TW201531647A - Heat dissipating structure for solid-state illuminating apparatus and manufactureing method thereof - Google Patents

Abstract

The present invention provides a solid state illuminating apparatus. The solid state illuminating apparatus comprises a light emitting diode module and a lamp cup. The light emitting diode module is located on the lamp cup. The lamp cup comprises a lamp shell, a heat dissipating structure and a thermal conducting material. The heat dissipating structure comprising a heat dissipating component and a hollow cylinder is located in the lamp shell. The heat dissipating component comprises a plurality of extending outward fins. The hollow cylinder is in the heat dissipating component, and the thermal conducting material is in the heat dissipating structure.

Description

Radiator structure of solid state lighting device and manufacturing method thereof

The present invention relates to a heat sink structure and a method of fabricating the same, and more particularly to a heat sink structure of a solid state lighting device and a method of fabricating the same.

A light-emitting diode belongs to a semiconductor component. The main semiconductor materials used include semiconductor III-V Group elements, which use electrical energy to provide semiconductor energy, which allows the combination of holes and electrons to release energy and emit photons or light. Since the light-emitting diode (LED) has many advantages such as fast reaction time, small volume, low power consumption, low pollution, high reliability, mass production, etc., the light-emitting diode is widely used in various fields, and even Light-emitting elements such as traditional incandescent bulbs or fluorescent lamps have been gradually replaced.

The development of light-emitting diodes has enabled the production of high-intensity white light-emitting diodes in a large number, making them widely applicable to many lighting devices, such as indoor lighting devices, or outdoor street lamps. High luminous efficacy LEDs represent high power at the same time.

Therefore, the high-power light-emitting diode inevitably faces the problem of heat dissipation. If the light-emitting diode is operated under excessive temperature, it may cause the brightness attenuation and the life reduction of the light-emitting diode illumination device. And other issues. Therefore, the heat dissipation problem of the light-emitting diode lighting device is an important issue.

The use of a plastic lamp housing as a light-emitting diode illumination device can solve the heat dissipation of a low-power wattage light-emitting diode lighting device, but for a high-power light-emitting diode lighting device, the temperature of the light-emitting diode substrate is too high. The problem of light decay of the light-emitting diode.

Therefore, there is a need to propose a novel solid state lighting device heat sink structure and a manufacturing method thereof to solve the heat dissipation problem of the solid state lighting device.

In view of the above, one of the objects of the present invention is to provide a heat sink structure of a solid-state lighting device and a manufacturing method thereof to solve the problem of light decay caused by excessive temperature of a high-power solid-state lighting device.

According to an embodiment of the invention, a solid state lighting device includes a light emitting diode chip module and a lamp cup. A light emitting diode chip module is located on the light cup. The lamp cup comprises a lamp housing, a heat sink structure and a heat conductive material. The heat sink structure is located in the lamp housing and comprises a heat sink and a hollow circular tube. The heat sink has a plurality of outwardly extending heat sinks, and the hollow round tube is located in the heat sink. The thermally conductive material is located inside and outside the heat sink structure.

Some embodiments of the invention are described in detail below. However, the present invention may be widely practiced in other embodiments than the following description, and the scope of the present invention is not limited by the examples, which are subject to the scope of the following patents. Further, in order to provide a clearer description and a better understanding of the present invention, the various parts of the drawings are not drawn according to their relative dimensions, and some dimensions have been exaggerated compared to other related dimensions; the irrelevant details are not fully drawn. Out, in order to make the schema simple.

The invention discloses a solid state lighting device heat sink structure and a manufacturing method thereof. Solid state lighting devices include semiconductor light emitting diode (LED) bulbs. The light-emitting diode bulb generally includes a lamp cover, a lamp cup, a circuit substrate, a light-emitting diode chip module, a light-emitting diode driving element, and the like. The components of the light-emitting diode bulb are understood and implemented by those skilled in the art in addition to the heat sink structure disclosed in the present invention and the method of manufacturing the same. Thus, other elements in the solid state lighting device are not specifically disclosed herein except for elements directly related to the solid state lighting device heat sink structure and method of manufacture thereof disclosed herein.

The first A diagram shows a lamp cup in accordance with an embodiment of the present invention. The lamp housing 10 of the lamp cup 1 has a cabin-like pattern around it, including concave recesses 17 and 19, and a recess 19 is located between the lower edges of the adjacent two recesses 17. An adjacent convex ridge line is formed at the junction of the adjacent two grooves 17, and the light transmission hole 102 of the horizontal seat portion of the cabin type pattern is connected above the groove 17. The light-transmitting hole 102 can be attached with a transparent or colored sheet to prevent moisture from entering or dust from falling into the bulb, so as to safely isolate the wafer module from accidental contact with water and dust falling in and affecting light penetration. The bottom edge of the lamp cup 1 is provided with a thread 101 for engaging with a metal or plastic joint for inputting an external power source. The lamp cup 1 has a heat sink structure, and the heat sink structure comprises a heat sink 12 and a hollow round tube 14. The center of the lamp cup 1 and the heat sink structure are covered with a heat conductive material 18, the heat conductive material 18 is electrically insulated, and the heat conductive material 18 comprises a heat conductive plastic. The thermally conductive material 18 has a circular opening 11 in the center for use with electrical wires to connect the light emitting diode elements above the thermally conductive material 18 with the drive elements within the thermally conductive material 18. The lamp housing 10 can be made of a heat conductive material 18 or other heat conductive material. The lamp housing 10 and the heat sink structure can be embedded/injection injection molding, that is, the heat sink structure is injection molded together with the heat conductive material, so that the lamp housing kit is integrated. forming.

The first B diagram shows a top view of the lamp cup shown in the first A diagram. The light-transmissive hole 102, the heat sink structure and the heat-conducting material 18 in the lamp housing 10 of the lamp cup 1 are visible. The heat dissipating member 12 and the hollow circular tube 14 of the heat sink structure comprise metal members, such as aluminum members, and are fabricated by extrusion molding. The heat sink 12 includes an annular structure having fins, and the hollow tube 14 has a groove. The heat sink 12 of the heat sink structure and the upper surface of the hollow tube 14 are in contact with the light emitting diode chip module substrate (not shown), which can effectively promote the heat conduction of the light emitting diode chip module substrate to the heat sink structure. The heat conductive material 18 is arranged above and around the heat sink structure, which can increase the contact area between the light emitting diode chip module substrate and the heat conductive material 18, and promote the conduction of heat energy. The heat conductive material 18 around the heat sink structure can promote the heat transfer of the metal to the heat conductive material 18, and promote heat conduction to the outside of the lamp cup 1 to achieve the heat dissipation effect. In addition, the inner side of the heat sink structure surrounds the heat conductive material 18 and leaves a space for the light emitting diode driving element to cause the light emitting diode driving element to transmit heat. Details regarding the heat sink and the hollow tube will be further described below.

The first C-figure shows the bottom view of the lamp cup shown in the first A-picture. The figure shows a cabin-like pattern around the lamp envelope 10 of the lamp cup 1, the recess 19 being located between the lower edge of the convex ridge and the adjacent two recesses 17.

The first D diagram shows a heat sink structure in accordance with an embodiment of the present invention. The heat sink 12 of the heat sink structure and the hollow circular tube 14. The heat sink 12 includes a ring-shaped structure having a radial fin 15 and a screw hole 13. The annular structure of the heat dissipating member 12 is preferably partially covered with the hollow circular tube 14 to match the wide and narrow shape of the light-emitting diode bulb or the lamp cup.

The first E diagram shows a top view of the heat sink structure shown in the first D diagram. The hollow circular tube 14 and the heat dissipating member 12 are formed by extrusion molding, and the hollow groove 14 is elastically contracted by the groove, and is easily placed and adhered to the heat sink 12. The screw hole 13 can be used for locking the LED chip module substrate, and the screw hole 13 has no limitation on the number and size of the screw holes. In addition to being used as a locking substrate, the C-shaped structure can also avoid stress concentration during lamp ejection or thermal expansion. The radial fins 15 of the heat sink 12 increase the surface area to enhance heat dissipation.

The first F diagram shows a heat sink in accordance with an embodiment of the present invention. The first G diagram shows a front view of the heat sink according to the first F diagram. The heat sink 12 includes an extruded metal piece. The shape and position of the heat sink 15 are merely examples and are not limiting. The position and number of the screw holes 13 are also merely examples and are not limiting.

The first H diagram shows a hollow circular tube in accordance with an embodiment of the present invention. The first I diagram shows a top view of the hollow circular tube according to the first H diagram. The hollow circular tube 14 contains extruded metal parts. The hollow circular tube 14 includes a dividing groove 16 to elastically contract the hollow circular tube 14 and is easily placed and attached to the heat sink 12.

Figure 2A shows a lamp cup in accordance with another embodiment of the present invention. The contour of the lamp housing 20 of the lamp cup 2 also has a cabin-like pattern, including concave recesses 27 and 29, and the recess 29 is located between the upper two recesses 27. An adjacent convex ridge line is formed at the junction of the adjacent two grooves 27, and an upper portion of the cabin type pattern is connected above the groove 27. The groove corresponds to the upper end of the lamp cup 2 connected to the substrate of the LED chip module, and may have a translucent cover, so that part of the light is transmitted through the translucent cover. The bottom edge of the lamp cup 2 is provided with a thread 201 for engaging with a metal or plastic joint for inputting an external power source. The lamp cup 2 also has a heat sink structure, and the heat sink structure comprises a heat sink 12 and a hollow round tube 14. The center of the lamp cup 2 and the heat sink structure are covered with a heat conductive material 28, the heat conductive material 28 is electrically insulated, and the heat conductive material 28 comprises a heat conductive plastic. The center of the thermally conductive material 28 has three circular holes 23 which can be used to pass the wires to connect the light emitting diode elements to the driving elements. The lamp housing 20 is composed of a heat conductive material 28 or other heat conductive material. The lamp housing 20 and the heat sink structure can be embedded/in-mold injection molding, and the heat sink structure and the heat conductive material are injection molded together, so that the lamp housing kit is integrally formed.

The second B diagram shows a front view of the lamp cup shown in the second A diagram. The figure shows a cabin-like pattern around the lamp envelope 20 of the lamp cup 2, the recess 29 being located between the convex ridgeline and the adjacent two recesses 27.

The second C diagram shows a top view of the lamp cup shown in the second A diagram. The figure shows the round hole in the lamp housing 20 of the lamp cup 2, the heat sink structure and the heat conductive material. The heat sink 12 of the heat sink structure and the upper surface of the hollow tube 14 are in contact with the light emitting diode chip module substrate (not shown), which can effectively promote the heat conduction of the light emitting diode chip module substrate to the heat sink structure. The heat conductive material 28 over and around the heat sink structure can increase the contact area between the light emitting diode chip module substrate and the heat conductive material 28, and promote the conduction of thermal energy. The heat conductive material 28 around the heat sink structure can promote the heat transfer of the metal to the heat conductive material 28, and promote heat conduction to the outside of the lamp cup 2 to achieve the heat dissipation effect. In addition, the heat conductive material 28 surrounded by the inner side of the heat sink structure leaves space for the light emitting diode driving element to cause the light emitting diode driving element to transmit heat.

The second D-figure shows a bottom view of the lamp cup shown in Figure A. The figure shows a cabin-like pattern around the lamp envelope 20 of the lamp cup 2, the recess 29 being located between the convex ridgeline and the adjacent two recesses 27.

The solid-state lighting device heat sink structure of the invention has the following advantages: the plastic lamp shell containing the metal part heat sink structure is completed by using the metal heat sink structure which is simple, easy to manufacture and low in cost, wherein the heat sink structure of the heat sink structure The surface area can be increased to facilitate heat dissipation, and the processing is easy and the manufacturing cost is low.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the following. Within the scope of the patent application.

1‧‧‧light cup
10‧‧‧Light shell
11‧‧‧ round hole
12‧‧‧ Heat sink
13‧‧‧ screw holes
14‧‧‧ hollow round tube
15‧‧‧ Heat sink
16‧‧‧"
17‧‧‧ Groove
18‧‧‧ Thermal Conductive Materials
19‧‧‧ Groove
101‧‧‧ thread
102‧‧‧Light hole
2‧‧‧light cup
20‧‧‧Light shell
23‧‧‧ round hole
27‧‧‧ Groove
28‧‧‧thermal materials
29‧‧‧ Groove
201‧‧‧ thread

The first A diagram shows a lamp cup in accordance with an embodiment of the present invention. The first B diagram shows a top view of the lamp cup shown in the first A diagram. The first C-figure shows the bottom view of the lamp cup shown in the first A-picture. The first D diagram shows a heat sink structure in accordance with an embodiment of the present invention. The first E diagram shows a top view of the heat sink structure shown in the first D diagram. The first F diagram shows a heat sink in accordance with an embodiment of the present invention. The first H diagram shows a hollow circular tube in accordance with an embodiment of the present invention. Figure 2A shows a lamp cup in accordance with another embodiment of the present invention. The second B diagram shows a front view of the lamp cup shown in the second A diagram. The second C diagram shows a top view of the lamp cup shown in the second A diagram. The second D-figure shows a bottom view of the lamp cup shown in Figure A.

1‧‧‧light cup

10‧‧‧Light shell

11‧‧‧ round hole

12‧‧‧ Heat sink

14‧‧‧ hollow round tube

17‧‧‧ Groove

18‧‧‧ Thermal Conductive Materials

19‧‧‧ Groove

101‧‧‧ thread

102‧‧‧Light hole

Claims (11)

A solid-state lighting device comprising: a light-emitting diode chip module; and a light cup, the light-emitting diode chip module is located on the light cup, the light cup comprises: a lamp housing; The heat dissipation member has a plurality of outwardly extending fins, the hollow tube is located in the heat sink; and a heat conductive material, the heat conductive material is located in the heat sink structure inside and outside. The solid state lighting device of claim 1, wherein the lamp casing has a cabin pattern around the contour of the casing, and includes a plurality of concave first and second grooves, the second groove being adjacent to the first A lower edge of the groove defines a convex ridge line adjacent to the first groove connection, and the plurality of light transmission holes located in the horizontal seat portion of the cabin type pattern are connected above the first groove. The solid state lighting device of claim 1, wherein the bottom edge of the lamp cup is provided with a thread for engaging with a metal joint for inputting an external power source. The solid state lighting device of claim 1, wherein the thermally conductive material comprises a thermally conductive plastic. The solid state lighting device of claim 1, wherein the heat conductive material center has one or a plurality of circular holes, and can be used to connect the light emitting diode chip module and the heat conductive material over the heat conductive material through a wire. A drive element inside. The solid state lighting device of claim 1, wherein the lamp housing and the heat sink structure are integrally molded in a buried/in-mold. The solid state lighting device of claim 1, wherein the heat dissipating member and the hollow circular tube comprise aluminum metal members and are fabricated by extrusion molding. The solid-state lighting device of claim 1, wherein the heat dissipating member comprises an annular structure having the heat dissipating fin, and the hollow circular tube has a sulking groove, so that the hollow circular tube can be elastically contracted, and is easy to be placed and densely. Fitted in the heat sink. The solid state lighting device of claim 1, wherein the heat sink structure has a similar C-type structure. The solid state lighting device of claim 8, wherein the annular structure is preferably partially covered with the hollow circular tube. The solid state lighting device of claim 1, wherein the lamp casing has a cabin pattern around the contour of the casing, and includes a plurality of concave first and second grooves, the second groove being adjacent to the first Between a groove, an adjacent convex ridge line is formed adjacent to the first groove connection, and the plurality of light transmission holes located at an upper portion of the cabin type pattern are connected above the first groove.