KR20060104645A - Display device and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a display device. A display device according to the present invention includes an insulating substrate; A gate line formed on the insulating substrate in a horizontal direction and a data line insulated from and intersecting the gate line to define a display area; A light emitting diode (LED) positioned in the non-display area outside the display area; A light emitting diode circuit unit controlling driving of a light emitting diode (LED); And a light emitting diode pad unit electrically connecting the light emitting diode (LED) and the light emitting diode circuit unit. As a result, a display device with improved space utilization efficiency of a substrate is provided.

Description

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME}

1 is a plan view of a display device according to a first exemplary embodiment of the present invention;

  2 is a cross-sectional view taken along II-II of FIG. 1;

3 is a layout view of the 'A' region of FIG.

4 is a cross-sectional view taken along line IV-IV of FIG. 1;

5A and 5B are cross-sectional views of display devices according to second and third embodiments of the present invention, respectively.

Explanation of Signs of Major Parts of Drawings

1 liquid crystal display 10 liquid crystal panel

20: first substrate 30: second substrate

40 liquid crystal layer 45 pixel electrode

50: sealant 60: driving chip

70 driving circuit portion 80 light emitting diode

81: light emitting diode pad portion 82: first pad

83: pad wire 84: second pad

85 solder 90 anisotropic conductive film

91: conductive particles 92: resin layer

The present invention relates to a display device and a method of manufacturing the same. More particularly, the present invention relates to a display device including a status display light emitting diode (LED) indicating when information is received from the outside and a method of manufacturing the same.

Recently, a flat panel display such as a liquid crystal display (LCD), a plasma display panel (PDP), or an organic light emitting diode (OLED) has been developed in place of the conventional CRT. The display device described above is manufactured in a small and medium size, and has been applied to portable display devices such as mobile phones, personal digital assistants (PDAs), MP3s, and portable multimedia players (PMPs).

The portable display device may transmit information to the outside or receive information from the outside for the convenience of the user. The light emitting diode (LED) is used as a means for receiving information from the outside or informing the user of the current state of the portable display device.

Such a conventional light emitting diode (LED) for a display device is mounted on a circuit board such as a printed circuit board (PCB) or a flexible printed circuit (FPC) in which a circuit is formed. However, since the light emitting diodes (LEDs) for display devices are mounted in the same region where the circuits are formed, there is a problem of complexity and poor workability.

In the non-display area of the thin film transistor substrate, a driving chip for applying an image signal and a pad portion connecting the gate line and the data line are formed. However, the unused space still exists in the non-display area of the thin film transistor substrate, and there is a problem that the space utilization rate is low because it is not properly utilized.

Accordingly, an object of the present invention is to provide a display device having good workability and high space utilization of a thin film transistor substrate and a method of manufacturing the same.

The object is, in accordance with the present invention, an insulating substrate; A gate line formed on the insulating substrate in a horizontal direction and a data line insulated from and intersecting the gate line to define a display area; A light emitting diode (LED) positioned in the non-display area outside the display area; A light emitting diode circuit unit controlling driving of a light emitting diode (LED); And a light emitting diode pad portion electrically connecting the light emitting diode (LED) and the light emitting diode circuit portion.

The light emitting diode circuit unit is formed on a circuit board, and the light emitting diode pad unit includes a first pad electrically connected to the light emitting diode (LED), a second pad electrically connected to the circuit board, and a first pad and a second pad. It may include a pad line for connecting.

In addition, in order to improve workability, the light emitting diode pad part preferably includes ITO (Indium Tin Oxide).

In addition, for convenience of operation, the light emitting diode pad part may include at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al).

Here, the light emitting diode (LED) may further include an anisotropic conductive film (ACF) for fixing the light emitting diode pad portion.

In addition, the method may further include a solder to fix the light emitting diodes (LEDs) to the light emitting diode pads.

Here, the solder is preferably made of at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au) and aluminum (Al).

The light emitting diode pad portion and the light emitting diode LED may be formed on the rear surface of the insulating substrate.

According to the present invention, a light emitting diode pad is formed by coating and patterning any one of a transparent conductive material and a metal material on a gate line, a data line defining an display area by crossing the gate line, and a non-display area outside the display area. Providing an insulating substrate including a portion; And a light emitting diode (LED) and a light emitting diode circuit portion on the circuit board are electrically connected to the light emitting diode pad portion.

Hereinafter, a liquid crystal display according to the present invention will be described in detail with reference to the drawings. The liquid crystal display device of the display device will be described as an example.

1 is a plan view of a liquid crystal display according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the liquid crystal display according to II-II of FIG. 1.

As shown in FIGS. 1 and 2, the liquid crystal display device 1 includes a liquid crystal panel 10, a driving chip 60, and a driving circuit unit 70, and the liquid crystal panel 10 includes a plurality of thin film transistors ( T) formed thin film transistor substrate (hereinafter referred to as 'first substrate', 20), color filter substrate formed on the color filter layer 33 (hereinafter referred to as 'second substrate', 30), the first The liquid crystal layer 40 encapsulated with the sealant 50 in the space between the substrate 20 and the second substrate 30 is included. Since the liquid crystal panel 10 is a non-light emitting device, a backlight unit (not shown) for irradiating light may be disposed on the rear surface of the thin film transistor substrate 20.

First, gate wirings 22 and 23 are formed on the first substrate 20 on the first insulating substrate 21 made of an insulating material such as glass, quartz, ceramic, or plastic. The gate lines 22 and 23 form a gate line (not shown) extending in parallel to each other in the horizontal direction, a gate electrode 22 of the thin film transistor T connected to the gate line (not shown), and a storage electrode capacitance. The sustain electrode line 23 is included. Gate lines (not shown) are respectively connected to shift registers (not shown) formed on the substrate material 21. The shift register receives a driving signal from the driving circuit unit 70 and serves as a gate driver. As a result, it is possible to achieve a cost reduction by eliminating the gate driving chip and an improvement in yield by simplifying the module process. Each gate line (not shown) is connected to a shift register (not shown), and each shift register (not shown) is connected to a gate array pad unit (not shown) for applying various signals.

The driving signal received includes a first clock signal CKV which is a gate-on voltage, a second clock signal CKVB having a phase opposite to that of the first clock signal, a scan start signal STV, a gate-off voltage Voff, and the like. have.

A gate insulating layer 24 made of silicon nitride (SiNx) or the like is formed on the first insulating substrate 21 and the gate lines 22 and 23. A semiconductor layer 25 made of amorphous silicon and an ohmic contact layer 26 made of n + hydrogenated amorphous silicon heavily doped with n-type impurities are sequentially formed on the gate insulating layer 24 where the gate electrode 22 is disposed. Here, the ohmic contact layer 26 is separated on both sides of the gate electrode 22.

Data wirings 27, 28, and 29 are formed on the ohmic contact layer 26 and the gate insulating film 24. The data wires 27, 28, and 29 are formed in the vertical direction and intersect with the gate line (not shown) to define the pixel, which is a branch of the data line 29 and the data line 29, and the upper portion of the resistive contact layer 26. In the drain electrode 28 and the data line 29, which are separated from the source electrode 27 and the source electrode 27 extending to the opposite side of the source electrode 27 with respect to the gate electrode 22. It includes a data pad unit (not shown) that extends to be outside the display area. The data pad part (not shown) is a part receiving a driving signal through the driving chip 60 and is wider than the data line 29. The data pad part (not shown) of the data wires 27, 28, and 29 is positioned in the non-display area outside the display area.

A protective film 43 made of silicon nitride is formed on the data wirings 27 and 28 and the semiconductor layer 26 which is not covered. The passivation layer 43 may be formed of silicon nitride (SiNx) or an organic layer. Each of the passivation layer 43 is provided with a contact hole 41 exposing a drain electrode 28 and a data pad (not shown).

Transparent conductive materials 45 and 81 are formed on the passivation layer 43. The transparent conductive materials 45 and 81 are made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The transparent conductive materials 45 and 81 include a pixel electrode 45 and a light emitting diode pad part 81 which are in electrical contact with the drain electrode 28 through the contact hole 41. The pixel electrode 45 applies the voltage from the drain electrode 28 to the liquid crystal to adjust the arrangement of the liquid crystals.

The light emitting diode pad portion 81 is formed at the same time as the pixel electrode 45 in the non-display area according to the first embodiment and includes indium tin oxide (ITO). As shown in FIG. 3, the first pad 82 and the light emitting diode circuit unit (not shown) are electrically connected to the light emitting diodes (LEDs) 80 by depositing and patterning ITO to form the light emitting diode pad unit 81. A second pad 84 electrically connected to the second pad) and a pad line 83 connecting the first pad 82 and the second pad 84 to each other. The LED pad unit 81 electrically connects the LEDs 80 for status display and the LED circuit unit (not shown). Then, the driving signal is supplied from the light emitting diode circuit unit (not shown) and applied to the light emitting diodes (LED) 80.

The light emitting diodes (LED) 80 are used as a means for receiving information from the outside or for notifying a user of the current state of the portable display device. If you receive information from the outside or the battery is low, it blinks at regular intervals or emits red, blue, and green lights to indicate its status. The light emitting diodes (LED) 80 have leads of an anode and a cathode, and each of the anode leads and the cathode leads is connected to the LED pad unit 81 to receive power. The light emitting diodes (LEDs) 80 are preferably provided in an area that can be easily recognized by a user in the non-display area of the first substrate 20. Meanwhile, the light emitting diodes LED 80 may be formed on the rear surface of the first substrate 20 together with the above-described light emitting diode pad portion 81 according to convenience and use. As shown in FIG. 4, the light emitting diode pad portion 81 and the electrodes of the light emitting diodes LED 80 are fixed by solder 85. The solder 85 preferably includes at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al). In addition to fixing the solder 85, the solder 85 may also electrically connect the LED pad unit 81 to the LED 80.

The LED circuit unit (not shown) supplies power to the LEDs 80 through the LED pad unit 81 and is formed in the driving circuit unit 70.

The driving chip 60 is mounted on the first substrate 20 in a COG (chip on glass) method. Although not shown, it may be connected to the first substrate 20 by various methods such as a chip on film (COF), and may also be connected to a flexible printed circuit board (FPC).

In the driving circuit unit 70, a timing controller and a driving voltage generator are formed.

As such, by mounting the light emitting diodes LED 80 in the non-display area on the first substrate 20, the space utilization rate of the non-display area can be increased. In addition, since the light emitting diode pad portion 81 is formed at the same time as the pixel electrode 45, workability is improved.

Next, the second substrate 30 is slightly smaller than the first substrate 20 and faces the first substrate 20. The second substrate 30 includes a second insulating substrate 31, a black matrix 32 formed on the second insulating substrate 31, and three primary colors of red, green and blue or cyan, magenta and yellow. It includes a color filter layer 33 having, an overcoat layer 34 formed on the color filter layer 33, and a common electrode 35 formed on the overcoat layer 34.

The outer black matrix 32 separates the display area from the non-display area. The black matrix 32 is made of a single metal or a combination of multiple metal layers such as chromium, chromium oxide and chromium nitride, or a black system to block light. It can be made of a photosensitive organic material with a pigment of. Here, carbon black, titanium oxide, or the like may be used as the black pigment.

The color filter layer 33 is formed by repeating red, green and blue or cyan, magenta and yellow colors, respectively, and serves to give color to light passing through the liquid crystal layer 40. The color filter layer 33 may be made of a colored photosensitive organic material using a known pigment dispersion method.

The overcoat layer 34 serves to protect the color filter layer 33, and an acrylic epoxy material is used as the material.

The common electrode 35 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The common electrode 35 directly applies a signal voltage to the liquid crystal layer 40 together with the pixel electrode 45 of the first substrate 20.

The first substrate 20 and the second substrate 30 completed as described above are arranged to face each other, and then bonded to each other using the sealant 50, and a liquid crystal dropping method or vacuum injection is performed between the two substrates 20 and 30. The liquid crystal layer 40 is filled using the method. Then, the liquid crystal display device 1 is completed through a module process of combining the light emitting diodes 80 and the driving circuit unit 70.

The liquid crystal display according to the present invention can increase the space utilization without being complicated by mounting the light emitting diodes (LED) 80 in the non-display area of the first substrate 20 which is not utilized. The light emitting diode pad portion 81 is formed in the non-display area at the same time as the pixel electrode 45 is formed, thereby improving process efficiency and workability.

Hereinafter, the second and third embodiments of the present invention will be described in detail with reference to FIGS. 5A and 5B.

As shown in Fig. 5A, the light emitting diode pad portion 81 is formed at the same time as the gate line (not shown). That is, the wiring material is deposited on the non-display area at the same time as the gate line (not shown) is formed. Here, each wiring including the gate line (not shown), the gate electrode 22, the data line 29, the source electrode 27, the drain electrode 28, and the like may be formed of a single layer of a metal or an alloy.

However, in order to compensate for the shortcomings of each metal or alloy and to obtain desired physical properties, they are often formed in multiple layers. For example, aluminum or an aluminum alloy is used as the lower layer, and chromium or molybdenum is used as the upper layer. The lower layer uses aluminum or aluminum alloy with low specific resistance to prevent signal resistance due to wiring resistance, and the upper layer uses aluminum or aluminum alloy that has low corrosion resistance due to chemicals and is easily oxidized to cause disconnection. The upper layer is formed of chromium or molybdenum, which is highly resistant to chemicals. In recent years, gold, tin, molybdenum, aluminum, titanium, tungsten, and the like have been spotlighted as wiring materials, and most of them are used in multiple layers.

In particular, according to the second embodiment of the present invention, when simultaneously forming the light emitting diode pad portion 81, an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au) and aluminum (Al) It is preferable to form a wiring including at least one of After depositing a wiring material including at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al), the first pad 82 and the pad wire ( 83) and the second pad 84 is patterned to complete the light emitting diode pad portion 81. As shown in FIG. Thereafter, at the time of forming the contact hole 41, the gate insulating layer 24 and the passivation layer 43 formed on the light emitting diode pad portion 81 are connected to both electrodes of the light emitting diode 80 and the light emitting diode pad portion 81. Form a connector. Then, the light emitting diodes 80 and the light emitting diode pad portion 81 are interconnected and fixed by using the solder 85 described above to complete the liquid crystal display device.

As shown in Fig. 5B, the light emitting diode pad portion 81 can be formed when the data line 29 is formed. In the third embodiment, the light emitting diodes 80 and the light emitting diode pads 81 are connected and fixed by using an anisotropic conductive film without using solder. The anisotropic conductive film (ACF) 90 includes the conductive particles 91 and the resin layer 92, and electrically connects the light emitting diodes 80 and the light emitting diode pads 81 to each other by the conductive particles. The resin layer is cured by heat or ultraviolet rays to fix the light emitting diodes 80 to the light emitting diode pad portion 81. The other content is the same as the first and second embodiments described above.

Hereinafter, the manufacturing method of the liquid crystal display device according to the present invention will be briefly described. Content other than the description follows a known manufacturing method.

First, a first insulating substrate 21 having a data line 29 defining a display area by insulated from a gate line (not shown) and the gate line (not shown) is formed. Here, as in the second and third embodiments to be described later, the light emitting diode pad unit 81 may be formed in the non-display area simultaneously with the gate line (not shown) and the data line 29.

Meanwhile, according to the first embodiment, the first pad 82, the pad line 83, and the second pad 84 are included in the non-display area at the same time as the pixel electrode 45 is formed using ITO (Indium Tin Oxide). The light emitting diode pad portion 81 is formed. The light emitting diode pad portion 81 is connected to a light emitting diode circuit portion (not shown) formed on the driving circuit portion 70. Thereafter, the light emitting diode pad portion 81 includes at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al). Fixing is performed by using any one of a solder 85 and an anisotropic conductive film ACF 90. As a result, the liquid crystal display device 1 is completed.

According to the second and third embodiments, the first pad 82 and the pad line 83 are formed in the non-display area of the first substrate 20 simultaneously with the formation of the gate line (not shown) and the data line 29. ) And a light emitting diode pad portion 81 including a second pad 84. The light emitting diode 80 is formed on the gate insulating film 24 and the passivation layer 43 formed on the light emitting diode pad portion 81 at the same time as the contact hole 41 for contacting the pixel electrode 45 with the drain electrode 28. And a connector to be connected to the both electrodes and the light emitting diode pad portion 81. The light emitting diodes 80 and the light emitting diode pad portion 81 are interconnected and fixed using the solder 85 or the anisotropic conductive film 90 described above to complete the liquid crystal display device 1.

The display device and the method of manufacturing the same according to the present invention can also be used in a panel or the like applied to an organic light emitting diode. The organic electroluminescent device is a self-luminous device using an organic material that emits light upon receiving an electrical signal. In the organic electroluminescent device, a cathode layer (pixel electrode), a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and an anode layer (counter electrode) are stacked. The drain electrode of the TFT substrate according to the present invention may be electrically connected to the cathode layer to apply a data signal.

As described above, according to the present invention, it is possible to provide a display device having improved workability and high space utilization of a thin film transistor substrate and a manufacturing method thereof.

Claims (9)

An insulating substrate; A gate line formed on the insulating substrate in a horizontal direction and a data line defining an display area by insulating crossing with the gate line; A light emitting diode (LED) positioned in the non-display area outside the display area; A light emitting diode circuit unit controlling driving of the light emitting diode (LED); And And a light emitting diode pad unit electrically connecting the light emitting diode (LED) and the light emitting diode circuit unit. The method of claim 1, The light emitting diode circuit portion is formed on a circuit board, The light emitting diode pad unit includes a first pad electrically connected to the light emitting diode (LED), a second pad electrically connected to the circuit board, and a pad line connecting the first pad and the second pad. Display device characterized in that. The method of claim 1, The light emitting diode pad unit includes an indium tin oxide (ITO). The method of claim 1, The light emitting diode pad unit includes at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al). The method of claim 1, And an anisotropic conductive film (ACF) for fixing the light emitting diode (LED) to the light emitting diode pad portion. The method of claim 1, And a solder to fix the light emitting diode (LED) to the light emitting diode pad part. The method of claim 6, And the solder comprises at least one of an alloy of tin (Sn) and gold (Au), chromium (Cr), gold (Au), and aluminum (Al). The method of claim 1, And the light emitting diode pad portion and the light emitting diode (LED) are formed on a rear surface of the insulating substrate. An insulating substrate including a light emitting diode pad unit is formed by applying and patterning one of a transparent conductive material and a metal material to a gate line, a data line defining a display area by crossing the gate line, and a non-display area outside the display area. Making a step; And electrically connecting the light emitting diode (LED) to the light emitting diode pad part and the light emitting diode circuit part on the circuit board.

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