturing method of the display device 100 according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 3A to 3C .

3A to 3C are schematic process diagrams for explaining a method of manufacturing a display device according to an exemplary embodiment of the present invention. Specifically, FIGS. 3A to 3C are schematic process diagrams for explaining a manufacturing method of the display device 100 of FIGS. 1 to 2 .

First, referring to FIG. 3A , the substrate 110 is folded at 90 degrees toward the lower surface of the substrate 110 in the backlight area BLA. Specifically, the first folding portion FA1 of the backlight area BLA may be folded 90 degrees toward the lower surface of the substrate 110 . Accordingly, the substrate 110 may be formed in an 'L' shape. In addition, as the substrate 110 is folded once in the lower surface direction, the connector CNT and the light output portion of the LED 140 may face the outside in the backlight area BLA.

Next, referring to FIG. 3B , while the first foldable portion FA1 is folded 90 degrees as shown in FIG. 3A , the second foldable portion FA2 of the backlight area BLA is folded 180 degrees. Specifically, the second folding portion FA2 extending from one end of the first flat portion FL1 extending from the first folding portion FA1 may be folded 180 degrees toward the lower surface of the first flat portion. Accordingly, a second flat portion FL2 extending from the second folding portion FA2 and having the LED 14 and the connector CNT disposed thereon may be defined. As described above, as the substrate 110 is folded twice in the lower surface direction, the connector CNT and the light emitting portion of the LED 140 are directed in a direction adjacent to the display area AA of the substrate 110 in the backlight area BLA. can be formed to

Next, referring to FIG. 3C , the mechanical unit 160 is fastened to the lower portion of the second folding portion FA2 formed in the backlight area BLA of the substrate 110 in FIG. 3B , and the backlight area BLA is folded twice. The light guide plate 170 is disposed on the left side of one area and below the substrate 110 .

Specifically, the mechanical part 160 is a structure for fixing the backlight area BLA where the LED 140 used as the backlight is disposed, and the first flat part FL1 and the second flat part FL1 on the lower surface of the second folding part FA2. It is formed to be in contact with the connector CNT formed on the two flat portions FL2. Accordingly, the mechanical unit 160 may fix the backlight area BLA of the substrate 110 without an adhesive. Here, the power supply unit POWER may be disposed through a connection wire extending from at least one side of the connector CNT.

In addition, the light guide plate 170 may be disposed between the lower surface of the substrate 110 and the mechanical part 160 so as to be adjacent to the second flat part FL2 . Accordingly, in the display device 100 according to an exemplary embodiment of the present invention, the backlight area of the substrate is folded twice so that the LEDs 140 emit light to the light guide plate 170 . Accordingly, the light guide plate 170 may propagate light incident from the LED 140 toward the substrate 110 .

Here, the light guide plate 170 is made of a light-transmitting material such as poly methyl methacrylate (PMMA), polycarbonate (PC), polymethylpentene (PMP), or polyamide (PA). , polyesterimide (PEI), polystyrene (PS), polyethersulfone (PES), and acrylonitrile styrene (AS).

Although not shown in FIG. 3C , a reflective sheet may be disposed on the lower surface of the light guide plate 170 , that is, between the light guide plate 170 and the mechanical unit. The reflective sheet may reflect light incident from the light guide plate 170 back toward the light guide plate 170, and may prevent light incident from the light guide plate 170 from being absorbed by an appliance.

Also, although not shown in FIG. 3C , an optical sheet unit may be disposed on the upper surface of the light guide plate 170 , that is, between the light guide plate 170 and the substrate 110 . The optical sheet unit may perform a role of condensing and diffusing light to uniformly propagate the light toward the substrate 110 so as to increase the luminance of the substrate 110 .

In general, a liquid crystal display device needs to minimize a bezel area to implement a front display. However, since a general liquid crystal display device uses a backlight unit, if there is a backlight unit, a separate structure must be fastened to the substrate, so the size of the device is inevitably increased. Accordingly, it may be difficult for a general liquid crystal display to implement a narrow bezel high-resolution display.

Accordingly, in the display device 100 according to an embodiment of the present invention, the backlight unit is removed and the LED 140 is disposed on the front surface of the substrate 110 . Thereafter, the backlight area BLA including the LED 140 disposed on the substrate 110 is folded twice in the direction of the rear surface of the substrate 110 so that the LED 140 may be disposed on the rear surface of the substrate 110. there is. At this time, the LED 140 disposed on the rear surface of the substrate 110 may be used as a backlight.

Therefore, in the display device 100 according to an embodiment of the present invention, since the LED 140 is disposed on the substrate 110, a separate backlight unit can be omitted. ) serves to fix the twice-folded area, so the size can be small.Therefore, since the area occupied by the display device 100 is also removed, the display device 100 can effectively implement a high-resolution display device by implementing a narrow bezel. can

4 and 5 are cross-sectional views of a display device according to another exemplary embodiment of the present invention. The display device 400 shown in FIGS. 4 and 5 differs from the display device 100 shown in FIGS. 2 to 3C except for the type of LED and other configurations are substantially the same, so duplicate descriptions are omitted. do.

Referring to FIG. 4 , a reflective layer 453 is disposed on the substrate 110 in the second flat portion FL2 where the backlight area BLA is folded twice. The reflective layer 453 is a layer for reflecting the light emitted toward the substrate 110 from among the light emitted from the LED 440 toward the upper portion of the display device 400 and outputting the light to the outside of the display device 400. 453 is disposed spaced apart on the same layer as the gate electrode 121 of the transistor 120 disposed in the display area AA. Accordingly, the reflective layer 453 may be disposed on the same layer as the first pad P1 and the second pad P2.

The reflective layer 453 may be made of a metal material having high reflectivity. For example, the reflective layer 453 may be formed of the same material as the gate electrode 121 of the transistor 120 disposed in the display area AA, but is not limited thereto, and a source disposed in the display area AA. The electrode 123 and the drain electrode 124 may be made of the same material.

Referring to FIG. 4 , an LED 440 is disposed on a reflective layer 453 . Specifically, a reflective layer is disposed between the substrate 110 and the LED 440 in the backlight area BLA. The LED 440 includes an n-type layer 442, an active layer 443, a p-type layer 444, an n-electrode 445, and a p-electrode 446. Hereinafter, it will be described that the LED 440 having a lateral structure is used as the LED 440, but the structure of the LED 440 is not limited thereto.

Describing the stacked structure of the LED 440 in more detail, the n-type layer 442 may be formed by injecting n-type impurities into gallium nitride (GaN) having excellent crystallinity. An active layer 443 is disposed on the n-type layer 442 . The active layer 443 is a light emitting layer that emits light from the LED 440 and may be formed of a nitride semiconductor, for example, indium gallium nitride (InGaN). A p-type layer 444 is disposed on the active layer 443 . The p-type layer 444 may be formed by implanting p-type impurities into gallium nitride (GaN). However, the constituent materials of the n-type layer 442, the active layer 443, and the p-type layer 444 are not limited thereto.

As described above, in the LED 440, the n-type layer 442, the active layer 443, and the p-type layer 444 are sequentially laminated, and after etching predetermined portions, the n-electrode 445 and the p-electrode are formed. (446). At this time, a predetermined portion is a space for separating the n-electrode 445 and the p-electrode 446, and the predetermined portion may be etched to expose a portion of the n-type layer 442. In other words, the surfaces of the LED 440 on which the n-electrode 445 and the p-electrode 446 are disposed may have different height levels rather than being flattened.

As such, the n-electrode 445 may be disposed on the etched region, that is, on the n-type layer 442 exposed through the etching process. The n-electrode 445 may be made of a conductive material, for example, a transparent conductive oxide. Meanwhile, a p-electrode 446 may be disposed on an unetched region, that is, on the p-type layer 444 . The p-electrode 446 may also be made of a conductive material, for example, a transparent conductive oxide. Also, the p-electrode 446 may be made of the same material as the n-electrode 445 .

As described above, in a state where the n-type layer 442, the active layer 443, the p-type layer 444, the n-electrode 445, and the p-electrode 446 are formed, the n-type layer 442 includes the n-electrode 445 and The LED 440 may be disposed closer to the reflective layer 453 than the p-electrode 446 .

Subsequently, a planarization layer 113 is disposed on the passivation layer 112 disposed in the area where the LED 440 is disposed in the backlight area BLA. The planarization layer 113 may be disposed over the transistor 120 and the LED 440 in regions other than the contact hole. In this case, the planarization layer 113 may be formed such that partial regions of the P-electrode 446 and the n-electrode 445 of the LED 440 are open.

Referring to FIG. 4 , the first connection electrode 451 is an electrode for connecting the first pad P1 and the p-electrode 446 of the LED 440 . The first connection electrode 451 comes into contact with the first pad P1 through contact holes formed in the passivation layer 112 and the planarization layer 113, and transmits light to the LED 440 through the contact hole formed in the planarization layer 113. It is in contact with the p-electrode 446.

The second connection electrode 452 is an electrode for connecting the second pad P2 and the n-electrode 445 of the LED 440 . The second connection electrode 452 is in contact with the second pad P2 through contact holes formed in the passivation layer 112 and the planarization layer 113, and transmits light to the LED 440 through the contact hole formed in the planarization layer 113. It is in contact with the n-electrode 445.

Next, with reference to FIG. 5 , a configuration added to the lower region of the substrate 110 will be described.

Referring to FIG. 5 , the mechanical part 460 contacts the connectors CNT disposed on the first flat part FL1 and the second flat part FL2 on the lower surface of the second folding part FA2 of the backlight area BLA. ) is concluded. Thereafter, the light guide plate 470 is formed on the left side of the area where the backlight area BLA is folded twice and under the substrate 110 .

In detail, the mechanical part 460 is a component for fixing the second folding area where the LED 440 used as the backlight is disposed, and the first flat part FL1 and the second flat part FL1 and the second folding area are located on the lower surface of the second folding part FA2. It may be formed to contact the connector CNT formed in the flat portion FL2. Accordingly, the mechanical unit 460 may fix the backlight area BLA of the substrate 110 without an adhesive. Here, the power supply unit POWER may be formed through a connection wire extending from at least one side of the connector CNT.

In addition, the light guide plate 470 may be formed between the lower surface of the substrate 110 and the mechanical part 460 so as to be adjacent to the second flat part FL2 . The light guide plate 470 may direct light incident from the LED 440 toward the substrate 110 .

Accordingly, in the display device 400 according to another embodiment of the present invention, the backlight unit is removed and the LED 440 is coupled to the front surface of the substrate 110 . Thereafter, the backlight area BLA including the LED 440 disposed on the substrate 110 may be folded twice in the direction of the rear surface of the substrate 110 to arrange the LED 440 on the rear surface of the substrate 110. there is. By being arranged, it can be used as a backlight.

At this time, the LED 440 disposed on the rear surface of the substrate 110 is a micro LED 440, and the area occupied by the LED 440 used as a backlight can be minimized. Therefore, since the space occupied by the area where the micro-unit LEDs 440 are disposed by being folded twice is reduced, it can be very effective in realizing a narrow bezel.

In addition, in the display device 400 according to an embodiment of the present invention, the backlight unit may be omitted by fastening the LED 440 to the substrate 110 and using the LED 440 fastened area as the backlight area BLA. At the same time, since the area occupied by fixtures for fastening the backlight unit is also removed, a high-resolution display device with a narrow bezel can be implemented.

An exemplary embodiment of the present invention can be described as follows.

A display device according to an embodiment of the present invention includes a substrate in which a non-display area including a display area and a backlight area is defined, first and second pads disposed in the backlight area, and disposed in the backlight area, and the first pad and An LED electrically connected to the second pad may be included.

According to another feature of the present invention, the display device further includes at least one insulating layer disposed on the first pad and the second pad, and a first connection electrode and a second connection electrode disposed on the at least one insulating layer, and the LED Is disposed on one or more insulating layers, the first connection electrode and the second connection electrode, and the first connection electrode and the second connection electrode connect each of the p-electrode and the n-electrode of the LED to the first through contact holes of the one or more insulating layers. It may be electrically connected to each of the pad and the second pad.

According to another feature of the present invention, the display device includes a reflective layer disposed between a substrate and the LED in a backlight area, at least one insulating layer disposed on the reflective layer, the first pad and the second pad, and p-electrode and n-electrode of the LED, respectively. It may further include a first connection electrode and a second connection electrode electrically connecting the first pad and the second pad, respectively.

According to another feature of the present invention, the first pad, the second pad and the reflective layer may be disposed on the same layer.

According to another feature of the present invention, the display device may further include a connector disposed between the display area and the LED, and a first power supply wire and a second power supply wire connecting the connector and the first pad and the second pad. there is.

According to another feature of the present invention, the display device further includes a light guide plate disposed below the substrate, and the backlight area of the substrate may be folded twice so that LEDs emit light to the light guide plate.

According to another feature of the present invention, the display device may further include a mechanical unit fixing the backlight area of the substrate.

According to another feature of the present invention, the non-display area may include a module bonding area extending from one side of the display area and a backlight area extending from the other side of the display area.

According to another feature of the present invention, the backlight region of the substrate includes a first folding portion folded at 90 degrees toward the lower surface of the substrate, a first flat portion extending from the first folding portion, and a lower surface direction of the first flat portion. It may include a second folding portion folded at 180 degrees and a second flat portion extending from the second folding portion and having LEDs disposed thereon.

According to another feature of the present invention, the display device may further include a light guide plate disposed adjacent to the second flat portion and having a side surface facing the light emitting portion of the LED.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100, 400: display device
110: substrate
111: gate insulating layer
112: passivation layer
113: planarization layer
114: adhesive layer
120: transistor
121: gate electrode
122: active layer
123: source electrode
124: drain electrode
131: pixel electrode
132 common electrode
140, 440: LED
141: LED base member
142, 442: n-type layer
143, 443: active layer
144, 444: p-type layer
145, 445: n-electrode
146, 446: p electrode
151, 451: first connection electrode
152, 452: second connection electrode
160, 460: mechanical part
170, 470: light guide plate
180: data driving unit
181: driving IC
182: base film
453: reflective layer
AA: display area
NA: non-display area
CNT: connector
FA1: first folding part
FA2: second folding part
FL1: first flat part
FL2: second flat part
POWER: power supply
P: pad
P1: first pad
P2: second pad
PX: pixels
VL1: 1st power supply wire
VL2: 2nd power supply wire
MBA: module bonding area
BLA: backlight area

Claims (10)

a substrate defining a non-display area including a display area and a backlight area;
a first pad and a second pad disposed in the backlight area on the substrate; and
an LED disposed in the backlight area and electrically connected to the first pad and the second pad; and
A light guide plate disposed below the substrate;
The display device of claim 1 , wherein the backlight region of the substrate is folded twice so that the light output portion of the LED faces the side surface of the light guide plate. According to claim 1,
one or more insulating layers disposed on the first pad and the second pad; and
Further comprising a first connection electrode and a second connection electrode disposed on the one or more insulating layers,
The LED is disposed on the one or more insulating layers, the first connection electrode and the second connection electrode,
The first connection electrode and the second connection electrode electrically connect each of the p-electrode and the n-electrode of the LED to the first pad and the second pad through a contact hole of the at least one insulating layer. According to claim 1,
a reflective layer disposed between the substrate and the LED in the backlight region;
one or more insulating layers disposed on the reflective layer, the first pad, and the second pad; and
The display device further includes a first connection electrode and a second connection electrode electrically connecting each of the p-electrode and the n-electrode of the LED to the first pad and the second pad, respectively. According to claim 3,
The first pad, the second pad, and the reflective layer are disposed on the same layer. According to claim 1,
a connector disposed between the display area and the LED; and
The display device further includes a first power supply wire and a second power supply wire connecting the connector to the first pad and the second pad. delete According to claim 1,
The display device further includes a mechanical part fixing the backlight region of the substrate. According to claim 1,
The non-display area includes a module bonding area extending from one side of the display area and the backlight area extending from the other side of the display area. According to claim 1,
The backlight area of the substrate,
a first folding portion folded at 90 degrees toward the lower surface of the substrate;
a first flat portion extending from the first folding portion;
a second folding part folded 180 degrees toward the lower surface of the first flat part; and
and a second flat portion extending from the second folding portion and having the LED disposed thereon. delete

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