WO2017197846A1

WO2017197846A1 - Terminal device and heat-dissipation structure thereof

Info

Publication number: WO2017197846A1
Application number: PCT/CN2016/103819
Authority: WO
Inventors: 黄竹邻
Original assignee: 中兴通讯股份有限公司
Priority date: 2016-05-17
Filing date: 2016-10-28
Publication date: 2017-11-23
Also published as: CN107396592B; CN107396592A

Abstract

The present invention relates to the field of electronic technology. Disclosed herein are a terminal device and a heat-dissipation structure thereof. The heat-dissipation structure comprises: a substrate, a heat-generating element, a thermal conductor and a shell which are stacked in sequence from bottom to top, and a shield frame provided between the substrate and the shell; the substrate, the shield frame and the shell enclose to form an accommodation space, and the heat-generating element and the thermal conductor are accommodated in the accommodation space; the thermal conductor comprises at least a first thermally-conductive layer which is made of a thermally-conductive phase change material. Thus, by filling the thermal conductor which comprises the first thermally-conductive layer made of a thermally-conductive phase change material and which is provided between the shell and the heat-generating element, the thermal conductor can dynamically adapt to a gap between the heat-generating element and the shell, along with changes in temperature during the operation of the terminal. On the one hand, the present invention ensures that a gap does not exist between the shell and the shield frame when the terminal is in a working state, thus ensuring electromagnetic shielding performances; on the other hand, the thermal conductor is always kept in sufficient contact with the heat-generating element and the shell, respectively, so as to maintain an unimpeded path for heat dissipation, thus ensuring heat-dissipation performances.

Description

Terminal device and its heat dissipation structure

Technical field

The present invention relates to the field of electronic technologies, and in particular, to a terminal device and a heat dissipation structure thereof.

Background technique

In the prior art, the heat dissipation structure of the mobile phone is as shown in FIG. 1 and FIG. 2, and includes a substrate 10, a heat generating component 20, a thermal pad 30, a casing 40, and a shield frame 50. The heat generating component 20 and the thermal pad 30 are housed in the substrate 10 and shielded. The frame 50 and the outer casing 40 are enclosed in an accommodating space formed to electromagnetically shield the heat generating component 20. The heating element 20 is disposed on the substrate 10 and has a certain gap with the outer casing 40. The thermal pad 30 is filled in the gap, and is in sufficient contact with the heating element 20 and the outer casing 40 to transfer the heat of the heating element 20 to the outer casing 40. The heat is finally dissipated into the air through the outer casing 40.

The height dimension of the thermal pad 30 has a fixed size, and the shield frame 50, the heat generating component 20, and the like have structural dimensional errors. Therefore, when the thermal pad 30 is filled in the gap between the heat generating component 20 and the outer casing 40, it is difficult to achieve heat conduction. The height of the pad 30 just matches the gap. Therefore, the following problem occurs: as shown in FIG. 1, when the thermal pad 30 is too low to completely fill the gap between the heat generating component 20 and the outer casing 40, the thermal pad 30 cannot be sufficiently contacted with the outer casing 40, resulting in heat dissipation. The method is not smooth, thereby affecting the heat dissipation performance; as shown in FIG. 2, when the thermal pad 30 is too high, the thermal pad 30 will lift the outer casing 40, so that a gap occurs between the outer casing 40 and the shield frame 50, resulting in the heating element 20 The electromagnetic shielding is over-exposed, causing leakage, which affects the electromagnetic shielding performance.

In summary, the existing heat dissipation structure cannot balance the heat dissipation performance and the electromagnetic shielding performance, thereby affecting the performance of the whole machine.

Summary of the invention

In view of this, the purpose of the embodiments of the present invention is to provide a terminal device and a heat dissipation structure thereof to solve the technical problem that the electromagnetic shielding performance and the heat dissipation performance cannot be balanced.

The technical solutions adopted by the embodiments of the present invention to solve the above technical problems are as follows:

According to an aspect of the embodiments of the present invention, there is provided a heat dissipation structure of a terminal device, the heat dissipation structure comprising a substrate stacked in order from bottom to top, a heat generating component, a heat conductor and a casing, and the substrate and the a shielding frame between the outer casings, the substrate, the shielding frame and the outer casing enclosing an accommodating space, wherein the heat generating component and the heat conductor are accommodated in the accommodating space, and the heat conductor is at least A first thermally conductive layer is included, the first thermally conductive layer being made of a thermally conductive phase change material.

Optionally, the heat conductor further includes a second heat conductive layer, and the second heat conductive layer is a soft heat conductive pad.

Optionally, the soft thermal pad is a thermal pad, a thermal fiber cloth pad or a thermal fiber mesh pad.

Optionally, the heat conductor further includes a second heat conductive layer, and the second heat conductive layer is a hard heat conductive pad.

Optionally, the hard thermal pad is a thermal conductive graphite pad or a thermal conductive copper mesh pad.

Optionally, the first heat conducting layer is placed on the second heat conducting layer.

Optionally, the second heat conducting layer is disposed above the first heat conducting layer.

Optionally, the heating element is an integrated circuit.

Optionally, the outer casing is a middle frame.

According to another aspect of the embodiments of the present invention, a terminal device includes a heat dissipation structure including a substrate stacked in order from bottom to top, a heat generating component, a heat conductor, and a casing, and a shielding frame between the substrate and the outer casing, the substrate, the shielding frame and the outer casing enclose an accommodating space, and the heating element and the heat conducting body are accommodated in the accommodating space The heat conductor includes at least a first heat conductive layer, and the first heat conductive layer is made of a thermally conductive phase change material.

In the heat dissipation structure of the embodiment of the present invention, a heat conductor having a first heat conduction layer made of a thermally conductive phase change material is filled between the outer casing and the heat generating component, so that the heat conductor can dynamically adapt to heat when the terminal is in operation. The gap between the component and the outer casing. On the one hand, there is no gap between the outer casing and the shielding frame when the terminal is in working state, thereby ensuring electromagnetic shielding performance; on the other hand, The heat conductor is always in full contact with the heating element and the outer casing, respectively, to maintain the smooth heat dissipation path and ensure the heat dissipation performance; on the other hand, when the first heat conduction layer of the heat conductor becomes a semi-flow state, it will infiltrate into contact with it. The surface gap of the object greatly expands the heat dissipation surface area from the microscopic point, which greatly improves the heat dissipation performance of the heat dissipation structure.

DRAWINGS

The drawings described herein are intended to provide a further understanding of the invention, and are intended to be a part of the invention. In the drawing:

1 is a schematic structural view of a heat dissipation structure of a mobile phone in the prior art;

2 is another schematic structural diagram of a heat dissipation structure of a mobile phone in the prior art;

3 is a schematic structural diagram of a heat dissipation structure of a terminal device according to an embodiment of the present invention;

FIG. 4 is another schematic structural diagram of a heat dissipation structure of a terminal device according to an embodiment of the present invention.

detailed description

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in order to make the present invention. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to FIG. 3 and FIG. 4, a heat dissipation structure of a terminal device according to an embodiment of the present invention is provided. The heat dissipation structure includes a substrate 100, a shield frame 500, a case 400, a heat generating component 200, and a heat conductor 300, a substrate 100, a heat generating component 200, and heat conduction. The body 300 and the outer casing 400 are stacked in this order from bottom to top. The shield frame 500 is disposed between the substrate 100 and the outer casing 400. The upper and lower ends of the shield frame 500 are provided with windows, so that the substrate 100, the shield frame 500 and the outer casing 400 are enclosed. An accommodating space, the heat generating component 200 and the heat conductor 300 are housed in the accommodating space.

In the embodiment of the present invention, the substrate 100 is a printed circuit board (PCB), and may of course be other supporting components. The heating element 200 is an integrated circuit (IC), and of course, other electronic components that require heat dissipation. The outer casing 400 is a middle frame, and may of course be a casing such as a rear cover. The outer casing 400 may be made of metal or alloy (such as magnesium alloy). Plastic, etc.

In the embodiment of the present invention, the heat conductor 300 includes at least a first heat conductive layer 310. The first heat conductive layer 310 is made of a thermally conductive phase change material (PCM), and the phase transition temperature of the heat conductive phase change material is preferably 30. Above Celsius. The thermally conductive phase change material is solid at room temperature (or room temperature) and is easy to handle. It can be used as a dry pad for strong and clean use on the surface of the thermal pad or device. When the device is hot and the device is hot, the thermally conductive phase change material becomes soft. With a little pressure applied, the thermally conductive phase change material, like hot grease, easily penetrates into the surface gap of the object in contact with it, so that the two surfaces are fully contacted and integrated. The process in which a thermally conductive phase change material changes from a solid to a liquid or from a liquid to a solid is called a phase change process, and a large amount of latent heat is absorbed or released during the phase change. The thermal phase change material may be selected from inorganic phase change materials, organic phase change materials, and composite phase change materials.

Optionally, the outer diameter of the first heat conduction layer 310 is slightly smaller than the inner diameter of the shield frame 500, thereby providing the first heat conduction layer 310 with an expansion space at the time of phase change. As shown in FIG. 3, at normal temperature (below the phase transition temperature), the first heat conduction layer 310 is solid, and the height of the heat conductor 300 is slightly higher than the gap between the heat generating component 200 and the outer casing 400, so that the heat conductor 300 will be jacked up. The outer casing 400 provides a certain gap between the outer casing 400 and the shield frame 500. As shown in FIG. 4, when the heat generating component 200 generates heat such that the temperature of the first heat conducting layer 310 of the heat conductor 300 is higher than the phase transition temperature, the first heat conducting layer 310 undergoes a phase change, and gradually changes from a solid state to a semi-liquid state, so that heat conduction is performed. The height of the body 300 gradually decreases, and the gap between the outer casing 400 and the shield frame 500 gradually disappears, and the heat conductor 300 and the outer casing 400 are always in full contact, and a large amount of heat is quickly transmitted to the first heat conducting layer 310 when the phase change occurs. The outer casing 400, the final outer casing 400, dissipates heat into the air.

In one aspect, the first heat conducting layer 310 made of a thermally conductive phase change material can dynamically adapt to the gap between the heat generating component 200 and the outer casing 400 as the temperature changes, such that the outer casing 400 and the shield frame 500 are not in operation when the terminal is in operation. There is a gap to ensure electromagnetic shielding performance; on the other hand, by dynamically adapting the gap between the heating element 200 and the outer casing 400, the thermal conductor 300 is always in full contact with the heating element 200 and the outer casing 400, respectively, maintaining the heat dissipation path. Smooth, ensuring heat dissipation performance; on the other hand, when the first heat conduction layer 310 of the heat conductor 300 becomes a semi-fluid state, it will penetrate into the surface gap of the object in contact with it, so that the two are in full contact, which greatly expands The contact area of the two greatly improves the heat dissipation performance of the heat dissipation structure.

Optionally, in the embodiment of the present invention, the heat conductor 300 further includes a second heat conductive layer 320, which is a soft thermal pad or a hard thermal pad, thereby forming a double layer through a thermal pad and a thermally conductive phase change material. The composite heat conductor can further improve the heat dissipation performance of the heat dissipation structure. Soft thermal pads such as thermal pad, thermal fiber cloth pad, thermal fiber mesh pad, or soft thermal pad made of clay and silicone grease, such as thermal graphite pad, thermal copper mesh pad, etc. Since the thermal pad has a certain rigidity and hardness, the proper height of the entire thermal conductor 300 can be set more precisely, and a reasonable adaptation of the gap between the heating element 200 and the outer casing 400 is achieved, so that the first thermal conductive layer 310 becomes half. After the fluid state, it is ensured that the outer casing 400 and the heat conductor 300 are always in full contact. Even if the gap between the heat generating component 200 and the outer casing 400 is large, the thermally conductive phase change material of the first heat conductive layer 310 can properly fit the gap, thereby expanding the application scenario of the heat dissipation structure of the embodiment of the present invention.

In the embodiment of the invention, the first heat conduction layer 310 is disposed on the second heat conduction layer 320. At this time, when the first heat conduction layer 310 becomes a semi-liquid state, the bottom of the first heat conduction layer 310 may infiltrate into the surface gap of the second heat conduction layer 320, and the top portion may infiltrate into the surface gap of the outer casing 400, so that the first heat conduction layer 310 and the first The two heat conducting layers 320 and the outer casing 400 are in full contact, and the heat dissipating surface area is greatly enlarged from the microscopic level, thereby greatly improving the heat dissipation performance.

Optionally, the outer diameter of the second heat conductive layer 320 is greater than the outer diameter of the heat generating component 200. Therefore, on the one hand, the contact area of the second heat conductive layer 320 and the heat generating component 200 is ensured to be maximized, which is advantageous for sufficient heat dissipation; on the other hand, the heat generating component 200 is sufficiently covered to maintain the electromagnetic shielding performance at a normal temperature state.

Optionally, in other embodiments, the first heat conductive layer 310 is disposed under the second heat conductive layer 320. At this time, when the first heat conductive layer 310 becomes a semi-liquid state, the bottom of the first heat conductive layer 310 may penetrate into the surface gap of the heat generating component 200, and the top portion may infiltrate into the surface gap of the second heat conductive layer 320, so that the first heat conductive layer 310 and the first heat conductive layer 310 The second heat conducting layer 320 and the heat generating component 200 are in full contact, and the heat dissipation surface area is greatly enlarged from the microscopic level, thereby greatly improving the heat dissipation performance.

Optionally, in some embodiments, the heat conductor may also be composed of only the first heat conducting layer made of a thermally conductive phase change material, and the technical problem of the present invention can also be solved, only at a suitable height of the entire heat conductor 300. It is more difficult to achieve a reasonable adaptation of the gap between the heating element 200 and the outer casing 400.

The heat dissipation structure of the embodiment of the present invention, by filling the heat conductor 300 having the first heat conduction layer 310 made of a thermally conductive phase change material between the outer casing 400 and the heat generating component 200, enables the heat conductor 300 to follow the temperature when the terminal device operates The variation dynamically adapts the gap between the heating element 200 and the outer casing 400. On the one hand, when the terminal device is in the working state, there is no gap between the outer casing 400 and the shield frame 500, which ensures electromagnetic shielding performance; on the other hand, the heat conductor 300 is always in full contact with the heat generating component 200 and the outer casing 400, respectively, and is maintained. The smoothing of the heat dissipation path ensures the heat dissipation performance; on the other hand, when the first heat conduction layer 310 of the heat conductor 300 becomes a semi-fluid state, the surface gap of the object in contact with it is infiltrated, and the microscopically greatly expanded. The heat dissipation surface area greatly improves the heat dissipation performance of the heat dissipation structure.

The embodiment of the present invention further provides a terminal device, the terminal device includes a heat dissipation structure including a substrate stacked in order from bottom to top, a heat generating component, a heat conductor and a casing, and the substrate and the a shielding frame between the outer casings, the substrate, the shielding frame and the outer casing enclosing an accommodating space, wherein the heat generating component and the heat conductor are accommodated in the accommodating space, and the heat conductor is at least A first thermally conductive layer is included, the first thermally conductive layer being made of a thermally conductive phase change material. The heat dissipation structure described in this embodiment is the heat dissipation structure of the above embodiment of the present invention, and details are not described herein again.

The terminal device in the embodiment of the present invention may be a mobile terminal such as a mobile phone or a tablet, or may be a fixed terminal such as a personal computer or a television.

The terminal device of the embodiment of the present invention, by modifying the heat dissipation structure, fills the heat conductor 300 having the first heat conduction layer 310 made of a thermally conductive phase change material between the outer casing 400 and the heat generating component 200, so that the terminal device conducts heat during operation. The body is capable of dynamically adapting the gap between the heat generating component 200 and the outer casing 400 as the temperature changes. On the one hand, when the terminal device is in the working state, there is no gap between the outer casing 400 and the shielding frame 500, which ensures the electromagnetic shielding performance of the terminal device; on the other hand, the thermal conductor 300 is always in full contact with the heating element 200 and the outer casing 400, respectively. The heat dissipation path is maintained to ensure the heat dissipation performance of the terminal device; on the other hand, when the first heat conduction layer 310 of the heat conductor 300 becomes a semi-flow state, it will infiltrate the surface gap of the object in contact with it, from the microscopic The heat dissipation surface area is greatly expanded, and the heat dissipation performance of the terminal device is greatly improved.

The preferred embodiments of the present invention have been described above with reference to the drawings, and are not intended to limit the scope of the invention. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and spirit of the invention are intended to be included within the scope of the invention.

Industrial applicability

According to the heat dissipation structure of the embodiment of the invention, a heat conductor having a first heat conduction layer made of a thermally conductive phase change material is filled between the outer casing and the heat generating component, so that the heat conductor can dynamically adapt to heat when the terminal is in operation. The gap between the component and the outer casing. On the one hand, when the terminal is in working state, there is no gap between the outer casing and the shielding frame to ensure electromagnetic shielding performance; on the other hand, the thermal conductor is always in full contact with the heating element and the outer casing, respectively, and the heat dissipation path is kept unsatisfactory. The heat dissipation performance; on the other hand, when the first heat conduction layer of the heat conductor becomes a semi-fluid state, it will infiltrate into the surface gap of the object in contact with it, greatly expanding the heat dissipation surface area from the microscopic, and greatly improving the heat dissipation structure. Thermal performance.

Claims

A heat dissipation structure of a terminal device includes a substrate (100), a heat generating component (200), a heat conductor (300), and a casing (400) stacked in this order from bottom to top, and a substrate (100) and a substrate a shielding frame (500) between the outer casings (400), the substrate (100), the shielding frame (500) and the outer casing (400) are enclosed to form an accommodating space, and the heating element (200) And the heat conductor (300) is housed in the accommodating space, the heat conductor (300) includes at least a first heat conductive layer (310), and the first heat conductive layer (310) is made of a heat conductive phase change material .
The heat dissipation structure of the terminal device according to claim 1, wherein the heat conductor (300) further comprises a second heat conduction layer (320), and the second heat conduction layer (320) is a soft heat conduction pad.
The heat dissipation structure of the terminal device according to claim 2, wherein the soft thermal pad is a thermal pad, a thermal fiber cloth pad or a thermal fiber mesh pad.
The heat dissipation structure of the terminal device according to claim 1, wherein the heat conductor (300) further comprises a second heat conduction layer (320), and the second heat conduction layer (320) is a hard heat conduction pad.
The heat dissipation structure of the terminal device according to claim 4, wherein the hard thermal pad is a heat conductive graphite pad or a thermal conductive copper mesh pad.
The heat dissipation structure of the terminal device according to any one of claims 1 to 5, wherein the first heat conduction layer (310) is placed on the second heat conduction layer (320).
The heat dissipation structure of the terminal device according to any one of claims 1 to 5, wherein the second heat conduction layer (320) is placed over the first heat conduction layer (310).
The heat dissipation structure of the terminal device according to any one of claims 1 to 5, wherein the heat generating component (200) is an integrated circuit.
The heat dissipation structure of the terminal device according to any one of claims 1 to 5, wherein the outer casing (400) is a middle frame.
A terminal device comprising the heat dissipation structure according to any one of claims 1-9.