TWM453096U - Heat dissipation substrate of lamp - Google Patents

Description

Lamp cooling substrate

The present invention provides a heat-dissipating substrate, in particular, a heat-dissipating substrate of a lamp which can effectively improve the heat-dissipating efficiency and the production efficiency, and has the same temperature inside and outside the heat-dissipating substrate, and has effectively dissipated heat from the heat source.

LED (Light-Emitting Diode) is a kind of semiconductor component. It was used as an indicator light, display panel, etc. in the early days. With the appearance of white light-emitting diodes, it was also used as illumination instead of traditional light bulbs. . It has become a common light source today, and has the advantages of high efficiency, long life, and not easy to break, which traditional light bulbs cannot match.

However, when the LED is emitting light, its own temperature is increased due to high heat generation, so that it is in a high temperature environment. At the same time, the energy conversion efficiency of LEDs will drop rapidly at high temperatures, which will waste power and generate more heat, which will cause the temperature to rise again and again, becoming a vicious circle and shortening its life. Therefore, in the past, an LED bulb composed of an LED usually has an annular heat-dissipating cup on its outer casing to increase its heat dissipation effect, and because of this, the assembly between the LED light source circuit board and the driving module is affected. The wires are connected, causing inconvenience in assembly.

Therefore, how to solve the above problems and lack of use, that is, the creator of this creation is related to the industry. The manufacturer is eager to study the direction of improvement.

Therefore, the authors of this creation have collected relevant information in view of the above-mentioned shortcomings. Through multi-party assessment and consideration, and through years of experience in the industry, through continuous trial and modification, this design can effectively improve the heat dissipation efficiency. And the production efficiency, the heat sink substrate inside and outside the temperature is consistent, the heat source has effectively cooled the heat sink substrate new patents.

The main purpose of this creation is to use the combination of the joint and the butt joint to effectively improve the production efficiency of the luminaire and at the same time have the heat dissipation effect.

For the purpose of the above, the present invention relates to a heat dissipation substrate for a lamp, comprising: at least one heat dissipation substrate formed with a plurality of heat dissipation fins, a joint portion formed by extending one end of the heat dissipation substrate, and a heat dissipation substrate An abutting portion is formed at one end, wherein the abutting portion and the joint portion are coupled to each other.

In the above, a heat shield is coupled to one side of the heat dissipating substrate, and the heat dissipating substrate and the lamp cover are combined by one of a snap, a snap or a thread lock, and the heat dissipating substrate is A light connecting module is disposed on the connecting portion, and the light emitting module is electrically connected to a power converter.

With the above structural composition, the joint of the joint portion and the butt joint portion is utilized to enhance the heat dissipation substrate of the creative lamp. Cooling effect and production efficiency.

In order to achieve the above objectives and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present creation, and the features and functions are as follows.

Please refer to the first and third figures, which are a side view and a schematic view of a preferred embodiment of the present invention. It can be clearly seen from the figure that the heat dissipation substrate of the creation lamp comprises: at least one heat dissipation substrate 1, a plurality of heat dissipation fins 11 are formed on one side of the heat dissipation substrate 1; a joint portion 12 formed by extending one end of the heat dissipation substrate 1; and an abutting portion 13 formed by extending the other end of the heat dissipation substrate 1 The joint portion 12 is coupled to each other.

With the above structure and composition design, the following is a description of the use of the present creation. Please refer to the second to fourth figures at the same time, which is a schematic diagram of the mold of the preferred embodiment of the present invention. As can be clearly seen, the heat-dissipating substrate 1 is extruded through a mold 2, which is shown in FIG. 2, and has a predetermined hole (not shown). The bottom of the hole has a flat surface, and has an upwardly convex surface at the top, and extrudes the aluminum extruded heat dissipating substrate 1 by using a die 2 (not shown). When the material 1 is made into the heat-dissipating substrate 1 of the lamp, the heat is dissipated by the cutter A by using a scraper (not shown). The surface of the substrate 1 is obliquely cut in and raised to scrape the heat dissipating fins 11 arranged in parallel with each other, and a base portion is defined at the bottom of the heat dissipating fins 11, and the base portion is biased to be deformed into a heat dissipation of the lamp. a predetermined shape of the substrate 1; when the above operation is completed, the connecting portion 14 is then attached to the heat dissipating substrate 1 in parallel for screwing or extrusion riveting, and the lamp cover 15 is fixed to the heat dissipating substrate 1 Then, the light-emitting module 16 on the connecting portion 14 and the wire group on the power converter 17 connected to one end of the light-emitting module 16 are connected through the fixing member 18 and the conductive portion 19, and then the conductive portion can be sequentially connected. 19. The fixing member 18 is combined with the other end of the heat dissipating substrate 1 to complete the complete assembly process. As can be clearly seen from the above description, the heat dissipating substrate 1 can be formed when the heat dissipating fin 11 is shredded. The circular arc structure has better heat dissipation effect than the square heat dissipation fin 11 of the prior art.

However, the above description is only a preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes using the present specification and the schema should be the same. It is included in the scope of this creation patent and is given to Chen Ming.

Therefore, referring to all the drawings, when using this design, compared with the conventional technology, the following advantages exist: the combination of the joint portion 12 and the docking portion 13 can effectively improve the manufacturing efficiency of the lamp and have the heat dissipation effect. And let the temperature inside and outside the heat-dissipating substrate be consistent, effectively The practical progress of the heat source for heat dissipation.

In summary, the heat-dissipating substrate of the lamp of the present invention can achieve its efficacy and purpose when it is used. Therefore, the creation is a practical and excellent creation, and the application for the new patent is required, and the application is made according to law. I hope that the trial committee will grant this creation as soon as possible to protect the hard work of the creators. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate and feel good.

1‧‧‧heating substrate

11‧‧‧ Heat sink fins

12‧‧‧Combination Department

13‧‧‧Docking Department

14‧‧‧Connecting Department

15‧‧‧shade

16‧‧‧Lighting module

17‧‧‧Power Converter

18‧‧‧Fixed parts

19‧‧‧Electrical Department

2‧‧‧Mold

The first figure is a side view of a preferred embodiment of the creation.

The second drawing is a schematic view of the mold of the preferred embodiment of the present invention.

The third figure is a schematic diagram of the production of the preferred embodiment of the present invention.

The fourth figure is a schematic diagram of the combination of the preferred embodiments of the present invention.

1‧‧‧heating substrate

11‧‧‧ Heat sink fins

Claims (7)

A heat dissipating substrate comprises: at least one heat dissipating substrate, wherein a plurality of heat dissipating fins are formed on one side of the heat dissipating substrate; a joint portion formed by extending one end of the heat dissipating substrate; and a heat dissipating substrate The abutting portion formed by extending the other end is coupled to the joint portion. The illuminating substrate for a luminaire according to claim 1, wherein a side of the heat dissipating substrate is coupled to a lamp cover. The illuminating substrate for a luminaire according to the second aspect of the invention, wherein the heat dissipating substrate and the lampshade are combined in one of a cassette, a snap or a thread lock. The illuminating substrate of the luminaire of claim 2, wherein a connecting portion is disposed between the heat dissipating substrate and the lamp cover. The light-emitting substrate of the lamp of claim 4, wherein the connecting portion is provided with a light-emitting module, and the light-emitting module is electrically connected to a power converter. The luminaire heat-dissipating substrate of claim 2, wherein the heat-dissipating substrate is provided with a fixing member at a side facing away from the lamp cover. The illuminating substrate for a luminaire according to claim 6, wherein the fixing member locks a conductive portion.