TWM510041U - Electronic device having heat-dissipating structure - Google Patents

Description

Electronic device with heat dissipation structure

The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation structure.

Existing electronic devices generally utilize thermal grease applied to electronic components that generate thermal energy during operation to direct thermal energy away from the electronic components themselves; although this method can direct waste heat away from the electronic components themselves, since such electronic components are typically The package is enclosed in the housing of the electronic device. Therefore, the waste heat remains in the electronic device. In other words, the electronic device cannot guide the waste heat away from the electronic device itself, and thus the temperature is too high, the hot is unsafe, and the temperature is excessive. High and affecting the performance of its own.

Therefore, the object of the present invention is to provide a safety problem that has a good heat dissipation structure, so that the temperature of the housing is not too high or there is a hot hand.

Therefore, the novel electronic device having a heat dissipation structure is detachably combined with a quick release seat for assembling a holding device, and includes a housing, a heat generating unit, and a heat dissipation structure.

The housing defines an installation space.

The heat generating unit is disposed in the installation space and is generated during operation Waste heat.

The heat dissipation structure is disposed in the installation space, and includes a contact piece that abuts the heat generating unit, and an extending piece extending from the contact piece and abutting against an inner surface of the housing, the extension piece has a bare to the outside The heat sink.

The effect of the present invention is that the waste heat generated by the heat generating unit in the housing is transmitted to the extending piece by the contact piece of the heat dissipation structure to be dissipated to the outside, thereby reducing the temperature of the housing of the electronic device is too high. Causes unsafe feelings of hot hands.

1‧‧‧Shell

11‧‧‧Set space

12‧‧‧ base wall

13‧‧‧ frame wall

14‧‧‧through slot

15‧‧‧ openings

2‧‧‧Fever unit

21‧‧‧ screen

22‧‧‧ motherboard

3‧‧‧heating structure

31‧‧‧Contacts

32‧‧‧heating surface

33‧‧‧Extension

4‧‧‧ Quick release seat

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a perspective exploded view showing an embodiment of the electronic device having a heat dissipation structure; and FIG. It is a cross-sectional view illustrating this embodiment of the novel electronic device having a heat dissipation structure.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 and FIG. 2, an embodiment of the electronic device with a heat dissipation structure is detachably combined with a quick release seat 4 for assembling a holding device, and includes a housing 1 and a heating unit 2. And a heat dissipation structure 3. In this example, the electronic device having the heat dissipation structure is, for example, a navigation device, and the holding device is a fixed bracket fixed to the vehicle.

The housing 1 defines an installation space 11 and includes a base wall 12 and a frame wall 13 extending from the base wall 12 and having a slot 14 defining a communication environment and the installation space 11 Opening 15.

The heat generating unit 2 is disposed in the installation space 11 and generates waste heat during operation, including a screen 21 disposed on the frame wall 13 closing the opening 15, and a plurality of integrated circuit components disposed and electrically connected to the screen 21 Motherboard 22.

The heat dissipation structure 3 is disposed in the installation space 11 and includes a contact piece 31 that abuts the heat generating unit 2, and an inner surface of the frame wall 13 extending from the contact piece 31 and abutting against the frame wall 13 of the housing 1. An extension piece 33, the extension piece 33 further has a heat dissipation surface 32 exposed to the outside by the through slot 14, the contact piece 31 is made of a heat conductive material and the opposite sides thereof abut against the screen 21 and the motherboard 22 The extension piece 33 is made of a metal material and an alloy containing good heat dissipation characteristics.

The quick release seat 4 is detachably slidably engaged with the slot 14 to be assembled with the housing 1 and abuts against a portion of the heat dissipation surface 32 of the extension piece 33 when it slides over the slot 14 .

When the electronic device with the heat dissipation structure of the present invention is used, the screen 21 and the motherboard 22 disposed in the housing 1 may generate waste heat due to the operation. At this time, the waste heat directly passes through the screen 21 and the motherboard 22 . The contact piece 31 is conducted to the extension piece 33, and then the heat dissipation surface 32 is exposed to the outside by the slot 14 to directly dissipate the waste heat on the extension piece 33 to the outside, thereby maintaining the normal operation of the electronic device as a whole.

In particular, because of the novel electronic device having a heat dissipation structure The extending piece 33 is disposed corresponding to the frame wall 13 of the housing 1 corresponding to the slot 14 , and at the same time, the quick release seat 4 is correspondingly slidably engaged in the slot 14 , so that the user is In use, the extension piece 33 having a high temperature due to the transfer of waste heat is not easily touched, and the safety in use can be effectively increased under the condition of effectively dissipating heat and maintaining the normal operation of the electronic device.

In addition, it is to be noted that, in view of the fact that the housing 1 in the above example is a flat cube, only a single-piece extension piece with a single slot 14 fitted to one side of the frame wall 13 is illustrated; in fact, the extension piece For example, the frame 33 can be placed against the frame wall 13 or extended against the base wall 12, and at the same time, a plurality of grooves and perforations can be matched, and the grooves and perforations can also be designed into a special pattern structure. A better heat dissipation effect is achieved, and since these structural changes are numerous, they are not illustrated here.

In summary, the electronic device with the heat dissipation structure of the present invention can transfer the waste heat generated by the heat generating unit 2 disposed in the housing 1 to the extension piece 33 by the contact piece 31, and utilize the through slot 14 The heat dissipating surface 32 that communicates the exposed surface with the outside can directly dissipate the waste heat to the outside, and lower the temperature of the housing 1 , and more because the extending piece 33 is a frame corresponding to the housing 1 corresponding to the slot 14 The inner surface of the wall 13 is such that the user only touches the housing 1 during use without touching the extension piece 33 having a high temperature due to the transfer of waste heat, thereby avoiding the temperature of the housing 1 being too high. The safety problem of the user is hot, so it can achieve the purpose of this new type.

However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change of the patent application scope and the patent specification content of the present invention is Modifications are still within the scope of this new patent.

1‧‧‧Shell

11‧‧‧Set space

12‧‧‧ base wall

13‧‧‧ frame wall

14‧‧‧through slot

15‧‧‧ openings

2‧‧‧Fever unit

21‧‧‧ screen

22‧‧‧ motherboard

3‧‧‧heating structure

31‧‧‧Contacts

32‧‧‧heating surface

33‧‧‧Extension

4‧‧‧ Quick release seat

Claims (7)

An electronic device having a heat dissipation structure, detachably combined with a quick release seat for assembling a holding device, comprising: a housing defining an installation space; and a heat generating unit disposed in the installation space and in operation And generating a waste heat; and a heat dissipating structure disposed in the installation space, and comprising a contact piece abutting the heat generating unit, and an extending piece extending from the contact piece and abutting against an inner surface of the housing, the extending piece It has a heat dissipation surface exposed to the outside world. The electronic device with a heat dissipation structure according to claim 1, wherein the housing comprises a base wall, and a frame wall extending from the base wall and having a slot, the extension piece being disposed against the frame wall, The heat dissipating surface is exposed to the outside through the through slot. The electronic device with a heat dissipation structure according to claim 2, wherein the quick release seat is detachably slidably engaged with the through slot to be assembled with the housing. The electronic device with a heat dissipation structure according to claim 3, wherein the quick release seat slides against a partial area of the heat dissipation surface of the extension piece when the groove is slid. The electronic device of claim 2, wherein the frame wall further defines an opening connecting the outside and the installation space, the heating unit includes a screen disposed on the frame wall to close the opening, and a setting A motherboard that has a plurality of integrated circuit components and is electrically connected to the screen. An electronic device having a heat dissipation structure according to claim 5, wherein the electronic device The opposite sides of the patch are placed between the screen and the motherboard against the screen and the integrated circuit components. The electronic device having a heat dissipation structure according to claim 1, wherein the contact sheet is made of a heat conductive material, and the extension piece is made of a metal material and an alloy containing good heat dissipation characteristics.