TWM525927U - Manufacturing equipment for glass substrate - Google Patents

Description

Glass substrate manufacturing equipment

The present invention relates to a manufacturing apparatus for a glass substrate of a flat panel display such as a liquid crystal display or a plasma display.

A glass substrate for a flat panel display such as a liquid crystal display or a plasma display (hereinafter referred to as "FPD") is a glass plate having a thin thickness of, for example, 0.5 to 0.7 mm. The glass substrate for FPD has a size of, for example, 300 × 400 mm in the first generation, and has a size of 2,850 × 3050 mm in the 10th generation.

When such a thin plate is used to manufacture a glass substrate for a large-sized FPD, an overflow down-draw method or a floating method is preferably used. For example, Patent Document 1 discloses a manufacturing apparatus for a glass substrate using an overflow down-draw method. In other words, in the case of the patent document 1, the sheet glass which overflows from the molded object is pinched by the conveyance roller (drawing roll), and the glass substrate is manufactured by slow-cooling in the process of pulling down.

The plate-shaped glass substrate produced by such an overflow down-draw method or the like is cut into a specific size. The cutting of the glass substrate is performed by forming a cutting line (cutting) along the cutting portion by using a cutter and breaking along the cutting line. Such a cutting device is disclosed, for example, in Patent Document 2 and the like.

Further, the end surface of the glass substrate which has been cut as described above is subjected to end face processing such as chamfer grinding. Such an end surface processing apparatus is disclosed, for example, in Patent Document 3 and the like.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2012/132425

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-171867

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2014-087879

Previously, in the end surface processing of a glass substrate, alignment for aligning the end faces of the glass substrate was performed before processing. For example, in the case of performing end surface processing using the end surface processing apparatus (described in detail below) which performs chamfer grinding as shown in FIG. 4, the grinding wheel 21 formed with the grinding groove 22 is relatively moved to be processed before processing. The aligned glass substrate 1 is subjected to end surface processing.

However, the alignment of the glass substrate is adjusted by pressing the end surface 1a of the glass substrate 1 held on the transfer table 30 from the transfer table 30. In the case of a glass substrate, the end portion exposed from the transfer table 30 is deflected, so that it is difficult to improve the accuracy of alignment. In particular, in the case of a glass substrate of a thin plate, there is a case where the amount of deflection of the end portion is large and the position of the glass substrate is difficult to adjust and cannot be aligned.

Patent Document 3 describes a method of acquiring the positional information of the end surface of the glass substrate at two points, and moving the grinding wheel between two points of the position, but the end portion of the deflection is as described above. It is difficult to accurately acquire position information, and therefore it is difficult to improve the alignment accuracy even by such a prior method.

With the high definition of FPD in recent years, the quality requirements for the glass substrate for FPD have become increasingly strict, and the strict control of manufacturing is required more than before.

Therefore, the object of the present invention is to provide a manufacturing apparatus for a glass substrate capable of producing a high-quality glass substrate by performing end surface processing with high precision without alignment before end surface processing.

This author and others have conducted in-depth research to solve the previous technical problems, and the results I have come to the creation with the following composition.

(Creation of Composition 1)

The present invention relates to a glass substrate manufacturing apparatus, comprising: a cutting device for cutting a glass substrate formed into a plate shape into a specific width; and an end surface processing device for performing end surface processing on an end surface of the cut glass substrate; And a transfer table for mounting the glass substrate; wherein the dicing device has a dicing mechanism for cutting the glass substrate into the width, and the glass substrate is placed on the transfer table in a state where the glass substrate is placed on the transfer table The glass substrate is cut into the width by the cutting mechanism without moving the alignment of the end faces before the end surface processing, by moving integrally along the glass substrate transport path with the transfer table.

(Creation of Composition 2)

A manufacturing apparatus for a glass substrate according to the first aspect, wherein the cutting device further comprises a cutting table, wherein the cutting mechanism forms a cutting line at a specific cutting position of the glass substrate on a first side of the glass substrate Moving upward, the cutting table is disposed on a second surface opposite to the first surface of the glass substrate so as to face the glass substrate.

(Creation of Composition 3)

In the manufacturing apparatus of the glass substrate of the first aspect, the end surface processing apparatus includes a grinding wheel and a driving mechanism and a control mechanism for driving the grinding wheel, and the grinding wheel is formed in a horizontal direction over the entire circumference of the grinding wheel. The grinding groove recessed inwardly has a shape in which a specific chamfered surface can be formed on an end surface of the glass substrate.

(Creation of Composition 4)

In the manufacturing apparatus which comprises a glass substrate, the said conveyance stage moves on the travel axis provided in the said glass substrate conveyance path.

(Creation of Composition 5)

A manufacturing apparatus for a glass substrate according to any one of 1 to 4, characterized in that The cutting line formed by the cutting mechanism and the processing point of the end surface processing apparatus are located on the same line along the glass substrate transport path.

(Creation of Composition 6)

The apparatus for manufacturing a glass substrate according to any one of claims 1 to 4, characterized in that at least one end of the glass substrate to be cut has an outer side region having a thickness different from a central region of the glass substrate, and the cutting mechanism has the outer region Cut and remove.

(Creation of Composition 7)

The apparatus for manufacturing a glass substrate according to any one of claims 1 to 4, wherein the end surface processing apparatus includes a guiding mechanism for guiding an end surface of the glass substrate to the end surface processing mechanism.

(constituting the creation of 8)

In the manufacturing apparatus of the glass substrate of the seventh aspect, the guiding means is configured to guide both end portions of the glass substrate to the guiding table of the grinding groove of the grinding wheel, and the guiding table is Both sides of the transfer table are disposed at a position separated from the transfer table by a fixed distance.

(Creation of Composition 9)

The apparatus for manufacturing a glass substrate according to any one of the first to fourth aspect, wherein the cutting mechanism is a cutter wheel that is rotationally moved with respect to a surface of the glass substrate.

(constituting the creation of 10)

In the manufacturing apparatus of the glass substrate of the second aspect, the cutting table is formed of a spherical or cylindrical member that can move in accordance with the movement of the cutting mechanism.

According to the present configuration, according to the above configuration, it is possible to perform the end surface processing with high precision without performing alignment before the end face processing and without performing alignment. Thereby, a high quality glass substrate can be manufactured.

1‧‧‧ glass substrate

1a‧‧‧End face of glass substrate

2‧‧‧Ends other than the product area

10‧‧‧ cutting device

11‧‧‧ cutting mechanism

12‧‧‧ cutting table

20‧‧‧End face processing device

21‧‧‧ grinding wheel

22‧‧‧ Grinding trough

30‧‧‧Transportation station

40‧‧‧Guide

50‧‧‧ dotted line

60‧‧‧Travel axle

A‧‧‧ arrow

ST1‧‧‧ steps

ST2‧‧‧ steps

ST3‧‧‧ steps

ST4‧‧‧ steps

ST5‧‧‧ steps

ST6‧‧‧ steps

ST7‧‧‧ steps

Fig. 1 is a view showing an example of a flow of a manufacturing apparatus of a glass substrate.

Fig. 2 is a plan view showing an embodiment of an apparatus for performing the cutting step to the end surface processing step in the present creation.

Fig. 3 is a front elevational view showing one embodiment of the apparatus for performing the cutting step to the end surface processing step in the present creation.

Fig. 4 is a perspective view showing an example of an end surface processing apparatus for an end surface processing step.

Hereinafter, the embodiment of the present creation will be described in detail.

(Overall outline of manufacturing equipment for glass substrates)

Fig. 1 is a view showing an example of a flow of a manufacturing apparatus of a glass substrate.

The manufacturing apparatus of the glass substrate mainly has a melting step (ST1), a clarification step (ST2), a stirring (homogenization) step (ST3), a supply step (ST4), a forming step (ST5), a cooling step (ST6), and cutting. Step (ST7).

In the melting step (ST1), molten glass is obtained by melting a glass raw material supplied into a melting tank (not shown). In the clarification step (ST2), clarification of the molten glass is carried out using a clarifying agent.

In the stirring (homogenization) step (ST3), the molten glass in the stirring tank (not shown) is stirred by a rotary tool such as a stirrer to homogenize the glass component.

In the supply step (ST4), the homogenized molten glass is supplied from a predetermined tank to the molding apparatus (not shown) through the specific agitation tank.

This molding apparatus is, for example, a molding apparatus using the above-described overflow down-draw method, and performs a molding step (ST5) and a cooling step (ST6).

In the molding step (ST5), the molten glass is formed into a flat glass to prepare a flat glass flow. In the case of using the overflow down-draw method, the flow direction of the flat glass is vertically below. In the cooling step (ST6), the flat glass which is formed after the formation is formed to have a desired thickness so as to be cooled without causing warpage or deformation due to cooling.

In the cutting step (ST7), the flat glass supplied from the above forming apparatus is cut to a specific length, thereby obtaining a plate-shaped glass substrate.

Further, the cut glass substrate is further cut into a specific size to prepare a glass substrate of a target size. After that, the glass substrate end surface is processed (grinding, polishing, etc.) and the glass substrate is cleaned, and after the presence of defects such as bubbles or pulsations, the glass substrate of the inspection product is packaged and shipped as a final product.

The present invention relates to a cutting step of cutting a glass substrate cut into a plate shape into a specific size (width) to produce a target size, and a grinding step of chamfering the end surface of the glass substrate after the cutting step. Improvements in a series of steps, such as processing steps, are described in more detail below.

The glass substrate produced in the present embodiment is preferably used for, for example, a glass substrate for a liquid crystal display, a glass substrate for an organic EL display, or a cover glass. Further, the glass substrate can be used as a cover glass for a portable terminal device or a cover glass for a housing, a touch panel, a glass substrate for a solar cell, or a cover glass. In particular, a glass substrate for a liquid crystal display is preferred.

Further, the length in the width direction and the longitudinal direction of the glass substrate is, for example, 500 mm to 3500 mm, preferably 1000 mm to 3500 mm, and more preferably 2000 mm to 3500 mm.

(composition of glass substrate)

The glass composition of the glass substrate for the above-mentioned use is an aluminosilicate glass or a boroaluminosilicate glass, and further an alkali-free glass or a slightly alkali glass. For example, the following glass is preferably used. Further, the content ratio of the composition shown below is expressed in mol%.

SiO ₂ 55~75%, Al ₂ O ₃ 5~20%, B ₂ O ₃ 0~15%, RO 5~20% (where R is all contained in the glass substrate of Mg, Ca, Sr and Ba) Element), R' ₂ O 0 to 0.4% (wherein R' is all of the elements contained in the glass substrate of Li, Na, and K).

Of course, in the present creation, it is not necessary to limit the glass composition of the glass substrate, and it is arbitrary.

Next, the cutting step to the end surface processing step in the present creation, and the apparatus preferably used in the series of steps will be described.

Fig. 2 is a plan view showing an embodiment of an apparatus for performing the cutting step to the end surface processing step in the present creation. Further, Fig. 3 is a front view showing an embodiment of an apparatus for performing the cutting step to the end surface processing step in the present creation.

The continuous flat glass supplied from the above-described forming apparatus, for example, by the overflow down-draw method, is cut to a specific length, and one piece of glass is separated from the continuous flat glass. The glass substrate 1 is obtained by cutting away the outer side region (so-called edge material) having a thickness formed at both ends of the separated glass. The obtained plate-shaped glass substrate 1 is adsorbed and held on the transfer table 30, and is conveyed to the cutting step, and is cut into four sides in order to be used by the panel manufacturer. Here, by the cutting device 10, a cutting line is formed at a specific cutting position at both end portions of the substrate (cutting step).

Then, as described above, the glass substrate 1 on which the cut lines are formed at the cutting positions of the both end portions of the substrate is formed such that the outer region (the end portion 2 outside the product region) is broken along the cutting line to be formed into a specific size, and is produced. Target size glass substrate (end cut).

Then, the glass substrate 1 of the target size produced by the cutting step described above is further adsorbed and held on the transfer table 30, and is transported to the subsequent end surface processing step. Here, the end surface of the glass substrate 1 to be cut is subjected to, for example, chamfer grinding (end surface processing step) by the end surface processing apparatus 20.

In the present embodiment, the glass substrate 1 is conveyed and held on the transfer table 30 while being transported between the steps, and is particularly characterized in that the glass substrate 1 is held on the transfer table 30 while being placed on the transfer table 30. The glass substrate 1 and the transfer table 30 are integrally moved along the glass substrate transport path, and the cutting step and the end surface processing step are performed. In the present embodiment, the transfer table 30 is configured to move on the travel shaft 60 provided on the glass substrate transport path. Arrow A in Fig. 2 indicates the conveyance direction of the glass substrate. The travel axis 60 is, for example, a rail, and the transport table 30 moves on the rail.

Next, the above cutting device will be described.

The cutting device 10 is provided with a cutting mechanism 11 that moves on one side of the glass substrate 1 by forming a cutting line at a specific cutting position of the glass substrate 1, and a cutting table 12 that is attached to the glass substrate 1. The other surface is disposed to face the cutting mechanism 11 described above. Here, the positional relationship between the cutting table 12 and the transfer table 30 can be appropriately adjusted in accordance with the size of the desired glass substrate and the position of the cutting mechanism 11.

Preferably, the cutting mechanism 11 is rotationally moved with respect to the surface of the glass substrate, and specifically, a cutting tool such as a cutter wheel is preferable. Furthermore, the cutter wheel described above is exemplified in FIGS. 2 and 3.

Further, it is preferable that the cutting table 12 is configured to move together with the movement (preferably, rotational movement) of the cutting mechanism 11. In this case, the size of the cutting table 12 may be a size required to receive a stable load from the load of the cutting mechanism 11. As the cutting table 12, for example, a platen made of SUS or a table made of a resin pad (for example, a urethane pad or the like) may be attached to the platen. Further, the cutting table 12 may not be a platen, and may be, for example, a spherical or wheel-shaped (cylindrical) member that can move together with the cutting mechanism 11 so as to oppose the cutting mechanism 11 . .

Further, the cutting table 12 may be configured to be fixed at a specific position. However, in this case, since only the cutting mechanism 11 is moved, the length of the cutting table 12 (the length of the substrate conveying direction) needs to be set. The length of the side of the glass substrate 1 forming the cut line in the transport direction is longer.

Further, a configuration may be adopted in which the positions of the cutting mechanism 11 and the cutting table 12 are fixed at the same time, and the glass substrate 1 is moved.

Further, in addition to the cutting mechanism 11 and the cutting table 12, the cutting device 10 further includes a driving mechanism and a control mechanism that drive and control the cutting mechanism 11 and the cutting table 12 (not shown).

In the above configuration, the cutting mechanism 11 is along a specific cutting position of the glass substrate 1. (for example, the position along the broken line 50 in Fig. 2) is moved while applying a specific load on one surface of the glass substrate 1, thereby forming a dicing line. At this time, a load is applied to the surface of the glass substrate in the direction in which the cutting edge of the cutting mechanism 11 is pressed. On the other hand, the cutting table 12 can receive the load from the cutting mechanism 11 on the other surface of the glass substrate 1, and stably form the cutting line.

Further, when the cutting table 12 is formed of a spherical or wheel-shaped (cylindrical) member that can move together with the movement of the cutting mechanism 11, the glass substrate 1 is cut by the spherical shape. Or the apex portion of the circumferential surface of the wheel member receives the load (pressing force) from the cutting mechanism 11, so that the force applied to the cutting edge of the cutting mechanism 11 is concentrated in the vertical direction, so that the depth (cut amount) can be stabilized. Cutting line.

Next, the above-described end surface processing apparatus 20 will be described.

Fig. 4 is a perspective view showing an example of an end surface processing apparatus for an end surface processing step. Hereinafter, description will be made with reference to Fig. 4 and Figs. 2 and 3 mentioned above.

The end surface processing apparatus 20 has a grinding wheel 21 which is entirely made of a cylindrical grindstone, a drive mechanism, a control mechanism, and the like. The grinding wheel 21 is formed with a grinding groove 22 which is recessed all the way in the horizontal direction of the circumferential surface thereof, and the grinding groove 22 has a shape capable of forming a specific chamfered surface with respect to the end surface of the glass substrate. The grindstone constituting the grinding wheel 21 may be any type of grindstone that can be used for grinding of ordinary glass, regardless of its type. The grinding wheel 21 is configured to be rotatable, for example, in the direction of the arrow shown in FIG.

The end surface processing apparatus 20 is provided such that the grinding wheel 21 and the both end faces 1a of the glass substrate 1 face each other. Then, the end surface processing apparatus 20 presses the grinding wheel 21 against the rotating grinding wheel 21 toward the both end faces 1a of the glass substrate 1 which are moved by the conveyance table 30, and grinds the end surface 1a, and performs chamfering processing. In addition, the glass substrate 1 may be temporarily stopped, and the grinding wheel 21 may be pressed against the rotating grinding wheel 21 toward the both end faces 1a of the glass substrate 1, and the grinding wheel 21 may be placed along the end surface of the glass substrate 1. 1a moves.

Furthermore, the guide table 40 shown in FIGS. 2 and 3 is disposed on both sides of the transfer table 30. At a position separated by a fixed distance, the guide members for guiding the both end portions (both end faces 1a) of the glass substrate 1 to the grinding grooves 22 of the grinding wheel 21, respectively. In particular, when the glass substrate 1 is a thin plate, since both end portions are deflected, a guide member for guiding both end portions of the glass substrate 1 to the grinding wheel 21 is required. In other words, the guiding table 40 is a mechanism for positioning in the height direction of the end portion of the glass substrate 1. As the guiding member, for example, a liquid-based suspension adsorption panel can be used. The guide table 40 can be adjusted to move in the vertical direction according to the amount of deflection of both end portions of the glass substrate, so that both end portions of the glass substrate 1 can be appropriately guided to the processing points of the grinding wheel 21. Further, the positional relationship between the guide table 40 and the transfer table 30 can be appropriately adjusted in accordance with the size of the product of the glass substrate after cutting, together with the position of the end surface processing device 20.

When the processing of one of the both end faces 1a of the glass substrate 1 is completed, the glass substrate 1 is rotated by 90 degrees, and the other of the both end faces is performed similarly.

As described above, the dicing line formation, the end dicing, and the end surface processing of the glass substrate 1 are performed as described above. However, in the present embodiment, the glass substrate 1 is adsorbed and held on the transfer table 30 while being held. In the state in which the glass substrate 1 is held on the transfer table 30, the glass substrate 1 and the transfer table 30 are integrally moved along the glass substrate transport path, and the cutting step and the end surface processing step are performed. In the present embodiment, in order to move the glass substrate 1 and the transfer table 30 integrally along the glass substrate transport path, the transfer table 30 moves on the travel axis 60 provided on the glass substrate transport path. .

According to the above configuration, the machining point (cutting line forming position) in the cutting step and the machining point in the end surface processing step are provided on the same line along the glass substrate conveying path. That is, in the dicing step, the glass substrate 1 and the transfer table 30 are integrally moved to form a dicing line parallel to the glass substrate transport path, and the end portion is cut along the dicing line. Then, by moving the glass substrate 1 and the transfer table 30 integrally on the glass substrate transfer path, the processing point of the end face processing is performed in the end face processing step. The end surface processing is performed by being disposed on an extension line of the above-described cutting line forming position. Therefore, the end face processing can be performed with high precision without the alignment before the previous end face machining without alignment. Further, since the machining allowance at the time of end face machining can be reduced, it is possible to perform machining without applying an excessive load to the grinding wheel 21, and thus the life of the tool can be extended.

In the present embodiment, the transport table 30 is configured to move on the travel axis 60 provided on the glass substrate transport path. However, the travel axis 60 may be provided with, for example, a traveling direction accuracy of ±30 μm and a height direction accuracy of ±40 μm.

For example, in the step of forming the above-described cutting line, there is a case where the accuracy of the height direction of the traveling shaft 60 affects the linearity of the cutting line. When the glass substrate 1 is changed in the height direction, the cutting line is not stably formed, the cutting line does not reach a desired depth, or the cutting mechanism 11 is slid, and a cutting line or the like cannot be formed.

On the other hand, the end portion of the glass substrate 1 is placed at a distance of at least 5 mm or more, for example, 30 mm or more, from the transfer table 30 that is adsorbed and held by the glass substrate 1 so as to absorb the end portion of the glass substrate 1 by the above-mentioned protruding region. The linearity of the shaft 60 causes a change in the upper and lower sides of the transfer table 30, and the end surface of the glass substrate 1 is stably supported at the processing point by the guide member, so that the formation region affected by the transfer to the dicing line can be suppressed.

Further, it is considered that the influence of the undulation of the traveling shaft 60 in the traveling direction causes a problem that the quality of the end surface due to the end surface processing is unstable. In such a case, for example, the linearity of the end surface of the glass substrate after the end surface processing is measured, and the X-axis direction of the grinding wheel 21 (that is, the direction perpendicular to the substrate transport direction in the plane of the glass substrate) is controlled. It can improve the processing precision and stabilize the end face quality. For example, the shape of the end surface after the processing is measured, and the processing line of the grinding wheel with respect to the glass substrate in the processing step is calculated based on the shape of the measured end surface, and the end surface is uniformly processed according to the calculated processing line. In the case of calculating the adjustment line, the X-axis direction is controlled by the trajectory of the grinding wheel 21 with respect to the glass substrate along the adjustment line, and the end surface is processed (Japanese Patent Application No. 2014- filed by the present applicant) 115299).

In the present creation, the thickness of the glass substrate 1 is, for example, 0.01 mm to 1.0 mm. Moreover, the present invention is particularly suitable for the manufacture of a glass substrate having a sheet thickness of 0.3 mm or less (for example, 0.05 mm to 0.3 mm).

The thinner the glass substrate is, the more unstable the formation of the dicing line is, and the end portion is easily deflected. The previous alignment before the end surface processing is more difficult, but the creation effect is remarkable for the manufacture of the glass substrate of the thin plate. Even if the end surface of the glass substrate of the sheet which has been previously difficult to be aligned is processed, the end surface after the dicing can be processed with high precision without alignment. More preferably, it is suitable for the production of a glass substrate having a thickness of 0.2 mm or less, and is preferably applied to the production of a glass substrate having a thickness of 0.1 mm or less.

As described above, in the state in which the glass substrate formed into a plate shape is placed on the transfer table, the glass substrate and the transfer table are integrally moved along the glass substrate transport path, thereby performing the cutting step. The cutting line formed by the cutting mechanism and the processing point of the end surface processing in the end surface processing step are located on the same line along the glass substrate transport path, so that alignment before the end surface processing is not required, and alignment is not performed. End face machining can be performed with high precision. Thereby, a high quality glass substrate can be manufactured.

In the above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit of the invention.

(variation)

In the above embodiment, first, the outer side region (so-called edge material) having a thickness formed on both ends of one glass separated from the continuous flat glass supplied from the forming device is cut and removed, so that the obtained glass is obtained. The substrate 1 is further formed into a specific size, and is cut by the above-described cutting step. As a variation of the embodiment, a configuration may be adopted in which one of the glass separated from the continuous flat glass is directly cut into a specific one without first cutting and removing the so-called edge material. The product size is cut by the above cutting step. In this case, in the cutting step, the cutting is included in addition to The end of the above-mentioned edge material outside the product area.

According to the present variation, if the edge material is provided, since the rigidity of the substrate is high, the process from the single sheet cutting to the processing step is relatively easy. In particular, in the glass substrate separated from the thin glass piece of 0.2 mm or less, it is preferable to carry out the processing without being cut and trimming the material to the processing apparatus while maintaining the rigidity of the glass.

1‧‧‧ glass substrate

1a‧‧‧End face of glass substrate

2‧‧‧Ends other than the product area

10‧‧‧ cutting device

11‧‧‧ cutting mechanism

12‧‧‧ cutting table

21‧‧‧ grinding wheel

22‧‧‧ Grinding trough

30‧‧‧Transportation station

40‧‧‧Guide

50‧‧‧ dotted line

60‧‧‧Travel axle

Claims (10)

A manufacturing apparatus for a glass substrate, comprising: a cutting device (10) for cutting a glass substrate formed into a plate shape into a specific width; and an end surface processing device (20) for performing an end surface of the glass substrate after the cutting End surface processing; and a transfer table (30) for mounting the glass substrate; and the dicing device has a cutting mechanism (11) for cutting the glass substrate into the width, and placing the glass substrate on the transfer table In the upper state, the glass substrate is moved along the glass substrate transport path integrally with the transfer table, and the glass substrate is cut into the width by the cutting mechanism without the alignment of the end faces before the end surface processing. . The manufacturing apparatus of the glass substrate of claim 1, wherein the cutting device (10) further comprises a cutting table (12), wherein the cutting mechanism (11) forms a cutting line at a specific cutting position of the glass substrate. The first surface of the glass substrate is moved, and the cutting table (12) is disposed on a second surface opposite to the first surface of the glass substrate so as to face the glass substrate. The apparatus for manufacturing a glass substrate according to claim 1, wherein the end surface processing device (20) includes a grinding wheel (21) and a driving mechanism and a control mechanism for driving the grinding wheel, and the grinding wheel is formed at a level of the circumferential surface thereof. The grinding groove (22) which is recessed toward the inner side in the entire direction, and the grinding groove has a shape capable of forming a specific chamfered surface with respect to the end surface of the glass substrate. The manufacturing apparatus of the glass substrate of claim 1, wherein The transfer table (30) moves on a travel shaft (60) provided on the glass substrate transport path. The manufacturing apparatus of the glass substrate according to any one of claims 1 to 4, wherein a cutting line formed by the cutting mechanism (11) and a processing point of the end surface processing apparatus (20) are located along the glass substrate conveying path The same line. The apparatus for manufacturing a glass substrate according to any one of claims 1 to 4, wherein at least one end of the glass substrate to be cut has an outer side region having a thickness different from a central portion of the glass substrate, and the cutting mechanism cuts the outer region . The apparatus for manufacturing a glass substrate according to any one of claims 1 to 4, wherein the end surface processing apparatus includes a guiding mechanism (40) for guiding an end surface of the glass substrate to the end surface Processing organization. The apparatus for manufacturing a glass substrate according to claim 7, wherein the guiding mechanism is for guiding the both end portions (1a) of the glass substrate (1) to the grinding grooves (22) of the grinding wheel (21), respectively. The guiding table (40), the guiding table (40) is disposed at a position spaced apart from the transfer table (30) by a fixed distance on both sides of the transfer table (30). The apparatus for manufacturing a glass substrate according to any one of claims 1 to 4, wherein the cutting mechanism is a cutter wheel that is rotationally moved with respect to the surface of the glass substrate. A manufacturing apparatus for a glass substrate according to claim 2, wherein said cutting table is formed of a spherical or cylindrical member movable with the movement of said cutting mechanism.