TWM466213U - A LED lamp - Google Patents

Abstract

The utility model discloses an LED lamp. The LED lamp comprises an LED lamp shade, a heat radiating fin, a driving chip and a lamp cap, wherein the LED lamp shade is connected with the heat radiating fin, the driving chip is arranged inside the heat radiating fin and electrically connected with the lamp cap, and the heat radiating fin comprises a wiring layer which is electrically connected with the driving chip. The LED lamp further comprises a plurality of LED lamp beads which are arranged on the heat radiating fin and electrically connected with the wiring layer. By the adoption of the LED lamp, the heat radiating problem of an existing LED lamp is effectively solved, heat resistance of the LED lamp is greatly reduced, light emitting efficiency of the LED lamp is further improved, the service life of the LED lamp is prolonged, and the assembling manufacturing cost is also reduced.

Description

LED lamp

The present invention relates to the field of manufacturing technology, and in particular to an LED lamp.

With the maturity of LEDs (Light Emitting Diodes) and white LEDs, their applications in projection lamps, street lamps, table lamps and other products have gradually developed, making LED lighting gradually replace traditional incandescent tungsten lamps. The main source of indoor and outdoor lighting.

LED is a kind of semiconductor device, which is different from traditional incandescent tungsten light bulb in that the traditional incandescent tungsten light bulb heats the filament until the light is emitted by a large current, and the LED is illuminated by the combination of electrons in the semiconductor material. The energy released is displayed so that the LED can excite relatively high brightness with very little current.

A prior art LED lamp, as shown in FIG. 1, includes an LED lamp cover 110, a heat sink 120, a drive wafer 130, a plastic base 140, and a lamp cap 150. A light panel 160 is disposed on the top of the heat sink 120. The light board 160 is a PCB board. The lamp board 160 is fixed on the heat sink 120 by a plurality of screws 170, and a plurality of LED lamp beads 180 are disposed on the light board 160. A driving wafer 130 is disposed in the plastic base 140 for driving a plurality of LED lamp beads 180 to emit light through the light board 160.

However, the biggest technical problem of LED lamps at present is the heat dissipation problem; as the brightness of the LEDs increases gradually, the heat generated by the LEDs in the illuminating process will gradually increase. If the heat generated is not immediately dissipated, it will not only accelerate. LED overall device aging, speed up the LED light decay, shorten the service life, and may even cause the chip to burn.

The purpose of the present invention is to provide an LED lamp, which not only effectively solves the heat dissipation problem of the existing LED lamp, but also greatly reduces the thermal resistance of the LED lamp, further improves the LED luminous efficiency, and prolongs the service life of the LED lamp. In addition, it is also reduced The manufacturing cost of assembly is reduced.

In order to achieve the above objectives, the author uses the following technical solutions.

An LED lamp comprising an LED lamp cover, a heat sink, a driving chip and a lamp cap, wherein the LED lamp cover is connected to the heat sink, and a driving chip is disposed inside the heat sink, the driving chip and the driving chip The heat sink comprises a wiring layer; the wiring layer is electrically connected to the driving chip; the LED lamp further comprises a plurality of LED lamp beads, wherein all the LED lamp beads are disposed in the heat dissipation On-chip and electrically connected to the wiring layer.

Further, the LED lamp beads are separately disposed on the heat sink at a certain circumferential interval.

Further, the LED lamp bead is soldered to the heat sink.

Further, a through hole is formed in the heat sink to allow the positive and negative lines of the driving chip to pass through.

Further, a plurality of heat dissipation fins are disposed around the outer surface of the heat sink, and the heat dissipation fins are spaced apart at equal distances.

Further, the LED lamp includes a base connector for riveting the drive wafer to the heat sink through the base connector.

Further, the bottom of the LED lamp cover is connected to the outer ring of the heat sink in an inserting manner or in a rotating manner.

The advantage of this creation is that the LED lamp bead is placed on the heat sink by using AI (Auto Insert)/SMT (Surface Mount Technology), which can reduce the assembly cost and material cost of the LED. At the same time, the heat source generated by the LED can be more directly transmitted on the heat sink, which greatly reduces the thermal resistance of the LED, thereby improving the luminous efficiency of the LED and prolonging the service life of the LED.

110‧‧‧LED lampshade

120‧‧‧ Heat sink

130‧‧‧Drive chip

140‧‧‧Plastic base

150‧‧‧ lamp holder

160‧‧‧light board

170‧‧‧ screws

180‧‧‧LED lamp beads

210‧‧‧LED lampshade

220‧‧‧heat fins

230‧‧‧Drive chip

240‧‧‧ lamp connector

250‧‧‧ lamp holder

260‧‧‧ Heat sink

261‧‧‧through hole

262‧‧‧ wiring layer

270‧‧‧LED lamp beads

1 is a schematic exploded view of a conventional LED lamp; FIG. 2 is a schematic exploded view of the LED lamp of the present invention; FIG. 3 is a partial schematic view of the LED lamp of the present invention; FIG. 4 is a plan view of FIG.

The specific implementation manner of the LED lamp provided by the present invention will be described in detail below with reference to the accompanying drawings.

2 is a schematic exploded view of the structure of the LED lamp of the present invention. 3 is a partial schematic view of the LED lamp of the present invention. Figure 4 is a plan view of Figure 3.

Referring to FIG. 2, an LED lamp includes an LED lamp cover 210, a heat sink 260, a driving die 230, and a base 250. The LED lamp cover 210 is coupled to the heat sink 260. The bottom of the LED lamp cover 210 is connected to the outer ring of the heat sink 260 in an inserting manner or in a rotating manner. In the present embodiment, the bottom of the LED lamp cover 210 is connected to the outer ring of the heat sink 260 in a threaded manner.

A driving wafer 230 is disposed inside the heat sink 260, and the driving wafer 230 is riveted to the base 250. The driving wafer 230 can adopt a more efficient driving wafer, which helps to better drive the LED lamp bead 270 to emit light, thereby increasing the amount of illumination.

A wiring layer 262 is disposed on the top of the heat sink 260, and the wiring layer 262 is connected to the positive and negative lines of the driving wafer 230 through a through hole 261. The wiring layer may be a patterned wiring layer. A plurality of LED lamp beads 270 are disposed on the heat sink 260, and all of the LED lamp beads 270 and the wiring layer 262 pass AI (Auto Insert)/SMT (Surface Mount Technology). The bonding technology is connected, and the LED lamp bead 270 is sequentially connected to the external power source after passing through the wiring layer 262, the driving wafer 230, and the lamp cap 250.

In the present embodiment, the LED lamp beads 270 are separately disposed on the wiring layer 262 of the heat sink 260 at a certain circumferential interval, so that the heat dissipation area is increased by the arrangement, which is beneficial to solving the heat dissipation of the LED lamp. problem.

Further, a through hole 261 is formed in the heat sink 260 so that the positive and negative lines of the driving wafer 230 pass through.

A plurality of heat dissipation fins 220 are disposed around the outer surface of the heat sink 260, and the heat dissipation fins 220 are equally spaced apart. Through the design of the heat dissipation fins 220, in order to better process the heat generated by the LED lamps, thereby greatly reducing the thermal resistance of the LEDs, In turn, the LED luminous efficiency is improved, and the service life of the LED is prolonged.

In the present embodiment, all of the LED lamp beads 270 are soldered to the heat sink 260 by solder paste, that is, using AI (Auto Insert)/SMT (Surface Mount Technology). The punching technique solders the LED lamp bead 270 to the wiring layer 262 of the heat sink 260.

In the present embodiment, the LED lamp bead 270 adopts a lamp bead having a luminous efficiency of 141.71 m/W, so that the luminous efficiency of the LED can be further improved.

The LED luminaire further includes a base connector 240 for riveting and fixing the drive wafer 230 to the heat sink 260 through the base connector 240.

In the present embodiment, the LED lamp cover 210 can adopt a full-circumference lamp cover to increase the transmittance of the lamp cover, and further improve the luminous efficiency.

It can be seen from the above that using the SMT (Surface Mount Technology) or AI (Auto Insert) tooling technology to place the LED bead on the heat sink can reduce the assembly cost and material cost of the LED. At the same time, the heat source generated by the LED can be more directly transmitted on the heat sink, which greatly reduces the thermal resistance of the LED, thereby improving the luminous efficiency of the LED and prolonging the service life of the LED. In addition, the manufacturing cost of assembly is also reduced.

The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can also make some improvements and retouching without departing from the principle of the present invention. These improvements and retouchings should also be considered. The scope of protection for this creation.

210‧‧‧LED lampshade

220‧‧‧heat fins

230‧‧‧Drive chip

240‧‧‧ lamp connector

250‧‧‧ lamp holder

260‧‧‧ Heat sink

270‧‧‧LED lamp beads

Claims (7)

An LED lamp comprising an LED lamp cover, a heat sink, a driving chip and a lamp cap, wherein the LED lamp cover is connected to the heat sink, and a driving chip is disposed inside the heat sink, the driving chip and the driving chip The lamp holder is riveted, the heat sink comprises a wiring layer, and the wiring layer is electrically connected to the driving chip; wherein the LED lamp further comprises a plurality of LED lamp beads, all of the LED lamp beads are disposed in the And on the heat sink, and electrically connected to the wiring layer. The LED lamp of claim 1, wherein the LED lamp beads are disposed separately on the heat sink at a certain circumferential pitch. The LED lamp of claim 1, wherein the LED lamp bead is soldered to the heat sink. The LED lamp of claim 1, wherein a through hole is formed in the heat sink such that the positive and negative lines of the driving chip pass through. The LED lamp of claim 1, wherein a plurality of heat dissipating fins are disposed around an outer surface of the heat sink, the heat dissipating fins being spaced apart at equal distances. The LED lamp of claim 1, further comprising a base connector for riveting the drive wafer to the heat sink through the base connector. The LED lamp of claim 1, wherein the bottom of the LED lamp cover is connected to the outer ring of the heat sink in an inserting manner or in a rotating manner.