TWM528312U - 用於切割玻璃基板之稜角的裝置 - Google Patents
用於切割玻璃基板之稜角的裝置 Download PDFInfo
- Publication number
- TWM528312U TWM528312U TW104218915U TW104218915U TWM528312U TW M528312 U TWM528312 U TW M528312U TW 104218915 U TW104218915 U TW 104218915U TW 104218915 U TW104218915 U TW 104218915U TW M528312 U TWM528312 U TW M528312U
- Authority
- TW
- Taiwan
- Prior art keywords
- strip
- glass substrate
- holding member
- contact
- heating source
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020140008632U KR20160001892U (ko) | 2014-11-25 | 2014-11-25 | 유리 기판 모서리 가공 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM528312U true TWM528312U (zh) | 2016-09-11 |
Family
ID=56074654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104218915U TWM528312U (zh) | 2014-11-25 | 2015-11-25 | 用於切割玻璃基板之稜角的裝置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20160001892U (ko) |
TW (1) | TWM528312U (ko) |
WO (1) | WO2016085181A1 (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3719904B2 (ja) * | 2000-04-13 | 2005-11-24 | シャープ株式会社 | 液晶表示装置のガラス基板の面取り方法およびその方法に用いる加熱器 |
WO2008010303A1 (fr) * | 2006-07-20 | 2008-01-24 | Takita Research & Development Co., Ltd. | Dispositif de coupe |
KR101405442B1 (ko) * | 2012-08-01 | 2014-06-13 | 주식회사 라미넥스 | 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치 |
KR101450440B1 (ko) * | 2013-03-29 | 2014-10-13 | 박성수 | 에지테잎 절삭칩역류방지편을 갖는 에지벤딩기 |
KR101462046B1 (ko) * | 2013-08-12 | 2014-11-18 | 주식회사 나노시스템 | 유리판의 모서리 가공 장치 |
-
2014
- 2014-11-25 KR KR2020140008632U patent/KR20160001892U/ko not_active Application Discontinuation
-
2015
- 2015-11-17 WO PCT/KR2015/012328 patent/WO2016085181A1/ko active Application Filing
- 2015-11-25 TW TW104218915U patent/TWM528312U/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2016085181A1 (ko) | 2016-06-02 |
KR20160001892U (ko) | 2016-06-02 |
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