TWM451664U - Circuit board - Google Patents

Abstract

The invention discloses a circuit board, which includes a board member and a testing structure disposed on the board member. The testing structure can be realized by a through hole or electrical testing pads. The board member has a surface and an electrical connection pad. The surface thereon defines a disposition area. The electrical connection pad is located in the disposition area. An electronic component can be placed in the disposition area to be electrically connected to the electrical connection pad. The testing structure is disposed close to the electrical connection pad, such that when the electronic component is placed on the board member, a user can use the testing structure, e.g. by a situation of light passing the through hole or by whether the electrical testing pad is short, to determine whether the electronic component is placed correctly. Compared to the prior art, the invention simplifies the inspection of the disposition of the electronic component, which is conducive to reduction of inspection cost in process and improvement of the process reliability.

Description

Circuit board

This creation is about a circuit board.

At present, the number of electronic components that the circuit board needs to carry on the implementation is increasing. When the electronic components are placed on the circuit board, it is difficult to detect whether the components are short or misplaced. If the missing or misplaced parts are found after the electronic components are soldered, the repairs will be reworked or even scrapped, which will increase the manufacturing cost. In addition, missing or misplaced electronic components may also cause short-circuit or open circuit during verification, resulting in material loss. At present, common methods for inspecting electronic components on a circuit board include manual visual inspection, optical image detection, and probe detection. In the manual visual inspection, when the electronic components have similar contours and the electronic components are densely arranged, it is easy to cause misjudgment. And when the inspector's eyes are tired, misjudgment is also likely to occur. In optical image detection, the ability of the image processing program used is critical to the detection accuracy. However, the more complicated the image processing program, the longer the processing time is, which increases the detection cost. In the probe detection, the probe needs to be correctly aligned to correctly contact the detection contact to avoid misjudgment. In addition, the electrical measurement and interpretation of the probe may introduce errors, noise, etc., and may also cause misjudgment. Moreover, the probe alignment and the physical contact detection contact also require a certain time, plus the time required for electrical measurement, interpretation, etc., the overall detection time is not short, and the detection cost is increased. Therefore, how to effectively detect the problematic upper board is the goal pursued by the industry.

In view of the problems in the prior art, one of the objects of the present invention is to provide a circuit board on which at least one electronic component can be disposed. The circuit board has a test structure adjacent to the electronic component, and the user can use the test structure to inspect the placement of the electronic component. Compared with the prior art, the creation simplifies the setting detection of the electronic component, improves the detection efficiency, and helps to reduce the cost of the process inspection and improve the process reliability.

According to one of the creations, the circuit board comprises a plate body and a through hole structure. The board body has a surface and an electrical connection pad, and a surface is defined on the surface, and the electrical connection pad is located in the placement area. The through hole structure is disposed on the board body and located in or adjacent to the first placement area, wherein an electronic component can be placed in the placement area to be electrically connected to the electrical connection pad, and a user can utilize The placement of the electronic component is checked by the passage of light through the via structure or by the use of a probe through the first via structure. For example, if the through hole structure is formed in the placement area, when the electronic component is correctly placed in the placement area, the electronic component can cover the through hole structure, so that the user cannot observe the structure through the through hole. The light is determined, so that the electronic component is correctly placed; otherwise, when there is no electronic component in the placement area, the through-hole structure is not covered, so that the user can smoothly observe the light passing through the through-hole structure. Therefore, it is judged that the electronic component is not placed correctly. For example, if the through hole structure is formed beside the placement area, after the electronic component is placed on the circuit board, the user can use the indication effect generated by the light passing through the through hole structure to find the placement area, and then Check if the electronic component is placed in the placement area. For example, if the via structure is formed beside the electrical connection pad, after the electronic component is placed, the user uses the probe to pass through the through hole structure. Whether the electronic component is correctly placed in the placement area is determined by whether the probe has contact with the contact of the electronic component. Thereby, the circuit board utilizes the characteristics of the light passing through the through-hole structure to provide a visual inspection basis for the user. Compared with the prior art, the circuit board simplifies the setting detection of the electronic component, improves the detection efficiency, and helps Reduce the cost of process inspection and improve process reliability.

Another circuit board according to the present invention comprises a board body and a test pad structure. The board body has a surface and an electrical connection pad, and a surface is defined on the surface, and the electrical connection pad is located in the placement area. The test pad structure is disposed on the surface and includes an outer test pad and an inner test pad. The outer test pad is disposed outside the placement area, and the inner test pad is disposed adjacent to the electrical connection pad and electrically connected to the outer test pad, wherein an electronic component can be placed in the placement area to be electrically The electrical connection pad is electrically connected. If the electronic component is in electrical contact with the inner test pad, the outer test pad is electrically connected to the electronic component via the inner test pad. Thereby, the circuit board utilizes the test pad structure to provide a medium for the user to conveniently measure the electronic component, and is particularly suitable for an electronic component packaged by a ball grid array (BGA), which has a high junction density, the electron Once the component is offset, it will be in electrical contact with the inner test pad and can be detected by the user via the outer test pad. Similarly, compared with the prior art, the circuit board simplifies the setting detection of the electronic component, improves the detection efficiency, and helps to reduce the cost of the process inspection and improve the process reliability.

The advantages and spirit of this creation can be further understood by the following detailed description of the creation and the drawings.

Please refer to FIG. 1 , which is a plan view of a circuit board 1 according to a preferred embodiment of the present invention; wherein, for simplicity of explanation, the circuit board 1 only shows a part of the circuit board actually used, and subsequent implementations The same is true in the case, and will not be repeated. In the present embodiment, the circuit board 1 includes a board body 12 and three through hole structures 14a, 14b, 14c. The board body 12 has a surface 122 and three sets of electrical connection pads 16a, 16b, 16c (shown in hatching) formed on the surface 122. Three placement areas 124a, 124b, 124c are defined on surface 122. In the present embodiment, the placement areas 124a, 124b, and 124c are actually framed by thick lines, and the middle parts are printed with electronic component symbols, which are resistance, capacitance, and inductance, respectively, but the creation is not limited thereto. . Electrical connection pads 16a, 16b, 16c are correspondingly located within placement areas 124a, 124b, 124c. The via structures 14a, 14b, 14c are respectively a via hole formed on the board body 12 and correspondingly located in the placement areas 124a, 124b, 124c.

Please refer to FIG. 2, which is a cross-sectional view of the electronic component 2a, 2c placed on the circuit board 1. The cross-sectional position can be referred to the line X-X in FIG. In the present embodiment, the electronic components 2a, 2c are placed in the placement areas 124a, 124c, respectively, to be electrically connected to the electrical connection pads 16a, 16c, and the intermediate placement area 124b is not placed in any electronic components. Due to the location of the via structures 14a, 14b, 14c, when electronic components are placed on the placement regions 124a, 124b or 124c to be electrically connected to the electrical connection pads 16a, 16b or 16c, the electronic components will be covered. Hole structure 14a, 14b or 14c. Therefore, in the present embodiment, when the light is projected from the lower side of the circuit board 1, due to the placement area The electronic components 2a, 2c are placed on the 124a, 124c, and the light rays (indicated by thick arrows) through the via structures 14a, 14c are shielded by the electronic components 2a, 2c, so that the user can only observe the passage from above the circuit board 1. Light from the via structure 14b. In practical applications, if the placement area 124a, 124c needs to be placed with electronic components, and the placement area 124b does not need to be placed with electronic components, the user can judge that the electronic components 2a, 2c have been observed by only observing the light passing through the via structure 14b. If the user observes the light passing through the through hole structure 14a or 14c or the light passing through the through hole structure 14b is not observed, it can be judged that the electronic components 2a, 2c are not correctly placed. The inspection method using the light passing through the through-hole structures 14a, 14b, 14c is quite suitable for the operator to carry out the inspection in the process. Compared with the conventional technology, a complicated image processing software or a probe actuating mechanism is required to complete the detecting operation, and the circuit board 1 according to the present invention provides a simplified detection operation for the user, improves the detection efficiency, and helps to reduce the process inspection. Cost and improve process reliability. In addition, this inspection method can effectively shorten the time of misplacement and missing parts after the placement and before welding, but this creation is not limited to this; in practice, this inspection method can also be applied after welding. , still can effectively detect the placement of electronic components.

Please refer to FIG. 3 and FIG. 4, FIG. 3 is a plan view of a circuit board 3 according to another embodiment of the present invention, and FIG. 4 is a cross-sectional view of the electronic component 2d placed on the circuit board 3, the cross-sectional position thereof. See line YY in Figure 3. The circuit board 3 and the circuit board 1 have substantially the same logic structure. Therefore, in the circuit board 3, the components named the same as the circuit board 1 can be referred to the description of the circuit board 1, and will not be described again; the following only describes the differences. In the present embodiment, the circuit board 3 includes three pairs of electrical connection pads 36 and corresponding three through hole structures 34, and the averaging is defined in the placement area 324 on the surface 322 of the board body 32. through The hole structures 34 are all through holes formed in the side of the electrical connection pad 36 and penetrating through the plate body 32. The electronic component 2d (for example, an RGB light-emitting diode element) has three pairs of contacts 22d corresponding to the three pairs of electrical connection pads 36. As shown in FIG. 4, the electronic component 2d is placed in the placement area 324 such that the contact 22d can be electrically connected to the electrical connection pad 36, and the electronic component 2d covers the via structure 34. Therefore, the user can also judge whether the electronic component 2d is correctly placed by the light passing through the through hole structure 34. Further, in this embodiment, when the electronic component 2d is correctly placed in the placement area 324, the contact 22d can be exposed from the via structure 34. Therefore, after the electronic component 2d is soldered to the circuit board 3, the user can use the wire or The probe 4a extends from the through-hole structure 34 to electrically contact the contact 22d, and the temperature after the electronic component 2d is actually mobilized can be measured to facilitate setting the driving conditions in time to exert the effect of protecting the electronic component 2d.

Please refer to FIG. 5, which is a top plan view of a circuit board 5 according to another embodiment of the present invention. The circuit board 5 and the circuit board 1 are substantially identical in structure, so that the circuit board 5 follows the component symbols of the circuit board 1. The main difference between the circuit board 5 and the circuit board 1 is that the through-hole structures 54a, 54b, 54c of the circuit board 5 are disposed outside the placement areas 124a, 124b, 124c. In the present embodiment, the via structure 54a includes a via hole formed beside the placement region 124a; the via structure 54b includes two via holes formed beside the placement region 124b; and the via structure 54c includes three via holes to form Next to the placement area 124c. Although the via structures 54a, 54b, 54c are not covered when the electronic components are placed in the placement regions 124a, 124b, 124c, the user can still utilize the light through the via structures 54a, 54b, 54c, ie, the light passes through The hole structure 54a forms a single spot, the light forms two spots through the through hole structure 54b, and the light forms three spots through the through hole structure 54c. The user can quickly find the position of the placement areas 124a, 124b, 124c of the corresponding via structures 54a, 54b, 54c by using the indication effect produced by different numbers of light spots, and then view the placement areas 124a, 124b, 124c according to the production specifications. Whether the electronic components on the board are placed correctly (including at least the case where they should be placed and should not be placed). For other descriptions of the circuit board 5, please refer to the relevant description of the circuit board 1, and will not be described again. In addition, it is added that, in practice, the through hole contours of the through hole structures 54a, 54b, 54c are not limited to a circular shape, and the difference in the number of through holes may be larger, which contributes to enhancing the visual recognition effect. .

In the foregoing embodiment, the via structures 14a, 14b, 14c, 34, 54a, 54b, 54c are all through holes formed in the board bodies 12, 32, and are not responsible for the electrical conduction function, but the present creation does not Limited. Taking the circuit board 1 as an example (as shown in FIG. 1), in practice, the via structure 14a can be modified on the electrical connection pad 16a as a via of the circuit board 1. At this time, when the solder paste is applied, the solder paste should not completely plug the via structure 14a, so that the user can still judge whether the electronic component is correctly placed by the light passing through the via structure 14a.

In the foregoing embodiment, the via structures 14a, 14b, 14c, 34, 54a, 54b, 54c serve as channels through which light passes, thereby judging the placement of the electronic components 2a, 2c, 2d by the passage of light, but this creation does not This is limited. Please refer to FIG. 6 and FIG. 7. FIG. 6 is a plan view of a portion of the circuit board 6 according to another preferred embodiment of the present invention, and FIG. 7 is a portion of the circuit board 6 on which the electronic component 2e is placed. For the cross-sectional view, refer to the line ZZ in Figure 6. In order to simplify the description, the circuit board 6 only shows one part of the circuit board actually used, and in the subsequent embodiments, the same Let me repeat. The circuit board 6 includes a board body 62 and a through hole structure 64. The body 62 has a surface 622 and a first electrical connection pad 66 (shown in hatching). A placement area 624 is defined on surface 622, which is shown in bold lines. The first electrical connection pad 66 is located within the placement area 624. The via structure 64 includes four via holes disposed around the first electrical connection pads 66 in the front, back, left, and right directions and within the placement region 624. The electronic component 2e includes a contact 22e corresponding to the first electrical connection pad 66. Since the via structure 64 is disposed beside the first electrical connection pad 66, when the electronic component 2e is placed in the placement area 624, if the contact 22e of the electronic component 2e is offset, the contact 22e will be self-via The at least one through hole of the structure 64 is exposed, and the user can use the probe 4b to pass through the through hole structure 64 to make electrical contact with the contact 22e, thereby detecting an electrical reaction, so that it can be judged that the electronic component 2e has been moved. Partial placement. The description of the circuit board 1 described above is also applicable to the above, and will not be repeated.

Please refer to FIG. 8, which is a top plan view of a circuit board 7 according to another embodiment of the present invention. The circuit board 7 and the circuit board 6 are substantially identical in structure, so that the circuit board 7 follows the component symbols of the circuit board 6. The main difference between the circuit board 7 and the circuit board 6 is that the via structure 74 of the circuit board 7 is not only disposed around a single first electrical connection pad 66. In this embodiment, the board 62 of the circuit board 7 includes a second electrical connection pad 68 (shown in hatching), and the through hole structure 74 includes two first through holes 742 and two second through holes. The hole 744, the first through hole 742 is formed beside the first electrical connection pad 66, and the second through hole 744 is formed beside the second electrical connection pad 68. The structure is designed to prevent the excessive through hole from causing the electrical connection pad structure. The problem of weakening strength. In this embodiment, a first direction D1 is defined on the surface 622 and a second direction D2 is non-parallel to the first direction D1, and the first through hole 742 is defined. The second through holes 744 are disposed on the two sides of the second electrical connection pad 68 in the second direction D2. Similarly, if the electronic component placed in the placement area 624 is offset, the user can also use the probe to pass through the first through hole 742 or the second through hole 744 to make electrical contact with the electronic component, thereby detecting that there is The electrical reaction is used as a basis for judging that the electronic component 2e has been shifted. For other descriptions of the circuit board 7, please refer to the relevant description of the circuit board 6, and will not be described again. In addition, in the evening of the present embodiment, the first direction D1 is perpendicular to the second direction D2, but the present creation is not limited thereto; in principle, only the first direction D1 and the second direction D2 need to be formed. With a non-zero angle, the via structure 74 provides detection of the two-dimensional offset setting of the electronic component 2e.

Referring to FIG. 9 and FIG. 10, FIG. 9 is a plan view of a portion of the circuit board 8 according to another preferred embodiment of the present invention, and FIG. 10 is a portion of the circuit board 8 on which the electronic component 2f is placed. For the cross-sectional view, refer to the line WW in Figure 9. The circuit board 8 includes a board 82 and two test pad structures 84a, 84b. The board body 82 has a surface 822 and a first electrical connection pad 86 (shown in hatching in the figure). A surface 822 defines a placement area 824. In this embodiment, the placement area 824 is implemented as a thick line. Box its scope. The first electrical connection pad 86 is located within the placement area 824. Test pad structures 84a, 84b are disposed on surface 822 and include an outer test pad 842a, 842b and an inner test pad 844a, 844b, respectively. The outer test pads 842a, 842b are disposed outside the placement area 824, and the inner test pads 844a, 844b are disposed adjacent to the first electrical connection pads 86 around the first electrical connection pads 86 and electrically corresponding to the outer test pads 842a, 842b. connection. In practice, the first electrical connection pad 86 is formed together with the test pad structures 84a, 84b. Or the test pad structures 84a, 84b are additionally printed on the surface 822, but the present invention is not limited thereto. Therefore, when the electronic component 2f is to be placed in the placement area 824 to be electrically connected to the electrical connection pad (including the first electrical connection pad 86), if the electronic component 2f is offset, the contact of the electronic component 2f 22f may be in electrical contact with the inner test pad 844a or 844b, and the corresponding outer test pad 842a or 842b is electrically connected to the contact 22f via the inner test pad 844a or 844b. At this time, the user can pass the corresponding outer test pad. 842a or 842b has an electrical response, so it can be judged that the electronic component 2f has been shifted. In this embodiment, as shown in FIG. 10, the contact 22f electrically contacts the inner test pad 844a, and the outer test pad 842a is electrically connected to the contact 22f via the inner test pad 844a. At this time, the user can use the probe. The needle 4c contacts an external test pad 842a that is not shielded by the electronic component 2f to measure an electrical reaction as a basis for judging that the electronic component 2f has been displaced.

Please refer to FIG. 11, which is a plan view of a circuit board 9 according to another embodiment of the present invention. The circuit board 9 and the circuit board 8 are substantially identical in structure, so that the circuit board 9 follows the component symbols of the circuit board 8. The main difference between the circuit board 9 and the circuit board 8 is that the test pad structures 94a, 94b of the circuit board 9 are not disposed only around a single first electrical connection pad 86. In the present embodiment, the board 82 of the circuit board 9 includes a second electrical connection pad 88 (shown in hatching in the figure) located in the placement area 824. Test pad structures 94a, 94b are disposed on surface 822 and include an outer test pad 942a, 942b and an inner test pad 944a, 944b, respectively. The inner test pads 944a, 944b are respectively disposed beside the first electrical connection pads 86 and the second electrical connection pads 88. The outer test pads 942a, 942b are disposed outside the placement area 824 and electrically corresponding to the outer test pads 842a, 842b. Sexual connection. In this embodiment, the surface 822 defines a first direction D3 and a non-parallel to the first direction D3. In the two directions D4, the inner test pad 944a is disposed adjacent to the first electrical connection pad 86 in the first direction D3, and the inner test pad 944b is disposed adjacent to the second electrical connection pad 88 in the second direction D4. Similarly, if the electronic components placed in the placement area 824 are offset, the electronic components may be in electrical contact with the inner test pads 944a or 944b. In this case, the user can use the probe contacts to be shielded from the electronic components. The test pad 942a or 942b measures an electrical response as a basis for judging that the electronic component has been displaced. For other descriptions of the circuit board 9, please refer to the related description of the circuit board 8, and will not be described again. In addition, in the evening of the present embodiment, the first direction D3 is perpendicular to the second direction D4, but the present creation is not limited thereto; in principle, only the first direction D3 and the second direction D4 need to be formed. With a non-zero angle, the test pad structures 94a, 94b provide detection of the two-dimensional offset setting of the electronic component 2f.

The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention.

1, 3, 5, 6, 7‧‧‧ boards

12, 32, 62, 82‧‧‧ board

122, 322, 622, 822‧‧‧ surface

124a, 124b, 124c, 324, 624, 824‧‧‧ placement area

14a, 14b, 14c, 34, 54a, 54b, 54c, 64, 74‧‧‧ through hole structure

16a, 16b, 16c, 36‧‧‧ electrical connection pads

2a, 2c, 2d, 2e, 2f‧‧‧ electronic components

22d, 22e, 22f‧‧‧ joints

4a, 4b, 4c‧‧ ‧ probe

66, 86‧‧‧First electrical connection pad

68, 88‧‧‧Second electrical connection pads

742‧‧‧First through hole

744‧‧‧Second through hole

84a, 84b, 94a, 94b‧‧‧ test pad structure

842a, 842b, 942a, 942b‧‧‧ external test pads

Test pad in 844a, 844b, 944a, 944b‧‧

D1, D3‧‧‧ first direction

D2, D4‧‧‧ second direction

1 is a top plan view of a circuit board in accordance with a preferred embodiment of the present invention.

Figure 2 is a cross-sectional view showing the electronic components placed on the circuit board in Figure 1.

Figure 3 is a top plan view of a circuit board in accordance with another embodiment of the present invention.

Figure 4 is a cross-sectional view of the electronic component placed on the circuit board in Figure 3.

Figure 5 is a top plan view of a circuit board in accordance with another embodiment of the present invention.

Figure 6 is a top plan view of a portion of a circuit board in accordance with another preferred embodiment of the present invention.

Fig. 7 is a cross-sectional view showing a portion on the circuit board on which electronic components are placed in Fig. 6.

Figure 8 is a top plan view of a circuit board in accordance with another embodiment of the present invention.

Figure 9 is a top plan view of a portion of a circuit board in accordance with another preferred embodiment of the present invention.

Fig. 10 is a cross-sectional view showing a portion on the circuit board on which electronic components are placed in Fig. 9.

Figure 11 is a top plan view of a circuit board in accordance with another embodiment of the present invention.

1‧‧‧ boards

2a, 2c‧‧‧ electronic components

12‧‧‧ board

14a, 14b, 14c‧‧‧through hole structure

16a, 16b, 16c‧‧‧ electrical connection pads

122‧‧‧ surface

Claims (15)

A circuit board comprising: a board body having a surface and a first electrical connection pad, the surface defining a first placement area, the first electrical connection pad being located in the first placement area; and a first a through hole structure is disposed on the board body, wherein an electronic component can be placed in the first placement area to be electrically connected to the first electrical connection pad, and the first through hole structure can be utilized by a user Check the placement of the electronic components. The circuit board of claim 1, wherein the first via structure is formed in the first placement area, and the electronic component is placed in the first placement area to be electrically connected to the first electrical connection pad. The electronic component covers the first via structure when connected. The circuit board of claim 2, wherein the electronic component comprises a contact, wherein the first via structure is formed beside the first electrical connection pad, and the electronic component is placed in the first placement area to enable The contact may be exposed from the first via structure when electrically connected to the first electrical connection pad. The circuit board of claim 2, wherein the first via structure comprises a plurality of vias disposed around the first electrical connection pad. The circuit board of claim 2, wherein the board body comprises a second electrical connection pad, the first through hole structure comprises a first through hole and a first Two through holes are respectively disposed adjacent to the first electrical connection pad and the second electrical connection pad. The circuit board of claim 5, wherein the surface defines a first direction and a second direction that is non-parallel to the first direction, the first through hole is disposed in the first electrical direction in the first direction Next to the connection pad, the second through hole is disposed in the second direction beside the second electrical connection pad. The circuit board of claim 1, wherein the first via structure is formed adjacent to the first placement region, and the first via structure comprises at least one first via. The circuit board of claim 7, further comprising a second via structure, wherein the surface defines a second placement area, the second via structure is disposed adjacent to the second placement area, the second via The structure includes at least one second through hole, and the number of the first through holes is not equal to the number of the second through holes. The circuit board of claim 1, wherein the first via structure comprises a through hole, and the through hole is a via hole. The circuit board of claim 1, wherein the user can check the placement of the electronic component by using light through the first via structure or by using a probe through the first via structure. A circuit board comprising: a plate having a surface and a first electrical connection pad, the surface defining a placement area, the first electrical connection pad being located in the placement area; and a first test pad structure disposed on the surface And comprising: a first outer test pad disposed outside the placement area; and a first inner test pad disposed adjacent to the first electrical connection pad and electrically connected to the first outer test pad, wherein The electronic component can be placed in the placement area to be electrically connected to the first electrical connection pad. If the electronic component is in electrical contact with the first inner test pad, the first outer test pad passes through the first inner The test pad is electrically connected to the electronic component. The circuit board of claim 11, wherein the board body comprises a second electrical connection pad disposed in the placement area, the circuit board further comprising a second test pad structure disposed on the surface and including a a second outer test pad and a second inner test pad electrically connected to the second outer test pad, the second outer test pad being disposed outside the placement area, the second inner test pad being disposed on the second electrical The electronic component can be placed in the placement area to be electrically connected to the first electrical connection pad and the second electrical connection pad, if the electronic component and the second inner test pad are electrically connected When in contact, the second outer test pad is electrically connected to the electronic component via the second inner test pad. The circuit board of claim 12, wherein the surface defines a first direction and a second direction that is non-parallel to the first direction, the first inner test pad is disposed in the first direction in the first direction Next to the connection pad, the second inner test pad is disposed in the second direction beside the second electrical connection pad. The circuit board of claim 11, further comprising a second test pad structure disposed on the surface and including a second outer test pad and one of the second inner test pads electrically connected to the second outer test pad The second outer test pad is disposed outside the placement area, and the second inner test pad is disposed adjacent to the first electrical connection pad, and if the electronic component is in electrical contact with the second inner test pad, The second outer test pad is electrically connected to the electronic component via the second inner test pad. The circuit board of claim 14, wherein the first inner test pad and the second inner test pad are disposed around the first electrical connection pad.