JP3160000U - LED lighting device and heat dissipation structure thereof - Google Patents

LED lighting device and heat dissipation structure thereof Download PDF

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JP3160000U
JP3160000U JP2010001465U JP2010001465U JP3160000U JP 3160000 U JP3160000 U JP 3160000U JP 2010001465 U JP2010001465 U JP 2010001465U JP 2010001465 U JP2010001465 U JP 2010001465U JP 3160000 U JP3160000 U JP 3160000U
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▲き▼郎 頼
▲き▼郎 頼
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群光電能科技股▲ふん▼有限公司
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Abstract

【課題】良好な放熱効率を備え、且つ製造コストを下げるLED照明具及びその放熱構造を提供する。【解決手段】放熱構造を備えたLED照明具は、ダウンライト、ダウンライト内部に納置するLEDモジュール及びダウンライト外部に被せる放熱構造を含み、ダウンライトは、最上板及び最上板周辺縁から折曲して伸びた側壁を備え、LEDモジュールは最上板の内側面に接着した回路板及び回路板上に電気連接する複数のLEDを含み、放熱構造は最上板の外側面に接着した蓋板及び蓋板周辺縁から折り曲げて伸び、間を開けて設置した複数の放熱片を備え、且つ放熱片はダウンライトの側壁外側に被せ、側壁と共に放熱通道を形成する。【選択図】図1An LED illuminator having good heat dissipation efficiency and lowering the manufacturing cost and a heat dissipation structure thereof are provided. An LED lighting device having a heat dissipation structure includes a downlight, an LED module placed inside the downlight, and a heat dissipation structure that covers the outside of the downlight. The downlight is folded from the uppermost plate and the peripheral edge of the uppermost plate. The LED module includes a circuit board bonded to the inner surface of the uppermost plate and a plurality of LEDs electrically connected on the circuit board; and the heat dissipation structure includes a cover plate bonded to the outer surface of the uppermost plate; A plurality of heat dissipating pieces that are bent and extended from the peripheral edge of the cover plate and are spaced apart from each other are provided, and the heat dissipating pieces cover the outside of the side wall of the downlight to form a heat dissipating passage with the side wall. [Selection] Figure 1

Description

本考案は、LED照明具に関するもので、特に放熱装置を備えたLED照明具に係わる。   The present invention relates to an LED lighting device, and more particularly to an LED lighting device including a heat dissipation device.

近年来、発光ダイオード(LED)技術は大きく発展し、日々進歩している。また省エネ、使用寿命が長く、体積が小さく、反応が早い等と言う特徴から、従来の電球に徐々に取って代わり将来の主流になると思われる。   In recent years, light emitting diode (LED) technology has been greatly developed and advanced day by day. In addition, due to the features of energy saving, long service life, small volume, quick response, etc., it seems that it will gradually replace the conventional light bulb and become the mainstream in the future.

一般的に、LEDの効率は高ければ高いほど、それに伴って廃熱も多くなる。しかしながら、高温はLEDの寿命及び発光効率にとり、非常に大きなマイナス影響を与える。そのため、効率が比較的高いLED照明具には大抵放熱構造が設置され、適時高熱を発散している。公知のLED放熱構造は、通常照明台の外表面に複数の放熱フィンが設置され、大範囲の放熱面積を備えた放熱フィンによって即座に廃熱を排除する。   In general, the higher the efficiency of an LED, the more waste heat is associated with it. However, the high temperature has a very large negative effect on the lifetime and luminous efficiency of the LED. For this reason, an LED illuminator having a relatively high efficiency is usually provided with a heat dissipation structure, and dissipates high heat in a timely manner. In a known LED heat dissipation structure, a plurality of heat dissipation fins are usually installed on the outer surface of the lighting stand, and waste heat is immediately eliminated by the heat dissipation fins having a large heat dissipation area.

特開2009−64636公報JP 2009-64636 A

解決しようとする問題点は、照明台の外表面上に設置した放熱フィンは数量が多く且つ体積が大きい。更に該照明台及び放熱フィンは通常、アルミ絞り加工もしくはダイカスト等で一体成型加工方式で製造される。金型コストは費用が高く且つ製造工程の時間が長い。更にこれらの放熱フィンは運送過程に於いてぶつかって瑕がつきやすく、そのため良品率に影響を与え、それが目下LED照明具の製造コストが高止まりしている原因にもなっている点である。   The problem to be solved is that the heat dissipating fins installed on the outer surface of the lighting stand have a large quantity and a large volume. Further, the illuminating stand and the heat radiating fin are usually manufactured by an integral molding method such as aluminum drawing or die casting. Mold costs are expensive and the manufacturing process is long. In addition, these heat radiation fins are likely to be wrinkled in the transportation process, which has an effect on the yield rate, which is currently the cause of the high cost of manufacturing LED lighting fixtures. .

本考案者は上述の欠点に鑑み、研究を重ね遂に上述の欠点を有効に改善し、良好な放熱効率を備え、且つ製造コストを下げるLED照明具及びその放熱構造を提供しようとするものである。   The present inventor intends to provide an LED lighting device and a heat dissipating structure thereof that can effectively improve the above-described drawbacks, have good heat dissipation efficiency, and reduce the manufacturing cost, in view of the above-mentioned drawbacks. .

上記課題を解決するために、本考案は、ダウンライト、ダウンライト内部に納置するLEDモジュール及びダウンライト外部に被せる放熱構造を含み、ダウンライトは、最上板及び最上板周辺縁から折曲して伸びた側壁を備える。LEDモジュールは最上板の内側面に接着した回路板及び回路板上に電気連接する複数のLEDを含み、放熱構造は最上板の外側面に接着した蓋板及び蓋板周辺縁から折り曲げて伸び、間を開けて設置した複数の放熱片を備え、且つ放熱片はダウンライトの側壁外側に被せ、側壁と共に放熱通道を形成することを最も主要な特徴とする。   In order to solve the above-described problems, the present invention includes a downlight, an LED module placed inside the downlight, and a heat dissipation structure that covers the outside of the downlight. The downlight is bent from the uppermost plate and the peripheral edge of the uppermost plate. With extended side walls. The LED module includes a circuit board bonded to the inner surface of the uppermost plate and a plurality of LEDs electrically connected to the circuit board, and the heat dissipation structure extends from the lid plate bonded to the outer surface of the uppermost plate and a peripheral edge of the lid plate, The main feature is that a plurality of heat dissipating pieces are provided with a space between them, and the heat dissipating pieces are placed on the outside of the side wall of the downlight to form a heat dissipating passage with the side wall.

本考案のLED照明具及びその放熱構造によれば、良好な放熱効率を備え、且つ製造コストを下げるという利点がある。   According to the LED lighting device and its heat dissipation structure of the present invention, there are advantages of providing good heat dissipation efficiency and reducing the manufacturing cost.

本考案のLED照明具の立体外観図である。It is a three-dimensional external view of the LED lighting fixture of this invention. 本考案のLED照明具の立体分解図である。It is a three-dimensional exploded view of the LED lighting device of the present invention. 本考案のLED照明具の使用指示図である。It is a use instruction figure of the LED lighting fixture of this invention. 本考案のLED照明具の第二実施例である。It is a 2nd Example of the LED lighting fixture of this invention. 本考案のLED照明具の第三実施例である。It is a 3rd Example of the LED lighting fixture of this invention.

良好な放熱効率を備え、且つ製造コストを下げるLED照明具を提供することを本考案の一目的とする。   It is an object of the present invention to provide an LED lighting device that has good heat dissipation efficiency and reduces the manufacturing cost.

組立が簡単で、加工が容易なLED照明具を提供することを本考案の別の一目的とする。   It is another object of the present invention to provide an LED lighting device that is easy to assemble and easy to process.

上述の目的を達成するため、本考案のLED照明具は、ダウンライト、LEDモジュール及び放熱構造を含み、ダウンライトは最上板及び最上板の周辺縁から折曲して伸びた側壁を備え、LEDモジュールはダウンライト内部に納置する。LEDモジュールは最上板内側面に接着する回路板及び回路板上で電気連接する複数のLEDを含み、放熱構造はダウンライト外部に被せ、放熱構造は最上板外側面に接着する蓋板及び蓋板周辺縁から折り曲げて成形した複数の放熱片を備え、放熱片はダウンライトの側壁外側に被せ、側壁と共に有効な放熱通道を形成する。   In order to achieve the above-described object, an LED lighting device of the present invention includes a downlight, an LED module, and a heat dissipation structure, and the downlight includes a top plate and a side wall bent and extended from a peripheral edge of the top plate. The module is placed inside the downlight. The LED module includes a circuit board that adheres to the inner surface of the uppermost plate and a plurality of LEDs that are electrically connected on the circuit board. The heat dissipation structure covers the outside of the downlight, and the heat dissipation structure adheres to the outer surface of the uppermost plate. A plurality of heat dissipating pieces bent from the peripheral edge are formed, and the heat dissipating pieces are placed on the outside of the side wall of the downlight to form an effective heat dissipating passage with the side wall.

本考案のもうひとつの目的は、LED照明具の放熱構造を提供することで、それはプレス式で製造し、それに対して折曲成型するため、製造コストを下げる。   Another object of the present invention is to provide a heat dissipating structure for an LED illuminator, which is manufactured by a press method and bent with respect thereto, thereby reducing the manufacturing cost.

上述の目的を達成するため、本考案のLED照明具の放熱構造は、LED照明具のダウンライト上に被せ、放熱構造は蓋板及び蓋板周辺縁から折曲して成形した複数の放熱片を含み、放熱片はダウンライトの外側で被せ、ダウンライトと共に放熱通道を形成する。   In order to achieve the above-described object, the heat dissipating structure of the LED lighting device of the present invention is placed on the downlight of the LED lighting device, and the heat dissipating structure is formed by bending the cover plate and the peripheral edge of the cover plate. The heat radiation piece is covered outside the downlight and forms a heat radiation passage with the downlight.

公知と比較すると、本考案のLED照明具は、公知のアルミ絞り加工型フィンを放熱構造とするのではなく、その放熱構造の蓋板及び放熱片は先ずプレス式で製造し、次にそれに対して折曲加工し、放熱構造をダウンライト外部のカバー体に成形する。その加工及び組立方式は簡単で、且つ大量の金型を製作する必要がないため、大幅な製造コストダウンを可能にする。更に本考案の放熱構造は、放熱片及びダウンライトの側壁の外の間に放熱通道を形成し、そこから外部の空気を進入させ、一部のLEDモジュールから発生した熱を取り去り、熱空気は更に蓋板の放熱孔からも放熱し、良好な自然対流設計で、更に良好な放熱機能を達成した。これにより、本考案の実用性及び経済性がより高めることができる。   Compared with the publicly known one, the LED lighting device of the present invention does not use the known aluminum-drawn fins as a heat dissipation structure, but the cover plate and the heat dissipation piece of the heat dissipation structure are first manufactured by pressing, and then And then bending the heat dissipation structure into the cover outside the downlight. The processing and assembling method is simple and it is not necessary to manufacture a large amount of molds, so that the manufacturing cost can be greatly reduced. Furthermore, the heat dissipation structure of the present invention forms a heat dissipation path between the heat dissipation piece and the outside of the side wall of the downlight, allows external air to enter from there, removes the heat generated from some LED modules, Furthermore, heat was radiated from the heat radiating hole of the cover plate, and a better heat radiating function was achieved with a good natural convection design. Thereby, the practicality and economical efficiency of this invention can be improved more.

本考案のLED照明具及びその放熱構造の実施例を、図に沿って説明するが、実施例は参考と説明のためであり、本考案を制限するものではない。   Although the Example of the LED lighting fixture of this invention and its heat dissipation structure is described along a figure, an Example is for reference and description, and does not restrict | limit this invention.

図1及び図2に示すのは、本考案の実施例のLED照明具の立体外観図及び立体分解図である。本考案のLED照明具1は、ダウンライト10、LEDモジュール20、及び放熱構造30を含む。   FIG. 1 and FIG. 2 are a three-dimensional external view and a three-dimensional exploded view of the LED lighting device of the embodiment of the present invention. The LED lighting device 1 of the present invention includes a downlight 10, an LED module 20, and a heat dissipation structure 30.

該ダウンライト10は、最上板11及び該最上板11周辺縁から折り曲げて伸びた側壁12を備え、該最上板11の中間箇所には穿孔110を設置する。更に該ダウンライト10は錐型筒であり、本実施例で、該側壁12の底縁は別に肩部13が形成されて伸び、該肩部13の末端は外向きに凸縁14が伸びる。   The downlight 10 includes a top plate 11 and a side wall 12 that is bent and extended from a peripheral edge of the top plate 11, and a perforation 110 is provided at an intermediate position of the top plate 11. Further, the downlight 10 is a conical cylinder, and in this embodiment, the bottom edge of the side wall 12 is extended with a shoulder 13 formed separately, and the end of the shoulder 13 is extended outwardly with a convex edge 14.

該LEDモジュール20は、該ダウンライト10内部に納置し、回路板21及び複数のLED22を含む。これらのLED22は該回路板21上に設置し、該回路板21と電気連接し、該回路板21は該ダウンライト10の最上板11の内側面に接着し、且つ電源を提供する導線23を備える。   The LED module 20 is placed inside the downlight 10 and includes a circuit board 21 and a plurality of LEDs 22. These LEDs 22 are installed on the circuit board 21 and are electrically connected to the circuit board 21. The circuit board 21 is bonded to the inner surface of the uppermost plate 11 of the downlight 10 and has a conductor 23 for providing power. Prepare.

該放熱構造30は、該ダウンライト10外部に被せる。該放熱構造30は、蓋板31及び該蓋板31周辺縁から折り曲げて成形し且つ間を隔てて設置した複数の放熱片32を含む。該蓋板31は、該ダウンライト10の最上板11外側面に接着し、該最上板11的穿孔110箇所に対応して通孔310を設置する。該穿孔110及び該通孔310には該LEDモジュール20の導線23を挿入し、そのうち、該蓋板31及び該ダウンライト10の最上板11の連接方式はネジ止め、もしくは導熱樹脂等その他の方式で達成する。   The heat dissipation structure 30 is placed outside the downlight 10. The heat dissipating structure 30 includes a cover plate 31 and a plurality of heat dissipating pieces 32 which are formed by being bent from the peripheral edge of the cover plate 31 and spaced from each other. The cover plate 31 is bonded to the outer surface of the uppermost plate 11 of the downlight 10, and through holes 310 are provided corresponding to the 110 perforations of the uppermost plate 11. The lead wire 23 of the LED module 20 is inserted into the perforation 110 and the through-hole 310, and the connection method of the lid plate 31 and the uppermost plate 11 of the downlight 10 is screwed or other methods such as heat conductive resin. To achieve.

更に該蓋板31は、複数の第一放熱孔311を設置する。これらの第一放熱孔311は該蓋板31の周辺縁近くに環設し、更にこれらの放熱片32は環形放射状で設置し、且つ各該放熱片32には第二放熱孔320を設置し、該放熱片32の末端は自由端で、且つ該ダウンライト10の肩部13を押さえて設置する。   Further, the cover plate 31 is provided with a plurality of first heat radiation holes 311. These first heat radiating holes 311 are provided in the vicinity of the peripheral edge of the cover plate 31, and these heat radiating pieces 32 are provided in a ring shape, and each heat radiating piece 32 is provided with a second heat radiating hole 320. The end of the heat dissipating piece 32 is a free end, and the shoulder portion 13 of the downlight 10 is pressed and installed.

図3に示すのは、本考案のLED照明具の使用指示図である。本実施例に於いて、該LED照明具1は、該ダウンライト10の開口箇所には更に透光ライトカバー40を設置して蚊、蝿等外物が該ダウンライト10内部に侵入するのを防止する。図からわかるように、これらの放熱片32は該ダウンライト10の側壁12外側を覆い、該側壁12と共に放熱通道100を形成する。これにより、該LED照明具1が光った時、該LEDモジュール20から発生する熱は、該回路板21を経て該ダウンライト10の最上板11へ伝導し、更に該最上板11から該放熱構造30の蓋板31上へ伝導し、最後に該蓋板31の伝導により、該LEDモジュール20から発生する熱は、該蓋板31及びこれらの放熱板32から放熱する。   FIG. 3 is a usage instruction diagram of the LED lighting device of the present invention. In this embodiment, the LED illuminator 1 is further provided with a translucent light cover 40 at the opening portion of the downlight 10 to prevent foreign objects such as mosquitoes and moths from entering the downlight 10. To prevent. As can be seen from the figure, these heat radiating pieces 32 cover the outside of the side wall 12 of the downlight 10 and form a heat radiating passage 100 together with the side wall 12. Thereby, when the LED lighting device 1 shines, the heat generated from the LED module 20 is conducted to the uppermost plate 11 of the downlight 10 through the circuit board 21 and further from the uppermost plate 11 to the heat dissipation structure. The heat generated on the LED module 20 is radiated from the cover plate 31 and the heat radiating plates 32 by the conduction of the cover plate 31 and finally the conduction of the cover plate 31.

この他、該ダウンライト10の側壁12及び該放熱構造30の放熱片32の間には放熱通道100が形成される。そのため、外部の空氣が該放熱片32の第二放熱孔320から該放熱通道100へ進入し、一部の該LEDモジュール20から発生した熱を出し、熱空気が形成されると、該蓋板31に開設された第一放熱孔311(図1参照)から放熱される。   In addition, a heat dissipation passage 100 is formed between the side wall 12 of the downlight 10 and the heat dissipation piece 32 of the heat dissipation structure 30. Therefore, when the external air enters the heat radiation passage 100 from the second heat radiation hole 320 of the heat radiation piece 32 and emits heat generated from a part of the LED modules 20, the hot air is formed. The heat is radiated from the first heat radiating hole 311 (see FIG. 1) established in 31.

図4は、本考案のLED照明具及びその放熱構造の第二実施例である。本実施例と第一実施例はおよそ同じであるが、異なる点は、LED照明具1’の放熱構造30’の放熱片32’で、これらの放熱片32’の末端は相互に連接していてカバーリング321’を形成している。該放熱構造30’を該ダウンライト10外部に被せると、該カバーリング321’は該ダウンライト10の肩部13を押さえる。   FIG. 4 shows a second embodiment of the LED lighting device and the heat dissipation structure thereof according to the present invention. The present embodiment and the first embodiment are approximately the same, but the difference is the heat dissipating piece 32 'of the heat dissipating structure 30' of the LED illuminator 1 ', and the ends of these heat dissipating pieces 32' are connected to each other. The cover ring 321 ′ is formed. When the heat dissipation structure 30 ′ is put on the outside of the downlight 10, the cover ring 321 ′ presses the shoulder portion 13 of the downlight 10.

図5は、本考案のLED照明具及びその放熱構造の第三実施例である。本実施例と第一実施例は凡そ同じであるが、異なる点は、LED照明具1”のLEDモジュール20”の導線23”の設置で、本実施例ではダウンライト10”の側壁12”上に穿孔120”を設置し、該導線23”を該穿孔120”に通した後、次に該放熱構造30”の放熱片32”の隙間を通し、外部電源台へ連接する。そのため、ダウンライト10”の最上板11”及び放熱構造30”の蓋板31”には穿孔を貫設する必要がなく、蚊や蝿などの侵入物が該ダウンライト10”内部に入るのを防止する効果を備える。   FIG. 5 shows a third embodiment of the LED lighting device of the present invention and its heat dissipation structure. The present embodiment and the first embodiment are substantially the same except that the conductor 23 "of the LED module 20" of the LED illuminator 1 "is installed on the side wall 12" of the downlight 10 "in this embodiment. A perforation 120 ″ is installed in the perforation 120 ″ and the lead wire 23 ″ is passed through the perforation 120 ″. Therefore, it is not necessary to penetrate through the top plate 11 ″ of the downlight 10 ″ and the cover plate 31 ″ of the heat dissipation structure 30 ″, and intruders such as mosquitoes and moths enter the downlight 10 ″. Has the effect of preventing.

上述の本考案は、良好な実施例であり、本考案の請求範囲を制限するものではなく、その他に本考案の特許精神を運用した同等効果の変化はすべて本考案の請求範囲に属する。   The above-described present invention is a preferred embodiment, and does not limit the scope of claims of the present invention. In addition, all changes in equivalent effects using the patent spirit of the present invention belong to the scope of claims of the present invention.

1 LED照明具
10 ダウンライト
100 放熱通道
11 最上板
110 穿孔
12 側壁
13 肩部
14 凸縁
20 LEDモジュール
21 回路板
22 LED
23 導線
30 放熱構造
31 蓋板
310 通孔
311 第一放熱孔
32 放熱片
320 第二放熱孔
50 透光ライトカバー
1’ LED照明具
30’ 放熱構造
32’ 放熱片
321’ カバーリング
1” LED照明具
10” ダウンライト
11” 最上板
12” 側壁
120” 穿孔
20” LEDモジュール
23” 導線
30” 放熱構
31” 造蓋板
32” 放熱片
40 透光ライトカバー
DESCRIPTION OF SYMBOLS 1 LED lighting tool 10 Downlight 100 Heat radiation passage 11 Top plate 110 Perforation 12 Side wall 13 Shoulder part 14 Convex edge 20 LED module 21 Circuit board 22 LED
23 Conductor 30 Heat radiation structure 31 Cover plate 310 Through hole 311 First heat radiation hole 32 Heat radiation piece 320 Second heat radiation hole 50 Translucent light cover 1 'LED illuminator 30' Heat radiation structure 32 'Heat radiation piece 321' Cover ring 1 "LED illumination Tool 10 "Downlight 11" Top plate 12 "Side wall 120" Perforation 20 "LED module 23" Conductor 30 "Heat radiation structure 31" Cover plate 32 "Heat radiation piece 40 Translucent light cover

Claims (10)

LED照明具において、
最上板及び該最上板周辺縁から折曲して伸びた側壁を備えるダウンライトと、
該ダウンライト内部に納置し、該最上板の内側面に接着する回路板及び電性連接在該回路板上に電気連接する複数のLEDを含むLEDモジュールと、
該ダウンライト外部に被せ、該最上板の外側面に接着する蓋板及び該蓋板の周辺縁から折曲して成形する複数の放熱片を備え、これらの放熱片は該ダウンライトの側壁外側に被せ、該側壁と共に放熱通道を形成する放熱構造を含むことを特徴とするLED照明具。
In LED lighting equipment,
A downlight comprising a top plate and a side wall bent and extended from the peripheral edge of the top plate;
An LED module that is placed inside the downlight and includes a circuit board that adheres to the inner surface of the uppermost plate and a plurality of LEDs that are electrically connected to the circuit board;
A cover plate that covers the outside of the downlight and is bonded to the outer surface of the uppermost plate, and a plurality of heat dissipation pieces that are bent from the peripheral edge of the cover plate, and these heat dissipation pieces are outside the side wall of the downlight. An LED illuminator comprising: a heat radiating structure that forms a heat radiating passage with the side wall.
前記LED照明具は、更に透光ライトカバーを含み、前記ダウンライトは開口を備え、該開口箇所には該透光ライトカバーを結合することを特徴とする請求項1記載のLED照明具。   The LED illuminator according to claim 1, further comprising a translucent light cover, wherein the downlight includes an opening, and the translucent light cover is coupled to the opening portion. 前記蓋板は、複数の第一放熱孔を設置し、これらの第一放熱孔は該蓋板の周辺縁近くに環設し、該ダウンライトの側壁の底端は肩部を形成して伸び、該肩部の末端は外向きに伸びる凸縁があり、これらの放熱片は、該蓋板周辺縁に間を隔てて該肩部上に設置し、各該放熱片は第二放熱孔を成形することを特徴とする請求項1記載のLED照明具。   The lid plate is provided with a plurality of first heat radiation holes, the first heat radiation holes are provided near the peripheral edge of the lid plate, and the bottom end of the side wall of the downlight forms a shoulder portion and extends. The end of the shoulder has a convex edge extending outward, and these heat dissipating pieces are installed on the shoulder with a gap to the peripheral edge of the lid plate, and each heat dissipating piece has a second heat dissipating hole. The LED lighting device according to claim 1, wherein the LED lighting device is molded. 前記回路板は導線を備え、且つ、前記ダウンライトには穿孔を設置し、該導線は該穿孔に通すことを特徴とする請求項1記載のLED照明具。   The LED lighting device according to claim 1, wherein the circuit board includes a conductive wire, and the downlight is provided with a perforation, and the conductive wire passes through the perforation. 前記各該放熱片の末端は自由端で、且つこれらの放熱片は環形の放射状であることを特徴とする請求項1記載のLED照明具。   2. The LED lighting device according to claim 1, wherein the end of each of the heat dissipating pieces is a free end, and the heat dissipating pieces are ring-shaped radially. 前記放熱片の末端は、相互に繋がり、カバーリングを形成することを特徴とする請求項1記載のLED照明具。   The LED lighting device according to claim 1, wherein ends of the heat radiation pieces are connected to each other to form a cover ring. LED照明具の放熱構造において、
前述のLED照明具の一ダウンライト上に被せ、蓋板及び該蓋板周辺縁から折曲して成形した複数の放熱片を含み、これらの放熱片は前述のダウンライトの外側に被せ、前述のダウンライトと共に放熱通道を形成することを特徴とするLED照明具の放熱構造。
In the heat dissipation structure of LED lighting equipment,
A cover plate and a plurality of heat dissipating pieces formed by bending from the periphery of the cover plate, and covering the outside of the down light. A heat dissipation structure for an LED lighting device, wherein a heat dissipation passage is formed together with the downlight.
前記蓋板は、複数の第一放熱孔を設置し、これらの第一放熱孔は、前記蓋板の周辺縁近くに環設し、これらの放熱片は、前記蓋板周辺縁に間隔を開けて設置し、且つ前記各放熱片は第二放熱孔を設置することを特徴とする請求項7記載のLED照明具の放熱構造。   The lid plate is provided with a plurality of first heat radiating holes, the first heat radiating holes are provided near the peripheral edge of the lid plate, and the heat radiating pieces are spaced from the peripheral edge of the lid plate. The heat radiation structure for an LED lighting device according to claim 7, wherein each of the heat radiation pieces is provided with a second heat radiation hole. 前記各該放熱片の末端は、自由端で、且つこれらの放熱片は環形放射状に形成することを特徴とする請求項7記載のLED照明具及びその放熱構造。   8. The LED illuminator and the heat dissipation structure thereof according to claim 7, wherein the end of each of the heat dissipating pieces is a free end, and these heat dissipating pieces are formed in an annular radial shape. 前記放熱片の末端は、相互に連接し、カバーリングを形成することを特徴とする請求項7記載のLED照明具の放熱構造。   8. The heat radiation structure for an LED lighting device according to claim 7, wherein the ends of the heat radiation pieces are connected to each other to form a cover ring.
JP2010001465U 2010-03-08 2010-03-08 LED lighting device and heat dissipation structure thereof Expired - Fee Related JP3160000U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013008779A1 (en) * 2011-07-13 2013-01-17 シャープ株式会社 Backlight device, display device, and television receiver
CN108889868A (en) * 2018-08-03 2018-11-27 梁栋 Folding type metal structure and its manufacturing method
JP2019087321A (en) * 2017-11-01 2019-06-06 パナソニックIpマネジメント株式会社 Illuminating device
JP2019087322A (en) * 2017-11-01 2019-06-06 パナソニックIpマネジメント株式会社 Illuminating device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013008779A1 (en) * 2011-07-13 2013-01-17 シャープ株式会社 Backlight device, display device, and television receiver
JP2019087321A (en) * 2017-11-01 2019-06-06 パナソニックIpマネジメント株式会社 Illuminating device
JP2019087322A (en) * 2017-11-01 2019-06-06 パナソニックIpマネジメント株式会社 Illuminating device
JP7012249B2 (en) 2017-11-01 2022-02-14 パナソニックIpマネジメント株式会社 Lighting equipment
JP7117575B2 (en) 2017-11-01 2022-08-15 パナソニックIpマネジメント株式会社 lighting equipment
CN108889868A (en) * 2018-08-03 2018-11-27 梁栋 Folding type metal structure and its manufacturing method

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